CN213688773U - Differential pressure sensor and electronic device - Google Patents
Differential pressure sensor and electronic device Download PDFInfo
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- CN213688773U CN213688773U CN202022827989.7U CN202022827989U CN213688773U CN 213688773 U CN213688773 U CN 213688773U CN 202022827989 U CN202022827989 U CN 202022827989U CN 213688773 U CN213688773 U CN 213688773U
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Abstract
The utility model discloses a differential pressure sensor and electronic equipment, the differential pressure sensor comprises a first substrate, a second substrate, an induction element and a feedback element, the first substrate is provided with a first air hole; the first substrate and the second substrate are enclosed to form an accommodating cavity, and the second substrate is provided with a second air hole communicated with the accommodating cavity; the induction element is arranged in the accommodating cavity, is connected with the first substrate and covers the first air hole; the feedback element is arranged in the accommodating cavity, connected with the second substrate and arranged at intervals with the second air hole; the feedback element is electrically connected with the sensing element. The utility model discloses install sensing element and feedback element respectively on first base plate and second base plate, realize that sensing element and feedback element distribute along thickness direction, can reduce the area of first base plate and second base plate. The utility model discloses packaging structure is simple, and the size is less, and the cost is lower.
Description
Technical Field
The utility model relates to a sensor technical field, in particular to differential pressure sensor and electronic equipment.
Background
A differential pressure sensor is a sensor for measuring a difference between two pressures, is generally used for measuring a differential pressure between front and rear ends of a certain device or component, and is widely used in medical devices, automobiles, and industrial components.
However, the MEMS chip and the ASIC chip of the current differential pressure sensor are arranged side by side on the same substrate, and the MEMS chip and the ASIC chip need to be arranged at intervals, which results in a large surface size of the substrate, a large transverse overall size of the package, and a large space occupied when the package is installed in an electronic device, resulting in space waste.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a differential pressure sensor and electronic equipment aims at solving the big problem of differential pressure sensor transverse dimension.
In order to achieve the above object, the present invention provides a differential pressure sensor comprising:
the first substrate is provided with a first air hole;
the first substrate and the second substrate are enclosed to form an accommodating cavity, and the second substrate is provided with a second air hole communicated with the accommodating cavity;
the induction element is arranged in the accommodating cavity, is connected with the first substrate and covers the first air hole;
the feedback element is arranged in the accommodating cavity, is connected with the second substrate and is arranged at intervals with the second air hole; the feedback element is electrically connected with the sensing element.
In an embodiment of the present invention, the first air hole and the second air hole are disposed in a staggered manner.
In an embodiment of the present invention, the sensing element includes a supporting portion and a sensing portion disposed in the accommodating cavity, and a periphery of the sensing portion is connected to the supporting portion to form a cavity; the supporting part is arranged around the first air hole, and one end, far away from the sensing part, of the supporting part is connected with the first substrate, so that the cavity is communicated with the first air hole.
In an embodiment of the present invention, a plurality of first pads are disposed on a side of the first substrate facing the second substrate;
one side of the second substrate, which faces the first substrate, is provided with a plurality of second bonding pads, and the first bonding pads and the second bonding pads are connected in a one-to-one correspondence mode through conductive adhesives.
In an embodiment of the present invention, a first adhesive layer is disposed on a periphery of the first substrate or the second substrate, and the first substrate and the second substrate are connected by the first adhesive layer;
and/or the first substrate and the second substrate are grounded through one first bonding pad or one second bonding pad.
In an embodiment of the present invention, the differential pressure sensor further includes a plurality of first wires, the sensing element is provided with a plurality of first pins, and each of the first pins and the first pad are respectively connected to two ends of the first wire.
In an embodiment of the present invention, the differential pressure sensor further includes a plurality of second wires, the feedback element has a plurality of second pins, the second substrate has a plurality of third pins and fourth pins, and one second pin is connected to one of the third pins or the fourth pin through one of the second wires; the third pins are connected with the second bonding pads in a one-to-one correspondence mode, and the fourth pins are used for being connected with external equipment.
In an embodiment of the present invention, the second substrate is provided with a second glue layer, and the feedback element is connected to the second substrate through the second glue layer.
In an embodiment of the present invention, the first substrate is made of ceramic;
and/or the second substrate is made of ceramic;
and/or, the sensing element is a MEMS chip;
and/or the feedback element is an ASIC chip.
The utility model discloses still provide an electronic equipment, electronic equipment includes electronic equipment main part and above-mentioned embodiment differential pressure sensor, differential pressure sensor locates the electronic equipment main part.
The utility model discloses differential pressure sensor among the technical scheme piles up the first base plate and the second base plate that set up from top to bottom through setting up two to enclose to close and form the chamber that holds that has inductive element and feedback element, realize inductive element and feedback element's encapsulation, install inductive element and feedback element respectively on first base plate and second base plate simultaneously, realize inductive element and feedback element distribute along thickness direction, can reduce the area of first base plate and second base plate. Moreover first gas pocket and second gas pocket are located induction element's both sides respectively, can detect the pressure differential between first gas pocket and the second gas pocket through at least induction element, the utility model discloses packaging structure is simple, and the size is less, and the cost is lower.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of an embodiment of a differential pressure sensor according to the present invention;
FIG. 2 is a schematic connection diagram of the first substrate and the sensing element shown in FIG. 1;
FIG. 3 is a schematic diagram of the connection between the second substrate and the feedback device in FIG. 1;
fig. 4 is a schematic view of adding conductive glue and glue layer in fig. 3.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | First substrate | 11 | First air hole |
| 12 | |
34 | First pin |
| 14 | First |
2 | |
| 21 | |
22 | |
| 23 | Second |
24 | |
| 25 | |
26 | |
| 3 | Induction element | 31 | Supporting part |
| 32 | Induction part | 33 | |
| 4 | |
5 | Conductive adhesive |
| 6 | First adhesive layer | 7 | Second |
| 8 | Containing cavity |
The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The MEMS chip and the ASIC chip of the current differential pressure sensor are arranged on the same substrate side by side, and the MEMS chip and the ASIC chip need to be arranged at intervals, so that the surface size of the substrate is large, the transverse overall size of the packaging body is large, and the packaging body occupies a large space when being installed in electronic equipment, so that the space is wasted.
Based on the above problem, the utility model provides a differential pressure sensor. The differential pressure sensor may be used inside a device or component to measure the differential pressure across the device or component.
In the embodiment of the present invention, as shown in fig. 1, the differential pressure sensor includes a first substrate 1, a second substrate 2, an inductive element 3, and a feedback element 4, wherein the first substrate 1 is provided with a first air hole 11; the first substrate 1 and the second substrate 2 enclose to form an accommodating cavity, and the second substrate 2 is provided with a second air hole 21 communicated with the accommodating cavity; the induction element 3 is arranged in the accommodating cavity, and the induction element 3 is connected with the first substrate 1 and covers the first air hole 11; the feedback element 4 is arranged in the accommodating cavity, and the feedback element 4 is connected with the second substrate 2 and arranged at intervals with the second air hole 21; the feedback element 4 is electrically connected to the inductive element 3.
The first substrate 1 and the second substrate 2 may be made of a conventional substrate material such as RF-4, BT, or a ceramic substrate. In this embodiment, the first substrate 1 and the second substrate 2 are made of ceramic, which can ensure that the differential pressure sensor can work in a severe environment (such as a humid environment or a corrosive gas environment).
The first substrate 1 and the second substrate 2 may have solder pads or electrical connection structures formed thereon for providing electrical connection points. The first substrate 1 and the second substrate 2 may be a single-layer or multi-layer circuit board, and the surfaces of the first substrate 1 and the second substrate 2 may be formed with circuit structures, or electrical contacts, such as pads and the like; the first substrate 1 and the second substrate 2 may further have an electrical connection structure formed therein for connecting electrical contacts on the front and back surfaces of the first substrate 1 and the second substrate 2.
The first substrate 1 and the second substrate 2 enclose a packaging shell serving as a differential pressure sensor, and are used for protecting internal electronic elements, and meanwhile, an accommodating cavity is formed between the first substrate 1 and the second substrate 2. The first substrate 1 and the second substrate 2 can be made of ceramic materials, are high-temperature resistant and simple in production process, can be produced in large scale, and the shell made of the ceramic materials has the characteristics of corrosion resistance and the like, so that a higher protection effect is achieved on products.
The edges of the second substrate 2 and the first substrate 1 are fixedly connected through welding or gluing and the like, so that an accommodating cavity is formed between the second substrate 2 and the first substrate 1. In this embodiment, the second substrate 2 has a second air hole 21 penetrating through the second substrate 2, so that the accommodating cavity is communicated with the outside of the housing enclosed by the second substrate 2 and the first substrate 1. The second substrate 2 is provided with at least one second air hole 21. In this embodiment, the second substrate 2 has only one second air hole 21, and in other embodiments, the second substrate 2 may further have more than two second air holes 21. The edge of the second substrate 2 is hermetically connected with the first substrate 1, so that the accommodating cavity can be communicated with the outside only through the second air hole 21, and gas in the accommodating cavity cannot leak at other positions. In this embodiment, the sensing element 3 covers the first air hole 11, that is, the sensing element 3 is provided with the first substrate 1, so that the first air hole 11 and the second air hole 21 are respectively located at two sides of the sensing element 3, and the sensing element 3 detects a pressure difference between the first air hole 11 and the second air hole 21 at the two sides, thereby realizing a function of measuring the pressure difference.
The feedback element 4 is connected with the sensing element 3, and the feedback element 4 can amplify, compensate and the like the pressure signal detected by the sensing element 3 to obtain a more accurate pressure signal, so that the differential pressure sensor can output the pressure signal more accurately.
The differential pressure sensor in this embodiment is through setting up two first base plate 1 and the second base plate 2 that stack up the setting from top to bottom to enclose and close and form the chamber that holds that has inductive element 3 and feedback element 4, realize the encapsulation to inductive element 3 and feedback element 4, install inductive element 3 and feedback element 4 respectively on first base plate 1 and second base plate 2 simultaneously, realize inductive element 3 and feedback element 4 distribute along thickness direction, can reduce the area of first base plate 1 and second base plate 2. Moreover first gas pocket 11 and second gas pocket 21 are located induction element 3's both sides respectively, can detect the pressure differential between first gas pocket 11 and the second gas pocket 21 through at least induction element 3, the utility model discloses packaging structure is simple, and the size is less, and the cost is lower.
In an embodiment of the present invention, the feedback element 4 includes a temperature sensing unit, a signal processing unit and a storage unit, wherein the temperature sensing unit is used for acquiring an ambient temperature in real time and outputting a temperature signal; the storage unit stores the compensation coefficient for temperature compensation; and the signal processing unit is used for compensating the pressure signal according to the temperature signal and the temperature compensation coefficient. The signal processing unit of the feedback element 4 performs signal processing on the pressure signal from the sensing element 3 and the temperature signal from the temperature sensing unit, respectively, for example, the signal processing unit includes an amplifying circuit for amplifying the signals, the signal processing unit includes an analog-to-digital conversion circuit for performing analog-to-digital conversion on the pressure and temperature analog signals, outputs a digital signal which is accurate and convenient to transmit, further compensates the pressure signal according to the temperature signal and a pre-stored temperature compensation coefficient to overcome signal drift caused by temperature change, and outputs a compensated pressure signal, so that the differential pressure sensor more accurately outputs the pressure signal.
In an embodiment of the present invention, the feedback element 4 further includes a multiplexer, and the multiplexer respectively reads the pressure signal or the temperature signal according to a predetermined period and transmits the pressure signal or the temperature signal to the signal processing unit. The multiplexer enables the signal processing unit to process the pressure electric signals and the temperature electric signals in a time-sharing mode, so that the structural design of the signal processing unit is simplified, and the pressure signals and the temperature signals can be processed only by arranging one amplifier and one analog-to-digital converter. For example, the predetermined period is 1s, the multiplexer reads the pressure signal in 0-500ms, transmits the pressure signal to the amplifier and the analog-to-digital converter for signal processing, and reads the temperature signal in 501-1000ms and transmits the temperature signal to the amplifier and the analog-to-digital converter for signal processing, and then compensates the pressure signal according to the temperature signal and the pre-stored temperature compensation coefficient. The feedback element 4 further comprises a voltage stabilizing unit for providing an internal power supply, and those skilled in the art can design the voltage stabilizing unit according to practical application conditions to meet the power supply signal as a design criterion.
In this embodiment, as shown in fig. 1, a groove is recessed in a side of the second substrate 2 facing the first substrate 1, and a groove wall of the groove and the second substrate 2 enclose to form the accommodating cavity. The feedback element 4 is provided with the bottom wall of the groove, and the second air hole 21 is opened in the bottom wall of the groove. It can be ensured that the first substrate 1 and the second substrate 2 enclose to form a sealed enclosure, and a receiving cavity is formed between the first substrate 1 and the second substrate 2.
In other embodiments, a side of the first substrate 1 facing the second substrate 2 is concavely provided with a groove, and a groove wall of the groove and the first substrate 1 enclose to form the accommodating cavity; the induction element 3 is provided with the bottom wall of the groove, and the first air hole 11 is formed in the bottom wall of the groove. It can be ensured that the first substrate 1 and the second substrate 2 enclose to form a sealed enclosure, and a receiving cavity is formed between the first substrate 1 and the second substrate 2.
In an embodiment of the present invention, the first air hole 11 and the second air hole 21 are disposed in a staggered manner.
It can be understood that the first air hole 11 and the second air hole 21 are arranged in a staggered manner, that is, the first air hole 11 and the sensing element 3 are arranged in a staggered manner, so that the positions of the first air hole 11 and the sensing element 3 are not overlapped, and light and/or dust is prevented from entering the sensing element 3 through the second air hole 21 while the differential pressure sensor is ensured to be capable of sensing pressure, thereby ensuring the sensing accuracy of the sensing element 3.
In an embodiment of the present invention, the sensing element 3 includes a supporting portion 31 and a sensing portion 32 disposed in the accommodating cavity, and the periphery of the sensing portion 32 is connected to the supporting portion 31 to form a cavity 33; the supporting portion 31 is disposed around the first air hole 11, and one end of the supporting portion, which is far away from the sensing portion 32, is connected to the first substrate 1, so that the cavity 33 is communicated with the first air hole 11.
In this embodiment, the sensing element 3 is the capacitive pressure sensing element, and the sensing element 3 includes a sensing portion 32 for sensing pressure and a supporting portion 31 for supporting an edge of the sensing portion 32. The sensing portion 32 is deformed when a pressure difference exists between two sides thereof, so that the capacitance of the sensing portion 32 is changed, and the output signal of the sensing element 3 is changed.
The sensing portion 32 includes a back plate and a diaphragm opposite to the back plate, and the back plate and the diaphragm form a capacitor. The back plate and the diaphragm are both prepared by an MEMS process. The vibrating diaphragm is arranged between the supporting part 31 and the back plate, a third air hole is formed in the back plate, the third air hole is communicated with the containing cavity, and the third air hole is formed, so that the pressure difference of the first air hole 11 and the second air hole 21, namely the pressure difference in the cavity 33 and the containing cavity, can be detected through the vibrating diaphragm.
In this embodiment, one end of the supporting portion 31, which is far away from the sensing portion 32, is connected to the first substrate 1 through an adhesive, so as to fixedly connect the sensing element 3.
In an embodiment of the present invention, a plurality of first pads 12 are disposed on a side of the first substrate 1 facing the second substrate 2;
a plurality of second bonding pads 22 are arranged on one side of the second substrate 2 facing the first substrate 1, and the first bonding pads 12 are connected with the second bonding pads 22 in a one-to-one correspondence manner through conductive adhesives 5.
It is understood that the electrical connection of the first substrate 1 and the second substrate 2 is achieved by the connection of the first pads 12 and the second pads 22.
In an embodiment of the present invention, a first adhesive layer 6 is disposed on a periphery of the first substrate 1 or the second substrate 2, and the first substrate 1 and the second substrate 2 are connected by the first adhesive layer 6; the first substrate 1 and the second substrate 2 are grounded through one of the first pad 12 or the second pad 22. The first substrate 1 or the second substrate 2 is hermetically connected through the first adhesive layer 6 to form a shell, the first substrate 1, the first adhesive layer 6 and the second substrate 2 are grounded through one of the first bonding pad 12 or the second bonding pad 22, an electronic shielding effect can be achieved, the influence of an external signal of a packaging structure on the differential pressure sensor is avoided, and therefore the sensitivity and the precision of the differential pressure sensor are improved.
In this embodiment, the first substrate is plate-shaped, and the first pad is disposed on the first substrate in a protruding manner. The periphery of the second substrate is convexly arranged on the second substrate, the periphery of the second substrate is high in pressure and the height of the second bonding pad, and the first substrate and the second substrate can be rapidly assembled.
In an embodiment of the present invention, the differential pressure sensor further includes a plurality of first wires 14, the sensing element 3 is provided with a plurality of first pins 34, and each of the two ends of the first wire 14 is connected to one of the first pins 34 and one of the first pads 12 respectively. In this embodiment, the first pad is connected to a pin, and the pin of the first pad is connected to the first pin through a first wire.
In an embodiment of the present invention, the differential pressure sensor further includes a plurality of second wires 23, the feedback element 4 is provided with a plurality of second pins 24, the second substrate 2 is provided with a plurality of third pins 25 and fourth pins 26, and one second pin 24 is connected to one of the third pins 25 or the fourth pins 26 through one of the second wires 23; the third pins 25 are connected to the second pads 22 in a one-to-one correspondence, and the fourth pins are used for connecting to an external device.
In other embodiments, the second pin 24 of the feedback element 4 may also be directly connected to the first pin 34 of the sensing element 3 through a wire.
It can be understood that, in this embodiment, the second pin 24 is connected to the third pin 25 through the second wire 23, the third pin 25 is connected to the second pad 22, the second pad 22 is connected to the first pad 12, and the first pad 12 is connected to the first pin 34, so that the connection between the sensing element 3 and the feedback element 4 is realized, the number of wires is reduced, the connection stability can be improved, and the stable transmission of direct signals of the sensing element 3 and the feedback element 4 is ensured.
Meanwhile, in the present embodiment, the fourth pin 26 is used for connecting with an external device to output a differential pressure signal.
In an embodiment of the present invention, the second substrate 2 is provided with a second glue layer 7, and the feedback element 4 is connected to the second substrate 2 through the second glue layer 7.
It will be appreciated that the fixation of the feedback element 4 may be achieved by the second glue layer 7 connecting the feedback element 4 and the second substrate 2.
In an embodiment of the present invention, the sensing element 3 is a MEMS chip, and the feedback element 4 is an ASIC chip.
It should be noted that, in this embodiment, a longitudinal thickness space is used, the thicknesses of the MEMS chip and the ASIC chip are both very small, and the occupied thickness space is very small, but the longitudinal size can be greatly reduced, the occupation of the longitudinal space is reduced, and the required installation area of the differential pressure sensor is reduced.
The specific preparation process of this example is as follows: adhering the sensing element on a first substrate, wherein annular glue scribing is adopted around a first air hole on the first substrate; the feedback element is pasted on the second substrate;
connecting the sensing element and the first substrate by a first lead, and connecting the feedback element and the second substrate by a second lead for transmitting electric signals;
performing a silver paste/solder paste dispensing process on the periphery of the first substrate or the second substrate and the bonding pad;
and turning over the first substrate, pasting the first substrate in alignment with the second substrate, and then carrying out reflow/baking curing.
The utility model discloses still provide an electronic equipment, this electronic equipment includes electronic equipment main part and differential pressure sensor, and this differential pressure sensor's concrete structure refers to above-mentioned embodiment, because this electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here. Wherein the differential pressure sensor is provided in the electronic device main body.
The above is only the optional embodiment of the present invention, and not therefore the scope of the present invention is limited, all under the inventive concept, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A differential pressure sensor, characterized in that the differential pressure sensor comprises:
the first substrate is provided with a first air hole;
the first substrate and the second substrate are enclosed to form an accommodating cavity, and the second substrate is provided with a second air hole communicated with the accommodating cavity;
the induction element is arranged in the accommodating cavity, is connected with the first substrate and covers the first air hole; and
the feedback element is arranged in the accommodating cavity, is connected with the second substrate and is arranged at intervals with the second air hole; the feedback element is electrically connected with the sensing element.
2. The differential pressure sensor of claim 1, wherein the first gas orifice and the second gas orifice are offset.
3. The differential pressure sensor of claim 1, wherein the sensing element comprises a support portion and a sensing portion disposed within the receiving cavity, the support portion being attached to a periphery of the sensing portion to form a cavity; the supporting part is arranged around the first air hole, and one end, far away from the sensing part, of the supporting part is connected with the first substrate, so that the cavity is communicated with the first air hole.
4. The differential pressure sensor according to claim 1, wherein a side of the first substrate facing the second substrate is provided with a plurality of first pads;
one side of the second substrate, which faces the first substrate, is provided with a plurality of second bonding pads, and the first bonding pads and the second bonding pads are connected in a one-to-one correspondence mode through conductive adhesives.
5. The differential pressure sensor of claim 4, wherein a perimeter of the first or second substrate is provided with a first glue layer, the first and second substrates being connected by the first glue layer;
and/or the first substrate and the second substrate are grounded through one first bonding pad or one second bonding pad.
6. The differential pressure sensor as recited in claim 4 wherein said differential pressure sensor further comprises a plurality of first conductive lines, said sensing element having a plurality of first leads, one first lead and one said first pad connected to each end of said first conductive line.
7. The differential pressure sensor of claim 4, wherein the differential pressure sensor further comprises a plurality of second conductive lines, the feedback element has a plurality of second pins, the second substrate has a plurality of third pins and fourth pins, and a second pin is connected to one of the third pins or the fourth pin through one of the second conductive lines; the third pins are connected with the second bonding pads in a one-to-one correspondence mode, and the fourth pins are used for being connected with external equipment.
8. The differential pressure sensor of claim 1, wherein the second substrate is provided with a second layer of glue, the feedback element being connected to the second substrate by the second layer of glue.
9. The differential pressure sensor according to any one of claims 1 to 8, wherein the first substrate is made of ceramic;
and/or the second substrate is made of ceramic;
and/or, the sensing element is a MEMS chip;
and/or the feedback element is an ASIC chip.
10. An electronic apparatus, characterized in that the electronic apparatus comprises an electronic apparatus main body and the differential pressure sensor according to any one of claims 1 to 9, the differential pressure sensor being provided to the electronic apparatus main body.
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| CN202022827989.7U CN213688773U (en) | 2020-11-30 | 2020-11-30 | Differential pressure sensor and electronic device |
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| CN202022827989.7U CN213688773U (en) | 2020-11-30 | 2020-11-30 | Differential pressure sensor and electronic device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114184233A (en) * | 2021-12-13 | 2022-03-15 | 上海立格仪表有限公司 | Intelligent sensor module and control method thereof |
| CN115962880A (en) * | 2021-10-11 | 2023-04-14 | 精量电子（深圳）有限公司 | Sensing device |
-
2020
- 2020-11-30 CN CN202022827989.7U patent/CN213688773U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115962880A (en) * | 2021-10-11 | 2023-04-14 | 精量电子（深圳）有限公司 | Sensing device |
| CN114184233A (en) * | 2021-12-13 | 2022-03-15 | 上海立格仪表有限公司 | Intelligent sensor module and control method thereof |
| CN114184233B (en) * | 2021-12-13 | 2022-11-25 | 上海立格仪表有限公司 | Intelligent sensor module and control method thereof |
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