CN213680958U

CN213680958U - Composite anode plate for electro-coppering

Info

Publication number: CN213680958U
Application number: CN202022630790.5U
Authority: CN
Inventors: 谷建华; 黄雷
Original assignee: Kunshan Chenggong Environmental Protection Technology Co ltd
Current assignee: Chenggong Environmental Protection Technology Nantong Co ltd; Jiangsu Sizhi Semiconductor Technology Co ltd
Priority date: 2020-11-14
Filing date: 2020-11-14
Publication date: 2021-07-13
Anticipated expiration: 2030-11-14

Abstract

The utility model relates to an electroplate technical field, and disclose a compound anode plate for electro-coppering, including the reaction ware, the mount has been cup jointed in the inside activity of draw-in groove, the blowing groove has been seted up at the mount top, mount one side surface demountable installation has the electrode active layer, mount opposite side surface demountable installation has the metal level. This kind of compound anode plate for electro-coppering, the blowing groove has been seted up through the mount top, mount one side surface demountable installation has the electrode active layer, mount opposite side surface demountable installation has the metal level, the problem of the electroplating inequality that the state leads to and electroplating interruption is interrupted to the solution needs to interrupt when electroplating the emergence composite anode material, there is the slider through activity inslot portion swing joint, slider outside fixed mounting has the fixed slot, the position state that has solved to be difficult to adjust compound anode plate when the reaction goes on guarantees the integrality problem of electroplating.

Description

Composite anode plate for electro-coppering

Technical Field

The utility model relates to an electroplate technical field, specifically be a compound anode plate for electro-coppering.

Background

On a printed circuit board, copper is used for interconnecting components on a substrate, and although it is a good conductor material for forming a pattern of a conductive path surface of the printed circuit board, it is easily tarnished by oxidation and solderability is lost by corrosion if exposed to air for a long time, and therefore, it is necessary to protect copper tracks, via holes and plated through holes using various techniques including organic painting, oxide film and plating techniques, in which the metal plating layer has characteristics of enhancing corrosion resistance of metal, increasing hardness, preventing abrasion, improving conductivity, smoothness, heat resistance and surface beauty.

In the copper electroplating technology, a soluble anode is adopted, preplated metal is used as the anode, the anode metal is dissolved during electroplating and is deposited on a cathode in a metal form, in the process, a composite anode plate is gradually reduced along with the electroplating time, the form of an electrode active layer needs to be added or the state of the composite anode plate needs to be adjusted to maintain the integrity of electroplating, in the adding process, the electroplating process needs to be interrupted, so that the electroplating cannot be normally carried out, and redundant waste materials after electrolysis can fall into electrolyte to greatly form waste resources, so that the composite anode plate for copper electroplating is provided.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides a compound anode plate for electro-coppering possesses the interpolation anode material that can be incessant, can adjust and wait to plate the interval between the object and improve the ageing of electroplating, and the scheduling advantage has solved the problem of mentioning in the background art.

(II) technical scheme

In order to realize the purpose of uninterruptedly adding the anode material, adjusting the distance between the anode material and the object to be plated to improve the timeliness of electroplating, the utility model provides the following technical scheme: the utility model provides a copper electroplating is with compound anode plate, includes the reaction ware, the plating bath has been seted up at reaction ware top, the activity groove has been seted up to reaction ware inner wall, the inside swing joint in activity groove has the slider, slider outside fixed mounting has the fixed slot, the draw-in groove has all been seted up to both sides about the reaction ware top, the mount has been cup jointed in the inside activity of draw-in groove, the blowing groove has been seted up at the mount top, mount one side surface demountable installation has the electrode active layer, mount opposite side surface demountable installation has the metal level, mount below fixedly connected with retrieves the net, it runs through and has seted up the hole to retrieve net top surface, the scale mark has been seted.

Preferably, the number of the movable grooves is two, the movable grooves are respectively and symmetrically arranged in the middle of the inner wall of the reaction vessel, and the length value of the movable grooves is equal to the width value of the reaction vessel.

Preferably, the inside activity of draw-in groove cup joints and remains the coating bath, the shape of treating the coating bath is two L shape grooves of symmetrical placement, the slider with the quantity of fixed slot is four, is located two respectively the even symmetrical placement in activity inslot portion, just the size of slider with the size looks adaptation of activity groove.

Preferably, the number of the clamping grooves is four, the four clamping grooves are symmetrically arranged on the upper side and the lower side of the top of the reaction vessel respectively, and the size of each clamping groove is matched with that of the top of the fixing frame.

Preferably, the size of the discharging groove is equal to that of the electrode active layer, and the size of the discharging groove is matched with the size of the openings at the left side and the right side of the fixing frame.

Preferably, the size of the recovery net is equal to the size of the bottom of the reaction vessel, the diameter of each hole is one millimeter, the number of the scale marks is eight, and the scale marks are vertically arranged on the inner wall of the right side of the reaction vessel at equal intervals.

(III) advantageous effects

Compared with the prior art, the utility model discloses possess following beneficial effect:

1. this kind of compound anode plate for electro-coppering has seted up the blowing groove through the mount top, mount one side surface demountable installation has the electrode active layer, mount opposite side surface demountable installation has the metal level, it can add electrode active layer and metal level in the blowing groove when electroplating going on to have realized, the integrality of the electroplating process of being convenient for is ended, the problem of electroplating unevenness and electroplating interruption that the state of electroplating leads to need to interrupt when electroplating the emergence when needing to add compound anode material is solved.

2. This kind of compound anode plate for electro-coppering has the slider through the inside swing joint of activity inslot, and slider outside fixed mounting has the fixed slot, and the draw-in groove has all been seted up to both sides about the reaction ware top, adjusts the position of slider and activity groove for thereby the reaction can be adjusted and treat to plate the distance between object and the electrode, and the process that goes on is electroplated in the control, has solved and has been difficult to adjust the position state of compound anode plate when the reaction goes on and has guaranteed the integrality problem of electroplating.

Drawings

FIG. 1 is a schematic view of the whole structure of the present invention;

FIG. 2 is a schematic side view of the structure of the present invention;

fig. 3 is a schematic enlarged view of a part a of the structure diagram 1 of the present invention.

In the figure: 1. a reaction vessel; 2. an electroplating bath; 3. a movable groove; 4. a slider; 5. fixing grooves; 6. a card slot; 7. a fixed mount; 8. a discharging groove; 9. an electrode active layer; 10. a metal layer; 11. recovering the net; 12. a hole; 13. scale lines; 14. and (5) a tank to be plated.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

Examples

Referring to fig. 1-3, a composite anode plate for electro-coppering comprises a reaction vessel 1, an electroplating bath 2 is arranged on the top of the reaction vessel 1, a movable groove 3 is arranged on the inner wall of the reaction vessel 1, the number of the movable grooves 3 is two, the movable grooves are respectively and symmetrically arranged in the middle of the inner wall of the reaction vessel 1, the length value is equal to the width value of the reaction vessel 1, a slide block 4 is movably connected in the movable groove 3, a fixed groove 5 is fixedly arranged on the outer side of the slide block 4, the number of the slide block 4 and the number of the fixed groove 5 are four, the slide block 4 is respectively and symmetrically arranged in the two movable grooves 3, the size of the slide block 4 is matched with the size of the movable groove 3, the upper side and the lower side of the top of the reaction vessel 1 are respectively and symmetrically arranged on the upper side and the lower side of the top of the reaction vessel 1, the size, so that the reaction can adjust the distance between the object to be plated and the electrode, control the progress of electroplating, the slot 6 is movably sleeved with the groove 14 to be plated, the groove 14 to be plated is shaped as two L-shaped slots which are symmetrically arranged, the slot 6 is movably sleeved with the fixing frame 7, the top of the fixing frame 7 is provided with the discharging groove 8, one side surface of the fixing frame 7 is detachably provided with the electrode active layer 9, the size of the discharging groove 8 is equal to that of the electrode active layer 9, the size of the discharging groove 8 is matched with the size of the openings at the left side and the right side of the fixing frame 7, the other side surface of the fixing frame 7 is detachably provided with the metal layer 10, the electrode active layer 9 and the metal layer 10 are added in the discharging groove 8, the completeness of the electroplating process is conveniently finished, the recovery net 11 is fixedly connected below the fixing frame 7, the top surface of the recovery net 11 is provided with the holes 12 in a penetrating, the reuse rate of this composite anode plate has been improved, and scale mark 13 has been seted up on 1 inner wall right side of reaction dish, and the size of retrieving net 11 equals with 1 bottom size of reaction dish, and the diameter value of hole 12 is a millimeter, and the quantity of scale mark 13 is eight, and equidistant vertical arrangement is respectively on 1 right side inner wall of reaction dish, adds equivalent electrolyte according to scale mark 13 for control electroplating process.

The working principle is as follows: firstly, the matched electrode active layer 9 and the metal layer 10 are fixedly arranged at the left side and the right side of the fixing frame 7, then an object to be plated is placed in the groove 14 to be plated, finally, the electrode active layer 9 and the metal layer 10 are added in the material discharge groove 8 in the electroplating process, the completeness of the electroplating process is convenient to finish, the recovery net 11 can recover the electrolyzed electrode active layer 9 and the electrolyzed metal layer 10 for continuous use, the repeated utilization rate of the composite anode plate is improved, the position of the sliding block 4 and the position of the movable groove 3 are adjusted, so that the reaction can adjust the distance between the object to be plated and the electrode, and the electroplating progress is controlled.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a compound anode plate for electro-coppering, includes reaction dish (1), its characterized in that: the top of the reaction vessel (1) is provided with an electroplating bath (2), the inner wall of the reaction vessel (1) is provided with a movable groove (3), a sliding block (4) is movably connected in the movable groove (3), a fixed groove (5) is fixedly arranged on the outer side of the sliding block (4), the upper side and the lower side of the top of the reaction vessel (1) are both provided with a clamping groove (6), a fixing frame (7) is movably sleeved in the clamping groove (6), a feed trough (8) is arranged at the top of the fixed frame (7), an electrode active layer (9) is detachably arranged on the surface of one side of the fixed frame (7), a metal layer (10) is detachably arranged on the other side surface of the fixed frame (7), the reaction vessel is characterized in that a recovery net (11) is fixedly connected to the lower portion of the fixing frame (7), a hole (12) is formed in the top surface of the recovery net (11) in a penetrating mode, and scale marks (13) are formed in the right side of the inner wall of the reaction vessel (1).

2. The composite anode plate for electrolytic copper plating according to claim 1, characterized in that: the number of the movable grooves (3) is two, the movable grooves are respectively positioned in the middle of the inner wall of the reaction vessel (1) and are symmetrically arranged, and the length value is equal to the width value of the reaction vessel (1).

3. The composite anode plate for electrolytic copper plating according to claim 1, characterized in that: the inside activity of draw-in groove (6) is cup jointed and is waited coating bath (14), the shape of treating coating bath (14) is two L shape grooves of symmetrical placing, slider (4) with the quantity of fixed slot (5) is four, is located two respectively the inside even symmetry of activity groove (3) is placed, just the size of slider (4) with the size looks adaptation of activity groove (3).

4. The composite anode plate for electrolytic copper plating according to claim 1, characterized in that: the number of the clamping grooves (6) is four, the four clamping grooves are symmetrically arranged on the upper side and the lower side of the top of the reaction vessel (1), and the size of each clamping groove (6) is matched with that of the top of the fixing frame (7).

5. The composite anode plate for electrolytic copper plating according to claim 1, characterized in that: the size of the discharging groove (8) is equal to that of the electrode active layer (9), and the size of the discharging groove (8) is matched with the sizes of the openings at the left side and the right side of the fixing frame (7).

6. The composite anode plate for electrolytic copper plating according to claim 1, characterized in that: retrieve the size of net (11) with reaction ware (1) bottom size equals, the diameter value of hole (12) is a millimeter, the quantity of scale mark (13) is eight, and equidistant vertical arrangement respectively is in on the inner wall of reaction ware (1) right side.