CN213613819U - Semiconductor thermoelectric device wire tool of bending - Google Patents

Abstract

The utility model relates to a semiconductor thermoelectric device wire tool of bending. It is not good that it has solved protection nature effect when wire buckles among the prior art, and the problem that packaging efficiency is low. It includes mounting plate, the mounting plate upper end is equipped with the semiconductor thermoelectric device that has the wire through unable adjustment base, it is equipped with the wire location structure that is vertical setting to lie in semiconductor thermoelectric device one side on the unable adjustment base, and semiconductor thermoelectric device upper end is equipped with and compresses tightly fixed subassembly, compress tightly the wire joint subassembly that forms removable continuous between fixed subassembly one side and the wire location structure upper end, and semiconductor thermoelectric device circumference is equipped with location installation mechanism, one side that location installation mechanism lies in wire joint subassembly is equipped with wire guide structure. The utility model has the advantages that: the protection effect on the circuit substrate is good, the lead is more convenient to bend, and the assembly efficiency is improved.

Description

Semiconductor thermoelectric device wire tool of bending

Technical Field

The utility model relates to a semiconductor thermoelectric module erection equipment field, concretely relates to semiconductor thermoelectric device wire tool of bending.

Background

When the traditional semiconductor thermoelectric device is installed, the wire is bent manually by a worker, and the following problems exist in the manual mode: the bending efficiency is low, the reject ratio and the rejection rate are high, the consistency is poor, welding spots are easy to fall off, and a substrate is easy to deform, so that the assembly efficiency is low due to a manual mode, the semiconductor thermoelectric device is easy to damage, and the protection effect is poor; simultaneously, the equipment of buckling that uses at present adds the guide die in the mould that the wire was buckled, and the wire quality that can make to buckle like this is relatively poor, can appear the error when controlling wire length, and the accuracy is not enough, can not adapt to the different wire of diameter, uses the flexibility not enough, and the flexibility is not good.

In order to solve the defects of the prior art, people have long searched for and put forward various solutions. For example, chinese patent document discloses a wire bending device [ CN201910315203.2], which includes a driving mechanism, the driving mechanism includes a main driving working chamber and a main driving motor, a first main driving pulley and a second main driving pulley are disposed in the main driving working chamber, a straightening mechanism is disposed on the upper side of the driving mechanism, the wire to be bent is straightened by the straightening mechanism, the length of the cut wire is controlled by a cutting mechanism, the bent wire can be sent out of the device by a bending and discharging mechanism for the next bending, a guide die is added during bending to improve the quality of bending, reduce the bending defect of the wire, and the guide die can be adjusted to adapt to wires with different diameters, and can adapt to the requirement of automatic operation.

The problem that the accuracy is not enough and the flexibility is not good when wire is buckled among the prior art has been solved to a certain extent to above-mentioned scheme, but this scheme still has a lot of not enoughly, for example: the protective effect is not good, the thermoelectric device is easily damaged, the bending speed of the lead is low, and the assembly efficiency is influenced.

Disclosure of Invention

The utility model aims at the above-mentioned problem, provide a reasonable in design, the semiconductor thermoelectric device wire tool of bending that protecting effect is good and the packaging efficiency is high.

In order to achieve the above purpose, the utility model adopts the following technical proposal: this semiconductor thermoelectric device wire tool of bending, including mounting plate, the mounting plate upper end is equipped with the semiconductor thermoelectric device that has the wire through unable adjustment base, it is equipped with the wire location structure that is vertical setting to lie in semiconductor thermoelectric device one side on the unable adjustment base, and semiconductor thermoelectric device upper end is equipped with compresses tightly fixed subassembly, compress tightly the wire joint subassembly that forms removable continuous between fixed subassembly one side and the wire location structure upper end, and semiconductor thermoelectric device circumference is equipped with location installation mechanism, one side that location installation mechanism lies in wire joint subassembly is equipped with wire guide structure. Through setting up wire location structure and setting up the fixed subassembly that compresses tightly in semiconductor thermoelectric device upper end and mutually supporting in semiconductor thermoelectric device one side that has the wire, buckle again after carrying out the location to the wire and compressing tightly, not only can prevent that the wire from causing the solder joint to drop and be located the circuit substrate deformation on the semiconductor thermoelectric device at the in-process of buckling, moreover, reduced the degree of difficulty that the wire buckled, it is better to make the uniformity after the wire buckles through wire guide structure, improved packaging efficiency and protecting effect good.

In foretell semiconductor thermoelectric device wire tool of bending, wire location structure is equipped with the vertical installation department that edgewise installation groove axial set up including setting up the bar mounting groove in unable adjustment base upper end in the mounting groove, and vertical installation department up end is equipped with a plurality of wire bending grooves that are the U-shaped, and one side that vertical installation department upper end is close to semiconductor thermoelectric device is equipped with the location step. Utilize wire bending groove to fix a position the wire, compress tightly the base plate portion that compresses tightly fixed subassembly one side through location step and being located and fix circuit substrate, stability is good, prevents that the in-process that the wire buckled, the condition of displacement from appearing.

In the semiconductor thermoelectric device wire bending jig, the middle part of the vertical installation part is provided with the positioning groove vertically extending along the vertical installation part, and two sides of one end of the positioning groove form the L-shaped wire positioning part. The fixing part is tightly connected with the vertical installation part through the positioning groove and the insertion rod positioned on the fixing part, so that the conducting wire is positioned and fastened more tightly.

In foretell semiconductor thermoelectric device wire tool of bending, compress tightly fixed subassembly and include U-shaped joint portion, U-shaped joint portion is equipped with towards one side of vertical installation department and has the base plate to compress tightly the portion, and base plate compresses tightly the portion bottom and is corresponding the setting with the location step, and still is equipped with the fixed part in the U-shaped joint portion, and the fixed part bottom is equipped with a plurality of scarf joint portions that are the one-to-one setting with the wire bending groove, and scarf joint portion pegs graft in the wire bending groove that corresponds. Compress tightly fixedly through U-shaped joint portion to semiconductor thermoelectric device, utilize base plate to compress tightly portion with circuit substrate one end closely fixed on the location step, through scarf joint portion and wire bending groove mutually support make the wire buckle when closely fixed.

In foretell semiconductor thermoelectric device wire tool of bending, scarf joint portion one side be equipped with be located the wire bending groove between the joint bellying correspond and set up the joint groove, the joint bellying sets up in the joint inslot that corresponds. The fixing part is connected with the upper end face of the vertical installation part more tightly when the clamping groove and the clamping bulge are connected.

In foretell semiconductor thermoelectric device wire tool of bending, the fixed part middle part is equipped with and is the peg graft pole that corresponds the setting with the constant head tank, and the peg graft pole is pegged graft in the constant head tank, and peg graft pole both sides are equipped with the wire portion of compressing tightly that corresponds the setting with L shape wire location portion, and the wire compresses tightly the groove with formation wire between L shape wire location portion. The lead can be effectively positioned through the lead pressing groove formed between the L-shaped lead positioning part and the lead pressing part.

In the above semiconductor thermoelectric device wire bending jig, the semiconductor thermoelectric device includes a circuit substrate, the upper and lower sides of the circuit substrate are provided with heat dissipation fins, the heat dissipation fins are circumferentially fixed by locking members, one end of the circuit substrate is exposed out of the heat dissipation fins and arranged on the positioning steps, and one end of the wire penetrates through the arc-shaped positioning groove at the bottom of the substrate pressing portion to be connected with the circuit substrate in a welding manner.

In foretell semiconductor thermoelectric device wire tool of bending, location installation mechanism establishes the fixed mounting spare in the semiconductor thermoelectric device circumference outside including the cover, and the fixed mounting spare both ends are equipped with the installation department, and installation department one end is equipped with the joint location portion of vertical setting, and wire guide structure is equipped with the wire standing groove including setting up the guide part in fixed mounting spare towards wire location structure one side, the guide part outer wall, and the vertical wire constant head tank that is located between the wire standing groove that is equipped with on the guide part. The wire positioning groove and the wire placing groove are arranged to enable the wire to be bent more consistently and to be placed easily.

In the semiconductor thermoelectric device lead bending jig, the substrate pressing portion is provided with L-shaped clamping portions used for clamping two ends of the upper side of the vertical installation portion. The setting up of L shape joint portion makes the stability between vertical installation department and the wire location structure better.

In the semiconductor thermoelectric device lead bending jig, the lead clamping assembly is formed between the fixing part and the vertical mounting part.

Compared with the prior art, the utility model has the advantages of: simple structure, it is convenient to install, one side through having the wire at semiconductor thermoelectric device sets up wire location structure, utilize wire fixed knot structure and the fixed subassembly that compresses tightly of setting in semiconductor thermoelectric device upper end to compress tightly the location to the wire, and utilize the interact of location step and base plate portion of compressing tightly to stabilize circuit substrate, prevent that circuit substrate from producing the displacement, not only can prevent that the wire from causing the solder joint to drop or be located the circuit substrate deformation on the semiconductor thermoelectric device at the in-process of buckling, moreover, the degree of difficulty that the wire buckled has been reduced, improved packaging efficiency and protecting effect is good.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of the compressing and fixing assembly of the present invention;

fig. 3 is a schematic structural view of the fixing base and the wire positioning structure of the present invention when they are connected;

fig. 4 is a schematic structural view of a semiconductor thermoelectric device according to the present invention;

fig. 5 is a schematic structural view of the positioning and mounting mechanism and the wire guiding structure according to the present invention.

In the figure, a mounting base plate 1, a fixed base 11, a semiconductor thermoelectric device 2, a wire 21, a circuit substrate 22, a heat sink 23, a locking member 24, a wire positioning structure 3, a bar-shaped mounting groove 31, a vertical mounting portion 32, a wire bending groove 33, a positioning step 34, a positioning groove 35, an L-shaped wire positioning portion 36, a clamping boss 37, a clamping fixed component 4, a U-shaped clamping portion 41, a substrate clamping portion 42, an L-shaped clamping portion 421, a fixing portion 43, a scarf joint portion 44, a clamping groove 45, a plug rod 46, a wire clamping portion 47, a wire clamping groove 48, an arc-shaped positioning groove 49, a wire clamping component 5, a positioning mounting mechanism 6, a fixed mounting member 61, a mounting portion 62, a clamping positioning portion 63, a wire guide structure 7, a guide portion 71, a wire placing groove 72, and a.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1-5, this semiconductor thermoelectric device wire tool of bending, including mounting plate 1, mounting plate 1 upper end is equipped with semiconductor thermoelectric device 2 that has wire 21 through unable adjustment base 11, it is equipped with wire location structure 3 that is vertical setting to lie in semiconductor thermoelectric device 2 one side on unable adjustment base 11, and semiconductor thermoelectric device 2 upper end is equipped with compresses tightly fixed subassembly 4, compress tightly and form detachable continuous wire joint subassembly 5 between fixed subassembly 4 one side and the wire location structure 3 upper end, and semiconductor thermoelectric device 2 circumference is equipped with location installation mechanism 6, one side that location installation mechanism 6 is located wire joint subassembly 5 is equipped with wire guide structure 7. Through setting up wire location structure 3 in semiconductor thermoelectric device 2 one side and fixing wire 21, utilize to compress tightly fixed subassembly 4 and compress tightly wire 21, not only can effectively prevent semiconductor thermoelectric device 2 when wire 21 buckles, prevent that the solder joint of wire tip from droing and the condition that circuit substrate 22 warp, and reduced the degree of difficulty that wire 21 buckled moreover, it is better to make the uniformity after the wire 21 buckles through wire guide structure 7, the packaging efficiency has been improved.

Wherein, wire location structure 3 is equipped with the vertical installation department 32 along the axial setting of strip mounting groove 31 including setting up strip mounting groove 31 in unable adjustment base 11 upper end in the mounting groove, and vertical installation department 32 up end is equipped with a plurality of wire bending grooves 33 that are the U-shaped, and one side that vertical installation department 32 upper end is close to semiconductor thermoelectric device 2 is equipped with location step 34. The lead bending groove 33 is mainly used for placing the lead 21, and the depth and the width of the lead bending groove 33 are both larger than the diameter of the lead 21; the positioning step 34 is used for pressing and positioning the circuit substrate 22 by matching with the substrate pressing part 42, so that the situation that the circuit substrate 22 displaces to cause welding spots to fall off when the lead 21 is bent is prevented.

As can be seen, the middle of the vertical mounting part 32 is provided with a positioning groove 35 extending vertically along the vertical mounting part 32, and two sides of one end of the positioning groove 35 form an L-shaped wire positioning part 36.

Further, compress tightly fixed subassembly 4 and include U-shaped joint portion 41, U-shaped joint portion 41 is equipped with towards one side of vertical installation department 32 and has base plate portion 42 that compresses tightly, and base plate portion 42 bottom and location step 34 are the corresponding setting, and still is equipped with fixed part 43 on the U-shaped joint portion 41, and fixed part 43 bottom is equipped with a plurality of scarf joints portion 44 that are the one-to-one setting with wire bending groove 33, and scarf joints portion 44 is pegged graft in corresponding wire bending groove 33. The substrate pressing portion 42 here is closely attached to the positioning step 34, and the thickness of the fixing portion 43 is the same as that of the wire bending groove 33.

In detail, one side of the scarf joint part 44 is provided with a clamping groove 45 corresponding to the clamping convex part 37 between the wire bending grooves 33, and the clamping convex part 37 is arranged in the corresponding clamping groove 45. The engagement of the engaging groove 45 and the engaging portion 44 improves the positioning of the lead wire 21 in the lead wire bending groove 33.

Specifically, the middle portion of the fixing portion 43 is provided with an insertion rod 46 corresponding to the positioning groove 35, the insertion rod 46 is inserted into the positioning groove 35, two sides of the insertion rod 46 are provided with wire pressing portions 47 corresponding to the L-shaped wire positioning portions 36, and a wire pressing groove 48 is formed between the wire pressing portions 47 and the L-shaped wire positioning portions 36.

Furthermore, the semiconductor thermoelectric device 2 includes a circuit substrate 22, the upper and lower sides of the circuit substrate 22 are provided with heat sinks 23, the heat sinks 23 are circumferentially fixed by the locking members 24, one end of the circuit substrate 22 is exposed out of the heat sinks 23 and is disposed on the positioning steps 34, and one end of the lead 21 passes through the arc-shaped positioning slot 49 located at the bottom of the substrate pressing portion 42 and is connected with the circuit substrate 22 by welding. The arcuate positioning slot 49 further positions the wire 21.

Obviously, the positioning and mounting mechanism 6 includes a fixing mounting member 61 sleeved on the outer side of the semiconductor thermoelectric device 2 in the circumferential direction, mounting portions 62 are provided at two ends of the fixing mounting member 61, and one end of each mounting portion 62 is provided with a vertically arranged clamping positioning portion 63, the wire guiding structure 7 includes a guiding portion 71 provided on one side of the fixing mounting member 61 facing the wire positioning structure 3, a wire placing groove 72 is provided on the outer wall of the guiding portion 71, and a wire positioning groove 73 located between the wire placing grooves 72 is vertically provided on the guiding portion 71. Wire constant head tank 73 here is located the same axis with constant head tank 35, and has the bar through-hole that corresponds the setting with bar mounting groove 31 on the fixed mounting piece 61, and wherein the guide part 71 middle part passes through connecting portion and links to each other with fixed mounting piece 61 bottom, and connecting portion are located constant head tank 35 department and are equipped with spacing bellying.

Preferably, the substrate pressing portion 42 is provided with L-shaped clamping portions 421 for clamping at both ends of the upper side of the vertical mounting portion 32.

More specifically, the fixing portion 43 and the vertical mounting portion 32 together form the wire clamping assembly 5.

The principle of the embodiment is as follows: the lead 21 is positioned through the lead bending groove 33 and the L-shaped lead positioning part 36, the lead positioned in the lead bending groove 33 is compressed by the embedding part 44, the lead 21 positioned on the L-shaped lead positioning part 36 is compressed by the lead compressing part 47 and the lead compressing groove 48 formed by the L-shaped lead positioning part 36, meanwhile, the circuit substrate 22 is positioned by the mutual matching of the positioning step 34 and the substrate compressing part 42, so that the circuit substrate 22 and the lead 21 are relatively positioned, the condition that the welding spot falls off or the circuit substrate 22 is damaged due to the fact that the circuit substrate 22 and the lead 21 generate relative movement when the lead 21 is bent is prevented, the lead is bent more conveniently, and the assembly efficiency is improved.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Although the mounting baseplate 1, the fixing base 11, the semiconductor thermoelectric device 2, the wires 21, the circuit substrate 22, the heat sink 23, the locking member 24, the wire positioning structure 3, the bar-shaped mounting groove 31, the vertical mounting portion 32, the wire bending groove 33, the positioning step 34, the positioning groove 35, the L-shaped wire positioning portion 36, the snap projection 37, the hold-down fixing member 4, the U-shaped snap portion 41, the substrate hold-down portion 42 are used more frequently herein, the terms of the L-shaped engaging portion 421, the fixing portion 43, the engaging portion 44, the engaging groove 45, the inserting rod 46, the wire pressing portion 47, the wire pressing groove 48, the arc-shaped positioning groove 49, the wire engaging component 5, the positioning and mounting mechanism 6, the fixing and mounting member 61, the mounting portion 62, the engaging and positioning portion 63, the wire guiding structure 7, the guiding portion 71, the wire placing groove 72, the wire positioning groove 73, etc., do not exclude the possibility of using other terms. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed in a manner that is inconsistent with the spirit of the invention.

Claims (10)

1. The utility model provides a semiconductor thermoelectric device wire tool of bending, includes mounting plate (1), mounting plate (1) upper end be equipped with semiconductor thermoelectric device (2) that have wire (21) through unable adjustment base (11), its characterized in that, unable adjustment base (11) on lie in semiconductor thermoelectric device (2) one side and be equipped with wire location structure (3) of vertical setting, and semiconductor thermoelectric device (2) upper end be equipped with and compress tightly fixed subassembly (4), compress tightly between fixed subassembly (4) one side and wire location structure (3) upper end and form removable continuous wire joint subassembly (5), just semiconductor thermoelectric device (2) circumference be equipped with location installation mechanism (6), one side that location installation mechanism (6) lie in wire joint subassembly (5) be equipped with wire guide structure (7).

2. The semiconductor thermoelectric device wire bending jig according to claim 1, wherein the wire positioning structure (3) comprises a strip-shaped mounting groove (31) arranged at the upper end of the fixing base (11), a vertical mounting portion (32) axially arranged along the strip-shaped mounting groove (31) is arranged in the mounting groove, a plurality of U-shaped wire bending grooves (33) are formed in the upper end face of the vertical mounting portion (32), and a positioning step (34) is arranged on one side, close to the semiconductor thermoelectric device (2), of the upper end of the vertical mounting portion (32).

3. The semiconductor thermoelectric device lead bending jig as claimed in claim 2, wherein a positioning groove (35) vertically extending along the vertical mounting portion (32) is provided in the middle of the vertical mounting portion (32), and L-shaped lead positioning portions (36) are formed on both sides of one end of the positioning groove (35).

4. The semiconductor thermoelectric device lead bending jig according to claim 3, wherein the pressing and fixing assembly (4) comprises a U-shaped clamping portion (41), a substrate pressing portion (42) is arranged on one side, facing the vertical mounting portion (32), of the U-shaped clamping portion (41), the bottom of the substrate pressing portion (42) is correspondingly arranged with the positioning step (34), a fixing portion (43) is further arranged on the U-shaped clamping portion (41), a plurality of embedding portions (44) which are correspondingly arranged with the lead bending grooves (33) in a one-to-one manner are arranged at the bottom of the fixing portion (43), and the embedding portions (44) are inserted into the corresponding lead bending grooves (33).

5. The semiconductor thermoelectric device lead bending jig according to claim 4, wherein one side of the embedding part (44) is provided with clamping grooves (45) corresponding to the clamping convex parts (37) positioned between the lead bending grooves (33), and the clamping convex parts (37) are arranged in the corresponding clamping grooves (45).

6. The semiconductor thermoelectric device lead bending jig as claimed in claim 5, wherein an insertion rod (46) is disposed in the middle of the fixing portion (43) and corresponds to the positioning groove (35), the insertion rod (46) is inserted into the positioning groove (35), lead pressing portions (47) corresponding to the L-shaped lead positioning portions (36) are disposed on two sides of the insertion rod (46), and lead pressing grooves (48) are formed between the lead pressing portions (47) and the L-shaped lead positioning portions (36).

7. The semiconductor thermoelectric device lead bending jig according to claim 4, wherein the semiconductor thermoelectric device (2) comprises a circuit substrate (22), heat dissipation fins (23) are arranged on the upper side and the lower side of the circuit substrate (22), the heat dissipation fins (23) are fixed in the circumferential direction through locking pieces (24), one end of the circuit substrate (22) is exposed out of the heat dissipation fins (23) and arranged on the positioning steps (34), and one end of the lead (21) penetrates through an arc-shaped positioning groove (49) formed in the bottom of the substrate pressing portion (42) to be connected with the circuit substrate (22) in a welding mode.

8. The semiconductor thermoelectric device wire bending jig according to claim 7, wherein the positioning installation mechanism (6) comprises a fixing mounting part (61) sleeved on the outer side of the circumference of the semiconductor thermoelectric device (2), mounting parts (62) are arranged at two ends of the fixing mounting part (61), a vertically arranged clamping positioning part (63) is arranged at one end of each mounting part (62), the wire guiding structure (7) comprises a guiding part (71) arranged on one side, facing the wire positioning structure (3), of the fixing mounting part (61), wire placing grooves (72) are formed in the outer wall of each guiding part (71), and wire positioning grooves (73) located between the wire placing grooves (72) are vertically formed in the guiding parts (71).

9. The semiconductor thermoelectric device lead bending jig according to claim 8, wherein the substrate pressing portion (42) is provided with L-shaped clamping portions (421) for clamping at both ends of the upper side of the vertical mounting portion (32).

10. The semiconductor thermoelectric device lead bending jig according to claim 4, wherein the fixing portion (43) and the vertical mounting portion (32) together form the lead clamping assembly (5).

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