CN213546300U - Water-cooled airtight glass-metal sealing structure - Google Patents
Water-cooled airtight glass-metal sealing structure Download PDFInfo
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- CN213546300U CN213546300U CN202022188965.1U CN202022188965U CN213546300U CN 213546300 U CN213546300 U CN 213546300U CN 202022188965 U CN202022188965 U CN 202022188965U CN 213546300 U CN213546300 U CN 213546300U
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Abstract
The utility model discloses a water-cooled gas tightness glass-metal sealing structure, include: the sealing structure comprises a first metal protective shell, a second metal protective shell, a metal sleeve, a metal guide pin and sealing glass; the first metal protective shell and the second metal protective shell are used for packaging a chip, and the first metal protective shell is arranged outside the second metal protective shell; the first metal protective shell and the second metal protective shell are connected through the metal sleeve to form a hollow cavity; cooling water is stored in the hollow cavity; the metal guide pin is led out from the chip and penetrates through the first metal protective shell and the second metal protective shell; and the metal guide needle and the metal sleeve are hermetically sealed by the sealing glass. The utility model discloses a pack the cooling water in the cavity that first metal protective housing and second metal protective housing formed and realize the protection to the chip under higher operating temperature, extension working life and improvement detection precision.
Description
Technical Field
The utility model relates to the technical field of electronic machinery, in particular to water-cooled gas tightness glass-metal sealing structure.
Background
The chip is usually encapsulated in the metal protective shell like a sensor chip to ensure that the performance of the chip is not influenced by the temperature and the humidity of the external environment, so that the service life of the device is prolonged and the accuracy of the device is ensured. The metal guide pin penetrates through the metal protective shell to provide power supply, signals or other required detection information for the sensor chip, and in order to achieve high air tightness, glass is used for sealing between the lead and the metal shell, so that mechanical connection can be achieved, and insulation and air tightness can be guaranteed.
The conventional metal shell has good heat conductivity, and when the external environment temperature is higher, the internal sensor chip is easily influenced, and the detection accuracy of the temperature sensor is influenced.
The proper working temperature of the sensor chip is below 100 ℃, optimally below 90 ℃, but part of the sensor working environment needs to be in 100-250 ℃ for a long time, such as a heat flow pipeline, an electric heating oven and the like, and the working life and the precision of the device are seriously influenced in the environment.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provide a water-cooled airtight glass-metal sealing structure.
The utility model adopts the following technical scheme:
a water-cooled hermetic glass-to-metal sealing structure comprising: the sealing structure comprises a first metal protective shell, a second metal protective shell, a metal sleeve, a metal guide pin and sealing glass; the first metal protective shell and the second metal protective shell are used for packaging a chip, and the first metal protective shell is arranged outside the second metal protective shell; the first metal protective shell and the second metal protective shell are connected through the metal sleeve to form a hollow cavity; cooling water is stored in the hollow cavity; the metal guide pin is led out from the chip and penetrates through the first metal protective shell and the second metal protective shell; and the metal guide needle and the metal sleeve are hermetically sealed by the sealing glass.
Preferably, a cooling water inlet and a cooling water outlet are formed in the first metal protective shell.
Preferably, the packaging structure further comprises a cooling water outlet pipe arranged on the inner wall of the first metal protection shell; the cooling water outlet pipe is connected with the cooling water outlet, and the top of the cooling water outlet pipe is higher than the cooling water inlet.
Preferably, the sealing temperature of the sealing glass is 600-1000 ℃.
Preferably, the first metal protective shell and the second metal protective shell are made of one or more of stainless steel, kovar alloy and nickel alloy.
Preferably, the metal guide needle is made of one or more of stainless steel, nickel-iron alloy and kovar alloy.
Preferably, the material of the metal sleeve comprises one or more of stainless steel, nickel-iron alloy and kovar alloy.
Preferably, the sealing glass has a thermal expansion coefficient greater than or equal to that of the metal pins and less than or equal to that of the first metal protective shell and the second metal protective shell.
Preferably, the packaging structure further comprises a threaded housing; the first metal protective shell is connected with the base through the threaded shell.
Preferably, the package structure further comprises a device cover plate; the device cover plate is arranged above the first metal protective shell.
Compared with the prior art, the beneficial effects of the utility model are as follows:
(1) the first metal protection shell and the second metal protection shell of the utility model are connected through the metal sleeve to form a hollow cavity; cooling water is stored in the hollow cavity; the metal guide pin is led out from the chip and penetrates through the first metal protective shell and the second metal protective shell; the metal guide pin and the metal sleeve are hermetically sealed through the sealing glass, and the packaging structure can protect a chip at a higher working temperature, prolong the service life of the chip and improve the detection precision of the chip.
(2) The utility model discloses a sealing-in frit can keep bond strength, insulating nature and high gas tightness under higher temperature, satisfies the encapsulation requirement.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention can be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following description lists the embodiments of the present invention.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
FIG. 1 is a cross-sectional view of the water-cooled hermetic glass-metal sealing structure of the present invention;
FIG. 2 is an external structural view of the water-cooled airtight glass-metal sealing structure according to the present invention;
fig. 3 is an enlarged view showing the connection of the sealing glass, the first metal lead pin and the metal sleeve according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, 2 and 3, the present invention provides a water-cooled airtight glass-metal sealing structure, which comprises: the device comprises a first metal protective shell 4, a second metal protective shell 5, a metal sleeve 2, a metal guide pin 1 and sealing glass 7; the first metal protection shell 4 and the second metal protection shell 5 are used for packaging a chip 6, and the first metal protection shell 4 is arranged outside the second metal protection shell 5; the first metal protective shell 4 and the second metal protective shell 5 are connected through the metal sleeve 2 to form a hollow cavity; cooling water is stored in the hollow cavity; the metal guide pin 1 is led out from the chip 6 and penetrates through the first metal protective shell 4 and the second metal protective shell 5; the metal guide needle 1 and the metal sleeve 2 are hermetically sealed through the sealing glass 7.
In this embodiment, the chip 6 is a sensor chip 6, and the metal lead pin 1 is used for supplying power to the sensor chip 6.
Specifically, the metal sleeve 2 is used for fixing the first metal protection shell 4 and the second metal protection shell 5 in a welding mode to form a hollow cavity for storing cooling water, and further forming a complete metal protection shell with cooling water. The metal sleeve 2 may be made of nickel-iron alloy, stainless steel, Kovar (Kovar, 4J29), or the like.
Further, the first protective metal shell 4 and the second protective metal shell 5 may be made of a nickel-iron alloy, stainless steel, Kovar (Kovar, 4J29), or the like.
The metal guide needle 1 can be made of nickel-iron alloy, stainless steel, Kovar alloy (Kovar, 4J29) and the like.
In this embodiment, the metal lead pin 1 and the metal sleeve 2 are hermetically sealed by using a sealing glass 7. The sealing glass 7 has a thermal expansion coefficient greater than or equal to that of the metal guide pin 1 and less than or equal to that of the first metal protective shell 4 and the second metal protective shell 5, and the sealing temperature is 600-1000 ℃.
Further, a cooling water inlet 41 and a cooling water outlet 42 are arranged on the first metal protection shell 4.
Correspondingly, the packaging structure further comprises a cooling water outlet pipe 9 arranged on the inner wall of the first metal protection shell; the cooling water outlet pipe 9 is connected to the cooling water outlet 42, and the top of the cooling water outlet pipe 9 is higher than the cooling water inlet 41, so that the whole hollow cavity can be filled with the cooling water introduced from the cooling water inlet 41.
In this embodiment, the package structure further includes a threaded housing 3; the first metal protective shell 4 is connected with the base through the threaded shell 3. In particular, the connection and locking is performed by means of a screw thread.
In this embodiment, the package structure further includes a device cover plate 8; the device cover plate 8 is disposed over the first protective metal shell 4. The protection of the package structure and the chip 6 is further realized by the device cover plate 8.
Referring to table 1 below, there are shown various embodiments and comparative examples of the present invention, which are related to the prior art.
TABLE 1
The utility model discloses a water-cooled gas tightness glass-metal sealing structure, the realization method on the preparation technology is as follows:
(1) opening holes in the first metal protective shell 4, wherein the holes comprise a cooling water inlet 41, a cooling water outlet 42 and a metal sleeve 2; in the corresponding position, the second metal protection shell 5 is also provided with a metal sleeve 2 hole;
(2) welding a cooling water outlet pipe 9 on the first metal protection shell 4;
(3) the metal sleeve 2 penetrates through the first metal protection shell 4 and the second metal protection shell 5 which are provided with holes and is welded, and a closed middle cavity structure is formed by simply welding the upper parts of the first metal protection shell 4 and the second metal protection shell 5;
(4) the metal guide pin 1, the metal sleeve 2, the first metal protection shell 4 and the second metal protection shell 5 are integrally sealed in an airtight manner by using the sealing glass 7;
(5) the chip 6 and the device cover plate 8 are soldered as necessary.
The above-mentioned be the utility model discloses a concrete implementation way, nevertheless the utility model discloses a design concept is not limited to this, and the ordinary use of this design is right the utility model discloses carry out immaterial change, all should belong to the act of infringement the protection scope of the utility model.
Claims (7)
1. A water-cooled airtight glass-metal sealing structure, comprising: the sealing structure comprises a first metal protective shell, a second metal protective shell, a metal sleeve, a metal guide pin and sealing glass; the first metal protective shell and the second metal protective shell are used for packaging a chip, and the first metal protective shell is arranged outside the second metal protective shell; the first metal protective shell and the second metal protective shell are connected through the metal sleeve to form a hollow cavity; cooling water is stored in the hollow cavity; the metal guide pin is led out from the chip and penetrates through the first metal protective shell and the second metal protective shell; and the metal guide needle and the metal sleeve are hermetically sealed by the sealing glass.
2. The water-cooled airtight glass-metal sealing structure according to claim 1, wherein said first metal protecting shell is provided with a cooling water inlet and a cooling water outlet.
3. The water-cooled airtight glass-metal sealing structure according to claim 2, further comprising a cooling water outlet pipe disposed on the inner wall of said first metal protection enclosure; the cooling water outlet pipe is connected with the cooling water outlet, and the top of the cooling water outlet pipe is higher than the cooling water inlet.
4. The water-cooled gas-tight glass-metal sealing structure according to claim 1, wherein the sealing temperature of the sealing glass is 600-1000 ℃.
5. The water-cooled airtight glass-metal sealing structure according to claim 1, wherein the sealing glass has a thermal expansion coefficient greater than or equal to that of the metal pins and less than or equal to that of the first and second metal protecting cases.
6. The water-cooled hermetic glass-to-metal sealing structure according to claim 1, further comprising a threaded housing; the first metal protective shell is connected with the base through the threaded shell.
7. The water-cooled hermetic glass-to-metal sealing structure according to claim 1, further comprising a device cover plate; the device cover plate is arranged above the first metal protective shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022188965.1U CN213546300U (en) | 2020-09-29 | 2020-09-29 | Water-cooled airtight glass-metal sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022188965.1U CN213546300U (en) | 2020-09-29 | 2020-09-29 | Water-cooled airtight glass-metal sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213546300U true CN213546300U (en) | 2021-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022188965.1U Active CN213546300U (en) | 2020-09-29 | 2020-09-29 | Water-cooled airtight glass-metal sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213546300U (en) |
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2020
- 2020-09-29 CN CN202022188965.1U patent/CN213546300U/en active Active
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