CN213520692U

CN213520692U - High-power semiconductor laser

Info

Publication number: CN213520692U
Application number: CN202022665567.4U
Authority: CN
Inventors: 林辉进
Original assignee: Guangdong Han Ying Laser Technology Co ltd
Current assignee: Guangdong Han Ying Laser Technology Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-06-22
Anticipated expiration: 2030-11-18

Abstract

The utility model discloses a high power semiconductor laser, including the laser instrument body, the both sides at laser instrument body top all are provided with the connecting rod, and one side that the connecting rod was kept away from relatively all is provided with the installation piece, and one side that the installation piece was kept away from relatively all is provided with two kellies, and the equal fixed mounting in both sides of laser instrument body bottom has the mounting bracket, and the inside of mounting bracket is provided with the bolt, and the mounting groove has all been seted up to the both sides at laser instrument body top, and the connecting rod runs through the inside to the laser instrument body through the mounting. The utility model discloses a set up the connecting rod and be used for installing the installation piece, be used for installing the connecting rod through setting up the laser instrument body, be used for installing the kelly through setting up the installation piece, be used for installing the bolt through setting up the mounting bracket, be used for installing the laser instrument body through setting up the bolt, solved the inconvenient installation of current semiconductor laser simultaneously to influence subsequent problem of using.

Description

High-power semiconductor laser

Technical Field

The utility model relates to a semiconductor laser technical field specifically is a high power semiconductor laser.

Background

The semiconductor laser device can be divided into homojunction, single heterojunction and double heterojunction, the homojunction laser and the single heterojunction laser are mostly pulse devices at room temperature, and the double heterojunction laser can realize continuous work at room temperature.

The conventional semiconductor laser is inconvenient to mount, so that subsequent use is influenced, and the use requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high power semiconductor laser possesses easy to assemble's advantage, has solved the inconvenient installation of current semiconductor laser to influence subsequent problem of using.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high power semiconductor laser, includes the laser instrument body, the both sides at laser instrument body top all are provided with the connecting rod, one side that the connecting rod was kept away from relatively all is provided with the installation piece, one side that the installation piece was kept away from relatively all is provided with two kellies, the equal fixed mounting in both sides of laser instrument body bottom has the mounting bracket, the inside of mounting bracket is provided with the bolt.

Preferably, the mounting groove has all been seted up to the both sides at laser instrument body top, the connecting rod runs through to the inside of laser instrument body through the mounting groove, the inside of mounting groove just is located the equal fixed mounting in one side that the connecting rod is close to relatively has first spring.

Preferably, the inside of laser instrument body and the top and the bottom that are located the mounting groove have all seted up first spout, the inside sliding connection of first spout has first slider, one side and connecting rod fixed connection that first slider is close to.

Preferably, two second sliding grooves are formed in the mounting block, a second sliding block is connected to the inside of each second sliding groove in a sliding mode, and one side of each second sliding block is fixedly connected with the mounting block.

Preferably, a second spring is welded to one side, which is located inside the second sliding groove and is relatively close to the second sliding block, and the other side of the second spring is welded to the second sliding groove.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the connecting rod and be used for installing the installation piece, be used for installing the connecting rod through setting up the laser instrument body, be used for installing the kelly through setting up the installation piece, be used for installing the bolt through setting up the mounting bracket, be used for installing the laser instrument body through setting up the bolt, solved the inconvenient installation of current semiconductor laser simultaneously to influence subsequent problem of using.

2. The utility model discloses a set up the mounting groove and be used for installing the connecting rod, be used for promoting the connecting rod to one side of keeping away from relatively through setting up first spring, thereby realize fixing the laser instrument body, realize spacing the connecting rod through the cooperation between first spout and the first slider, thereby increase the stability between laser instrument body and the connecting rod, realize installing the removal that realizes the kelly simultaneously to the kelly through the cooperation between second spout and the second slider, be used for promoting the second slider to both sides through setting up the second spring, thereby realize fixing the laser instrument body.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional structure of the present invention;

fig. 3 is the schematic view of the cross-sectional structure of the installation block of the present invention.

In the figure: 1. a laser body; 2. a connecting rod; 3. mounting blocks; 4. a clamping rod; 5. a first spring; 6. mounting grooves; 7. a first chute; 8. a first slider; 9. a second slider; 10. a second spring; 11. a second chute; 12. a mounting frame; 13. and (4) bolts.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description herein, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings to facilitate the description of the patent and to simplify the description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be considered limiting of the patent. In the description of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can, for example, be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Referring to fig. 1-3, a high power semiconductor laser comprises a laser body 1, connecting rods 2 are disposed on both sides of the top of the laser body 1, an installation block 3 is disposed on one side of the connecting rods 2 away from each other, two clamping rods 4 are disposed on one side of the installation block 3 away from each other, installation frames 12 are fixedly installed on both sides of the bottom of the laser body 1, bolts 13 are disposed inside the installation frames 12, the installation blocks 3 are installed by the connecting rods 2, the connecting rods 2 are installed by the laser body 1, the clamping rods 4 are installed by the installation block 3, the bolts 13 are installed by the installation frames 12, the laser body 1 is installed by the bolts 13, installation grooves 6 are disposed on both sides of the top of the laser body 1, and the connecting rods 2 penetrate into the laser body 1 through the installation grooves 6, the laser body 1 is fixed by fixedly mounting first springs 5 in the mounting grooves 6 and on the side close to the connecting rods 2, the connecting rods 2 are mounted by arranging the mounting grooves 6, the connecting rods 2 are pushed to the side far away from the connecting rods 2 by arranging the first springs 5, the laser body 1 is fixed by arranging the first chutes 7 in the laser body 1 and on the top and bottom of the mounting grooves 6, the first slide block 8 is connected in the first chute 7 in a sliding manner, the side close to the first slide block 8 is fixedly connected with the connecting rods 2, the connecting rods 2 are limited by the matching between the first chute 7 and the first slide block 8, so that the stability between the laser body 1 and the connecting rods 2 is improved, two second chutes 11 are arranged in the mounting block 3, the second slide block 9 is connected in the second chute 11 in a sliding manner, and one side of the second slide block 9 is fixedly connected with the mounting block 3, realize installing the removal that realizes kelly 4 simultaneously to kelly 4 through the cooperation between second spout 11 and the second slider 9, the inside of second spout 11 and be located one side welding that second slider 9 is close to relatively has second spring 10, and the opposite side and the 11 welding of second spout of second spring 10 are used for promoting second slider 9 to both sides through setting up second spring 10 to the realization is fixed laser instrument body 1.

During the use, according to the installation needs with connecting rod 2 to the inside shrink of laser body 1, promote kelly 4 to one side that is close to relatively, run through kelly 4 to the inside of external installation hole, promote second slider 9 through second spring 10 and promote to one side that keeps away from relatively to the realization is fixed laser body 1, places whole in the top of the fixed object of wanting, runs through the bottom of treating fixed object through bolt 13, thereby realizes fixing laser body 1.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high power semiconductor laser comprising a laser body (1), characterized in that: the laser comprises a laser body (1), wherein connecting rods (2) are arranged on two sides of the top of the laser body (1), an installation block (3) is arranged on one side, away from the connecting rods (2), of the laser body, two clamping rods (4) are arranged on one side, away from the installation block (3), of the laser body, mounting frames (12) are fixedly arranged on two sides of the bottom of the laser body (1), and bolts (13) are arranged inside the mounting frames (12).

2. A high power semiconductor laser as claimed in claim 1 wherein: mounting groove (6) have all been seted up to the both sides at laser instrument body (1) top, connecting rod (2) run through the inside to laser instrument body (1) through mounting groove (6), the inside of mounting groove (6) and be located the equal fixed mounting in one side that connecting rod (2) are close to relatively have first spring (5).

3. A high power semiconductor laser as claimed in claim 2 wherein: first spout (7) have all been seted up to the inside of laser instrument body (1) and the top that is located mounting groove (6) and bottom, the inside sliding connection of first spout (7) has first slider (8), one side and connecting rod (2) fixed connection that first slider (8) are close to.

4. A high power semiconductor laser as claimed in claim 1 wherein: two second chutes (11) are formed in the mounting block (3), a second sliding block (9) is connected to the inside of the second chutes (11) in a sliding mode, and one side of the second sliding block (9) is fixedly connected with the mounting block (3).

5. A high power semiconductor laser as claimed in claim 4 wherein: and a second spring (10) is welded at one side, which is positioned in the second sliding groove (11) and is relatively close to the second sliding block (9), and the other side of the second spring (10) is welded with the second sliding groove (11).