CN213518180U

CN213518180U - Mixed cooling structure of high-density server

Info

Publication number: CN213518180U
Application number: CN202022780712.3U
Authority: CN
Inventors: 杨振宇; 刘羽; 崔坤磊; 张敏
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2020-11-26
Filing date: 2020-11-26
Publication date: 2021-06-22
Anticipated expiration: 2030-11-26

Abstract

The utility model discloses a high density server mixed cooling structure, including mainboard, CPU fin one, CPU fin two and memory, be equipped with CPU fin one and CPU fin two on the mainboard, the both sides of CPU fin one and CPU fin two are equipped with the memory respectively, the mainboard front end is equipped with the hard disk slot, is equipped with the fan between mainboard front end and the hard disk slot, CPU fin one and CPU fin two are equipped with independent liquid cooling pipeline respectively, hard disk slot front end is located respectively in the import and the export of liquid cooling pipeline. The combination of air cooling and liquid cooling is adopted, the size of a cooling fan and the power consumption are reduced, the heat quantity which needs to be taken away by the fan is greatly reduced because the CPU with the largest heat dissipation quantity is cooled by liquid, and the fan only needs to cool the memory, the mainboard and components on the mainboard; on the other hand, the fan is reduced in size to make room for the coolant flow tubes to avoid interference.

Description

Mixed cooling structure of high-density server

Technical Field

The utility model relates to a server field, specific high density server mixed cooling structure that says so.

Background

The existing server cooling technologies mainly include two types: air cooling and liquid cooling. Take high-density servers as an example: 4 servers are arranged in a 2U space, the server is arranged at the front end of a chassis of the server in an air cooling mode, two cooling fans are arranged and directly dissipate heat of a CPU, a memory, a mainboard and electronic components on the mainboard, wherein the CPU is provided with cooling fins which are in close contact with the CPU. The arrangement form of liquid cooling is complex, except the CPU, other electronic circuit devices also need cooling fins, and all the cooling fins are provided with cooling liquid which circularly flows; another liquid cooling method is to immerse the entire server in a non-conductive cooling liquid, but this requires a separately designed server cabinet with excellent sealing.

The advantages and disadvantages of air cooling and liquid cooling are opposite, and the following aspects are mainly provided: 1. the liquid cooling is obviously higher than the air cooling in the energy consumption efficiency of the server operation, the liquid-cooled PUE is generally 1.1-1.4, and the air-cooled PUE is generally 1.7-2.5; 2. the liquid cooling is obviously higher than the air cooling in terms of manufacturing cost and later maintenance cost, because the structure of the liquid cooling is complex and the requirement on sealing performance is high; 3. the air cooling server has larger noise pollution, is harmful to human health, and has very small noise of liquid cooling.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high density server hybrid cooling structure, this cooling structure manufacturing cost and maintenance cost are far less than pure liquid cooling server, and noise pollution ratio forced air cooling server also has obvious improvement.

The utility model provides a technical scheme that its technical problem adopted is: the mixed cooling structure of the high-density server comprises a mainboard, a first CPU cooling fin, a second CPU cooling fin and a memory, wherein the first CPU cooling fin and the second CPU cooling fin are arranged on the mainboard, the memories are respectively arranged on two sides of the first CPU cooling fin and the second CPU cooling fin, a hard disk slot is arranged at the front end of the mainboard, a fan is arranged between the front end of the mainboard and the hard disk slot, independent liquid cooling pipelines are respectively arranged on the first CPU cooling fin and the second CPU cooling fin, and the inlet and the outlet of the liquid cooling pipeline are respectively arranged at the front end of the hard disk slot.

Further, the liquid cooling pipeline of the first CPU cooling fin comprises a first cooling liquid input pipe, a first cooling liquid output pipe and an inner cooling pipe, the inner cooling pipe is arranged inside the first CPU cooling fin, the inlet end of the first cooling liquid input pipe is arranged outside the front end of the first CPU cooling fin, the outlet end of the first cooling liquid input pipe is connected with the inlet of the inner cooling pipe of the first CPU cooling fin, one end of the first cooling liquid output pipe is connected with the outlet of the inner cooling pipe of the first CPU cooling fin, and the other end of the first cooling liquid output pipe is arranged outside the front end of the first CPU cooling fin.

Furthermore, the first cooling liquid input pipe and the first cooling liquid output pipe are respectively inclined towards the direction of the main board at the positions close to the rear ends of the CPU cooling fins.

Further, the liquid cooling pipeline of the second CPU cooling fin comprises a second cooling liquid input pipe, a second cooling liquid output pipe and an inner cooling pipe, the inner cooling pipe is arranged inside the second CPU cooling fin, the inlet end of the second cooling liquid input pipe is arranged outside the front end of the hard disk slot, the outlet end of the second cooling liquid input pipe is connected with the inlet end of the inner cooling pipe of the second CPU cooling fin, one end of the second cooling liquid output pipe is connected with the outlet end of the inner cooling pipe of the second CPU cooling fin, and the other end of the second cooling liquid output pipe is arranged outside the front end of.

Furthermore, the liquid cooling pipeline is provided with at least one fixing buckle for fixing.

Furthermore, the liquid cooling pipeline and the first CPU cooling fin or the second CPU cooling fin connecting port are both the lower part of one side of the cooling fin.

The utility model has the advantages that:

1. the cooling structure of the utility model combines air cooling and liquid cooling, and the liquid cooling is combined with the external cooling pipe through the cooling pipe arranged in the cooling fin, so the size of the cooling fan and the power consumption are reduced, because the CPU with the maximum heat dissipation capacity is cooled by the liquid, the heat quantity needed to be taken away by the fan is greatly reduced, and the fan only needs to cool the memory, the mainboard and the components on the mainboard; on the other hand, the fan is reduced in size to make room for the coolant flow tubes to avoid interference.

2. The mixed cooling method is easy to realize, only the CPU cooling fins and the cooling fan need to be replaced, the external liquid flow pipe is added, and then the front panel and the rear panel of the hard disk are perforated, so that the method can be realized on a newly-produced server, can also be realized by reforming the existing air cooling server, and has high practicability.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a bottom view of FIG. 1;

FIG. 3 is a partial right side view of FIG. 1;

FIG. 4 is a view showing a state where cooling pipes are arranged obliquely;

fig. 5 is a schematic view of the arrangement structure of the cooling tubes of the second CPU fin.

In the figure:

the main board 1, the CPU radiator I2, the CPU radiator II 3, the memory 4, the fan 5, the coolant input pipe I6, the coolant output pipe I7, the coolant inlet 8, the coolant outlet 9, the hard disk slot 10, the coolant input pipe II 11, the coolant output pipe II 12 and the coolant output pipe II 13 are fixed and buckled.

Detailed Description

The high-density server hybrid cooling structure of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1 to 5, the utility model discloses a high density server mixed cooling structure only needs to add the interior cooling fluid flow pipe in that the fin is inside, increase simultaneously outside cooling fluid flow pipe can, interior cooling pipe and outer cooling pipe form independent liquid cooling pipeline. For the high-density server, a mixed cooling mode of liquid cooling for the CPU and air cooling for other components is adopted, so that the advantages of air cooling and liquid cooling can be combined, and the maximum economic benefit can be obtained with the minimum cost investment. The main structure of the liquid cooling system comprises a main board 1, a first CPU cooling fin 2, a second CPU cooling fin 3 and a memory 4, wherein the first CPU cooling fin and the second CPU cooling fin are arranged on the main board, the memories are respectively arranged on two sides of the first CPU cooling fin and the second CPU cooling fin, a hard disk slot 10 is arranged at the front end of the main board, and four through holes for mounting liquid cooling pipes are correspondingly and respectively arranged on a front panel and a rear panel of the hard disk slot 10. A fan 5 is arranged between the front end of the mainboard and the hard disk slot, the CPU cooling fin I2 and the CPU cooling fin II 3 are respectively provided with an independent liquid cooling pipeline, and the inlet and the outlet of the liquid cooling pipeline are respectively arranged at the front end of the hard disk slot 10.

As shown in fig. 1, the liquid cooling pipeline of the CPU heat sink 12 includes a first cooling liquid input pipe 6 and a first cooling liquid output pipe 7, the inlet end of the first cooling liquid input pipe is disposed outside the front end of the hard disk slot, the outlet end of the first cooling liquid input pipe is connected to the inlet of the first cooling pipe of the CPU heat sink, one end of the first cooling liquid output pipe is connected to the outlet of the first cooling pipe of the CPU heat sink, and the other end of the first cooling liquid output pipe is disposed outside the front end of the hard disk slot 10.

Because the liquid cooling pipes of the CPU cooling fin I2 and the CPU cooling fin II 3 are arranged up and down, in order to avoid interference, as shown in figures 3 and 4, the cooling liquid input pipe I and the cooling liquid output pipe I are respectively inclined towards the direction of the main board at the position close to the rear end of the CPU cooling fin II 3, the height of the pipes is reduced, the cooling liquid output pipe and the cooling liquid input pipe are ensured to be connected with the lower part of the CPU cooling fin I, and the spatial position with the same overlooking angle as before is kept.

As shown in fig. 5, the liquid cooling pipeline of the second CPU heat sink 3 includes a second cooling liquid input pipe 11 and a second cooling liquid output pipe 12, the inlet of the second cooling liquid input pipe is located outside the front end of the hard disk slot, the outlet of the second cooling liquid input pipe is connected to the inlet of the second internal cooling pipe of the second CPU heat sink, one end of the second cooling liquid output pipe is connected to the outlet of the internal cooling pipe of the second CPU heat sink, and the other end of the second cooling liquid output pipe is located outside the front end of the hard disk slot.

In order to improve the stability of each way liquid cooling pipe installation, be equipped with at least one fixed buckle 13 that plays the fixed action on the liquid cooling pipeline, quantity and the mounted position that the buckle used set up according to the user demand, do not do the injecion as long as can reach the purpose of fixed liquid cooling pipe.

And the liquid cooling pipeline and the first CPU radiating fin or the second CPU radiating fin connecting port are both the lower part of one side of the radiating fin, so that the cooling effect is ensured, and the radiating efficiency is improved. The coolant inlet 8 and the coolant outlet 9 of the liquid cooling tube are arranged at the front end of the server, and since the rear end has power supply and communication line interfaces, and the front end does not have any obstruction, if the liquid cooling tube is arranged at the rear end, the structural complexity is increased, and even the performance is sacrificed, such as occupying the communication line interface position.

For the high-density server example, the power of the two fans is about 100W, and if the required fan power is in direct proportion to the energy consumption of components needing to be cooled in the server, after the CPU is cooled by liquid, the power of the two fans is only 33.3W, so that the single-machine PUE is greatly reduced, and the economic benefit is remarkable. The size and the power consumption of the cooling fan are reduced, because the CPU with the largest heat dissipation capacity is cooled by liquid, the heat quantity to be taken away by the fan is greatly reduced, and the fan only needs to cool the memory, the mainboard and components on the mainboard; on the other hand, the fan is reduced in size to make room for the coolant flow tubes to avoid interference. The manufacturing cost and the maintenance cost are far lower than those of a pure liquid cooling server, and the noise pollution is obviously improved compared with that of an air cooling server.

The foregoing is merely illustrative of some of the principles of the present invention and the description is not intended to limit the invention to the specific constructions and applications shown, so that all modifications and equivalents that may be utilized are within the scope of the invention.

Other technical features than those described in the specification are known to those skilled in the art.

Claims

1. The mixed cooling structure of the high-density server comprises a mainboard, a first CPU cooling fin, a second CPU cooling fin and a memory, wherein the first CPU cooling fin and the second CPU cooling fin are arranged on the mainboard, the memory is arranged on two sides of the first CPU cooling fin and the second CPU cooling fin respectively, and a hard disk slot is arranged at the front end of the mainboard.

2. The hybrid cooling structure for high-density servers according to claim 1, wherein the liquid cooling circuit of the first CPU heat sink includes a first cooling liquid input pipe, a first cooling liquid output pipe, and an internal cooling pipe, the internal cooling pipe is disposed inside the first CPU heat sink, the inlet of the first cooling liquid input pipe is disposed outside the front end of the hard disk slot, the outlet of the first cooling liquid input pipe is connected to the inlet of the internal cooling pipe of the first CPU heat sink, one end of the first cooling liquid output pipe is connected to the outlet of the internal cooling pipe of the first CPU heat sink, and the other end of the first cooling liquid output pipe is disposed outside the front end of the hard disk slot.

3. The hybrid cooling structure for high-density servers of claim 2, wherein said first coolant input pipe and said first coolant output pipe are inclined toward the main board near the rear ends of the CPU heat sinks, respectively.

4. The hybrid cooling structure for the high-density server as claimed in claim 1, wherein the liquid cooling pipeline of the second CPU heat sink includes a second cooling liquid input pipe, a second cooling liquid output pipe and an internal cooling pipe, the internal cooling pipe is disposed inside the second CPU heat sink, the inlet of the second cooling liquid input pipe is disposed outside the front end of the hard disk slot, the outlet of the second cooling liquid input pipe is connected to the inlet of the internal cooling pipe of the second CPU heat sink, one end of the second cooling liquid output pipe is connected to the outlet of the internal cooling pipe of the second CPU heat sink, and the other end of the second cooling liquid output pipe is disposed outside the front end of the.

5. The hybrid cooling structure of claim 1, wherein the liquid cooling pipes are provided with at least one fixing clip for fixing.

6. The hybrid cooling structure for high-density servers according to claim 1, wherein the liquid cooling pipeline and the first or second connection port of the CPU heat sink are both lower portions of one side of the heat sink.