CN213457228U

CN213457228U - Chip test system and chip automatic test platform

Info

Publication number: CN213457228U
Application number: CN202021487153.0U
Authority: CN
Inventors: 黄思琪; 郭庆锐; 杨全勇
Original assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Current assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Priority date: 2020-07-24
Filing date: 2020-07-24
Publication date: 2021-06-15
Anticipated expiration: 2030-07-24

Abstract

The embodiment of the utility model provides a relate to chip test technical field, provide a chip test system and chip automatic test platform. The chip testing system comprises a material taking mechanism, a testing and positioning mechanism and a power-on mechanism; the material taking mechanism is positioned at one side of the testing and positioning mechanism and used for placing the obtained chip on the testing and positioning mechanism and taking away the chip after the test is finished; the power-on mechanism is positioned at the other side of the test positioning mechanism and used for powering on the chip on the test positioning mechanism; the test positioning mechanism comprises an object stage, a bearing position used for placing the chip is arranged on the object stage, a positioning device is arranged on the corresponding bearing position on the object stage, and the positioning device is used for limiting the chip to be separated from the bearing position. The embodiment of the utility model provides a chip test system, through feeding agencies, test positioning mechanism and add the mechanism and replace the manual work to get and put, location and test chip, improved efficiency of software testing.

Description

Chip test system and chip automatic test platform

Technical Field

The embodiment of the utility model provides a relate to chip test technical field, especially relate to a chip test system and chip automatic test platform.

Background

The chip is widely applied to various fields such as mobile terminals, computer equipment, face recognition, smart homes, aerospace and the like. In the development and use of chips, multiple parameters of the chips are generally required to be tested to determine whether the performance and the working state of the chips meet the requirements.

The existing chip testing device has low automation degree, and most of the testing operation processes need manual operation to be completed. For example, after the chip is positioned by manually using the test tool, the manual power-on test is performed, and after the test is completed, the chip is taken away from the test tool manually, so that the test efficiency is low.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a chip test system and chip automatic test platform for the degree of automation who solves chip testing arrangement among the prior art is low, needs a great deal of manual operation, problem that efficiency of software testing is low.

In a first aspect, an embodiment of the present invention provides a chip testing system, including: the device comprises a material taking mechanism, a test positioning mechanism and a power-up mechanism;

the material taking mechanism is positioned at one side of the test positioning mechanism and used for placing the obtained chip on the test positioning mechanism and taking away the chip after the test is finished;

the power-up mechanism is positioned at the other side of the test positioning mechanism and used for powering up the chip on the test positioning mechanism;

the test positioning mechanism comprises an objective table, wherein a bearing surface used for placing a chip is arranged on the objective table, a boss is arranged on the bearing surface in a protruding mode and used for placing the chip on the table surface of the boss, a limiting device is arranged on the objective table corresponding to the boss and used for limiting the chip to be separated from the boss and correcting the position of the chip.

The test positioning mechanism further comprises a base and a rotating seat, the rotating seat is rotatably installed on the base, the object stage is fixedly installed on the rotating seat, and the object stage is provided with a plurality of rotating seats at intervals along the rotating direction of the rotating seat.

The object stages comprise two object stages, the bosses on the two object stages are opposite in the direction perpendicular to the rotation axis of the rotating seat, and the boss on each object stage is positioned at one end, away from the rotation axis of the rotating seat, of each object stage.

The rotary seat is provided with a plurality of upright posts corresponding to the plurality of object stages in a protruding manner, and the object stages are arranged on the upright posts respectively.

The limiting device comprises two clamping pieces capable of moving in the width direction of the boss, the width of the boss is larger than that of the chip, the two clamping pieces are respectively arranged on two sides of the width direction of the boss, and the two clamping pieces are provided with a limiting state and a releasing state, wherein the limiting state is close to the releasing state, and the releasing state is far away from the releasing state.

The power-up mechanism comprises a probe and a probe support, wherein one end of the probe is fixed on the probe support, and the other end of the probe is used for being in contact with the chip.

The probe comprises an electricity adding section and a fixing section, one end of the electricity adding section is detachably mounted at one end of the fixing section, the electricity adding section is far away from one end of the fixing section and used for being in contact with the chip, and the fixing section is far away from one end of the electricity adding section and used for being fixed on the probe support and electrically connected with the power supply device.

The feeding device comprises a feeding mechanism, a discharging mechanism and a feeding mechanism, wherein the feeding mechanism comprises a suction nozzle and a rack, the rack is arranged on the feeding mechanism, the suction nozzle is fixed on the rack, and the feeding mechanism is used for driving the rack to drive the suction nozzle to move between a feeding position and a discharging position.

The suction nozzle is provided with an air suction channel, the suction nozzle is provided with an absorption end used for absorbing the chip, the end face of the absorption end is convexly provided with a plurality of contact pins used for contacting with the non-functional area of the chip, each contact pin is provided with an air suction port communicated with the air suction channel on the end face of the free end, and the contact pins are mutually spaced to form an avoidance space between any two adjacent contact pins.

In a second aspect, an embodiment of the present invention provides an automatic chip testing platform, including the chip testing system according to the first aspect.

The embodiment of the utility model provides a chip test system, through feeding agencies, test positioning mechanism and add the mechanism and replace the manual work to get and put, location and test chip, improved efficiency of software testing.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a chip testing system according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a test positioning mechanism according to an embodiment of the present invention;

FIG. 3 is a schematic view of the carrier stage of FIG. 2;

fig. 4 is a schematic structural view of a material taking mechanism according to an embodiment of the present invention;

FIG. 5 is a schematic view of the construction of the suction nozzle of FIG. 4;

FIG. 6 is a schematic view of the nozzle of FIG. 5 from another perspective;

FIG. 7 is a schematic view of the nozzle of FIG. 5 from another perspective;

FIG. 8 is a schematic structural diagram of a power-up mechanism according to an embodiment of the present invention;

FIG. 9 is a schematic view of the structure of FIG. 8 at the probe mount;

FIG. 10 is a schematic diagram of the structure of the probe of FIG. 9.

In the figure: 1. a material taking mechanism; 11. a suction nozzle; 111. a contact pin; 112. an air suction port; 113. avoiding a space; 114. a second boss; 115. a substrate; 116. an air suction passage; 117. mounting holes; 12. a frame; 13. a vacuum tube; 14. a drive device; 15. a vacuum tube interface; 16. a vacuum gauge; 2. a power-up mechanism; 21. a probe; 211. a power-on section; 212. a fixed section; 213. a protrusion; 22. a probe support; 221. A probe mounting hole; 23. a mounting seat; 24. a movement driving device; 25. a left and right adjusting frame; 26. a front and rear adjusting frame; 3. a test positioning mechanism; 31. an object stage; 311. a bearing surface; 312. a first boss; 313. A guide groove; 32. a limiting device; 321. a clamping member; 322. a guide portion; 33. a base; 34. a rotating base; 35. a column; 4. and a moving mechanism.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Fig. 1 is a schematic structural diagram of a chip testing system according to an embodiment of the present invention. The chip testing system comprises a material taking mechanism 1, a testing and positioning mechanism 3 and an electrifying mechanism 2. The material taking mechanism 1 is located at one side of the test positioning mechanism 3 and is used for placing the obtained chip on the test positioning mechanism 3 and taking away the chip after the test is completed. The power-on mechanism 2 is positioned at the other side of the test positioning mechanism 3 and is used for powering on the chip on the test positioning mechanism 3.

Wherein, as shown in fig. 2, the embodiment of the present invention is a schematic structural diagram of a testing and positioning mechanism. In the embodiment of the present invention, the test positioning mechanism 3 includes an objective table 31. As shown in fig. 3, which is a schematic structural diagram of the object stage in fig. 2, a carrying surface 311 for placing a chip is disposed on the object stage 31, a first boss 312 is convexly disposed on the carrying surface 311 for placing the chip on a table surface of the first boss 312, a position limiting device 32 is disposed on the object stage 31 corresponding to the first boss 312, and the position limiting device 32 is used for limiting the chip to be separated from the first boss 312 and correcting the position of the chip. The position limiting device 32 can limit the position of the chip on the first boss 312.

After placing the chip on objective table 31 through picking mechanism 1, can add the electric test through adding electric mechanism 2 to the chip on objective table 31, add after the electric test is accomplished, take away the chip from objective table 31 through picking mechanism 1 again. The chip testing system provided by the embodiment of the utility model has the advantages that the material taking mechanism 1, the testing and positioning mechanism 3 and the power-up mechanism 2 replace manual chip taking, positioning and testing, so that a full-automatic chip testing system is formed, and the testing efficiency is improved; the whole testing process does not need manual participation, does not need manual cooperation of the tool clamp to position the chip, and avoids damage to the chip caused by human factors.

The material used for the stage 31 generally needs to have good heat dissipation, and for example, the stage 31 made of red copper or the stage 31 plated with gold may be used. In order to make the carrying surface 311 and the chip contact well for heat dissipation, the flatness and roughness of the carrying surface 311 are required to be high, and the carrying surface 311 needs to be mirror-processed to ensure good contact heat dissipation.

As shown in fig. 2, in this embodiment, the testing and positioning mechanism 3 further includes a base 33 and a rotating base 34, the rotating base 34 is rotatably mounted on the base 33, the object stage 31 is disposed on the rotating base 34, and the object stage 31 is provided with a plurality of testing and positioning mechanisms 3 along the rotating direction of the rotating base 34 at intervals to provide a plurality of object stages 31, so that not only can the interference between the material taking mechanism 1 and the power-up mechanism 2 be avoided, but also the operation efficiency of the device can be improved.

Taking the number of the object stages 31 as two as an example, the two object stages 31 are respectively a first object stage and a second object stage, firstly, the rotating base 34 is driven to rotate the first object stage to the material taking mechanism 1, and the material taking mechanism 1 places the chip to be tested on the first object stage; then, the rotating seat 34 is driven to rotate the first objective table to the position of the power-up mechanism 2, the power-up mechanism 2 performs power-up test on the chip on the first objective table, at the moment, the second objective table is located at the position of the material taking mechanism 1, and the material taking mechanism 1 places the chip to be tested on the second objective table; then, the rotating base 34 is driven to rotate the first objective table to the position of the material taking mechanism 1, after the material taking mechanism 1 takes away the tested chip on the first objective table, another chip to be tested is placed on the first objective table, at this time, the second objective table is located at the position of the power-up mechanism 2, and the power-up mechanism 2 carries out power-up test on the chip on the second objective table.

The embodiment of the utility model provides a chip test system, through the test positioning mechanism 3 that sets up many objective tables, and set up a plurality of objective tables 31 on roating seat 34, make to add the electric test and get to put the material and go on simultaneously in the different station departments of test positioning mechanism 3, not only avoided the feeding agencies 1 and add the electric mechanism 2 emergence interference, still reduced the time of waiting for last unloading, promoted efficiency of software testing.

When two object stages 31 are provided, as shown in fig. 2, the bearing surfaces 311 on the two object stages 31 are opposite to each other in a direction perpendicular to the rotation axis of the rotating base 34, and the bearing surface 311 on each object stage 31 is located at an end of each object stage 31 away from the rotation axis of the rotating base 34, so that the material taking mechanism 1 and the power-up mechanism 2 are not easily interfered with the object stages 31, and the structure of the test positioning mechanism 3 is simple.

Furthermore, the rotating base 34 is convexly provided with a plurality of upright columns 35 corresponding to the plurality of object stages 31, and the plurality of object stages 31 are respectively arranged on the plurality of upright columns 35, so that the material taking mechanism 1 and the power-on mechanism 2 are not easy to interfere with the object stages 31.

In the embodiment of the present invention, the positioning device 32 may be disposed in various ways, for example, the positioning device 32 may be a vacuum adsorption device; as shown in fig. 2, in the present embodiment, the carrying surface 311 is used for placing the chip upward, the position-limiting device 32 includes two clamping members 321 capable of moving along the width direction of the first boss 312, the two clamping members 321 are respectively disposed at two sides of the width direction of the first boss 312, and the two clamping members 321 have a position-limiting state in which they are close to each other and a releasing state in which they are away from each other. The structure of the limiting means 32 is thus relatively simple.

Further, as shown in fig. 2 and 3, in the present embodiment, the clamping member 321 is provided with a guide portion 322 protruding toward the carrying surface 311 of the stage 31, the carrying surface 311 of the stage 31 is provided with a guide groove 313 extending along the width direction corresponding to the guide portion 322, and the guide portion 322 and the guide groove 313 form a guiding fit in the width direction. By providing the guide portion 322 and the guide groove 313, the movement guide of the clamp 321 on the stage 31 can be realized.

In this embodiment, the width of the first boss 312 is set to be greater than the width of the chip, so that when the two clamping members 321 are in a limiting state, the two clamping members 321 respectively abut against two opposite side surfaces of the first boss 312 in the width direction, the width of the first boss 312 is set to be greater than the width of the chip, when the two clamping members 321 are folded to limit the chip, the clamping members 321 abut against the first boss 312 without being in direct contact with the chip, and thus the situation that the two clamping members 321 clamp the chip is avoided.

The difference between the width of the first boss 312 and the width of the chip is not too large or too small, and the difference between the width of the first boss 312 and the width of the chip is too large, so that the chip is not corrected; in this embodiment, the width of the first bump 312 is set to be 0.05mm to 0.1mm wider than the width of the chip, and by optimizing the value range of the difference between the width of the first bump 312 and the width of the chip, the problem that the difference between the width of the first bump 312 and the width of the chip is too large or too small can be effectively avoided.

Similarly, the height of the first bosses 312 should not be too large or too small, and the height of the first bosses 312 is related to the height of the heat sink of the chip and the height of the clamping members 321, and usually, the sum of the height of the first bosses 312 and the height of the heat sink of the chip is equal to or slightly less than the height of the clamping members 321.

Fig. 8 is a schematic structural diagram of an electric mechanism according to an embodiment of the present invention. In the embodiment of the present invention, the power-on mechanism 2 includes a probe 21 and a probe support 22, one end of the probe 21 is fixed on the probe support 22, and the other end is used for contacting with the chip.

In order to solve the problem that the conventional power-up mechanism is inconvenient in probe replacement, fig. 9 is a schematic structural diagram of a probe holder in fig. 8, and fig. 10 is a schematic structural diagram of a probe in fig. 9. The probe 21 includes a power-applying section 211 and a fixing section 212, wherein one end of the power-applying section 211 is detachably mounted on one end of the fixing section 212, one end of the power-applying section 211 away from the fixing section 212 is used for contacting with a chip, and one end of the fixing section 212 away from the power-applying section 211 is used for being fixed on the probe holder 22 and electrically connected with a power supply device.

The embodiment of the utility model provides a probe 21 is split type structure, as shown in fig. 9, on probe 21 was fixed in probe support 22 through canned paragraph 212, when probe 21 appeared wearing and tearing with electric section 211, owing to be detachable between electric section 211 and the canned paragraph 212, need not pull down probe 21 whole from probe support 22 and change, only need change with electric section 211 can, so this split type structure's probe 21 changes comparatively conveniently.

There are various embodiments for realizing the detachable connection between the charging section 211 and the fixing section 212, for example, a threaded hole may be provided on an end surface of one of the charging section 211 and the fixing section 212, and an external thread matching the threaded hole may be provided on a peripheral side surface of the other; for another example, in the present embodiment, the fixed section 212 and the power applying section 211 have proximal ends close to each other, an insertion groove (not shown in the drawings) is formed on an end surface of the proximal end of one of the fixed section 212 and the power applying section 211, and the proximal end of the other one is inserted into an insertion portion (not shown in the drawings, specifically, in the present embodiment, the fixed section 212 is provided with the insertion groove, and the power applying section 211 is provided with the insertion portion). Wherein, a limiting structure (not shown in the figures) is arranged between the inner side wall of the slot and the proximal end of the power-on section 211, so as to limit the insertion part to be separated from the slot from the notch. Wherein, limit structure's the mode of setting up has the multiple, for example, limit structure can be including the inside wall of locating the slot and insert spacing arch and spacing groove on establishing the portion, and spacing arch and spacing groove form spacing cooperation.

Further, an elastic member (not shown in the figures, the elastic member may be a spring or a silicone member, etc.) is disposed in the slot, and the elastic member elastically abuts between the bottom wall of the slot and the insertion portion. Through the arrangement of the elastic member, the charging section 211 can elastically stretch and contract relative to the fixing section 212, so that the charging section 211 is in flexible contact with the conductive point of the chip when in contact with the conductive point.

The probe 21 is contacted with the heat sink of the chip through the charging section 211, the contact area between the two cannot be too large, and the too large contact area can cause the probe 21 to easily touch the chip and the gold wire; as shown in fig. 10, in the present embodiment, a protrusion 213 is protruded from an end surface of the end of the energizing section 211 away from the fixing section 212 for electrically connecting to the chip through the protrusion 213. Thus, by controlling the size of the protrusion 213, the contact area between the power applying section 211 and the conductive point of the chip can be adjusted, which is advantageous to control the contact area therebetween.

One end of the probe 21 is fixed on the probe holder 22, specifically, as shown in fig. 9, in this embodiment, the probe holder 22 is provided with a probe mounting hole 221, the probe mounting hole 221 penetrates through the probe holder 22 in the extending direction of the probe 21, and one end of the fixing section 212, which is far away from the power applying section 211, is inserted into the probe mounting hole 221 and extends out of the probe mounting hole 221. One end of the fixing section 212 protrudes out of the probe mounting hole 221, which facilitates electrical connection of the end of the fixing section 212 with a power supply device.

When power-up mechanism 2 is used for powering up a high-power chip, the problem of mechanism heat dissipation needs to be considered, the material of the existing probe support 22 is usually hard plastics such as iron cotton rose, and in the embodiment, the probe support 22 is made of metal, an insulating layer is arranged on the surface of the probe support 22, the probe support 22 made of sampling metal can be used for replacing the hard plastics and strengthening heat dissipation, and meanwhile, the surface of the probe support 22 is subjected to insulating treatment, so that short circuit can be avoided.

In order to increase the degree of automation of the energizing mechanism 2, as shown in fig. 8, in the present embodiment, the energizing mechanism 2 further includes a mounting base 23 and a movement driving device 24, the probe holder 22 is movably mounted on the mounting base 23 along the extending direction of the probe 21, and the movement driving device 24 is used for driving the probe holder 22 to move on the mounting base 23. The movement driving device 24 may be an air cylinder, a hydraulic cylinder, a servo motor, or the like.

While the extending direction of the probe 21 is generally upward and downward, that is, the moving driving device 24 can drive the probe holder 22 to move on the mounting base 23 to adjust the probe 21 upward and downward, and in this embodiment, the probe 21 can also be adjusted in the left and right directions and in the front and back directions, specifically, the energizing mechanism 2 includes a left and right adjusting frame 25 and a front and back adjusting frame 26, the left and right adjusting frame 25 is disposed on the front and back adjusting frame 26, the mounting base 23 is disposed on the left and right adjusting frame 25, the probe 21 can be adjusted in the left and right directions by operating the left and right adjusting frame 25, and the probe 21 can be adjusted in the front and back directions by operating the front and back adjusting frame 26, so that when the energizing mechanism is mounted on the automatic chip testing table, the probe 21 can be adjusted in the left and right directions and in the front and back directions according to the carrying position of the chip. The left and right adjusting frames 25 and the front and rear adjusting frames 26 may be the existing one-dimensional adjusting frames.

The embodiment of the utility model provides an in, add the one end and the power supply unit electric connection of power section 211 are kept away from to the canned paragraph 212 of the probe 21 of mechanism 2, and power supply unit sets up in the rack, adds power mechanism 2 and installs on the mesa of rack, sets up power supply unit in the rack, can save the installation space on the mesa of rack.

As shown in fig. 1, the embodiment of the utility model provides a chip test system still includes moving mechanism 4, as shown in fig. 4 does the utility model provides a feeding mechanism's schematic structure diagram, feeding mechanism 1 include suction nozzle 11 and frame 12, and frame 12 installs in moving mechanism 4, and suction nozzle 11 is fixed in frame 12, is used for absorbing the chip, moving mechanism 4 are used for driving frame 12 and remove between getting material position and unloading position with driving suction nozzle 11.

The moving mechanism 4 may include a driving device in the X-axis direction and a driving device in the Y-axis direction, and according to an operation program set by the system, the driving device in the X-axis direction and the driving device in the Y-axis direction respectively drive the material taking mechanism 1 to perform feeding motions along the X-axis and the Y-axis, so as to move the suction nozzle 11 of the material taking mechanism 1 to a position above the carrying position of the test positioning mechanism 3 for placing the chip.

In order to simplify the mechanism of the apparatus, in the embodiment, the moving mechanism 4 only provides a driving force in one direction, for example, the moving mechanism includes a linear driving device, and after the picking mechanism 1 sucks the chip through the suction nozzle 11, the picking mechanism 1 is driven by the linear driving device to move linearly to above the chip carrying surface 311 of the test positioning mechanism 3. In order to make the material taking mechanism reach the upper part of the bearing surface 311 of the test positioning mechanism under the driving of the linear driving device, the suction nozzle 11 of the material taking mechanism 1 should be located in the same vertical plane with the bearing surface 311 of the test positioning mechanism 3. After the taking mechanism 1 sucks the chip, the chip can be driven by the linear driving device to do linear movement back and forth according to the fixed motion track, and the chip taking and placing action is executed.

Wherein, linear drive device can be the sharp module motor, and the sharp module motor includes the slip table and is fixed in the motor of slip table one end, the output fixedly connected with ball screw of motor, swing joint has the slide on the ball screw. The frame 12 of the material taking mechanism 1 is fixedly installed on a sliding seat of the linear driving device, and under the driving of the motor, the ball screw rotates to drive the sliding seat to move along the axis direction of the ball screw, so that the material taking mechanism 1 is driven to move along the axis direction of the ball screw. Certainly, linear drive device still can be for cylinder and guide rail assembly, and feeding agencies 1 slidable mounting is in the guide rail, and the cylinder is fixed in the one end of guide rail, and the output of cylinder passes through the connecting rod to be connected with feeding agencies 1, and under the linear drive of cylinder, the connecting rod promotes feeding agencies 1 and moves along the guide rail.

The suction nozzle 11 is arranged on the frame 12, and the material taking mechanism 1 can absorb the chip through the suction nozzle 11. In order to solve the problem that the chip is easily damaged by sucking the chip through the conventional suction nozzle, as shown in fig. 5 to 7, in this embodiment, a suction channel 116 is disposed in the suction nozzle 11, the suction nozzle 11 has a suction end for sucking the chip, a plurality of contact pins 111 for contacting with the non-functional area of the chip are convexly disposed on an end surface of the suction end, a suction port 112 communicated with the suction channel 116 is disposed on an end surface of a free end of each contact pin 111, and the plurality of contact pins 111 are spaced from each other to form a relief space 113 between any two adjacent contact pins 111. The chip generally includes a substrate and an electronic device disposed on the substrate, and the non-functional region of the chip refers to a region of the substrate where the electronic device and the gold wire are not disposed.

In the embodiment of the present invention, the material taking mechanism further includes a pressure sensor (not shown in the figure), the pressure sensor is disposed on the suction nozzle 11, and the pressure sensor is used for detecting the pressure of the contact pin 111 of the suction nozzle 11 on the chip; therefore, in the process that the suction nozzle 11 moves to enable the contact pins 111 to be in contact with the chip, the pressure of the contact pins 111 on the chip can be detected in real time through the pressure sensor, and the problem that the chip is crushed due to the fact that the pressure of the contact pins 111 on the chip is too large can be avoided.

The embodiment of the utility model provides a suction nozzle 11 contacts the non-functional area of adsorbing the chip through contact foot 111, has formed between a plurality of contact feet 111 and has dodged space 113, has avoided the suction end of suction nozzle 11 and the functional area contact of chip, and suction nozzle 11 just is difficult for causing the damage to the functional area of chip like this.

The suction nozzle 11 is provided with a plurality of contact pins 111, and specifically, as shown in fig. 5 and 6, in the present embodiment, a second boss 114 is convexly provided on the end surface of the suction end, and the plurality of contact pins 111 are convexly provided on the second boss 114. The second boss 114 is arranged at the suction end, and the contact pin 111 is arranged on the second boss 114, so that the strength of the contact pin 111 is improved, and the contact pin 111 is not easy to break.

Since the functional region of the chip is usually protruded with the light emitting bar and the non-functional regions are formed on both sides of the light emitting bar, as shown in fig. 5 and 6, in this embodiment, two contact pins 111 are provided, and the two contact pins 111 are spaced and opposed to each other in the first direction, and the air inlet 112 is disposed on the contact pins 111 in a direction perpendicular to the first direction. An avoiding space 113 for avoiding the light-emitting strip is formed between the two contact pins 111, so that the light-emitting strip is not easy to scratch, and the two contact pins 111 are only arranged, so that the structure of the suction nozzle 11 is simpler, and the chip can be stably adsorbed through the suction nozzle 11. The single contact pin 111 is provided with an air inlet 112, the single contact pin 111 may be provided with one or more air inlets 112, and the shape of the air inlet 112 may be a circular opening, a square opening, an oval opening, or the like. The air inlet 112 is arranged on the contact pin 111 along a direction perpendicular to the first direction, which may mean that a plurality of air inlets 112 are arranged on a single contact pin 111, and the plurality of air inlets 112 are arranged on the contact pin 111 at intervals along the direction perpendicular to the first direction; as shown in fig. 6, in this embodiment, the air inlets 112 are elongated openings extending in a direction perpendicular to the first direction, and the two air inlets 112 are elongated openings, so that the shapes of the two air inlets 112 can be more adapted to the shapes of the non-functional areas on the two sides of the light-emitting strip, so as to increase the absorption area of the chip by the suction nozzle 11 as much as possible, and thus the chip can be more stably absorbed by the suction nozzle 11.

The suction nozzle 11 is disposed on the frame 12, and specifically, as shown in fig. 4, a vacuum tube 13 extending in the up-down direction is disposed on the frame 12, the suction nozzle 11 is disposed at the lower end of the vacuum tube 13, the suction port 112 of the suction nozzle 11 faces downward, and the suction channel 116 of the suction nozzle 11 is communicated with the vacuum tube 13 (as shown in fig. 4, the vacuum tube 13 is provided with a vacuum tube interface 15 to communicate with an external vacuum system through the vacuum tube interface 15).

The suction nozzle 11 is disposed at a lower end of the vacuum tube 13, specifically, as shown in fig. 5 to 7, in this embodiment, the suction nozzle 11 includes a base 115 for connecting with the vacuum tube 13, the base 115 includes a first end surface and a second end surface that are opposite to each other, the plurality of contact pins 111 are disposed on the first end surface (the first end surface is an end surface of the suction end), the second end surface is provided with a mounting hole 117, the lower end of the vacuum tube 13 is mounted in the mounting hole 117 and is communicated with the suction channel 116, and the mounting and positioning between the vacuum tube 13 and the suction nozzle 11 can be realized by disposing the mounting hole 117.

Further, as shown in fig. 6 and 7, in the present embodiment, a mounting hole 117 is formed through the first end surface and located at the periphery of the plurality of contact pins 111, so as to mount the suction nozzle 11 on the vacuum tube 13 by providing a screw (not shown in the drawings) at the mounting hole 117. The suction nozzle 11 is mounted on the vacuum tube 13 by means of screws, so that the suction nozzle 11 can be easily mounted and dismounted. And, when the mounting holes 117 are provided in plural, and the plural mounting holes 117 are provided around the plural contact pins 111, it is advantageous to firmly mount the suction nozzle 11 on the vacuum tube 13, for example, the base 115 is a rectangular parallelepiped, the first end surface is square, and the four mounting holes 117 are provided, and the four mounting holes 117 are respectively provided at four corners of the first end surface.

Further, as shown in fig. 6, in the present embodiment, the mounting hole 117 is countersunk, and the mounting hole 117 is countersunk, so that when the screw is mounted at the mounting hole 117, the screw can be prevented from protruding from the first end surface.

The material taking mechanism 1 can absorb the chip by the suction nozzle 11, and the suction nozzle 11 is usually movable, for example, the suction nozzle 11 can have a movable stroke in a vertical direction and/or a horizontal direction, and specifically, as shown in fig. 4, in this embodiment, the vacuum tube 13 is disposed on the frame 12 in a vertically movable manner, and the material taking mechanism 1 further includes a driving device 14 (the driving device 14 can be a motor or the like), and the driving device 14 is used for driving the vacuum tube 13 to move vertically. The movement mode of the material taking mechanism 1 is simple.

In this embodiment, the material taking mechanism 1 further includes a vacuum gauge 16 communicated with the vacuum pipe 13, and the vacuum gauge 16 is used for detecting the adsorption force of the suction nozzle 11 on the chip. The suction force of the suction nozzle 11 to the chip can be controlled by the vacuum gauge 16, wherein the vacuum gauge 16 may be fixed to the frame 12.

The embodiment of the utility model provides a still provide a chip automatic test platform, this chip test system includes like the above-mentioned embodiment chip test system.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A chip test system, comprising: the device comprises a material taking mechanism, a test positioning mechanism and a power-up mechanism;

2. The chip testing system according to claim 1, wherein the testing positioning mechanism further comprises a base and a rotary base, the rotary base is rotatably mounted on the base, the stage is fixedly mounted on the rotary base, and a plurality of stages are arranged at intervals along a rotation direction of the rotary base.

3. The chip testing system according to claim 2, wherein the stage comprises two stages, the two stages have bosses opposite to each other in a direction perpendicular to the rotation axis of the rotary base, and the boss of each stage is located at an end of each stage away from the rotation axis of the rotary base.

4. The chip testing system according to claim 2, wherein the rotary base is provided with a plurality of columns corresponding to the plurality of stages, and the plurality of stages are respectively provided on the plurality of columns.

5. The chip testing system according to any one of claims 1 to 4, wherein the limiting device comprises two clamping members capable of moving along the width direction of the boss, the width of the boss is larger than the width of the chip, the two clamping members are respectively arranged on two sides of the width direction of the boss, and the two clamping members have a limiting state of being close to each other and a releasing state of being far away from each other.

6. The system for testing chips of any of claims 1-4, wherein the power-up mechanism comprises a probe and a probe holder, one end of the probe is fixed to the probe holder, and the other end of the probe is used for contacting with a chip.

7. The chip testing system of claim 6, wherein the probe comprises a power applying section and a fixing section, one end of the power applying section is detachably mounted on one end of the fixing section, one end of the power applying section away from the fixing section is used for contacting the chip, and one end of the fixing section away from the power applying section is used for being fixed on the probe holder and electrically connected with the power supply device.

8. The chip testing system according to any one of claims 1 to 4, further comprising a moving mechanism, wherein the material taking mechanism comprises a suction nozzle and a frame, the frame is mounted on the moving mechanism, the suction nozzle is fixed to the frame, and the moving mechanism is configured to drive the frame to drive the suction nozzle to move between a material taking position and a material discharging position.

9. The chip testing system according to claim 8, wherein the suction nozzle is provided with a suction channel, the suction nozzle has a suction end for sucking the chip, a plurality of contact pins for contacting with the non-functional area of the chip are convexly provided on an end surface of the suction end, a suction port communicating with the suction channel is provided on an end surface of a free end of each of the contact pins, and the plurality of contact pins are spaced apart from each other to form an avoiding space between any two adjacent contact pins.

10. An automatic chip test station, comprising a chip test system according to any one of claims 1 to 9.