CN213426647U - Data acquisition device for computer network engineering - Google Patents
Data acquisition device for computer network engineering Download PDFInfo
- Publication number
- CN213426647U CN213426647U CN202022613119.XU CN202022613119U CN213426647U CN 213426647 U CN213426647 U CN 213426647U CN 202022613119 U CN202022613119 U CN 202022613119U CN 213426647 U CN213426647 U CN 213426647U
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- Prior art keywords
- acquisition device
- casing
- data acquisition
- computer network
- panel
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- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000005057 refrigeration Methods 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 230000000694 effects Effects 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 6
- 238000001035 drying Methods 0.000 claims description 7
- 239000002274 desiccant Substances 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 3
- 238000010622 cold drawing Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The utility model discloses a data acquisition device for computer network engineering in the technical field of data acquisition device, which comprises a housin, the inner chamber bottom sliding connection of casing has the base plate, install the acquisition device main part on the base plate, one side of base plate is vertical to be fixed with movable panel, be equipped with the link on the outer wall of movable panel, casing inner chamber top is fixed with the heating panel through the mount, the inner wall of movable panel is installed with the fan, the connecting block has been opened at a lateral wall top of casing, movable panel is connected with the connecting block through the connecting screw, a plurality of semiconductor refrigeration pieces are installed to the bottom of heating panel, simple structure, the modern design, pull out the acquisition device main part outside the casing, can avoid the inconvenience of current overhauing in the casing like this, and adopt the pull mode, convenient; meanwhile, the semiconductor refrigerating sheet is arranged in the shell to dissipate heat of the main body of the acquisition device borne in the shell, the heat dissipation effect is good, the structure is compact, and the size of the case is reduced.
Description
Technical Field
The utility model relates to a data acquisition device technical field specifically is a data acquisition device for computer network engineering.
Background
The existing data acquisition device integrates a bar code scanning device, an RFID technology and a data terminal, is provided with terminal computer equipment which can be operated by a battery in an off-line mode, has the functions of real-time acquisition, automatic storage, real-time display, real-time feedback, automatic processing and automatic transmission, and can provide guarantee for the authenticity, validity, real-time property and usability of field data.
However, the device is inconvenient to disassemble and assemble, and when the device is damaged, the device is inconvenient to maintain quickly, so that the maintenance efficiency is influenced.
Based on this, the utility model designs a data acquisition device for computer network engineering to solve the above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a data acquisition device for computer network engineering to solve the above-mentioned problem of mentioning.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a data acquisition device for computer network engineering, includes the casing, the inner chamber bottom sliding connection of casing has the base plate, install the collection system main part on the base plate, the vertical movable panel that is fixed with in one side of base plate, be equipped with the link on the outer wall of movable panel, casing inner chamber top is fixed with the heating panel through the mount, the fan has been installed to the inner wall of movable panel, open at a lateral wall top of casing has the connecting block, the movable panel pass through the connecting screw with the connecting block is connected, a plurality of semiconductor refrigeration pieces are installed to the bottom of heating panel.
Preferably, sliding grooves are formed in two sides of the bottom of the shell, and sliding blocks connected to the inside of the sliding grooves in a sliding mode are arranged at the bottom of the base plate.
Preferably, one side of the shell is open, and the movable panel is matched with the opening of the shell in size.
Preferably, the fan is located at an upper side of the heat radiating plate.
Preferably, the heating panel includes the heat-conducting plate, leads cold drawing and heat insulating board, the heat insulating board is located the heat-conducting plate with lead between the cold drawing, the cold junction of semiconductor refrigeration piece with lead cold drawing contact setting, the hot junction of semiconductor refrigeration piece with the heat-conducting plate contact setting.
Preferably, a drying box is installed on the inner wall of the shell, and a drying agent is arranged in the drying box.
Compared with the prior art, the beneficial effects of the utility model are that: the data acquisition device for computer network engineering is simple in structure and novel in design, the main body of the acquisition device is pulled out of the shell, so that the inconvenience of the conventional maintenance in the shell can be avoided, and the data acquisition device is convenient to operate by adopting a pulling mode, greatly improves the maintenance efficiency, saves time and labor and is beneficial to reducing the maintenance cost; meanwhile, the semiconductor refrigerating sheet is arranged in the shell to dissipate heat of the main body of the acquisition device borne in the shell, the heat dissipation effect is good, the structure is compact, and the size of the case is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic diagram of the structure of the heat dissipation plate of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a housing; 2. a substrate; 3. a collection device body; 4. a movable panel; 5. a connecting end; 6. a fan; 7. connecting blocks; 8. a connecting screw; 9. a heat dissipation plate; 10. a chute; 11. a slider; 12. a semiconductor refrigeration sheet; 13. a heat conducting plate; 14. a cold conducting plate; 15. a heat insulation plate; 16. a fixing frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a data acquisition device for computer network engineering, which comprises a housin 1, the inner chamber bottom sliding connection of casing 1 has base plate 2, install collection system main part 3 on the base plate 2, the vertical activity panel 4 that is fixed with in one side of base plate 2, be equipped with link 5 on the outer wall of activity panel 4, 1 inner chamber top of casing is fixed with heating panel 9 through mount 16, the inner wall of activity panel 4 is installed and is had fan 6, open at one side wall top of casing 1 has connecting block 7, activity panel 4 is connected with connecting block 7 through connecting screw 8, a plurality of semiconductor refrigeration pieces 12 are installed to the bottom of heating panel 9.
Wherein, the bottom both sides of casing 1 are opened there is spout 10, and the bottom of base plate 2 is equipped with sliding connection in the inside slider 11 of spout 10, when needs overhaul collection device main part 3 that lies in on base plate 2, only need pull movable panel 4 mutually outward for collection device main part 3 is pulled out outside casing 1, so that to the maintenance of collection device main part 3.
Wherein, one side of casing 1 is the opening form, and movable panel 4 and casing 1's opening size phase-match, and after movable panel 4 installation, movable panel 4 can be sealed the opening of casing 1, has waterproof sealing strip between movable panel 4 and the casing 1.
Wherein, fan 6 is located the upper portion one side of heating panel 9, dispels the heat to the hot junction of heating panel 9 through fan 6 forced draft, continues to refrigerate to the hot junction of heating panel 9 then.
Wherein, the heating panel 9 includes heat-conducting plate 13, lead cold drawing 14 and heat insulating board 15, heat insulating board 15 is located heat-conducting plate 13 and leads between the cold drawing 14, the cold junction of semiconductor refrigeration piece 12 with lead cold drawing 14 contact setting, the hot junction of semiconductor refrigeration piece 12 and the contact setting of heat-conducting plate 13 can dispel the heat through heat-conducting plate 13, and lead cold drawing 14 and can cool off collection system main part 3, guarantee collection system main part 3's performance.
Wherein, the drying box is installed to the inner wall of casing 1, be equipped with the drier in the drying box, because of containing vapor in the air, in the course of the work of semiconductor refrigeration piece 12, bearing functional unit's cavity in the casing 1, vapor can condense into the drop of water when meeting the cold, can damage functional unit. The drying box is arranged in the cavity, so that water vapor in the air in the cavity can be adsorbed after the cavity is sealed, and the condition that the functional parts are damaged is avoided.
The specific working principle is as follows:
when the collecting device is used, when the collecting device main body 3 needs to be overhauled, only the connecting screw 8 needs to be disassembled, and the collecting device main body 3 is pulled out of the shell 1, so that the inconvenience of overhauling in the shell 1 in the prior art can be avoided, and the drawing mode is adopted, so that the operation is convenient, the maintenance efficiency is greatly improved, the time and the labor are saved, and the maintenance cost is favorably reduced; meanwhile, the semiconductor refrigerating sheet 12 is arranged in the shell 1 to dissipate heat of the acquisition device main body 3 borne in the shell 1, the heat dissipation effect is good, the structure is compact, and the size of the case is reduced.
Wherein, direct current is introduced to the semiconductor refrigeration sheet 9, and under the thermoelectric effect, two contacts are electrified, one temperature reduction is a cold end, and the other temperature rise is a hot end. Under continuous power-on, the heat transfer process is always generated in the semiconductor refrigerating sheet 9 until the temperature difference between the cold end and the hot end reaches the function set value. The refrigeration principle of the semiconductor refrigeration sheet 9 is a mature technology in the prior art, and is not described herein.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The utility model provides a data acquisition device for computer network engineering which characterized in that: including casing (1), the inner chamber bottom sliding connection of casing (1) has base plate (2), install collection system main part (3) on base plate (2), the vertical activity panel (4) that is fixed with in one side of base plate (2), be equipped with link (5) on the outer wall of activity panel (4), casing (1) inner chamber top is fixed with heating panel (9) through mount (16), fan (6) are installed to the inner wall of activity panel (4), open a lateral wall top of casing (1) has connecting block (7), activity panel (4) through connecting screw (8) with connecting block (7) are connected, a plurality of refrigeration pieces (12) are installed to the bottom of heating panel (9).
2. The data acquisition device for computer network engineering according to claim 1, characterized in that: the bottom both sides of casing (1) are opened there are spout (10), the bottom of base plate (2) is equipped with sliding connection in inside slider (11) of spout (10).
3. The data acquisition device for computer network engineering according to claim 1, characterized in that: one side of the shell (1) is in an opening shape, and the movable panel (4) is matched with the opening size of the shell (1).
4. The data acquisition device for computer network engineering according to claim 1, characterized in that: the fan (6) is positioned on one side of the upper part of the heat dissipation plate (9).
5. The data acquisition device for computer network engineering according to claim 1, characterized in that: heating panel (9) include heat-conducting plate (13), lead cold plate (14) and heat insulating board (15), heat insulating board (15) are located heat-conducting plate (13) and lead between cold plate (14), the cold junction of semiconductor refrigeration piece (12) with lead cold plate (14) contact setting, the hot junction of semiconductor refrigeration piece (12) with heat-conducting plate (13) contact setting.
6. The data acquisition device for computer network engineering according to claim 1, characterized in that: the drying box is installed on the inner wall of the shell (1), and a drying agent is arranged in the drying box.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022613119.XU CN213426647U (en) | 2020-11-12 | 2020-11-12 | Data acquisition device for computer network engineering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022613119.XU CN213426647U (en) | 2020-11-12 | 2020-11-12 | Data acquisition device for computer network engineering |
Publications (1)
Publication Number | Publication Date |
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CN213426647U true CN213426647U (en) | 2021-06-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202022613119.XU Expired - Fee Related CN213426647U (en) | 2020-11-12 | 2020-11-12 | Data acquisition device for computer network engineering |
Country Status (1)
Country | Link |
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CN (1) | CN213426647U (en) |
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2020
- 2020-11-12 CN CN202022613119.XU patent/CN213426647U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210611 |
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CF01 | Termination of patent right due to non-payment of annual fee |