CN213423871U - Computer host computer water-cooling structure - Google Patents
Computer host computer water-cooling structure Download PDFInfo
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- CN213423871U CN213423871U CN202021810827.6U CN202021810827U CN213423871U CN 213423871 U CN213423871 U CN 213423871U CN 202021810827 U CN202021810827 U CN 202021810827U CN 213423871 U CN213423871 U CN 213423871U
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- Prior art keywords
- water
- processing unit
- central processing
- cooling
- heat
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- 238000001816 cooling Methods 0.000 title claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 75
- 238000012545 processing Methods 0.000 claims abstract description 45
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 239000000498 cooling water Substances 0.000 claims abstract description 19
- 238000009423 ventilation Methods 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 230000000875 corresponding effect Effects 0.000 claims description 5
- 230000002596 correlated effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 5
- 239000004411 aluminium Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a main frame water-cooling structure, it sets up the heat conduction piece to locate the laminating through the central processing unit at quick-witted incasement, and set up the water course in the heat conduction piece, heat conduction piece and circulating water pump, the water tank leads to pipe and connects, form a circulation water route, the cooling water is at this circulation water route mesocycle flow, thereby take away central processing unit's heat, realize the heat dissipation cooling to central processing unit, and through setting up a plurality of surfaces that the heat conduction piece centers on central processing unit, thereby can increase heat conduction piece and central processing unit's contact surface, thereby further improve the radiating effect.
Description
Technical Field
The utility model relates to a computer technology field, concretely relates to main frame water-cooling structure.
Background
The case is used as a part of computer accessories and has the main function of placing and fixing various computer accessories to play a role in supporting and protecting, and a large number of integrated circuits are used in computer components. It is known that the heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. Most heat sinks absorb heat by contacting the surfaces of heat-generating components, and then transfer the heat to a remote location by various methods, such as air in a chassis, and then the chassis transfers the hot air to the outside of the chassis, thereby dissipating heat from the computer.
Computers have become indispensable components in daily work, and the requirement of heat dissipation of computers with high partial configuration is very high at the same time, and because computers mostly work on integrated circuits, the high temperature can cause unstable operation or faults in the computers, and is not favorable for long-term use.
SUMMERY OF THE UTILITY MODEL
In view of this, the embodiment of the utility model provides a computer mainframe water-cooling structure is dedicated to providing, central processing unit department laminating through at quick-witted incasement sets up the heat conduction piece, and set up the water course in the heat conduction piece, heat conduction piece and circulating water pump, the water tank leads to pipe and connects, form a circulation water route, the cooling water is at this circulation water route mesocycle flow, thereby take away central processing unit's heat, realize the heat dissipation cooling to central processing unit, and through setting up a plurality of surfaces that the heat conduction piece centers on central processing unit, thereby can increase the contact surface of heat conduction piece and central processing unit, thereby further improve the radiating effect.
An embodiment of the utility model provides a pair of computer host computer water-cooling structure, include: the computer comprises a case and a central processing unit arranged in the case; the heat conduction block is attached to the central processing unit; a circulating water pump for driving the flow of cooling water; a water tank for storing the cooling water; the water pipe is used for connecting the heat conduction block, the circulating water pump and the water tank; wherein a water channel is provided in the heat-conducting block, the cooling water flows in the water channel, and the heat-conducting block is provided around a plurality of outer surfaces of the cpu.
In one embodiment, the circulating water pump adjusts the rotating speed according to the temperature of the central processing unit.
In one embodiment, the rotation speed of the circulating water pump is positively correlated with the temperature of the central processing unit.
In one embodiment, the heat conducting block comprises an aluminum block.
In one embodiment, the outer wall of the water tank is provided with radiating fins.
In one embodiment, a heat dissipation fan is disposed at the water tank.
In an embodiment, the plurality of heat dissipation fans are respectively disposed on two opposite sides of the water tank, and the wind directions of the heat dissipation fans located on the two sides of the water tank are opposite.
In one embodiment, a vent is disposed at a position of the chassis corresponding to the heat dissipation fan.
In one embodiment, the vent holes are a vent mesh structure.
In one embodiment, a detachable filter screen is arranged on the inner side of the ventilation hole.
The embodiment of the utility model provides a pair of computer mainframe water-cooling structure, it sets up the heat conduction piece to locate the laminating through the central processing unit at quick-witted incasement, and set up the water course in the heat conduction piece, heat conduction piece and circulating water pump, the water tank leads to pipe and connects, form a circulation water route, the cooling water is at this circulation water route mesocycle flow, thereby take away central processing unit's heat, realize the heat dissipation cooling to central processing unit, and through setting up a plurality of surfaces that the heat conduction piece centers on central processing unit, thereby can increase the contact surface of heat conduction piece and central processing unit, thereby further improve the radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a water-cooling structure of a computer host according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Further, in the exemplary embodiments, since the same reference numerals denote the same components having the same structure or the same steps of the same method, if an embodiment is exemplarily described, only a structure or a method different from the already described embodiment is described in other exemplary embodiments.
Throughout the specification and claims, when one element is described as being "connected" to another element, the one element may be "directly connected" to the other element or "electrically connected" to the other element through a third element. Furthermore, unless explicitly described to the contrary, the term "comprising" and its corresponding terms should only be taken as including the stated features, but should not be taken as excluding any other features.
Fig. 1 is a schematic structural diagram of a water-cooling structure of a computer host according to an embodiment of the present application. As shown in fig. 1, the water-cooling structure includes: the cooling system comprises a case 1, a central processing unit 2, a heat conducting block 3, a circulating water pump 4, a water tank 5 and a water pipe 6, wherein the central processing unit 2, the heat conducting block 3, the circulating water pump 4, the water tank 5 and the water pipe 6 are arranged in the case 1, the heat conducting block 3 is attached to the central processing unit 2, the circulating water pump 4 is used for driving cooling water to flow, the water tank 5 is used for storing the cooling water, and the water pipe 6 is used for; wherein, set up the water course in the heat conduction piece 3, the cooling water flows in the water course, and heat conduction piece 3 sets up around a plurality of surfaces of central processing unit 2. Because the main heating component in the computer is the central processing unit 2, the heat conducting block 3 can be attached to the outer surface of the central processing unit 2, the heat of the central processing unit 2 is led out to the heat conducting block 3, the circulating water pump 4, the water tank 5 and the water pipe 6 form a circulating water path, and a water path is arranged in the heat conducting block 3, so that the heat at the heat conducting block 3 can be taken away and dissipated by using cooling water flowing in the circulating water path, and the central processing unit 2 is cooled; in addition, heat conduction piece 3 sets up around a plurality of surfaces of central processing unit 2, and heat conduction piece 3 can increase heat conduction piece 3 and central processing unit 2 area of contact promptly with a plurality of surface laminating of central processing unit 2 to improve heat conduction efficiency, thereby improve the radiating effect. It should be understood that the heat conduction block 3 may be attached to four outer surfaces of the cpu 2, or may be attached to three surfaces of the cpu 2, which is not limited in this application. It should also be understood that, for other heat generating components in the computer, a heat conducting block may be attached to the heat generating component to achieve heat dissipation, and a specific location of the heat conducting block may be determined according to actual needs, which is not specifically limited in this application.
The embodiment of the utility model provides a pair of computer mainframe water-cooling structure, it sets up the heat conduction piece to locate the laminating through the central processing unit at quick-witted incasement, and set up the water course in the heat conduction piece, heat conduction piece and circulating water pump, the water tank leads to pipe and connects, form a circulation water route, the cooling water is at this circulation water route mesocycle flow, thereby take away central processing unit's heat, realize the heat dissipation cooling to central processing unit, and through setting up a plurality of surfaces that the heat conduction piece centers on central processing unit, thereby can increase the contact surface of heat conduction piece and central processing unit, thereby further improve the radiating effect.
In one embodiment, the circulating water pump 4 adjusts the rotation speed according to the temperature of the cpu 2. The rotating speed of the circulating water pump 4 is adjusted by monitoring the temperature of the central processing unit 2, so that the rotating speed of the circulating water pump 4 can be adjusted according to the requirement, and the energy consumption of a circulating water path is saved on the premise of ensuring the cooling requirement of the central processing unit 2. In a further embodiment, the rotational speed of the circulating water pump 4 is positively correlated with the temperature of the cpu 2. When the temperature of the central processing unit 2 is too high, the rotating speed of the circulating water pump 4 can be increased to increase the heat dissipation rate, so that the temperature of the central processing unit 2 is reduced, and the problem of faults caused by the fact that the temperature of the central processing unit 2 is too high is solved.
In an embodiment, the heat conducting block 3 comprises an aluminium block. Through setting up the better aluminium piece of heat conductivility, can accelerate central processing unit 2's heat transfer to heat conduction piece 3 to improve the radiating efficiency.
In one embodiment, the outer wall of the water tank 5 is provided with heat radiating fins. Through set up radiating fin in the outer wall department of water tank 5, can improve water tank 5's radiating efficiency to can reduce the temperature of cooling water, guarantee then that the temperature of the cooling water that reachs heat conduction piece 3 department is lower, just also guaranteed heat radiation effect of heat conduction piece 3. In an embodiment, the water tank 5 may comprise an aluminum tank. Through setting up the better aluminium case of thermal conductivity, can accelerate the heat of cooling water in the water tank 5 and dispel to improve the radiating efficiency.
In one embodiment, as shown in fig. 1, a heat dissipation fan 7 is disposed at the water tank 5. By providing the heat radiation fan 7, the heat radiation of the cooling water in the water tank 5 can be further accelerated, thereby improving the heat radiation efficiency. In a further embodiment, the heat dissipation fans 7 are disposed on two opposite sides of the water tank 5, and the wind directions of the heat dissipation fans 7 on the two sides of the water tank 5 are opposite. By providing the plurality of heat radiating fans 7, heat radiating efficiency can be improved, and convection is formed by using opposite wind directions of the heat radiating fans 7 at both sides of the water tank 5, thereby further improving heat radiating efficiency.
In one embodiment, as shown in fig. 1, a ventilation hole 8 is disposed at a position of the chassis 1 corresponding to the heat dissipation fan 7. In one embodiment, the vent holes 8 are a vent mesh structure. Through setting up ventilation hole 8, can derive the heat of quick-witted incasement 1 inside to avoid quick-witted incasement 1 inside high temperature and drive the temperature of cooling water and also corresponding the improvement, simultaneously, set up ventilation hole 8 into mesh structure, can avoid debris to get into quick-witted incasement 1 inside and influence the performance of computer.
In one embodiment, as shown in fig. 1, a removable screen 9 is provided inside the vent 8. Through setting up detachable filter screen 9, can filter the air that gets into quick-witted case 1 inside, avoid debris to get into and influence the performance of computer, filter screen 9 can be dismantled simultaneously, can realize filter screen 9's washing, has further guaranteed the clean of quick-witted case 1 inside.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalents and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a computer host computer water-cooling structure which characterized in that includes:
the computer comprises a case and a central processing unit arranged in the case;
the heat conduction block is attached to the central processing unit;
a circulating water pump for driving the flow of cooling water;
a water tank for storing the cooling water; and
the water pipe is used for connecting the heat conduction block, the circulating water pump and the water tank;
wherein a water channel is provided in the heat-conducting block, the cooling water flows in the water channel, and the heat-conducting block is provided around a plurality of outer surfaces of the cpu.
2. The water-cooling structure of claim 1, wherein the water circulating pump adjusts a rotation speed according to a temperature of the central processing unit.
3. The water-cooling temperature reduction structure according to claim 2, wherein the rotation speed of the circulating water pump is positively correlated with the temperature of the central processing unit.
4. The water-cooled temperature reduction structure according to claim 1, wherein the heat conduction block comprises an aluminum block.
5. The water-cooling structure of claim 1, wherein the outer wall of the water tank is provided with heat dissipation fins.
6. The water-cooling structure of claim 1, wherein a heat dissipation fan is disposed at the water tank.
7. The water-cooling structure of claim 6, wherein the number of the heat dissipation fans is plural, the heat dissipation fans are respectively disposed on two opposite sides of the water tank, and the wind directions of the heat dissipation fans located on the two sides of the water tank are opposite.
8. The water-cooling structure of claim 6, wherein a ventilation hole is formed in the case at a position corresponding to the cooling fan.
9. The water-cooled cooling structure of claim 8, wherein the ventilation holes are a ventilation mesh structure.
10. The water-cooling structure of claim 8, wherein a detachable filter screen is arranged inside the ventilation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021810827.6U CN213423871U (en) | 2020-08-26 | 2020-08-26 | Computer host computer water-cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021810827.6U CN213423871U (en) | 2020-08-26 | 2020-08-26 | Computer host computer water-cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213423871U true CN213423871U (en) | 2021-06-11 |
Family
ID=76258566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021810827.6U Expired - Fee Related CN213423871U (en) | 2020-08-26 | 2020-08-26 | Computer host computer water-cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213423871U (en) |
-
2020
- 2020-08-26 CN CN202021810827.6U patent/CN213423871U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210611 |