CN213368452U - Case heat radiation structure of helicopter airborne equipment - Google Patents
Case heat radiation structure of helicopter airborne equipment Download PDFInfo
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- CN213368452U CN213368452U CN202022606518.3U CN202022606518U CN213368452U CN 213368452 U CN213368452 U CN 213368452U CN 202022606518 U CN202022606518 U CN 202022606518U CN 213368452 U CN213368452 U CN 213368452U
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- 230000005855 radiation Effects 0.000 title abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 73
- 238000012545 processing Methods 0.000 claims abstract description 31
- 102100029368 Cytochrome P450 2C18 Human genes 0.000 claims abstract description 14
- 101000919360 Homo sapiens Cytochrome P450 2C18 Proteins 0.000 claims abstract description 14
- 230000007613 environmental effect Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model provides a quick-witted case heat radiation structure of helicopter airborne equipment, include: the device comprises a case main body, a processing module, a VPX or CPCI connector, a PCB mother board, a PCB interface board, an aviation connector, a heat dissipation cold plate and an L-shaped heat pipe; the top panel and the bottom panel of the case main body form a main radiating surface; the two side panels are chip mounting surfaces, and the heat dissipation cold plate is mounted on the top panel and the bottom panel of the case body through the locker; the heat dissipation cold plate is provided with L-shaped heat conduction grooves, the section of each heat conduction groove is U-shaped, and the heat dissipation cold plate is tightly connected with the processing module and used for dissipating heat of the processing module; the L-shaped heat pipe is arranged in the heat conduction groove, covers the processing module through the heat conduction pad and extends to the mounting surface of the heat dissipation cold plate and the case. The utility model discloses make on chip heat directly conducts the quick-witted case main part through the heat pipe, reduce thermal resistance and conduction route, can satisfy on-machine environmental suitability and electromagnetic compatibility requirement.
Description
Technical Field
The utility model belongs to the technical field of electronic equipment's temperature control and specifically relates to a quick-witted case heat radiation structure of helicopter airborne equipment is related to.
Background
With the continuous development of electronic technology, the power of an electronic equipment system is larger and larger, but the physical size is smaller and smaller, the heat flow density is increased sharply, and the heat dissipation risk is increased. Especially, under the severe working environment of high temperature, the reliability of the equipment can be ensured only through good heat dissipation. The above phenomena are particularly evident in the field of electronic devices in the field of aircraft, in particular in the field of devices onboard helicopters. Meanwhile, airborne equipment of the helicopter has higher requirements on environmental adaptability and weight indexes.
The existing heat dissipation methods for airborne equipment of a helicopter mainly comprise three methods: air-cooled heat dissipation, liquid-cooled heat dissipation and cold conduction heat dissipation. The air-cooled heat dissipation method has medium heat dissipation efficiency, is suitable for generating equipment with low heat dissipation requirement, but has poor electromagnetic compatibility. The liquid cooling heat dissipation method can obtain the highest heat dissipation efficiency, but needs secondary cooling equipment, increases the weight by hundreds of kilograms, and is not suitable for being adopted on a helicopter. The cold conduction and heat dissipation method has good electromagnetic compatibility but low heat dissipation efficiency, and is generally used for low-power consumption equipment (below 50 watts). The three heat dissipation methods before the problem of heat dissipation of the helicopter-mounted equipment with high power consumption (more than 50 watts) cannot be well solved.
Therefore, a case heat dissipation structure of the airborne equipment of the helicopter, which has good heat dissipation and light weight, is urgently needed to be constructed, so that the heat dissipation efficiency of the airborne equipment is improved, the extra weight is not increased, and the environmental requirement on the helicopter is met.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defect that exists among the prior art, the utility model aims to provide a quick-witted case heat radiation structure of helicopter airborne equipment, to helicopter high-power consumption airborne equipment to the radiating efficiency, weight, the multiple restraint of electromagnetic compatibility etc., a heat radiation structure is proposed, make on the chip heat directly conducts the equipment machine case through the heat pipe, reduce the thermal resistance and shorten the conduction route, improve the on-machine environmental suitability and satisfy the on-machine electromagnetic compatibility requirement, and do not increase extra weight, reach higher radiating efficiency, compromise the purpose of performance and weight simultaneously.
In order to achieve the above object, the present invention provides the following technical solutions.
A case heat dissipation structure of helicopter airborne equipment, it includes: the device comprises a case main body, a processing module, a VPX or CPCI connector, a PCB mother board, a PCB interface board and an aviation connector, and also comprises a heat dissipation cold plate and an L-shaped heat pipe;
the whole case main body is in a cuboid shape, and the processing module, the VPX or CPCI connector, the PCB motherboard, the PCB interface board, the heat dissipation cold plate and the L-shaped heat pipe are all arranged inside the case main body; the cabinet main body includes: the front panel and the rear panel are integrally rectangular; fins are respectively arranged on the outer surfaces perpendicular to the top panel and the bottom panel; the two side panels are provided with corresponding mounting clamping grooves for fixedly mounting the PCB motherboard and the PCB interface board, and the heat dissipation cold plate is mounted on the top panel and the bottom panel of the case main body through a locker; the front panel and the rear panel are integrally square, and the front panel is uniformly provided with a plurality of aviation connectors;
the processing module, the VPX or CPCI connector, the PCB motherboard and the PCB interface board are electrically connected with the aviation connector;
the heat dissipation cold plate is rectangular as a whole, each heat dissipation cold plate is provided with an L-shaped heat conduction groove, the section of each heat conduction groove is U-shaped, and the heat dissipation cold plate is tightly connected with the processing module;
the L-shaped heat pipe is arranged in the heat conduction groove, covers the processing module through the heat conduction pad and extends to the mounting surface of the heat dissipation cold plate and the case main body.
Preferably, the L-shaped heat pipe is fixed in the heat conducting groove of the heat dissipation cold plate, and the diameter of the L-shaped heat pipe is 5 mm-8 mm; and the L-shaped heat pipe is flush with the surface of the heat dissipation cold plate after being installed.
Preferably, the width of the heat conduction groove is 5 mm-8 mm, and each heat dissipation cold plate is provided with 2L-shaped heat conduction grooves.
Preferably, a plurality of grooves parallel to each other are arranged inside the L-shaped heat pipe.
Preferably, the fins are provided in plurality and uniformly arranged on the outer surfaces of the top panel and the bottom panel, the thickness of the fins is 10mm, and the height of the fins is 15 mm.
Preferably, the processing module comprises: CPU, FPGA and power chip.
Preferably, the module signal generated by the processing module is led out to the aviation connector of the front panel of the chassis main body through a VPX or CPCI connector, a PCB motherboard, a PCB interface board and an aviation socket.
Preferably, an electromagnetic shielding strip is disposed at a gap between the panels of the chassis main body.
The utility model has the advantages that:
1. the heat dissipation efficiency is high: the heat of each chip in the processing module is directly conducted to the surface of the case through the heat pipe, and the heat dissipation problem of high-power airborne equipment can be solved.
2. No additional volume and weight are added: no secondary cooling equipment is required and the volume and weight are substantially the same as before the addition of the heat pipe.
3. The environmental suitability is good: the requirements of the airborne environment of the helicopter and the electromagnetic compatibility of the helicopter are met.
4. The reliability is high: compared with an air cooling heat dissipation method, no fan component is provided; compared with a liquid cooling heat dissipation method, the method has no secondary cooling equipment, and the heat dissipation reliability of the heat pipe is higher than that of air cooling heat dissipation and liquid cooling heat dissipation.
Drawings
Fig. 1 is a schematic view of the heat dissipation cold plate of the present invention.
Fig. 2 is a schematic view of the main body of the case of the present invention.
Fig. 3 is a schematic diagram of the internal signal extraction of the case body of the present invention.
Fig. 4 is an assembled side view of the main body of the casing of the present invention.
Fig. 5 is an assembly diagram of the case body and the processing module according to the present invention.
Detailed Description
In order to make the purpose, technical solution and advantages of the present invention clearer, the following will combine the drawings in the embodiments of the present invention to perform more detailed description on the technical solution in the embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are only some, but not all embodiments of the invention. The embodiments and the directional terms described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
The present invention will be further described with reference to fig. 1-5.
A case heat dissipation structure of helicopter airborne equipment, it includes: case main part, processing module 11, VPX or CPCI connector 12, PCB motherboard 13, PCB interface board 14, aviation connector 7 still include: a heat-dissipating cold plate 8 and an L-shaped heat pipe;
the case main body is integrally in a cuboid shape, and the processing module 11, the VPX or CPCI connector 12, the PCB mother board 13, the PCB interface board 14, the heat dissipation cold plate 8 and the L-shaped heat pipe are all arranged inside the case main body; the cabinet main body includes: the structure comprises a top panel 1, a bottom panel 2, a front panel 3, a rear panel 4 and two side panels 5, wherein the top panel 1, the bottom panel 2 and the two side panels 5 are rectangular as a whole; fins 6 are respectively arranged on the outer surfaces of the top panel 1 and the bottom panel 2 in a vertical mode to form a main radiating surface; the two side panels 5 are provided with corresponding mounting clamping grooves for fixedly mounting the PCB mother board 13 and the PCB interface board 14, and the heat dissipation cold plate 8 is mounted on the top panel 1 and the bottom panel 2 of the case body through a locker 10; the front panel 3 and the rear panel 4 are integrally square, and the front panel 3 is uniformly provided with a plurality of aviation connectors 7;
the processing module 11, the VPX or CPCI connector 12, the PCB motherboard 13 and the PCB interface board 14 are electrically connected with the aviation connector 7;
the heat dissipation cold plate 8 is rectangular as a whole, each heat dissipation cold plate 8 is provided with an L-shaped heat conduction groove 9, the section of each heat conduction groove 9 is U-shaped, and the heat dissipation cold plate 8 is tightly connected with the processing module 11 and used for dissipating heat of the processing module 11;
the L-shaped heat pipe is disposed in the heat conducting groove 9, and the L-shaped heat pipe covers the processing module 11 through a heat conducting pad and extends to a mounting surface of the heat dissipation cold plate 8 and the case main body.
The L-shaped heat pipe is fixed in the heat conducting groove 9 of the heat dissipation cold plate 8 in a welding mode, and the diameter of the L-shaped heat pipe is 5 mm-8 mm; the L-shaped heat pipe is flush with the surface of the heat dissipation cold plate 8 after being installed.
The width of the heat conducting groove 9 is 5 mm-8 mm, and each heat radiating cold plate 8 is provided with 2L-shaped heat conducting grooves 9.
The L-shaped heat pipe is integrally processed and formed by adopting a copper material, a plurality of parallel grooves are formed in the L-shaped heat pipe, and liquid flowing back in the pipe rapidly conducts heat in the L-shaped heat pipe through the grooves so as to achieve the effect of conducting the heat of the processing module 11.
The heat dissipation cold plate 8 is a heat conduction surface, and conducts heat generated by the processing module 11 to the top panel 1 and the bottom panel 2 of the case body through the locker 10.
The fins 6 are used for enhancing the heat conduction of the surface of the case main body, and can play a good heat dissipation effect under the condition of weak air convection.
The processing module 11 includes: CPU, FPGA and power chip.
The module signal generated by the processing module 11 is led out to the aviation connector 7 of the front panel 3 of the case main body through a VPX or CPCI connector 12, a PCB motherboard 13, a PCB interface board 14 and an aviation socket 15.
Electromagnetic shielding strips are arranged at the gaps of the panels of the case main body.
The working process of the utility model
The power consumption of a comprehensive task processor of a certain helicopter is 83 watts. When the traditional cold conduction and heat dissipation mode is adopted, the maximum working temperature is 68 ℃ through the test of a high-temperature working test. Adopt the utility model discloses a heat pipe heat dissipation method improves quick-witted case and module cold plate structure, and the highest operating temperature can reach 76 ℃.
As shown in fig. 1, the heat pipe heat dissipation technology is adopted for the internal module of the onboard processor. Every be provided with the heat conduction groove 9 that is the L type on the heat dissipation cold drawing 8, heat conduction groove 9 is used for installing L type heat pipe, and L type heat pipe diameter is 5 mm. The L-shaped heat pipe directly covers the CPU, the FPGA and the power supply chip. The L-shaped heat pipe is in contact with the processor module (each chip) by adopting a heat conducting pad.
As shown in fig. 2, the heat pipe heat dissipation technology is applied to the case body of the onboard processor. The top panel 1 and the bottom panel 2 of the case body are main heat dissipation surfaces, and heat is dissipated through air convection and heat radiation. The height of the fins 6 of the top panel is 15mm, and the thickness of the fins is 10 mm. The front of the chassis is mounted with an aerial connector 7.
As shown in fig. 3, the processing module 11 signals are led out to the aviation connector 7 of the front panel 3 of the chassis main body through the VPX or CPCI connector 12, the PCB motherboard 13 and the PCB interface board 14.
Ground test and aerial test flight show that certain type helicopter combined task processor adopts the utility model discloses a heat pipe heat dissipation method satisfies the helicopter airborne equipment high temperature work, low temperature work, high temperature storage, low temperature storage, vibration, impact, acceleration, temperature impact, temperature-height and the electromagnetic compatibility requirement that GJB150 and GJB151 stipulate, satisfies the flight operation requirement.
Finally, it should be pointed out that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (8)
1. A case heat dissipation structure of helicopter airborne equipment, it includes: case main part, processing module, VPX or CPCI connector, PCB motherboard, PCB interface board and aviation connector, its characterized in that: the heat dissipation cold plate and the L-shaped heat pipe are also included;
the whole case main body is in a cuboid shape, and the processing module, the VPX or CPCI connector, the PCB motherboard, the PCB interface board, the heat dissipation cold plate and the L-shaped heat pipe are all arranged inside the case main body; the cabinet main body includes: the front panel and the rear panel are integrally rectangular; fins are respectively arranged on the outer surfaces perpendicular to the top panel and the bottom panel; the two side panels are provided with corresponding mounting clamping grooves for fixedly mounting the PCB motherboard and the PCB interface board; the heat dissipation cold plate is arranged on the top panel and the bottom panel of the case body through a locker; the front panel and the rear panel are integrally square, and the front panel is uniformly provided with a plurality of aviation connectors;
the processing module, the VPX or CPCI connector, the PCB motherboard and the PCB interface board are electrically connected with the aviation connector;
the heat dissipation cold plate is rectangular as a whole, each heat dissipation cold plate is provided with an L-shaped heat conduction groove, the section of each heat conduction groove is U-shaped, and the heat dissipation cold plate is tightly connected with the processing module;
the L-shaped heat pipe is arranged in the heat conduction groove, covers the processing module through the heat conduction pad and extends to the mounting surface of the heat dissipation cold plate and the case main body.
2. The heat dissipation structure for a case of a helicopter airborne apparatus according to claim 1, characterized in that: the L-shaped heat pipe is fixed in the heat conducting groove of the heat dissipation cold plate, and the diameter of the L-shaped heat pipe is 5-8 mm; and the L-shaped heat pipe is flush with the surface of the heat dissipation cold plate after being installed.
3. The heat dissipation structure for a case of a helicopter airborne apparatus according to claim 2, characterized in that: the width of the heat conduction groove is 5 mm-8 mm, and each heat dissipation cold plate is provided with 2L-shaped heat conduction grooves.
4. A heat dissipating structure for a case of a helicopter airborne apparatus according to claim 3, characterized in that: and a plurality of grooves which are parallel to each other are arranged in the L-shaped heat pipe.
5. The heat dissipating structure for a casing of a helicopter airborne apparatus according to claim 4, characterized in that: the fin is provided with a plurality ofly, evenly sets up on the surface of top panel and bottom surface board, fin thickness is 10mm, the height 15mm of fin.
6. The heat dissipating structure for a casing of a helicopter airborne apparatus according to claim 5, characterized in that: the processing module comprises: CPU, FPGA and power chip.
7. The heat dissipating structure for a casing of a helicopter airborne apparatus according to claim 6, characterized in that: and module signals generated by the processing module are led out to the aviation connector of the front panel of the case main body through the VPX or CPCI connector, the PCB motherboard, the PCB interface board and the aviation socket.
8. The heat dissipating structure for a casing of a helicopter airborne apparatus according to claim 7, characterized in that: electromagnetic shielding strips are arranged at the gaps of the panels of the case main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022606518.3U CN213368452U (en) | 2020-11-12 | 2020-11-12 | Case heat radiation structure of helicopter airborne equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022606518.3U CN213368452U (en) | 2020-11-12 | 2020-11-12 | Case heat radiation structure of helicopter airborne equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213368452U true CN213368452U (en) | 2021-06-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022606518.3U Active CN213368452U (en) | 2020-11-12 | 2020-11-12 | Case heat radiation structure of helicopter airborne equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213368452U (en) |
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2020
- 2020-11-12 CN CN202022606518.3U patent/CN213368452U/en active Active
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