CN213305770U - 5G wireless communication module - Google Patents
5G wireless communication module Download PDFInfo
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- CN213305770U CN213305770U CN202022849822.0U CN202022849822U CN213305770U CN 213305770 U CN213305770 U CN 213305770U CN 202022849822 U CN202022849822 U CN 202022849822U CN 213305770 U CN213305770 U CN 213305770U
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- communication module
- wireless communication
- circuit board
- module circuit
- heat dissipation
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Abstract
The utility model discloses a 5G wireless communication module, including 5G wireless communication module circuit board and connecting plate, the front surface central point of 5G wireless communication module circuit board puts embedding fixed mounting has 5G communication module chip, the front surface movable mounting of 5G communication module chip has the heat dissipation frame, 5G wireless communication module circuit board one side is close to the position of upper end and has signal antenna swing joint spare through screw fixed mounting, signal antenna swing joint spare install in 5G wireless communication module circuit board other end fixedly connected with signal antenna. A5G wireless communication module, play for the radiating effect of 5G communication module chip through establishing the heat dissipation frame through ventilative film and heat conduction silicone grease heat dissipation film, make 5G wireless communication module circuit board through the connecting plate, can decide whether to keep standing on the mainboard or keeping parallel with the mainboard as required to this decision occupies surplus mounting area on the mainboard.
Description
Technical Field
The utility model relates to a wireless communication module technical field, in particular to 5G wireless communication module.
Background
The wireless communication module has the functions of: communication function: support GPRS and short message binary channels transmission data, support multicenter data communication, adopt the function: gather serial devices data, like serial instrument, collector, PLC etc. remote management function: support remote parameter setting, procedure upgrading, its characteristics have: the industrial design is suitable for outdoor severe environment, a software and hardware watchdog is arranged in the industrial design, the industrial design is free from crash and disconnection, transparent data transmission is supported, a domain name resolution function is supported, configuration software and a user self-development software system are supported, and the industrial design has the advantages that: the wireless communication module is widely applied to the fields of vehicle monitoring, remote control, remote measurement, small wireless networks, wireless meter reading, access control systems, cell paging, industrial data acquisition systems, wireless tags, identity recognition, non-contact RF smart cards, small wireless data terminals, safety fire prevention systems, wireless remote control systems, biological signal acquisition, hydrological weather monitoring, robot control, wireless data communication, digital audio, digital image transmission and the like, and the data transmission can be simply divided into two major modes of wired and wireless, namely wired: including setting up optical cable, cable or renting the special line of telecommunications, wireless: establishing a special wireless data transmission system or borrowing a public network information platform; the existing wireless communication module has certain disadvantages when in use, the chip is easy to scald when the service life is too long, the size of the mounting position of the general wireless communication module is not mounted according to the size of the mainboard, and the residual mounting position of the mainboard is possibly not enough
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a 5G wireless communication module, which can effectively solve the problems of the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a 5G wireless communication module, includes 5G wireless communication module circuit board and connecting plate, the front surface central point of 5G wireless communication module circuit board puts embedding fixed mounting has 5G communication module chip, the front surface movable mounting of 5G communication module chip has the heat dissipation frame, 5G wireless communication module circuit board one side is close to the position of upper end and has signal antenna swing joint spare through screw fixed mounting, the installation of signal antenna swing joint spare is in 5G wireless communication module circuit board other end fixedly connected with signal antenna.
Preferably, an opening is formed in the middle of the lower surface of the 5G wireless communication module circuit board, and a circular jack is formed in the position, close to the lower surface of the 5G wireless communication module circuit board, of the inner side of the opening.
Preferably, the positions, close to the upper end, of the two sides of the connecting plate are fixedly provided with cylindrical joints, grooves are evenly formed in the front surface of the connecting plate, welding pins are fixedly arranged in the grooves, wires are fixedly connected between the welding pins and the 5G wireless communication module circuit board, the cylindrical joints are mounted at the other ends of the connecting plate and movably mounted on the inner side of the circular jacks, and the connecting plate is movably mounted on the inner side of the opening through the cylindrical joints.
Preferably, a breathable film is fixedly mounted at the position of the front surface inside the heat dissipation outer frame, and a heat-conducting silicone grease heat dissipation film is fixedly mounted on the rear surface of the breathable film.
Preferably, the rear surface of the heat-conducting silicone grease heat dissipation film is attached to the front surface of the 5G communication module chip.
Preferably, the thickness of the 5G wireless communication module circuit board is the same as that of the connecting board.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, through the heat dissipation frame that sets up, the heat dissipation frame plays through ventilative film and heat conduction silicone grease heat dissipation film and gives the radiating effect of 5G communication module chip, and through the connecting plate that sets up, the connecting plate makes 5G wireless communication module circuit board, can decide whether to keep standing on the mainboard or keeping parallel with the mainboard according to the demand to this decision occupies surplus mounting area on the mainboard.
Drawings
Fig. 1 is a schematic view of an overall structure of a 5G wireless communication module according to the present invention;
fig. 2 is a cross-sectional view of a circular jack of a 5G wireless communication module circuit board of the 5G wireless communication module of the present invention;
fig. 3 is a partial sectional view of a heat dissipation frame of a 5G wireless communication module according to the present invention;
fig. 4 is an enlarged view of a portion a in fig. 1 of a 5G wireless communication module according to the present invention.
In the figure: 1. a 5G wireless communication module circuit board; 101. an opening; 102. a circular jack; 2. 5G communication module chip; 3. a connecting plate; 301. a cylindrical joint; 302. a groove; 303. welding a pin; 304. a wire; 4. a heat dissipation outer frame; 401. a breathable film; 402. a heat conductive silicone grease heat dissipation film; 5. a signal antenna movable connecting piece; 6. a signal antenna.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, a 5G wireless communication module includes a 5G wireless communication module circuit board 1 and a connection board 3, a 5G wireless communication module chip 2 is fixedly embedded in the center of the front surface of the 5G wireless communication module circuit board 1, a heat dissipation outer frame 4 is movably mounted on the front surface of the 5G communication module chip 2, a signal antenna movable connector 5 is fixedly mounted on one side of the 5G wireless communication module circuit board 1 near the upper end thereof by screws, and a signal antenna 6 is fixedly connected to the other end of the 5G wireless communication module circuit board 1 where the signal antenna movable connector 5 is mounted;
an opening 101 is formed in the middle of the lower surface of the 5G wireless communication module circuit board 1, and a circular jack 102 is formed in the position, close to the lower surface of the 5G wireless communication module circuit board 1, of the inner side of the opening 101; cylindrical connectors 301 are fixedly mounted at positions, close to the upper ends, of two sides of the connecting plate 3, grooves 302 are uniformly formed in the front surface of the connecting plate 3, welding pins 303 are fixedly mounted inside the grooves 302, a lead 304 is fixedly connected between the welding pins 303 and the 5G wireless communication module circuit board 1, the cylindrical connectors 301 are mounted at the other ends of the connecting plate 3 and movably mounted on the inner sides of the circular jacks 102, and the connecting plate 3 is movably mounted on the inner sides of the openings 101 through the cylindrical connectors 301; a ventilating film 401 is fixedly arranged at the position of the front surface inside the heat dissipation outer frame 4, and a heat-conducting silicone grease heat dissipation film 402 is fixedly arranged on the rear surface of the ventilating film 401; the rear surface of the heat-conducting silicone grease heat-dissipating film 402 is attached to the front surface of the 5G communication module chip 2; the thickness of the 5G wireless communication module circuit board 1 is the same as that of the connecting board 3.
It should be noted that, the utility model relates to a 5G wireless communication module, when in use, the welding feet 303 in the groove 302 on the front surface of the connecting board 3 are welded to the proper position on the mainboard, the wire 304 plays a role of connecting the circuit, the 5G wireless communication module circuit board 1 is adjusted to stand on the mainboard or keep parallel with the mainboard through the circular jack 102 on the 5G wireless communication module circuit board 1 and the cylindrical joints 301 on both sides of the connecting board 3, the heat dissipation frame 4 plays a role of dissipating heat for the 5G communication module chip 2 through the ventilation film 401 and the heat conduction silicone grease heat dissipation film 402, the heat dissipation frame 4 can be detached, the connecting board 3 makes the 5G wireless communication module circuit board 1, whether to stand on the mainboard or keep parallel with the mainboard can be decided according to the area requirement of the residual mainboard mounting position, thereby determining the residual installation area occupied on the mainboard.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A 5G wireless communication module, characterized in that: including 5G wireless communication module circuit board (1) and connecting plate (3), the front surface central point of 5G wireless communication module circuit board (1) puts embedding fixed mounting has 5G communication module chip (2), the front surface movable mounting of 5G communication module chip (2) has heat dissipation frame (4), there is signal antenna swing joint spare (5) through screw fixed mounting in the position that 5G wireless communication module circuit board (1) one side is close to the upper end, install in 5G wireless communication module circuit board (1) other end fixedly connected with signal antenna (6) of signal antenna swing joint spare (5).
2. The 5G wireless communication module according to claim 1, wherein: an opening (101) is formed in the middle of the lower surface of the 5G wireless communication module circuit board (1), and a circular jack (102) is formed in the position, close to the lower surface of the 5G wireless communication module circuit board (1), of the inner side of the opening (101).
3. The 5G wireless communication module according to claim 2, wherein: the utility model discloses a wireless communication module, including connecting plate (3), the both sides of connecting plate (3) are close to the position fixed mounting of upper end and have cylinder joint (301), connecting plate (3) front surface evenly sets up fluted (302), the inside fixed mounting of recess (302) has welding foot (303), fixedly connected with wire (304) between welding foot (303) and 5G wireless communication module circuit board (1), cylinder joint (301) are installed in the other one end movable mounting of connecting plate (3) and are in circular jack (102) inboard, connecting plate (3) pass through cylinder joint (301) movable mounting in opening (101) inboard.
4. The 5G wireless communication module according to claim 1, wherein: the heat dissipation frame is characterized in that a ventilating film (401) is fixedly arranged on the front surface inside the heat dissipation frame (4), and a heat conduction silicone grease heat dissipation film (402) is fixedly arranged on the rear surface of the ventilating film (401).
5. The 5G wireless communication module according to claim 4, wherein: the rear surface of the heat-conducting silicone grease heat dissipation film (402) is attached to the front surface of the 5G communication module chip (2).
6. The 5G wireless communication module according to claim 1, wherein: the thickness of the 5G wireless communication module circuit board (1) is the same as that of the connecting board (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022849822.0U CN213305770U (en) | 2020-12-02 | 2020-12-02 | 5G wireless communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022849822.0U CN213305770U (en) | 2020-12-02 | 2020-12-02 | 5G wireless communication module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213305770U true CN213305770U (en) | 2021-05-28 |
Family
ID=76017135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022849822.0U Active CN213305770U (en) | 2020-12-02 | 2020-12-02 | 5G wireless communication module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213305770U (en) |
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2020
- 2020-12-02 CN CN202022849822.0U patent/CN213305770U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 21st floor, block B, building 9, Shenzhen Bay science and technology ecological park, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Haizhijing Technology Group Co.,Ltd. Address before: 518000 21st floor, block B, building 9, Shenzhen Bay science and technology ecological park, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAIZHIJING TECHNOLOGY CO.,LTD. |