CN213280192U - Soft and hard combined plate product structure with stepped plate thickness - Google Patents
Soft and hard combined plate product structure with stepped plate thickness Download PDFInfo
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- CN213280192U CN213280192U CN202021969536.1U CN202021969536U CN213280192U CN 213280192 U CN213280192 U CN 213280192U CN 202021969536 U CN202021969536 U CN 202021969536U CN 213280192 U CN213280192 U CN 213280192U
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Abstract
The utility model discloses a product structure of a ladder-shaped plate thick rigid-flexible board, which comprises a flexible board, a first rigid board and a second rigid board; the upper surface of the first hard board and the lower surface of the second hard board are respectively provided with a first groove, a second groove, a third groove and a fourth groove, the first groove is communicated with the second groove, the depths of the first groove and the second groove are different to form a stepped structure, correspondingly, the third groove is communicated with the fourth groove, and the depths of the third groove and the fourth groove are different to form a stepped structure; the product can be used for mounting electronic components on different areas and different numbers of circuit layers and can be used for mounting the electronic components on areas with different thicknesses in the hard board area.
Description
Technical Field
The utility model belongs to the technical field of the soft or hard combination circuit board and specifically relates to indicate the thick soft or hard combination board product structure of echelonment board.
Background
The layer number and the thickness of a hard board area and a hard board area of the existing soft and hard combined circuit board are consistent. However, as electronic products are miniaturized and light-weighted, the design and installation space is more and more compact, and in order to save the internal space of the products, electronic components need to be installed on different areas and circuit layers with different layers on the same rigid-flexible circuit board, or need to be installed on areas with different thicknesses in a rigid board area due to the limitation of the assembly space. Therefore, there is a need for improvement of the existing soft and hard combined circuit board.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a product structure of a step-shaped rigid-flexible printed circuit board, which can effectively solve the problem that the conventional rigid-flexible printed circuit board cannot mount electronic components on circuit layers of different areas and layers on the same rigid-flexible printed circuit board and cannot mount electronic components on areas with different thicknesses in the rigid-flexible printed circuit board.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a product structure of a step-shaped plate thick rigid-flexible board comprises a flexible board, a first rigid board and a second rigid board;
the soft board comprises a PI base layer, a first copper foil layer and a second copper foil layer; the first copper foil layer and the second copper foil layer are respectively covered on the upper surface and the lower surface of the PI base layer; the upper surface of the first copper foil layer is partially covered with a first bonding layer, the surface of the first bonding layer is bonded with a first PI covering film, the lower surface of the second copper foil layer is partially covered with a second bonding layer, and the surface of the second bonding layer is bonded with a second PI covering film;
the first hard board comprises a first PP layer, a third copper foil layer, a first FR4 layer, a fourth copper foil layer, a second PP layer, a fifth copper foil layer, a second FR4 layer, a sixth copper foil layer and a first copper-plated layer which are sequentially overlapped from bottom to top, wherein the first PP layer covers the upper surface of the first copper foil layer, a first groove and a second groove are formed in the upper surface of the first copper-plated layer, the first groove penetrates downwards to the upper surface of the first PI covering film, the second groove is communicated with the first groove, the second groove penetrates downwards to the upper surface of the fourth copper foil layer, and the depth of the second groove is different from that of the first groove to form a stepped structure;
this second hardboard is including the third PP layer from top to bottom coincide in proper order, the seventh copper foil layer, third FR4 layer, the eighth copper foil layer, the fourth PP layer, the ninth copper foil layer, fourth FR4 layer, tenth copper foil layer and second copper-plated layer, third PP layer covers the lower surface at the second copper foil layer, third recess and fourth recess have been seted up to the lower surface on second copper-plated layer, this third recess upwards runs through to the lower surface that the second PI covered the membrane, this fourth recess and third recess intercommunication, the fourth recess upwards runs through to the lower surface on eighth copper foil layer, the fourth recess is different with the degree of depth of third recess and forms the stair structure.
Preferably, the thickness of the first PP layer is greater than that of the third copper foil layer, and the first adhesive layer and the first PI cover film are embedded in the first PP layer.
Preferably, the third PP layer has a thickness greater than that of the seventh copper foil layer, and the second adhesive layer and the second PI cover film are embedded in the third PP layer.
Preferably, the upper surface of the first copper plating layer and the lower surface of the second copper plating layer are coated with a first solder resist layer.
As a preferable scheme, the bottom surfaces of the second and fourth grooves are coated with second solder resist layers, and the second solder resist layers cover the upper surface of the fourth copper foil layer and the lower surface of the eighth copper foil layer.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
the upper surface of the first copper plating layer and the lower surface of the second copper plating layer are respectively provided with a first groove, a second groove, a third groove and a fourth groove, and the first groove and the second groove are matched for communication, the depths of the first groove and the second groove are different to form a stepped structure, correspondingly, the third groove and the fourth groove are communicated, and the depths of the third groove and the fourth groove are different to form a stepped structure; the product can be used for mounting electronic components on different areas and different numbers of circuit layers and can be used for mounting the electronic components on areas with different thicknesses in the hard board area.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 shows a specific structure of the preferred embodiment of the present invention.
The attached drawings indicate the following:
10. soft board 11, PI basic unit
12. First copper foil layer 13, second copper foil layer
14. First adhesive layer 15 and first PI cover film
16. Second adhesive layer 17, second PI cover film
20. First hard board 201, first recess
202. Second groove 21, first PP layer
22. Third copper foil layer 23, first FR4 layer
24. A fourth copper foil layer 25, a second PP layer
26. Fifth copper foil layer 27, second FR4 layer
28. Sixth copper foil layer 29, first copper plating layer
30. The second hard board 301 and the third groove
302. Fourth groove 31, third PP layer
32. Seventh copper foil layer 33, third FR4 layer
34. Eighth copper foil layer 35, fourth PP layer
36. Ninth copper foil layer 37 and fourth FR4 layer
38. Tenth copper foil layer 39, second copper-plated layer
40. First solder resist layer 50, second solder resist layer.
Detailed Description
Referring to fig. 1, a specific structure of a preferred embodiment of the present invention is shown, which includes a soft board 10, a first hard board 20 and a second hard board 30.
The flexible printed circuit board 10 comprises a PI base layer 11, a first copper foil layer 12 and a second copper foil layer 13; the first copper foil layer 12 and the second copper foil layer 13 are respectively covered on the upper surface and the lower surface of the PI base layer 11; in this embodiment, the upper surface of the first copper foil layer 12 is partially covered with a first adhesive layer 14, the surface of the first adhesive layer 14 is adhesively covered with a first PI cover film 15, the lower surface of the second copper foil layer 13 is partially covered with a second adhesive layer 16, and the surface of the second adhesive layer 16 is adhesively covered with a second PI cover film 17.
The first hard board 20 comprises a first PP layer 21, a third copper foil layer 22, a first FR4 layer 23, a fourth copper foil layer 24, a second PP layer 25, a fifth copper foil layer 26, a second FR4 layer 27, a sixth copper foil layer 28 and a first copper-plated layer 29 which are sequentially overlapped from bottom to top, the first PP layer 21 covers the upper surface of the first copper foil layer 12, a first groove 201 and a second groove 202 are formed in the upper surface of the first copper-plated layer 29, the first groove 201 penetrates downwards to the upper surface of the first PI cover film 15, the second groove 202 is communicated with the first groove 201, the second groove 202 penetrates downwards to the upper surface of the fourth copper foil layer 24, and the second groove 202 and the first groove 201 are different in depth to form a stepped structure. In this embodiment, the thickness of the first PP layer 21 is greater than that of the third copper foil layer 22, and the first adhesive layer 14 and the first PI cover film 15 are embedded in the first PP layer 21.
The second hard board 30 includes a third PP layer 31, a seventh copper foil layer 32, a third FR4 layer 33, an eighth copper foil layer 34, a fourth PP layer 35, a ninth copper foil layer 36, a fourth FR4 layer 37, a tenth copper foil layer 38 and a second copper-plated layer 39, which are sequentially stacked from top to bottom, the third PP layer 31 covers the lower surface of the second copper foil layer 13, the lower surface of the second copper-plated layer 39 is provided with a third groove 301 and a fourth groove 302, the third groove 301 upwards penetrates through the lower surface of the second cover film PI 17, the fourth groove 302 is communicated with the third groove 301, the fourth groove 302 upwards penetrates through the lower surface of the eighth copper foil layer 34, and the fourth groove 302 and the third groove 301 have different depths to form a ladder structure. In this embodiment, the thickness of the third PP layer 31 is greater than that of the seventh copper foil layer 32, and the second adhesive layer 16 and the second PI cover film 17 are embedded in the third PP layer 31.
And the upper surface of the first copper-plated layer 29 and the lower surface of the second copper-plated layer 39 are coated with a first solder resist layer 40, and the bottom surface of the second groove 202 and the bottom surface of the fourth groove 302 are coated with a second solder resist layer 50, the second solder resist layer 50 covering the upper surface of the fourth copper foil layer 24 and the lower surface of the eighth copper foil layer 34.
Detailed description the manufacturing process of this embodiment is as follows:
firstly, the soft board 10 is manufactured by a laminating and pressing mode, then, the upper side and the lower side of the soft board 10 are laminated and pressed, to make the first hard board 20 and the second hard board 30, so that the first hard board 20, the soft board 10 and the second hard board 30 are sequentially stacked together, then, depth control groove milling is respectively carried out on the first hard board 20 and the second hard board 30, after etching, a depth control cover is opened to expose the hard board area with the low layer number, and a first groove 201, a second groove 202, a third groove 301, and a fourth groove 302 are formed, the second groove 202 and the first groove 201 have different depths to form a stepped structure, the fourth groove 302 and the third groove 301 have different depths to form a stepped structure, and then, a first solder resist layer 40 is coated on both the upper surface of the first copper plating layer 29 and the lower surface of the second copper plating layer 39, and a second solder resist layer 50 is coated on both the upper surface of the fourth copper foil layer 24 and the lower surface of the eighth copper foil layer 34.
The utility model is mainly designed by respectively arranging a first groove, a second groove, a third groove and a fourth groove on the upper surface of a first copper plating layer and the lower surface of a second copper plating layer, and matching the first groove and the second groove for communication, wherein the first groove and the second groove have different depths to form a ladder structure, correspondingly, the third groove and the fourth groove are communicated, and the third groove and the fourth groove have different depths to form a ladder structure; the product can be used for mounting electronic components on different areas and different numbers of circuit layers and can be used for mounting the electronic components on areas with different thicknesses in the hard board area.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (5)
1. The utility model provides a thick soft and hard of echelonment board product structure, its characterized in that: comprises a soft board, a first hard board and a second hard board;
the soft board comprises a PI base layer, a first copper foil layer and a second copper foil layer; the first copper foil layer and the second copper foil layer are respectively covered on the upper surface and the lower surface of the PI base layer; the upper surface of the first copper foil layer is partially covered with a first bonding layer, the surface of the first bonding layer is bonded with a first PI covering film, the lower surface of the second copper foil layer is partially covered with a second bonding layer, and the surface of the second bonding layer is bonded with a second PI covering film;
the first hard board comprises a first PP layer, a third copper foil layer, a first FR4 layer, a fourth copper foil layer, a second PP layer, a fifth copper foil layer, a second FR4 layer, a sixth copper foil layer and a first copper-plated layer which are sequentially overlapped from bottom to top, wherein the first PP layer covers the upper surface of the first copper foil layer, a first groove and a second groove are formed in the upper surface of the first copper-plated layer, the first groove penetrates downwards to the upper surface of the first PI covering film, the second groove is communicated with the first groove, the second groove penetrates downwards to the upper surface of the fourth copper foil layer, and the depth of the second groove is different from that of the first groove to form a stepped structure;
this second hardboard is including the third PP layer from top to bottom coincide in proper order, the seventh copper foil layer, third FR4 layer, the eighth copper foil layer, the fourth PP layer, the ninth copper foil layer, fourth FR4 layer, tenth copper foil layer and second copper-plated layer, third PP layer covers the lower surface at the second copper foil layer, third recess and fourth recess have been seted up to the lower surface on second copper-plated layer, this third recess upwards runs through to the lower surface that the second PI covered the membrane, this fourth recess and third recess intercommunication, the fourth recess upwards runs through to the lower surface on eighth copper foil layer, the fourth recess is different with the degree of depth of third recess and forms the stair structure.
2. The product structure of the stepped plate thickness rigid-flexible printed board as claimed in claim 1, wherein: the thickness of the first PP layer is larger than that of the third copper foil layer, and the first bonding layer and the first PI covering film are buried in the first PP layer.
3. The stepped plate thickness rigid-flexible printed board product structure as claimed in claim 1 or 2, wherein: the third PP layer is thicker than the seventh copper foil layer, and the second bonding layer and the second PI covering film are embedded in the third PP layer.
4. The product structure of the stepped plate thickness rigid-flexible printed board as claimed in claim 1, wherein: and the upper surface of the first copper plating layer and the lower surface of the second copper plating layer are coated with a first solder mask layer.
5. The product structure of the stepped plate thickness rigid-flexible printed board as claimed in claim 1, wherein: and the bottom surfaces of the second groove and the fourth groove are coated with second solder mask layers, and the second solder mask layers cover the upper surface of the fourth copper foil layer and the lower surface of the eighth copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021969536.1U CN213280192U (en) | 2020-09-10 | 2020-09-10 | Soft and hard combined plate product structure with stepped plate thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021969536.1U CN213280192U (en) | 2020-09-10 | 2020-09-10 | Soft and hard combined plate product structure with stepped plate thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213280192U true CN213280192U (en) | 2021-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021969536.1U Active CN213280192U (en) | 2020-09-10 | 2020-09-10 | Soft and hard combined plate product structure with stepped plate thickness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213280192U (en) |
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- 2020-09-10 CN CN202021969536.1U patent/CN213280192U/en active Active
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