CN213276491U - High-density server based on quick modification of detachable middle back plate - Google Patents
High-density server based on quick modification of detachable middle back plate Download PDFInfo
- Publication number
- CN213276491U CN213276491U CN202022469014.1U CN202022469014U CN213276491U CN 213276491 U CN213276491 U CN 213276491U CN 202022469014 U CN202022469014 U CN 202022469014U CN 213276491 U CN213276491 U CN 213276491U
- Authority
- CN
- China
- Prior art keywords
- module
- backplate
- connector
- midplane
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012986 modification Methods 0.000 title abstract description 13
- 230000004048 modification Effects 0.000 title abstract description 13
- 238000013461 design Methods 0.000 abstract description 8
- 238000004364 calculation method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The utility model provides a high density server based on quick modification of backplate in can dismantling, include: well backplate module, function node module, power module, well backplate module includes backplate in first well backplate and the second, backplate can be dismantled with the second through the backplate connector in first well backplate is connected, function node module passes through node connector and well backplate module connection, power module passes through power connector and well backplate module connection, and backplate is perpendicular to can dismantle from top to bottom in first well backplate and the second and is connected, and the height that first well backplate and backplate can be dismantled after being connected corresponds the same with quick-witted case height, can realize the server design of different height and not configuration, has reduced the problem that the cost risees because of changing the server leads to, has satisfied the diversified customization demand of customer, has improved server product competitiveness.
Description
Technical Field
The utility model belongs to the technical field of the server and specifically relates to a high density server based on quick modification of backplate in can dismantling.
Background
With the development of technology, the importance of servers becomes higher and higher, and various height (U is a unit representing the size of a server, 1U is 44.45mm, and 8U is 355.6mm) servers are also appeared in succession, such as 1U, 2U, 4U, 5U, 8U, and the like, and the server configuration is also more and more diversified.
The cloud service provider mainly applies virtualization integration, cloud scene optimization, database analysis and management, data analysis, artificial intelligence and the like to many overseas cloud service provider customers, such as Microsoft, Amazon, IBM, Facebook and the like, and aims to meet the cloud application scene of the provider or the customized requirements of the provider according to specific scenes, and most cloud service providers are custom architectures and customize server architecture systems of the provider.
In the prior art, server manufacturers generally mostly use general server products, but the general server products cannot meet the customization requirements of customers to the maximum extent, and rapid modification and deep optimization cannot be performed, so that the requirements are rapid, customer service processing and scheme support are met more efficiently, and the competitiveness of the server products is not favorably improved.
Disclosure of Invention
The utility model discloses a solve the problem that exists among the prior art, the innovation provides a high density server based on the quick modification of backplate in can dismantling, can realize not co-altitude and the server design that can not dispose, has satisfied the diversified customization demand of customer, has improved server product competitiveness.
The utility model discloses the first aspect provides a high density server based on quick modification of backplate in can dismantling, include: the middle backboard module comprises a first middle backboard and a second middle backboard, the first middle backboard is detachably connected with the second middle backboard through a backboard connector, the functional node module is connected with the middle backboard module through a node connector, the power supply module is connected with the middle backboard module through a power supply connector, the first middle backboard is vertically and detachably connected with the second middle backboard, and the height of the first middle backboard after the first middle backboard is detachably connected with the second middle backboard is the same as the height of the case correspondingly.
Optionally, the functional node modules include a compute node module and a storage node module, the compute node module is connected to the middle back panel module through a compute node connector, and the storage node module is connected to the middle back panel module through a storage node connector.
Further, the first middle back plate and the second middle back plate respectively comprise a calculation node connector and a storage node connector which are vertically arranged in parallel, wherein the center height of the calculation node connector is the same as that of the storage node connector.
Further, the number of computing node connectors is multiple of the number of storage node connectors.
Further, the height of the storage node module is the same as the height of the compute node module.
Optionally, the method further comprises: and the IO module is connected with the middle back plate module through the high-speed connector.
Furthermore, the IO module includes a plurality of IO boards, each IO board includes a plurality of PCIE slots, and the PCIE slots are connected to the PCIE devices.
Further, the PCIE device includes a network card, a GPU card, and a RAID card.
The utility model discloses a technical scheme include following technological effect:
the utility model discloses a problem that exists among the prior art, the innovation has provided a high density server based on the quick modification of backplate in can dismantling, can realize not co-altitude and the server design that can not dispose, has reduced the problem that the cost that leads to because change server risees, has satisfied the diversified customization demand of customer, has improved server product competitiveness.
The utility model discloses among the technical scheme in the first backplate and the second in the backplate can be dismantled perpendicularly from top to bottom and be connected, in the first backplate and the second the backplate can be dismantled the height after being connected and the quick-witted case height corresponds the same, can form the not server of co-altitude through the mode that the backplate can be dismantled perpendicularly about in first and the second, improved the convenience of the quick modification of server, simple easy operation.
The utility model discloses in the technical scheme in the first backplate and the second backplate all include vertical calculation node connector and the storage node connector that sets up side by side, wherein, the central height of calculating node connector is the same with the central height of storage node connector, can select the calculation node module and the storage node module of different quantity according to the customer demand, has improved the flexibility of server configuration.
The utility model discloses IO module includes a plurality of IO boards among the technical scheme, and every IO board includes a plurality of PCIE slots, can realize the extension of a plurality of PCIE equipment.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
Drawings
For a clear explanation of the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for a person skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first middle back plate and a second middle back plate in a first embodiment of the present invention;
fig. 3 is a schematic structural view illustrating a connection between a first middle back plate and a second middle back plate of two different heights according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of positions of node connectors in the first middle back plate and the second middle back plate according to the first embodiment of the present invention;
fig. 5 is a schematic configuration diagram of an 8U server according to a first embodiment of the present invention;
fig. 6 is a schematic configuration diagram of a 4U server according to a first embodiment of the present invention;
fig. 7 is a schematic configuration diagram of a 5U server in the first embodiment of the present invention.
Detailed Description
In order to clearly illustrate the technical features of the present invention, the present invention is explained in detail by the following embodiments in combination with the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted so as to not unnecessarily limit the invention.
Example one
As shown in fig. 1, the utility model provides a high density server based on can dismantle quick modification of well backplate includes: well backplate module 1, function node module 2, power module 3, well backplate module 1 includes first well backplate 11 and second well backplate 12, but first well backplate 11 passes through backplate connector 13 and is connected with backplate 12 in the second is dismantled, but function node module 2 passes through node connector 14 and is connected with well backplate module 1, power module 3 passes through power connector 15 and is connected with well backplate module 1, but first well backplate 11 and second well backplate 12 vertical detachable connection from top to bottom, the height after first well backplate 11 can be dismantled with backplate 12 in the second corresponds the same with quick-witted case height.
The functional node module 2 includes a computing node module 21 and a storage node module 22, the computing node module 21 is connected to the middle back panel module 1 through a computing node connector 141, and the storage node module 22 is connected to the middle back panel module 1 through a storage node connector 142.
The compute node module 11 is mainly a motherboard, and is used for CPU (central processing unit) installation, memory expansion, south bridge, management chip expansion, and the like, and can implement computation, management monitoring, and expansion of an external low-speed interface of the whole system.
The storage node modules 22 are mainly hard disk backplanes and are used for storing expansion of hard disks, wherein the heights of the hard disk backplanes are the same as those of the storage node modules 22, and different hard disk backplanes can be matched according to customer requirements.
The power module 3 is mainly used for supplying power to the whole system and is a common standard redundant power supply.
As shown in fig. 2-4, each of the first midplane 11 and the second midplane 12 includes a computing node connector 141 and a storage node connector 142 arranged vertically in parallel, wherein a center height of the computing node connector 141 is the same as a center height of the storage node connector 142.
The number of compute node connectors 141 is multiplied by the number of storage node connectors 142. Generally, because each compute node module 21 includes two CPUs, the number of compute node connectors 141 corresponds to 2 times the number of storage node connectors 142.
The height of the storage node module 22 is the same as the height of the compute node module 11.
In the design of the midplane module 1, the same corresponding position is considered, the expansion of the computation node module 21 and the storage node module 22 can be realized, the design of the computation node module 21 is considered to be incapable of interfering with the storage node connector 142 connected with the storage node module 22, for example, the position of the corresponding storage node connector 142 can be hollowed out in the design; the storage node module 22 is designed in consideration of the fact that it cannot interfere with the computing node connector 141 to which the computing node module 21 is connected, and for example, the position of the portion corresponding to the computing node connector 141 may be hollowed out at the time of design. As long as the compute node module 21 and the storage node module 22 do not exist at the same level at the same time, it can be ensured that, according to the requirements of the client application scenario, if the application scenario is a compute-type application scenario, the compute node module 21 can be expanded, and if the application scenario is a warm-cold storage, the storage node module 22 can be expanded.
Further, the high-density server further includes: and the IO (input/output) module 4 is connected with the middle back panel module 1 through a high-speed connector 16.
The IO module 4 includes a plurality of IO boards 41, each IO board 41 includes a plurality of PCIE slots, and the PCIE slots are connected to PCIE (peripheral component interconnect express) devices. Specifically, the PCIE device may include a network card, a GPU (graphics processing unit) card, and a RAID (Redundant Arrays of Independent Disks) card.
The utility model discloses a problem that exists among the prior art, the innovation has provided a high density server based on the quick modification of backplate in can dismantling, can realize not co-altitude and the server design that can not dispose, has reduced the problem that the cost that leads to because change server risees, has satisfied the diversified customization demand of customer, has improved server product competitiveness.
The utility model discloses among the technical scheme in the first backplate and the second in the backplate can be dismantled perpendicularly from top to bottom and be connected, in the first backplate and the second the backplate can be dismantled the height after being connected and the quick-witted case height corresponds the same, can form the not server of co-altitude through the mode that the backplate can be dismantled perpendicularly about in first and the second, improved the convenience of the quick modification of server, simple easy operation.
The utility model discloses in the technical scheme in the first backplate and the second backplate all include vertical calculation node connector and the storage node connector that sets up side by side, wherein, the central height of calculating node connector is the same with the central height of storage node connector, can select the calculation node module and the storage node module of different quantity according to the customer demand, has improved the flexibility of server configuration.
The utility model discloses IO module includes a plurality of IO boards among the technical scheme, and every IO board includes a plurality of PCIE slots, can realize the extension of a plurality of PCIE equipment.
Example two
The technical solution of the present invention is illustrated specifically for the sake of more clearly illustrating the connection between the first middle back plate 11 and the second middle back plate 12. The height of the first midplane 11 may be 4U, the height of the second midplane 12 may be 1U, and the height of the entire midplane module 1 may be 5U, 4U, 8U, etc., for example, 4U may be implemented by a first midplane 11 having a height of 4U, 5U may be implemented by a first midplane 11 having a height of 4U being detachably connected to a second midplane 12 having a height of 1U, and 8U may be implemented by a first midplane 11 having a height of 4U and a second midplane 12 having a height of 4U. The realization scheme of each height can be the random combination, and does not restrict the quantity of backplate 12 in first well backplate 11 and the second, can include backplate 12 realization in a plurality of first well backplates 11 and a plurality of second, and backplate 12 also can be adjusted in a flexible way according to actual conditions in first well backplate 11 and the second, the utility model discloses do not do the restriction here.
Fig. 5 shows an 8U server chassis configuration: more PCIE add-in cards and more storage devices can be supported. Each computing node module 21 occupies 1U of height and is used for computing output of the whole computer system, 4 computing node modules 21 occupy 4U of height of 8U chassis, the computing node modules 21 are connected to a computing node connector 141 (one type of high-speed connector) of the middle backplane module 1, interconnection of 4 computing node modules 21 is achieved, and PCIE signals of the computing node modules 21 are sent to the IO module 4 through the middle backplane module 1. The storage node module 22 occupies 4U height (2U +2U, respectively) of the 8U chassis in total, and is used for expanding the hard disk for storage output; the IO module 4 occupies 7U in total, is used for expanding PCIE devices, and is composed of 3 IO boards 41 (2 same IO boards, 3U high, 1 IO board 1U high), each IO board 41 is connected to the middle backplane module 1 through a high-speed connector, and PCIE signals on the IO boards 41 come from the CPU of the computing node module 21; the power module 3 occupies 1U, the middle backboard module 1 is provided with a power connector 15 which can expand a standard power module and is used for supplying power to the whole machine, wherein the selection of the power consumption of the power can determine the type of the power by referring to the power consumption condition of the whole machine system; the midplane module 1 is used for interconnecting modules (the midplane module 1 is implemented by connecting a first midplane 11 with a height of 4U and a second midplane 12 with a height of 4U).
Fig. 6 shows a 4U server chassis configuration: the market positioning is a high-density cloud optimization high-end machine type, and is used for supporting application services of cloud service provider customers, each computing node module 21 occupies 1U height and is used for making computing output of a whole machine system, 4 computing node modules 21 occupy 4U heights of an 8U case, the computing node modules 21 are connected to computing node connectors 141 (high-speed connectors) of a middle backboard module 1, interconnection of the 4 computing node modules 21 is achieved, and PCIE signals of the computing node modules 21 are sent to an IO module 4 through the middle backboard module 1.
The storage function is that the M.2 hard disk in the computing node module 21 provides storage expansion; the IO module 4 occupies 3U and is used for expanding PCIE equipment; the power module 3 occupies 1U and is used for supplying power to the whole machine; the midplane module 1 may be directly formed by a first midplane 11 with a height of 4U, or may be formed by connecting two first midplane 11 and a second midplane 12 with different or the same height (2U +2U, 1U +3U, etc.).
Fig. 7 shows a 5U server chassis configuration: the market positioning is a cloud service provider with IO preposed cloud optimization high-end model and can meet IO preposed requirements. Each computing node module 21 occupies 1U of height and is used for computing output of the whole computer system, 4 computing node modules 21 occupy 4U of height of 8U of chassis, the computing node modules 21 are connected to a computing node connector 141 (high-speed connector) of the middle backplane module 1, interconnection of the 4 computing node modules 21 is achieved, and PCIE signals of the computing node modules 21 are sent to the IO module 4 through the middle backplane module 1. The power module 3 occupies 1U and is used for supplying power to the whole machine; the storage node module 22 occupies 2U in total and is used for storing hard disk expansion; the IO module occupies 3U and is used for expanding a PCIE IO board card (PCIE equipment); the middle back plate module 1 is used for realizing interconnection among modules; can be formed by connecting a first middle back plate 11 with the height of 4U and a second middle back plate 12 with the height of 1U).
It should be noted that, the server height and the corresponding configuration provided in the present invention are exemplary, and corresponding adjustment can be made according to actual conditions, and the present invention is not limited herein.
Although the present invention has been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art without inventive work are still within the scope of the present invention.
Claims (8)
1. A quick retrofit, high density server based on a removable midplane, comprising: the middle backboard module comprises a first middle backboard and a second middle backboard, the first middle backboard is detachably connected with the second middle backboard through a backboard connector, the functional node module is connected with the middle backboard module through a node connector, the power supply module is connected with the middle backboard module through a power supply connector, the first middle backboard is vertically and detachably connected with the second middle backboard, and the height of the first middle backboard after the first middle backboard is detachably connected with the second middle backboard is the same as the height of the case correspondingly.
2. The removable midplane-based, quick-retrofit, high-density server of claim 1, wherein the functional node modules comprise compute node modules connected to the midplane module by a compute node connector and storage node modules connected to the midplane module by a storage node connector.
3. The removable midplane of claim 2, wherein the first midplane and the second midplane each comprise a compute node connector and a storage node connector vertically juxtaposed, wherein a center height of the compute node connector is the same as a center height of the storage node connector.
4. The removable midplane-based, quick-retrofit, high-density server of claim 3, wherein the number of compute node connectors is multiple times the number of storage node connectors.
5. The removable midplane-based, quick-retrofit, high-density server of claim 4, wherein the storage node modules have a height that is the same as the height of the compute node modules.
6. The removable midplane-based, quick-retrofit, high-density server of any of claims 1-5, further comprising: and the IO module is connected with the middle back plate module through the high-speed connector.
7. The fast retrofit high-density server based on the removable midplane of claim 6, wherein the IO modules comprise a plurality of IO boards, each IO board comprising a plurality of PCIE slots, the PCIE slots connected to PCIE devices.
8. The fast retrofit, high density server based on removable midplane of claim 7, wherein PCIE devices comprise network card, GPU card, RAID card.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022469014.1U CN213276491U (en) | 2020-10-30 | 2020-10-30 | High-density server based on quick modification of detachable middle back plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022469014.1U CN213276491U (en) | 2020-10-30 | 2020-10-30 | High-density server based on quick modification of detachable middle back plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213276491U true CN213276491U (en) | 2021-05-25 |
Family
ID=75952085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022469014.1U Active CN213276491U (en) | 2020-10-30 | 2020-10-30 | High-density server based on quick modification of detachable middle back plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213276491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113867486A (en) * | 2021-08-27 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Double-middle-backboard mounting structure of server |
-
2020
- 2020-10-30 CN CN202022469014.1U patent/CN213276491U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113867486A (en) * | 2021-08-27 | 2021-12-31 | 苏州浪潮智能科技有限公司 | Double-middle-backboard mounting structure of server |
| CN113867486B (en) * | 2021-08-27 | 2023-08-18 | 苏州浪潮智能科技有限公司 | Dual-middle backboard mounting structure of server |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100541444C (en) | The management system of multiple main board system | |
| US20020124128A1 (en) | Server array hardware architecture and system | |
| JP3157935U (en) | server | |
| US20170215296A1 (en) | Multi-bay apparatus | |
| CN213276491U (en) | High-density server based on quick modification of detachable middle back plate | |
| CN210639614U (en) | NVME hard disk backboard system supporting various bandwidths | |
| CN108959158A (en) | A kind of processor plate based on Whitley platform | |
| CN209821735U (en) | Extensible computing server with 4U8 nodes | |
| CN105094699A (en) | Memory system of cloud server | |
| US20060136644A1 (en) | SAS hot swap backplane expander module | |
| CN211427335U (en) | Novel high-end eight-path server | |
| CN214011980U (en) | Server with RAS (remote server system) characteristic | |
| CN109471823B (en) | 4OU storage structure | |
| CN106547316A (en) | A kind of rack-mount server | |
| CN101320313A (en) | Memory apparatus | |
| CN210428236U (en) | High-density eight-path server | |
| CN113840489A (en) | Blade computer system based on hybrid architecture | |
| CN111563058A (en) | Device for switching PCIE Gen4 in server | |
| CN218630661U (en) | 4U server supporting 8GPU modules | |
| CN220795800U (en) | Four-way CPU server | |
| CN215416537U (en) | Multi-node hot plug 4U storage server | |
| CN208607572U (en) | A kind of 3U9 node high density server | |
| CN217360785U (en) | Data computing system and server with built-in data computing system | |
| CN213545261U (en) | Server mainboard based on dual-path processor | |
| CN218240830U (en) | Universal 4U server supporting multiple GPUs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |