CN213242262U

CN213242262U - Monolithic ceramic capacitor

Info

Publication number: CN213242262U
Application number: CN202022311547.7U
Authority: CN
Inventors: 孙永卫
Original assignee: Nanjing Xinyusheng Electronics Co ltd
Current assignee: Nanjing Xinyusheng Electronics Co ltd
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2021-05-18
Anticipated expiration: 2030-10-16

Abstract

The utility model discloses a monolithic ceramic capacitor relates to monolithic ceramic capacitor technical field, need follow the circuit board and dismantle for solving current monolithic ceramic capacitor when damaging, brings inconvenience for the maintenance personal, and the serious maintenance time that increases influences maintenance personal's work efficiency's problem. The ceramic chip capacitor comprises a ceramic chip capacitor main body and is characterized in that first connecting leads are arranged on two sides of the lower end of the ceramic chip capacitor main body and are connected with the ceramic chip capacitor main body in a welded mode, a first connecting end is arranged outside the first connecting leads and is fixedly connected with the first connecting leads and the ceramic chip capacitor main body, a second connecting end is arranged at the lower end outside the first connecting leads, a connecting boss is arranged at the lower end outside the first connecting leads and is fixedly connected with the first connecting leads, a conductive limiting cylinder is arranged inside the second connecting end, and the conductive limiting cylinder is fixedly connected with the second connecting end.

Description

Monolithic ceramic capacitor

Technical Field

The utility model relates to a monolithic ceramic capacitor technical field specifically is a monolithic ceramic capacitor.

Background

Ceramic capacitors are also known as ceramic dielectric capacitors or monolithic capacitors. As the name suggests, a ceramic capacitor is a capacitor with ceramic as a dielectric material. According to the difference of ceramic materials, the low frequency ceramic capacitor and the high frequency ceramic capacitor can be divided into two categories. The capacitor can be classified according to structural forms, and can be divided into a plurality of circular chip capacitors, tubular capacitors, rectangular capacitors, chip capacitors, feedthrough capacitors and the like, and the service voltage can be divided into high-voltage, medium-voltage and low-voltage ceramic capacitors. The difference in dielectric constant can be classified into negative temperature coefficient, positive temperature coefficient, zero temperature coefficient, high dielectric constant, low dielectric constant, etc. according to the temperature coefficient. In addition, there are methods for classifying types I, II and III. Compared with other capacitors, the common ceramic capacitor has the advantages of higher use temperature, large specific capacity, good moisture resistance, smaller dielectric loss, large-range selectable capacitance temperature coefficient and the like. The method is widely used in electronic circuits and has considerable consumption.

However, the conventional monolithic ceramic capacitor needs to be detached from the circuit board when damaged, which brings inconvenience to maintenance personnel, seriously increases maintenance time, and affects the working efficiency of the maintenance personnel; therefore, the existing demand is not satisfied, and a monolithic ceramic capacitor is proposed for this.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a monolithic ceramic capacitor to the monolithic ceramic capacitor who proposes in solving above-mentioned background art need dismantle from the circuit board when damaging and get off, brings inconvenience for maintenance personal, seriously increases maintenance duration, influences maintenance personal's work efficiency's problem.

In order to achieve the above object, the utility model provides a following technical scheme: a monolithic ceramic capacitor comprises a ceramic chip capacitor main body, wherein first connecting leads are arranged on two sides of the lower end of the ceramic chip capacitor main body and are connected with the ceramic chip capacitor main body in a welding mode, a first connecting end is arranged outside the first connecting lead and is fixedly connected with the first connecting lead and the ceramic chip capacitor main body, a second connecting end is arranged at the lower end of the outer portion of the first connecting lead, a connecting boss is arranged at the lower end of the outer portion of the first connecting lead and is fixedly connected with the first connecting lead, a conductive limiting cylinder is arranged inside the second connecting end and is fixedly connected with the second connecting end, the connecting boss is connected with the conductive limiting cylinder through a clamping groove, a second connecting lead is arranged at the lower end of the inner portion of the conductive limiting cylinder, and is fixedly connected with the conductive limiting cylinder, the ceramic chip capacitor comprises a ceramic chip capacitor body and is characterized in that a first resin coating is arranged outside the ceramic chip capacitor body and fixedly connected with the ceramic chip capacitor body.

Preferably, the contact boss is installed to the lower extreme of first connecting lead and the upper end of second connecting lead, the equal fixed connection of lower extreme and the second connecting lead of contact boss and first connecting lead.

Preferably, a second resin coating is arranged outside the second connecting end, and the second resin coating is fixedly connected with the second connecting end.

Preferably, an insulation pressing plate is installed at the lower end of the second connecting end, and the insulation pressing plate is fixedly connected with the second connecting end.

Preferably, a third resin coating is arranged outside the insulating pressing plate, and the third resin coating is fixedly connected with the insulating pressing plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an installation electrically conductive spacing section of thick bamboo can assist the staff to carry out the contact connection with first connecting lead and second connecting lead, make the connecting boss outside the first connecting lead can fix inside electrically conductive spacing section of thick bamboo through the draw-in groove, make the ceramic chip electric capacity main part need not dismantle the device whole from the circuit board when damaging, it is more convenient to make maintenance personal dismantle, avoid increasing maintenance time, influence maintenance personal's work efficiency, need not to weld again, the maintenance time has been saved in the increase, and need not use tools during the maintenance, increase the practicality of device, installation contact boss can increase the area of contact of first connecting lead and second connecting lead, increase the practicality of device;

2. the utility model discloses an insulating pressing plate of installation can make and press down on its upper end when the maintenance in the staff, is convenient for dismantle bad ceramic chip electric capacity main part, and can not harm the second and connect lead wire and circuit board welded firmly surely, sets up that third resin coating can play the protection and act on, prevents the electric leakage.

Drawings

Fig. 1 is a schematic structural diagram of a monolithic ceramic capacitor according to the present invention;

fig. 2 is a front view of a monolithic ceramic capacitor according to the present invention;

fig. 3 is an enlarged view of a portion a of fig. 1.

In the figure: 1. a ceramic chip capacitor main body; 2. a first resin coating layer; 3. a first connection end; 4. a first connecting lead; 5. a second connection end; 6. a second resin coating layer; 7. a conductive limiting cylinder; 8. a second connecting lead; 9. an insulating pressing plate; 10. a third resin coating layer; 11. contacting the boss; 12. and connecting the lug bosses.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, the present invention provides an embodiment: a monolithic ceramic capacitor comprises a ceramic chip capacitor main body 1, wherein first connecting leads 4 are respectively arranged on two sides of the lower end of the ceramic chip capacitor main body 1, the first connecting leads 4 are connected with the ceramic chip capacitor main body 1 in a welding manner, a first connecting end 3 is arranged outside the first connecting leads 4, the first connecting end 3 is fixedly connected with the first connecting leads 4 and the ceramic chip capacitor main body 1, a second connecting end 5 is arranged at the lower end of the outer part of the first connecting leads 4, a connecting boss 12 is arranged at the lower end of the outer part of the first connecting leads 4, the connecting boss 12 is fixedly connected with the first connecting leads 4, a conductive limiting cylinder 7 is arranged inside the second connecting end 5, the conductive limiting cylinder 7 can be arranged to assist workers to connect the first connecting leads 4 and the second connecting leads 8 in a contact manner, so that the connecting boss 12 outside the first connecting leads 4 can be fixed inside the conductive limiting cylinder 7 through a clamping groove, make ceramic chip electric capacity main part 1 need not dismantle the whole device from the circuit board when damaging, it is more convenient to make maintenance personal dismantle, avoid increasing maintenance duration, influence maintenance personal's work efficiency, need not to weld again, the maintenance duration has been saved of increaseing, and need not the use of tools during the maintenance, increase the practicality of device, electrically conductive spacing section of thick bamboo 7 and 5 fixed connection of second link, connecting boss 12 passes through the draw-in groove with electrically conductive spacing section of thick bamboo 7 and is connected, second connecting lead 8 is installed to the lower extreme of the inside of electrically conductive spacing section of thick bamboo 7, second connecting lead 8 and electrically conductive spacing section of thick bamboo 7 fixed connection, the outside of ceramic chip electric capacity main part 1 is provided with first resin coating 2, first resin coating 2 and ceramic chip electric capacity main part 1 fixed connection.

Further, contact boss 11 is all installed to the lower extreme of first connecting lead 4 and the upper end of second connecting lead 8, and contact boss 11 and the equal fixed connection of the lower extreme of first connecting lead 4 and second connecting lead 8, installation contact boss 11 can increase the area of contact of first connecting lead 4 and second connecting lead 8, increase the practicality of device.

Further, the outside of second link 5 is provided with second resin coating 6, and second resin coating 6 and second link 5 fixed connection set up second resin coating 6 and can play the effect of protection.

Furthermore, insulating pressing plate 9 is installed to the lower extreme of second link 5, and insulating pressing plate 9 and second link 5 fixed connection install insulating pressing plate 9 and can make the staff press down on its upper end when the maintenance, be convenient for dismantle bad ceramic chip electric capacity main part 1 get off, and can not harm second connecting lead 8 and the firm of circuit board welded and decide.

Further, the outside of insulating pressing plate 9 is provided with third resin coating 10, and third resin coating 10 and insulating pressing plate 9 fixed connection set up third resin coating 10 and can play the protection and the effect, prevent the electric leakage.

The working principle is as follows: when workers need to maintain and disassemble, the workers only need to press the upper end of the insulating pressing plate 9 to pull the ceramic chip capacitor main body 1 upwards to disassemble the damaged ceramic chip capacitor main body 1, then a ceramic chip capacitor main body 1 with intact function is selected, the first connecting lead 4 at the lower end of the ceramic chip capacitor main body is reinserted into the conductive limiting cylinder 7 to complete replacement and maintenance, the conductive limiting cylinder 7 is installed in the device to assist the workers to connect the first connecting lead 4 and the second connecting lead 8 in a contact manner, so that the connecting boss 12 outside the first connecting lead 4 can be fixed inside the conductive limiting cylinder 7 through the clamping groove, the whole device does not need to be disassembled from the circuit board when the ceramic chip capacitor main body 1 is damaged, the disassembly of the workers is more convenient, the maintenance time is prevented from being increased, the working efficiency of the workers is prevented from being influenced, the re-welding is not needed, and the maintenance time is greatly saved, and need not the use of tools during the maintenance, increase the practicality of device, installation contact boss 11 can increase the area of contact of first connecting lead 4 and second connecting lead 8, increases the practicality of device, and installation insulation is pressed down the clamp plate 9 and can be made the staff press down on its upper end when the maintenance, is convenient for dismantle bad ceramic chip electric capacity main part 1 get off, and can not harm second connecting lead 8 and circuit board welded firmly surely, sets up third resin coating 10 and can play the effect of protection, prevents the electric leakage.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A monolithic ceramic capacitor comprising a ceramic chip capacitor body (1), characterized in that: the ceramic chip capacitor comprises a ceramic chip capacitor main body (1), wherein first connecting leads (4) are respectively arranged on two sides of the lower end of the ceramic chip capacitor main body (1), the first connecting leads (4) are connected with the ceramic chip capacitor main body (1) in a welding mode, a first connecting end (3) is arranged outside the first connecting leads (4), the first connecting end (3) is fixedly connected with the first connecting leads (4) and the ceramic chip capacitor main body (1), a second connecting end (5) is arranged at the lower end of the outer portion of the first connecting leads (4), a connecting boss (12) is arranged at the lower end of the outer portion of the first connecting leads (4), the connecting boss (12) is fixedly connected with the first connecting leads (4), a conductive limiting cylinder (7) is arranged inside the second connecting end (5), the conductive limiting cylinder (7) is fixedly connected with the second connecting end (5), and the connecting boss (12) is connected with the conductive limiting cylinder (7) through a clamping groove, the ceramic chip capacitor is characterized in that a second connecting lead (8) is installed at the lower end of the inside of the conductive limiting cylinder (7), the second connecting lead (8) is fixedly connected with the conductive limiting cylinder (7), a first resin coating (2) is arranged on the outside of the ceramic chip capacitor main body (1), and the first resin coating (2) is fixedly connected with the ceramic chip capacitor main body (1).

2. The monolithic ceramic capacitor of claim 1, wherein: contact boss (11) are all installed to the lower extreme of first connecting lead (4) and the upper end of second connecting lead (8), contact boss (11) and the equal fixed connection of the lower extreme of first connecting lead (4) and second connecting lead (8).

3. The monolithic ceramic capacitor of claim 1, wherein: and a second resin coating (6) is arranged outside the second connecting end (5), and the second resin coating (6) is fixedly connected with the second connecting end (5).

4. The monolithic ceramic capacitor of claim 1, wherein: and an insulating pressing plate (9) is installed at the lower end of the second connecting end (5), and the insulating pressing plate (9) is fixedly connected with the second connecting end (5).

5. The monolithic ceramic capacitor of claim 4, wherein: and a third resin coating (10) is arranged outside the insulating pressing plate (9), and the third resin coating (10) is fixedly connected with the insulating pressing plate (9).