CN213124442U - Chip packaging structure, lens and equipment - Google Patents

Abstract

The application discloses a chip packaging structure, a lens and equipment, which comprise an image sensor chip, wherein the image sensor chip comprises a photosensitive area and a logic area surrounding the photosensitive area; the transparent cover plate covers the photosensitive area so as to isolate the photosensitive area from air; the injection molding part surrounds the transparent cover plate to package the image sensor chip, and the transparent cover plate bears the pressure in the injection molding process of the injection mold; the application is used for molding and packaging of the image sensor chip, preprocessing is carried out before the image sensor chip enters the assembly, the induction area of the image sensor chip is protected, the induction area is prevented from being exposed, the induction area is effectively isolated from air contact, cracking is also avoided in the logic area of the image sensor chip, and large-scale high yield mass production is realized.

Description

Chip packaging structure, lens and equipment

Technical Field

The application relates to the technical field of chip molding and packaging, in particular to a chip packaging structure, a lens and equipment.

Background

Image sensors are used in a variety of electronic devices, including digital cameras, cell phone cameras, camcorders, and cameras mounted on automobiles, security devices, and robots. When an image sensor chip is molded and packaged into a CMP (chip Molding Package) product, the image sensor chip is exposed in the air before injection Molding in the prior art, so that the control of tiny dust is very difficult, an ultrahigh clean room grade is required, the control cost of the tiny dust is high, the manufacturing maintenance cost is high, the requirement on the process environment is high, and the cutting efficiency is low.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a chip packaging structure and an image sensor packaging part, and the packaging structure technology for realizing low cost, high performance, high reliability and large-scale high-yield mass production is realized; the technical scheme is as follows:

according to an embodiment, a chip package structure includes an image sensor chip including a photosensitive area and a logic area surrounding the photosensitive area; the transparent cover plate covers the photosensitive area so as to isolate the photosensitive area from air; and the injection molding part surrounds the transparent cover plate to encapsulate the image sensor chip, and the transparent cover plate bears the pressure in the injection molding process of the injection mold.

For example, in the chip packaging structure provided in at least one embodiment of the present application, the transparent cover plate is a glass cover plate, and the glass cover plate is a tempered glass with a thickness of 0.02mm to 2 mm.

For example, in a chip package structure provided in at least one embodiment of the present application, the glass cover plate includes a first surface close to the photosensitive region and a second surface far from the photosensitive region, a filter is disposed on the first surface, and a light-transmitting film is disposed on the second surface.

For example, in the chip packaging structure provided in at least one embodiment of the present application, the filter film is an IR film, and the light-transmitting film is an AR film.

For example, in a chip package structure provided in at least one embodiment of the present application, the injection molding part includes a first injection molding surface in contact with the image sensor chip and a second injection molding surface opposite to the first injection molding surface.

For example, in the chip package structure provided in at least one embodiment of the present application, the second injection molding surface is located on a side of the second surface of the glass cover plate facing away from the image sensor chip, or the second injection molding surface is located on a side of the second surface of the glass cover plate close to the image sensor chip, or the second injection molding surface is flush with the second surface of the glass cover plate.

For example, in the chip package structure provided by at least one embodiment of the present application, the second molding surface is located on a side of the second surface of the glass cover plate facing away from the image sensor chip, and the second molding surface covers an edge of the second surface, where the second molding surface abuts against the second molding surface.

For example, in the chip package structure provided in at least one embodiment of the present application, the transparent cover is made of plastic or sapphire.

According to an embodiment, a lens is provided, which comprises a PCB substrate, the chip packaging structure, a glass plate and an optical component, wherein the PCB substrate, the chip packaging structure, the glass plate and the optical component are sequentially connected.

According to one embodiment, the equipment comprises the lens.

Some embodiments of the present application provide a chip package structure and a lens, which bring beneficial effects as follows: the image sensor chip is preprocessed before being assembled, namely a transparent cover plate is covered on the surface of a photosensitive area of the image sensor chip, the transparent cover plate can well protect a sensing area of the image sensor chip before injection molding and in the injection molding process, the sensing area is prevented from being exposed, the sensing area is effectively isolated from being contacted with air, the sensing area is prevented from being polluted by particles, and the glass surface transparent cover plate after injection molding is easier to clean; in addition, in the injection molding process, the pressure of the injection mold is borne by the transparent cover plate and is dispersed to the bottom chip, so that the cracking of a logic area of the image sensor chip is avoided, and the large-scale high-yield mass production is realized.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of an image sensor chip structure;

FIG. 2 is a diagram illustrating an image sensor chip package according to the related art;

FIG. 3 is a schematic diagram of an image sensor chip covered with a transparent cover according to the present application;

FIG. 4 is a schematic structural diagram of a chip package structure according to the present application;

FIG. 5 is a schematic view of the structure of the transparent cover of the present application;

FIG. 6 is a side view of an embodiment of a chip package;

FIG. 7 is a side view of another embodiment of a chip package structure of the present application;

FIG. 8 is a side view of another embodiment of a chip package structure of the present application;

FIG. 9 is a side view of a further embodiment of a chip package structure of the present application;

fig. 10 is a flow chart of the chip package structure process of the present application.

Reference numerals: 100-image sensor chip, 110-photosensitive area, 120-logic area;

200-transparent cover plate, 210-first surface, 220-second surface, 211-light-transmitting film, 221-light filter film;

300-injection molding part, 310-first injection molding surface, 320-second injection molding surface, 400-injection molding part a.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

The present application will be described in detail with reference to specific examples.

In the related art, as shown in fig. 1-2, before the injection molding process is performed on the image sensor chip, the image sensor chip 100 is exposed and exposed in the air, which causes particle dust and the like to pollute the photosensitive area 110, and the particle control cost is high and the cutting efficiency is low;

in the injection molding process, the injection molding part 300 of the image sensor chip can only be arranged above the logic area 120 and cannot be pressed above the photosensitive area 110, so that the injection mold is hollow above the corresponding area of the photosensitive area 110 in the injection molding process, the pressure is concentrated in the logic area 120, and the logic area 120 of the image sensor chip 100 bears huge pressure in the injection molding process due to the small contact area, so that the logic area 120 is easy to crack;

after the injection molding process is finished, when the image sensor chip is cleaned, because the injection molding process is used for injection molding of the image sensor chip 100 except the photosensitive area 110, a wall-type injection molding part A400 is formed around the photosensitive area 110 to block the wall-type injection molding part A400, so that the photosensitive area 110 is sunken in the injection molding part A400, and a step is formed between the photosensitive area 110 and the injection molding part A400, when in the subsequent air-water washing process, dirt is difficult to wash out from the sunken part where the photosensitive area 110 is located, and water stain remained in the groove is difficult to throw out through rotary washing, so that the washing effect is poor; moreover, when the image sensor chip 100 is washed with air and water, the surface of the photosensitive area 110 is still exposed, and dust particles and the like are difficult to clean due to the grooves on the surface of the photosensitive area 110.

In view of the above, the present application provides a chip package structure, which is provided according to an embodiment and is used for a mold package of an image sensor chip 100, as shown in fig. 3 to 9, and includes: the image sensor comprises an image sensor chip 100, a transparent cover plate 200 and an injection molding part 300, wherein the image sensor chip 100 comprises a photosensitive area 110 and a logic area 120 surrounding the photosensitive area 110; the transparent cover plate 200 covers the photosensitive area 110 to seal the photosensitive area 110 of the image sensor chip 100 and isolate the photosensitive area 110 from air; the injection molding part 300 surrounds the transparent cover plate 200 to encapsulate the image sensor chip 100, and the transparent cover plate 200 bears the pressure generated during the injection molding process of the injection molding module.

In the present embodiment, the transparent cover 200 is specifically a glass cover.

The height of the injection molding part 300 can be adjusted according to the process requirement to determine the height of the injection molding part 300 and the surface width of the injection molding part 300, and whether the injection molding part 300 covers the surface of the transparent cover plate 200 to widen the gluing area is determined according to the process requirement.

In the actual processing process, the chip packaging structure of the present application is realized by the process steps as shown in fig. 10: wafer Level (Wafer Level) incoming materials before image sensor chips are not cut are sprayed with glue on the surfaces of the Wafer Level incoming materials, then transparent cover plates 200 are adhered to the surfaces of the Wafer levels, rapid baking is conducted to enable the Wafer Level image sensors to be firmly adhered to the transparent cover plates 200 to prevent the transparent cover plates 200 from falling off, then single image sensor units are formed after cutting, chip Level (Die Level) image sensors are formed, the surfaces of the single image sensor units are covered with the transparent cover plates 200, then the wafers covered with the transparent cover plates 200 are cleaned, the chip Level (Die Level) is connected, then pressure welding and routing are conducted, then an injection molding process is conducted, cleaning is conducted after injection molding is completed, baking is conducted to remove stress, the image sensor chips are prevented from being pulled by adhesives, then the image sensor chips are placed into a product loading jig to be cleaned, and finally the image sensor chips are assembled with optical components.

According to the chip packaging structure, the image sensor chip 100 is protected by covering the transparent cover plate 200 on the photosensitive area 110 of the image sensor chip 100, the photosensitive area 110 is prevented from being exposed, particle dust and the like are prevented from polluting the photosensitive area 110, and the particle control cost is reduced; meanwhile, by covering the transparent cover plate 200 on the photosensitive region 110, the injection mold does not need to be hollow in the middle in the injection molding process, namely, the injection mold can be ballasted above the photosensitive region 110 for injection molding, so that the contact area is enlarged, the mold pressure is borne by the transparent cover plate 200 and is dispersed to the chip at the bottom of the image sensor chip 100, the cracking of the logic region 120 is avoided, and the damage of the image sensor chip 100 is also avoided; by covering the transparent cover plate 200 on the light-sensing area 110 of the image sensor chip 100, when the injection molding process is finished and the subsequent cleaning operation is performed, the surface of the light-sensing area 110 is covered by the smooth and flat transparent cover plate 200, so that dust particles can be cleaned by air water; meanwhile, by covering the transparent cover plate 200 on the light-sensing area 110 of the image sensor chip 100, when the optical assembly is subsequently assembled above the image sensor chip 100, the image sensor chip 100 has a pressure-resistant function, and the distance between the lens sheet and the light-sensing area 110 is increased, so that the shadow caused by the particles remaining on the light-sensing area 110 can be reduced, and even the shadow caused by the dust particles can be eliminated.

For example, in the chip package structure provided in at least one embodiment of the present application, as shown in fig. 3, the transparent cover plate 200 is a glass cover plate, and the glass cover plate is a tempered glass with a thickness of 0.02mm to 2 mm; according to the traditional image sensor chip packaging process, a glass plate is covered on injection molding after the injection molding process is finished, the thickness of the glass plate covered traditionally is 0.25mm, the glass plate is thin and does not have a compression-resistant function, and the reinforced glass with a certain thickness is arranged as the transparent cover plate 200, so that the glass plate has a good compression-resistant function and is used for bearing the pressure of an injection molding process mold; the particle shadow is reduced or eliminated by also enlarging the distance between the optical components and the photosensitive area 110 of the image sensor chip 100.

For example, in the chip package structure provided in at least one embodiment of the present disclosure, as shown in fig. 5, the transparent cover plate 200 includes a first surface 210 close to the photosensitive region 110 and a second surface 220 far from the photosensitive region 110, a light transmissive film 211 is disposed on the first surface 210, and a filter film 221 is disposed on the second surface 220; by arranging the light-transmitting film 211 on the first surface 210 of the transparent cover plate 200, the light transmittance of the transparent cover plate 200 can be enhanced, and the light transmittance of the transparent cover plate 200 can be improved; by disposing the filter film 221 on the second surface 220 of the transparent cover plate 200, the invisible light can be filtered out.

For example, in the chip package structure provided in at least one embodiment of the present application, as shown in fig. 5, the filter film 221 is an IR film, and the light-transmitting film 211 is an AR film; the infrared filter (IR-cut) may allow visible light to pass through the transparent cover 200 to cut off or reflect infrared light, so that the photosensitive structure of the image sensor 100 is not affected by unnecessary infrared light; the anti-reflection film (AR) may reduce reflected light, thereby increasing the amount of light transmitted through the transparent cover 200.

For example, in the chip package structure provided in at least one embodiment of the present application, as shown in fig. 6 to 9, the injection molding part 300 includes a first injection molding surface 310 contacting the image sensor chip 100 and a second injection molding surface 320 opposite to the first injection molding surface 310, so as to package the entire image sensor chip 100.

For example, in the chip package structure provided in at least one embodiment of the present application, the second injection molding surface 320 is located on a side of the second surface 220 of the glass cover plate 200 close to the image sensor chip 100, as shown in fig. 6, that is, the second injection molding surface 320 is lower than the second surface 220 of the glass cover plate 200; at this time, the transparent cover plate 200 protrudes from the injection molding part 300, so that the photosensitive region 110 is no longer recessed in the injection molding part 300, thereby avoiding the defect that the particles are not easily thrown out during the subsequent cleaning process after the injection molding process.

For example, in the chip package structure provided in at least one embodiment of the present application, as shown in fig. 7, the second injection molding surface 320 is flush with the second surface 220 of the glass cover plate 200, and at this time, the transparent cover plate 200 and the injection molding part 300 are located on the same horizontal plane, so that the photosensitive region 110 is no longer recessed in the injection molding part 300, thereby avoiding a defect that particles are not easily thrown away during a subsequent cleaning process after the injection molding process.

For example, in the chip package structure provided in at least one embodiment of the present application, the second injection molding surface 320 is located on a side of the second surface 220 of the glass cover plate 200 facing away from the image sensor chip 100, as shown in fig. 8, that is, the second injection molding surface 320 is higher than the second surface 220 of the glass cover plate 200, and since the surface of the photosensitive area 110 is covered by the smooth and flat transparent cover plate 200, the groove structure of the photosensitive area 110 is covered, which is beneficial for cleaning dust particles with air and water when a subsequent cleaning operation is performed after the injection molding process is completed;

for example, in the chip package structure provided in at least one embodiment of the present application, the second injection molding surface 320 is located on a side of the second surface 220 of the glass cover plate 200 facing away from the image sensor chip 100, as shown in fig. 9, that is, the second injection molding surface 320 is higher than the second surface 220 of the glass cover plate 200, and the second injection molding surface 320 covers an edge of the second surface 220 where the second injection molding surface 320 abuts against the second injection molding surface 220, so that the second injection molding surface 320 is pressed against the edge of the second surface 220, at this time, the surface of the photosensitive area 110 is covered by the smooth and flat transparent cover plate 200, so that the groove structure of the photosensitive area 110 is covered, and when a subsequent cleaning operation is performed after an injection molding process is completed, dust particles are cleaned with air and water; moreover, the embodiment can enlarge the surface width of the second injection molding surface 320, provide convenience for subsequent glue dispensing and glue drawing, and avoid the problem that the glue is not firm when the image sensor is connected with the optical assembly due to insufficient glue dispensing width.

For example, in the chip package structure provided in at least one embodiment of the present application, the transparent cover 200 may be a sapphire cover or a plastic cover.

The second aspect of the application provides a camera lens, including PCB base plate, above-mentioned chip package structure, glass board and optical assembly, the PCB base plate chip package structure, glass board with optical assembly connects gradually.

A third aspect of the present application provides an apparatus including the lens barrel described above.

Although embodiments of the present application have been disclosed for illustrative purposes, those skilled in the art will recognize that: various modifications, additions and substitutions are possible, without departing from the scope and spirit of the application as disclosed in the accompanying claims.

Claims (10)

1. A chip package structure, comprising:

an image sensor chip including a photosensitive area and a logic area surrounding the photosensitive area;

the transparent cover plate covers the photosensitive area so as to isolate the photosensitive area from air; and

and the injection molding part surrounds the transparent cover plate to encapsulate the image sensor chip, and the transparent cover plate bears the pressure in the injection molding process of the injection mold.

2. The chip package structure according to claim 1, wherein the transparent cover plate is a glass cover plate, and the glass cover plate is a tempered glass having a thickness of 0.02mm to 2 mm.

3. The chip package structure according to claim 2, wherein the glass cover plate includes a first surface close to the photosensitive region and a second surface far from the photosensitive region, wherein a filter is disposed on the first surface, and a light transmissive film is disposed on the second surface.

4. The chip package structure according to claim 3, wherein the filter is an IR film and the light-transmissive film is an AR film.

5. The chip package structure according to claim 3 or 4, wherein the injection molding part comprises a first injection molding surface in contact with the image sensor chip and a second injection molding surface opposite to the first injection molding surface.

6. The chip package structure according to claim 5, wherein the second molding surface is located on a side of the second surface of the glass cover plate facing away from the image sensor chip, or the second molding surface is located on a side of the second surface of the glass cover plate close to the image sensor chip, or the second molding surface is flush with the second surface of the glass cover plate.

7. The chip package structure according to claim 5, wherein the second molding surface is located on a side of the second surface of the glass cover plate facing away from the image sensor chip, and the second molding surface covers an edge of the second surface against which the second molding surface abuts.

8. The chip package structure according to claim 1, wherein the transparent cover is made of plastic or sapphire.

9. A lens, comprising a PCB substrate, the chip package structure of any one of claims 1 to 8, a glass plate and an optical component, wherein the PCB substrate, the chip package structure, the glass plate and the optical component are connected in sequence.

10. A device characterized by comprising the lens barrel according to claim 9.

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