CN213124106U

CN213124106U - Metal magnetic powder core integrated chip inductor

Info

Publication number: CN213124106U
Application number: CN202022317757.7U
Authority: CN
Inventors: 苏立良
Original assignee: Cyge Electronic Technology Hunan Co ltd
Current assignee: Cyge Electronic Technology Hunan Co ltd
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2021-05-04
Anticipated expiration: 2030-10-19

Abstract

The utility model provides a metal magnetic powder core integral type chip inductance, it is including metal magnetic powder core and be located the hollow coil of metal magnetic powder in-core, metal magnetic powder core surface is wrapped in proper order has one nanometer insulation coating and secondary nanometer insulation coating, metal magnetic powder core bottom both ends are equipped with the electrode face, metal magnetic powder core both ends tip is equipped with the side end face, the electrode face, the side end face surface all plates copper and forms the copper layer, alloy material or other metal material formation metallization electrode are electroplated to the copper layer surface of electrode face. The metal magnetic powder core integrated chip inductor only keeps the bottom electrode, reduces the thickness of the electrode and coats the side electrode with the insulating material, thereby reducing the installation size of a product on a circuit board, increasing the installation space of the integrated circuit board and creating favorable conditions for the high-integration development of the integrated circuit industry; the comprehensive performance of the product is greatly improved under the condition of the same size.

Description

Metal magnetic powder core integrated chip inductor

Technical Field

The utility model relates to an inductance technology especially indicates a metal magnetic powder core integral type chip inductance.

Background

The traditional inductor comprises a slurry end-sealed electroplating type integrally-formed inductor, a material sheet spot welding electrode type integrally-formed inductor and a T-core electrode type integrally-formed inductor; the size of the slurry end-capped electroplating type integrally-formed inductor is small, and when the inductor is subjected to surface mounting, the tin stacking area on the side surface is large, so that the density of an integrated circuit is reduced, and the space of a circuit board is wasted. Meanwhile, the slurry end-capped electroplated integrally-formed inductor comprises a body with 4 metal layers, namely copper/silver/nickel/tin, at the electrode welding position, parasitic capacitance is easily formed among the 4 metal layers, the direct-current resistance of the inductor is increased, and the self-resonance frequency of the inductor is reduced; the lead frame of the sheet spot welding electrode type integrally formed inductor is bent from the side edge to the bottom of a product, the length size of the product is lengthened due to the bending amplitude and the thickness of the frame, the product performance is limited due to the limitation of coil design, the space of a circuit board is wasted, and the density of an integrated circuit is reduced; the T-core electrode type integrally formed inductor has large production investment and low output, the production cost of the product is very high, the large-scale production is not facilitated, and the market demand is difficult to meet quickly.

Disclosure of Invention

The invention aims to provide a metal magnetic powder core integrated chip inductor.

In order to achieve the above object, the present invention provides a technical solution: the integrated chip inductor with the metal magnetic powder core comprises the metal magnetic powder core and a hollow coil positioned in the metal magnetic powder core, wherein a primary nanometer insulating coating layer and a secondary nanometer insulating coating layer are sequentially coated on the surface of the metal magnetic powder core from inside to outside, electrode surfaces are arranged at two ends of the bottom of the metal magnetic powder core, side end faces are arranged at two ends of the metal magnetic powder core, copper is plated on the surfaces of the electrode surfaces and the side end faces to form copper layers, and a metalized electrode is formed by electroplating the surface of the copper layer of each electrode surface.

The metal magnetic powder core is formed by adopting carbonyl iron powder or soft magnetic alloy powder through mould pressing.

The primary nano insulating coating layer and the secondary nano insulating coating layer are formed by coating polyimide materials.

The corners of the surface of the metal magnetic powder core are in arc smooth transition.

The hollow coil is formed by winding a round wire or a flat wire.

Two ends of the bottom of the metal magnetic powder core protrude downwards to form an electrode surface.

The bottom of the electrode surface is flush with the bottom of the metal magnetic powder core.

The technical advantages of the utility model reside in that:

1) the metal magnetic powder core integrated chip inductor only keeps the bottom electrode and coats the product body with the nano insulating material, saves the side tin stacking size of a slurry end-capping electroplating type and a material sheet spot welding electrode type integrated inductor product, effectively reduces the installation size of the product on a circuit board, increases the installation space of the integrated circuit board, and creates favorable conditions for the highly integrated development of the integrated circuit industry; the comprehensive performance of the product is greatly improved under the condition of the same size.

2) The ion plating technology or the traditional electroplating process is used in the manufacturing process, the compactness of the plating layer is improved, and meanwhile, the plating layer is reduced from 4 layers to 2 layers, so that the manufacturing cost is saved, and the process yield is improved.

3) The thickness of the insulating coating of the product is made to be more than 5um by adopting a new nano insulating coating material and a nano insulating coating process, and the insulating coating material is a polyimide material.

Drawings

Fig. 1 is the schematic diagram of the electrode surface downward bulge of the present invention.

Fig. 2 is the schematic view of the electrode surface bottom of the present invention being flush with the bottom of the metal magnetic powder core.

Fig. 3 is a process diagram of the present invention.

Reference numerals: 1-metal magnetic powder core, 2-hollow coil, 3-primary nano insulating coating layer, 4-electrode surface, 5-side end surface, 6-copper layer, 7-secondary nano insulating coating layer and 8-metallized electrode.

Detailed Description

The present invention will be further explained with reference to the drawings, and the preferred embodiment of the present invention is: referring to fig. 1 and fig. 2, the metal magnetic powder core integrated chip inductor according to the present embodiment includes a metal magnetic powder core 2 and a hollow coil 1 located in the metal magnetic powder core 2, and corners of the surface of the metal magnetic powder core 2 are all in arc smooth transition; the metal magnetic powder core 2 is integrally molded by carbonyl iron powder or soft magnetic alloy powder; the surface of a metal magnetic powder core 2 is sequentially coated with a primary nano insulating coating layer 3 and a secondary nano insulating coating layer 7, two ends of the bottom of the metal magnetic powder core 2 are provided with electrode surfaces 4, two end parts of the metal magnetic powder core 2 are provided with side end surfaces 5, the surfaces of the electrode surfaces 4 and the side end surfaces 5 are plated with copper to form copper layers 6, and the surfaces of the copper layers 6 of the electrode surfaces 4 are plated with alloy materials or other metal materials to form metallized electrodes 8; the primary nano insulating coating layer 3 and the secondary nano insulating coating layer 7 are formed by coating polyimide materials, and the electrode surface can be designed into a downward convex structure (shown in figure 1) or the bottom of the electrode surface is flush with the bottom of the metal magnetic powder core (shown in figure 2) according to needs.

The preparation process of the inductor comprises the following steps (see the attached figure 3): winding an air-core coil, compression molding, primary chamfering, hot-press curing, secondary chamfering, primary nano-insulation coating, primary grinding, electrode copper plating, secondary nano-insulation coating, secondary grinding, electrode metallization electroplating, testing and packaging, wherein,

the first step is as follows: winding an air-core coil: manufacturing an air core coil according to the specification setting requirement of a product; the winding mode adopts multi-shaft orderly winding on a winding jig;

the second step is as follows: compression molding: forming by adopting carbonyl iron powder or alloy materials (iron silicon, iron silicon chromium, iron nickel, iron silicon aluminum, amorphous nano material systems and the like);

the third step: primary chamfering: the compression molding product is mixed with a chamfering medium according to a certain proportion according to the weight of the product and then is put into chamfering equipment to complete chamfering operation; the ratio of the weight of the product to the chamfering medium is 1-1000: 1;

the fourth step: hot-pressing and curing: neatly typesetting the products, putting the products into a cavity of hot-pressing equipment, controlling the temperature of the cavity of the hot-pressing equipment to be more than or equal to 150 ℃, and maintaining the pressure of more than or equal to 0.5 ton for more than or equal to 10 minutes to complete the hot-pressing curing operation;

the fifth step: and (3) secondary chamfering: mixing the hot-pressed product with a chamfering medium according to a certain ratio according to the weight of the product, and putting the product into chamfering equipment to complete secondary chamfering operation; the ratio of the weight of the product to the chamfering medium is 1-1000: 1;

a sixth step: primary nano insulation coating: using polyimide nano material to carry out insulation coating treatment on the surface of the product, wherein the thickness of the insulation layer is more than or equal to 5um, and baking the product at 150 ℃ or more than 150 ℃ for 1 hour or more than 1 hour to solidify the insulation layer after coating;

a seventh step of: primary grinding: and arranging the products in a tool in order, grinding the products by using a high-precision grinding machine, and grinding the single side of the products to be more than or equal to 5um to expose the copper section of the conductive wire of the hollow coil and the two electrode surfaces at the bottom of the products.

An eighth step: and (3) electrode copper plating: electroplating a copper layer with thickness more than or equal to 10um on the product after primary grinding;

a ninth step: secondary nano insulation coating: using polyimide nano material to carry out insulation coating treatment on the surface of the product, wherein the thickness of the insulation layer is more than or equal to 5um, and baking the product at 150 ℃ or more than 150 ℃ for 1 hour or more than 1 hour to solidify the insulation layer after coating;

a tenth step: and (3) secondary grinding: arranging the products in a jig in order, grinding the products by using a high-precision grinding machine, and grinding one side of the products to be more than or equal to 5um to expose the copper conductor coating at the bottom of the products;

an eleventh step: electroplating a metallized electrode: the product adopts an ion plating technology (PVD technology) or a traditional electroplating technology, and the required alloy material or other metal material plating layer is added on the surface of the electrode area plated with copper so as to increase the weldability, the welding resistance and the adhesive force of the product;

a twelfth step: testing and packaging: and (4) carrying out full-automatic test packaging on the products to eliminate defective products with size and characteristics, and packaging the defective products into a carrier tape.

The above-mentioned embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, so that all the changes made according to the shape and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a metal magnetic powder core integral type chip inductance, it is including metal magnetic powder core (2) and be located hollow coil (1) of metal magnetic powder core (2), its characterized in that: the surface of the metal magnetic powder core (2) is sequentially coated with a primary nano insulating coating layer (3) and a secondary nano insulating coating layer (7) from inside to outside, electrode surfaces (4) are arranged at two ends of the bottom of the metal magnetic powder core (2), side end surfaces (5) are arranged at two end parts of the metal magnetic powder core (2), copper is plated on the surfaces of the electrode surfaces (4) and the side end surfaces (5) to form a copper layer (6), and a metalized electrode (8) is formed by electroplating on the surface of the copper layer (6) of the electrode surface (4).

2. The integrated chip inductor with metal magnetic powder core as claimed in claim 1, wherein: the metal magnetic powder core (2) is formed by adopting carbonyl iron powder or soft magnetic alloy powder through mould pressing.

3. The integrated chip inductor with metal magnetic powder core as claimed in claim 1, wherein: the primary nano insulating coating layer (3) and the secondary nano insulating coating layer (7) are formed by coating polyimide materials.

4. The integrated chip inductor with metal magnetic powder core as claimed in claim 1, wherein: the corners of the surface of the metal magnetic powder core (2) are in arc smooth transition.

5. The integrated chip inductor with metal magnetic powder core as claimed in claim 1, wherein: the hollow coil (1) is formed by winding a round wire or a flat wire.

6. The integrated chip inductor with metal magnetic powder core as claimed in claim 1, wherein: two ends of the bottom of the metal magnetic powder core (2) are protruded downwards to form an electrode surface (4).

7. The integrated chip inductor with metal magnetic powder core as claimed in claim 1, wherein: the bottom of the electrode surface (4) is flush with the bottom of the metal magnetic powder core (2).