CN213105920U

CN213105920U - High-density interconnected circuit board hole plugging resin grinding processing device

Info

Publication number: CN213105920U
Application number: CN202021392511.XU
Authority: CN
Inventors: 杜平辉; 江英俊
Original assignee: Anji Shenzhen Sen Electronics Co ltd
Current assignee: Anji Shenzhen Sen Electronics Co ltd
Priority date: 2020-07-15
Filing date: 2020-07-15
Publication date: 2021-05-04
Anticipated expiration: 2030-07-15

Abstract

The utility model relates to a grinder technical field specifically is a high density interconnected circuit board consent resin grinds processingequipment, including the device main part, the device main part includes support, platen, the platform of polishing and the organism of polishing, the support top has linked firmly the platen, and the top intermediate position department of platen has linked firmly the platform of polishing, the platen top is provided with the organism of polishing, the platen obtains inside elevating gear that is provided with, elevating gear includes cavity and through-hole, the inside of cavity is provided with the dwang, the right side of dwang is run through the platen and has linked firmly the connecting rod, the inside clamping device that is provided with of platform of polishing. The utility model provides the high ease of use has effectively prevented when polishing the completion and need retrieve the circuit board, because the circuit board volume is thinner, when the staff perk the circuit board for a long time, can cause the damage to the hand, and operates comparatively loaded down with trivial details, has influenced operating personnel's work efficiency's problem.

Description

High-density interconnected circuit board hole plugging resin grinding processing device

Technical Field

The utility model relates to a grinder technical field specifically is a high density interconnected circuit board consent resin grinds processingequipment.

Background

The existing high-density interconnected circuit board hole plugging resin grinding processing device is mainly used for grinding hole plugging positions on the surface of a circuit board, so that resin and hole plugging are flush, coating processing is facilitated, the existing high-density interconnected circuit board hole plugging resin grinding processing device has various functions, diversification is realized, and therefore the existing high-density interconnected circuit board hole plugging resin grinding processing device can meet the use requirements of people, and the following problems still exist.

The existing high-density interconnected circuit board hole plugging resin grinding processing device is generally designed into a fixed structure, when the circuit board needs to be recovered after polishing, the circuit board is thin in size, when workers warp the circuit board for a long time, damage to hands can be caused, the operation is complex, the usability and the practicability are reduced, the work efficiency of the operators is influenced, and therefore a novel high-density interconnected circuit board hole plugging resin grinding processing device is urgently needed to solve the problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high density interconnected circuit board consent resin grinds processingequipment to when polishing the completion and retrieving that proposes in solving above-mentioned background art, because the circuit board volume is thin when perk the circuit board, can cause the damage to the hand, operate comparatively loaded down with trivial details problem.

In order to achieve the above object, the utility model provides a following technical scheme: a resin grinding and processing device for a high-density interconnected circuit board plug hole comprises a device main body, wherein the device main body comprises a support, a table plate, a grinding table and a grinding machine body, the top end of the support is fixedly connected with the table plate, the middle position of the top end of the table plate is fixedly connected with the grinding table, the top end of the table plate is provided with the grinding machine body, two sides of the bottom end of the grinding machine body are fixedly connected with the upper surface of the table plate, the table plate is internally provided with a lifting device, the lifting device comprises a cavity and a through hole, a rotating rod is arranged inside the cavity, two sides of the rotating rod are movably connected with the cavity through bearings, a centrifugal sheet is arranged at the middle position outside the rotating rod, the right side of the rotating rod penetrates through the table plate and is fixedly connected with a connecting rod, a torsion spring is wound on the outer part of the connecting rod, the two sides of the top end inside the bedplate are fixedly connected with first slide rails, the first slide rails are connected with first slide blocks in a sliding mode, the first slide blocks are two groups, the inner sides of the first slide blocks, close to the polishing table, are fixedly connected to the two sides of the fixed plate, ejector rods are arranged in the middle of the top end of the fixed plate and penetrate through the bedplate to extend to the interior of the polishing table, and clamping devices are arranged inside the polishing table.

Preferably, clamping device includes fixing base and second slide rail, the top of the platform both sides of polishing has all linked firmly the fixing base, and the inside cover of fixing base is equipped with the push rod, the central point department of putting that the push rod is close to the platform of polishing has all linked firmly the push pedal, and the outside winding of push rod has compression spring, compression spring keeps away from the platform central point department of putting of polishing and links firmly at the fixing base outer wall, and compression spring is close to the central point department of putting of polishing the platform and all links firmly the outer wall at the push rod, both sides have all linked firmly the second slider around the push pedal bottom, the second slide rail has all been seted up at both ends around the platform top left and right sides of polishing, and second slide rail and second slider be sliding.

Preferably, the centrifugal sheets are provided with two groups, and the centrifugal sheets are designed in a water drop shape.

Preferably, the top of centrifugation piece is provided with the gyro wheel, and the both sides of gyro wheel are inside the fixed plate through pivot swing joint, the rotation groove of mutually supporting with the gyro wheel has all been seted up to the left and right sides of the inside bottom of fixed plate.

Preferably, the ejector rods are provided with six groups, the bottom ends of the ejector rods are fixedly connected to the top end of the fixing plate, rubber blocks are glued to the top ends of the six groups of ejector rods, and through holes matched with the ejector rods are formed in the polishing table.

Preferably, the two groups of push rods are fixedly connected with pull plates at the positions far away from the center of the polishing table.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this high density interconnection circuit board consent resin grinds processingequipment is provided with the fixed plate, ejector pin and through-hole, when the circuit board is polished and is accomplished, upwards carry out under the effect that removes through the fixed plate, the ejector pin upwards extrudees, make the ejector pin pass from the through-hole is inside, the circuit board that will polish lifts up, the staff of being convenient for takes, the ease of use has been improved, effectively prevented when polishing the completion and need retrieve the circuit board, because the circuit board volume is thinner, when the staff perks the circuit board for a long time, probably cause the damage to the hand, and the operation is comparatively loaded down with trivial details, operating personnel's work efficiency's problem has been influenced.

2. This high density interconnection circuit board consent resin grinds processingequipment is provided with push pedal and compression spring, when will add man-hour to the circuit board, at first under the effect of push pedal, fix the circuit board, be convenient for polish to consent department, improved ease of use and practicality, and under compression spring extruded effort, be convenient for carry out the centre gripping to the circuit board of equidimension not, effectively prevented when polishing the operation to the circuit board, the circuit board probably takes place the dislocation, lead to damaging the problem of circuit board component.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is a schematic view of a front cross-sectional view of the elevating device of the present invention;

fig. 3 is an enlarged schematic view of the structure at a in fig. 2 according to the present invention;

fig. 4 is an enlarged schematic view of the structure at B in fig. 2 according to the present invention;

fig. 5 is a schematic view of a top-view cross-sectional structure of the polishing table of the present invention.

In the figure: 100. a device main body; 110. a support; 120. a platen; 130. a polishing table; 140. polishing the machine body; 200. a raising device; 210. a chamber; 211. rotating the rod; 212. a centrifugal sheet; 213. a connecting rod; 214. a torsion spring; 215. a first slide rail; 216. a first slider; 217. a fixing plate; 218. a top rod; 219. a roller; 220. a through hole; 300. a clamping device; 310. a fixed seat; 311. a push rod; 312. pushing the plate; 313. a compression spring; 314. a second slider; 320. a second slide rail.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides an embodiment: a resin grinding processing device for a high-density interconnected circuit board plug hole comprises a device main body 100, the device main body 100 comprises a support 110, a table plate 120, a grinding table 130 and a grinding machine body 140, the top end of the support 110 is fixedly connected with the table plate 120, the middle position of the top end of the table plate 120 is fixedly connected with the grinding table 130, the top end of the table plate 120 is provided with the grinding machine body 140, two sides of the bottom end of the grinding machine body 140 are fixedly connected with the upper surface of the table plate 120, a lifting device 200 is arranged inside the table plate 120 and comprises a chamber 210 and a through hole 220, a rotating rod 211 is arranged inside the chamber 210, two sides of the rotating rod 211 are movably connected with the chamber 210 through bearings, a centrifugal sheet 212 is arranged at the middle position outside the rotating rod 211, the right side of the rotating rod 211 penetrates through the table plate 120 and is fixedly connected with a connecting rod 213, a torsion spring 214, and torsion spring 214's right side links firmly at the connecting rod 213 outer wall, and the both sides at the inside top of platen 120 all link firmly first slide rail 215, and the inside sliding connection of first slide rail 215 has first slider 216, and two sets of first sliders 216 are close to the platform 130 inboard of polishing and all link firmly in the both sides of fixed plate 217, and the intermediate position department on the top of fixed plate 217 is provided with ejector pin 218, and ejector pin 218 runs through platen 120 and extends to the platform 130 inside of polishing, and the platform 130 inside of polishing is provided with clamping device 300.

The clamping device 300 includes a fixing base 310 and a second slide rail 320, the fixing base 310 is fixed to the top of the two sides of the polishing table 130, the fixed seat 310 is internally sleeved with a push rod 311, the push rod 311 is fixedly connected with a push plate 312 at a position close to the center of the polishing table 130, and a compression spring 313 is wound outside the push rod 311, the compression spring 313 far away from the center of the polishing table 130 is fixedly connected with the outer wall of the fixed seat 310, the compression spring 313 is fixedly connected to the outer wall of the push rod 311 near the center of the polishing platform 130, the front and rear sides of the bottom end of the push plate 312 are fixedly connected to the second slide blocks 314, the front and rear ends of the left and right sides of the top end of the polishing platform 130 are respectively provided with the second slide rails 320, the second slide rails 320 are slidably connected with the second slide blocks 314, under the effect of this mechanism, can fix the circuit board component of equidimension not, be convenient for polish the consent resin of inside, improved ease for use and practicality.

The centrifugal sheet 212 is provided with two sets, and the centrifugal sheet 212 is the design of drop shape, under the effect of centrifugal sheet 212, can upwards jack-up fixed plate 217 when centrifugal sheet 212 rotates for ejector pin 218 upwards removes, and the circuit board component that will process is ejecting, is convenient for take, has improved ease for use and practicality.

The top of centrifugal piece 212 is provided with gyro wheel 219, and inside the fixed plate 217 through pivot swing joint in the both sides of gyro wheel 219, and the rotating groove of mutually supporting with gyro wheel 219 has all been seted up to the left and right sides of the inside bottom of fixed plate 217, under gyro wheel 219's effect, can prevent that centrifugal piece 212 from taking place the card and dying for the operation is more smooth, has improved ease of use and practicality.

The ejector rod 218 is provided with six groups, the bottom end of the ejector rod 218 is fixedly connected to the top end of the fixing plate 217, the top ends of the six groups of ejector rods 218 are glued with rubber blocks, through holes 220 matched with the ejector rods 218 are formed in the polishing table 130, under the action of the through holes 220, the ejector rods 218 can better support and press the circuit board, the circuit board can be moved out, and usability and practicability are improved.

The two groups of push rods 311 are fixedly connected with pull plates at the central positions far away from the polishing table 130, and under the action of the pull plates, the push plates 312 can be pulled, so that the circuit board can be conveniently clamped.

The working principle is as follows: when the circuit board is polished, firstly, the connecting rod 213 is rotated to drive the rotating rod 211 to rotate, the connecting rod 213 elastically deforms, the centrifugal sheet 212 rotates while the rotating rod 211 rotates, the fixing plate 217 is upwards extruded under the mutual matching action of the rollers 219, the fixing plate 217 upwards moves under the action of the first sliding rail 215 and the first sliding block 216, and the processed circuit board is jacked up under the mutual matching action of the mandril 218 at the top end of the fixing plate 217 and the through hole 220 to take out the circuit board;

when the circuit board is to be fixed, firstly the pulling plate is pulled to drive the pushing plate 312 to move, the compression spring 313 generates elastic deformation, and then the circuit board is put in, so that the pushing plate 312 fixes the circuit board under the action of the restoring force of the compression spring 313, the hole plugging part is convenient to polish, and the operation is finished.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a high density interconnected lines board consent resin grinds processingequipment, includes device main part (100), device main part (100) are including support (110), platen (120), the platform (130) of polishing and the organism (140) of polishing, support (110) top has linked firmly platen (120), and the top intermediate position department of platen (120) has linked firmly platform (130) of polishing, platen (120) top is provided with the organism (140) of polishing, and the bottom both sides of the organism (140) of polishing all link firmly the upper surface at platen (120), its characterized in that: the bedplate (120) is internally provided with a lifting device (200), the lifting device (200) comprises a chamber (210) and a through hole (220), a rotating rod (211) is arranged in the chamber (210), two sides of the rotating rod (211) are movably connected with the chamber (210) through bearings, a centrifugal sheet (212) is arranged at the middle position of the outer side of the rotating rod (211), the right side of the rotating rod (211) penetrates through the bedplate (120) and is fixedly connected with a connecting rod (213), a torsion spring (214) is wound outside the connecting rod (213), the left side of the torsion spring (214) is fixedly connected with the outer surface of the bedplate (120), the right side of the torsion spring (214) is fixedly connected with the outer wall of the connecting rod (213), two sides of the top end in the bedplate (120) are fixedly connected with first sliding rails (215), and a first sliding block (216) is slidably connected in the first sliding rails (215), the two groups of first sliding blocks (216) are close to the inner sides of the grinding table (130) and are fixedly connected to two sides of the fixing plate (217), an ejector rod (218) is arranged in the middle of the top end of the fixing plate (217), the ejector rod (218) penetrates through the table plate (120) and extends to the inside of the grinding table (130), and a clamping device (300) is arranged inside the grinding table (130).

2. The grinding and processing device for the resin of the high-density interconnected circuit board plug hole according to claim 1, wherein: the clamping device (300) comprises a fixed seat (310) and a second sliding rail (320), the fixed seats (310) are fixedly connected with the top ends of the two sides of the grinding table (130), a push rod (311) is sleeved in the fixed seat (310), push plates (312) are fixedly connected at the central positions of the push rods (311) close to the polishing table (130), and a compression spring (313) is wound outside the push rod (311), the compression spring (313) is fixedly connected with the outer wall of the fixed seat (310) at the position far away from the center of the grinding table (130), and the compression springs (313) are fixedly connected with the outer wall of the push rod (311) at the central position close to the grinding table (130), the front side and the rear side of the bottom end of the push plate (312) are fixedly connected with second sliding blocks (314), the front end and the rear end of the left side and the rear side of the top end of the polishing table (130) are both provided with a second sliding rail (320), and the second sliding rail (320) is in sliding connection with a second sliding block (314).

3. The grinding and processing device for the resin of the high-density interconnected circuit board plug hole according to claim 1, wherein: two groups of centrifugal blades (212) are arranged, and the centrifugal blades (212) are designed in a water drop shape.

4. The grinding and processing device for the resin of the high-density interconnected circuit board plug hole according to claim 1, wherein: the top of centrifugal piece (212) is provided with gyro wheel (219), and the both sides of gyro wheel (219) are inside fixed plate (217) through pivot swing joint, the rotation groove of mutually supporting with gyro wheel (219) has all been seted up to the left and right sides of the inside bottom of fixed plate (217).

5. The grinding and processing device for the resin of the high-density interconnected circuit board plug hole according to claim 1, wherein: six groups of ejector rods (218) are arranged, the bottom ends of the ejector rods (218) are fixedly connected to the top end of the fixing plate (217), rubber blocks are glued to the top ends of the six groups of ejector rods (218), and through holes (220) matched with the ejector rods (218) are formed in the polishing table (130).

6. The grinding and processing device for the resin of the high-density interconnected circuit board plug hole according to claim 2, wherein: the central positions of the two groups of push rods (311) far away from the grinding table (130) are fixedly connected with pull plates.