CN213094717U - Aerogel heat abstractor based on microcontroller - Google Patents

Aerogel heat abstractor based on microcontroller Download PDF

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Publication number
CN213094717U
CN213094717U CN202021528900.0U CN202021528900U CN213094717U CN 213094717 U CN213094717 U CN 213094717U CN 202021528900 U CN202021528900 U CN 202021528900U CN 213094717 U CN213094717 U CN 213094717U
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heat dissipation
cabinet
heat
liquid delivery
microcontroller
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CN202021528900.0U
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郑星
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Tianjin Weiyuan Technology Development Co ltd
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Tianjin Weiyuan Technology Development Co ltd
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Abstract

The utility model discloses an aerogel heat abstractor based on microcontroller relates to the heat abstractor field, including weather shield, heat dissipation cabinet, fan board and heating panel, weather shield fixed mounting is in fan board back, and fan board fixed mounting is in the back inboard of heat dissipation cabinet, and the inboard fixed mounting in heat dissipation cabinet bottom has the heating panel; the heat dissipation cabinet includes temperature sensor and microcontroller, the temperature sensor is connected with the microcontroller electrical property, microcontroller connects gradually to fan board and heating panel through the wire, fan board edge four corners and axle center department fixed mounting have the heat dissipation fan, the heating panel includes the heat absorption piece, the liquid delivery pipe, fin and liquid delivery pump, the both ends of heat absorption piece are all through liquid delivery pipe fixed connection respectively to fin and liquid delivery pump, and fin and liquid delivery pump pass through liquid delivery pipe fixed connection, not only be favorable to optimizing heat abstractor radiating efficiency, degree of automation is higher simultaneously, need not artifical manual control radiating process, still possess the function of prevention steam erosion.

Description

Aerogel heat abstractor based on microcontroller
Technical Field
The utility model belongs to the technical field of heat abstractor, concretely relates to aerogel heat abstractor based on microcontroller.
Background
Aerogels, also known as xerogels. When most of the solvent is removed from the gel, the liquid content in the gel is much less than the solid content, or the space network structure of the gel is filled with gas, and the appearance is solid, namely xerogel, also called aerogel. In the manufacturing process of the aerogel, heat dissipation is one of the more important steps, so the use of the aerogel heat dissipation device is also indispensable.
Current aerogel heat abstractor needs manual control heat dissipation process, wastes time and energy, and its current heat abstractor adopts the fan to blow radiating mode more simultaneously, leads to the radiating efficiency low, and the preparation process is slow, and when meetting sleet weather at outdoor work moreover, inside the easy infiltration device of steam corrodes inside precision parts, leads to the organism trouble.
SUMMERY OF THE UTILITY MODEL
The utility model provides an aerogel heat abstractor based on microcontroller has solved among the prior art heat abstractor and needs manual control heat dissipation process, wastes time and energy, and the heat dissipation adopts the fan to blow the heat dissipation simultaneously, and the radiating efficiency is low, and the preparation process is slow, and when meetting sleet weather at the outwork, inside steam permeates the device easily, corrodes inside precision part, leads to the problem of organism trouble.
The technical scheme of the utility model is realized like this:
an aerogel heat dissipation device based on a microcontroller comprises a rain shield, a heat dissipation cabinet, a fan plate and a heat dissipation plate, wherein the rain shield is fixedly installed at the back of the fan plate, the fan plate is fixedly installed on the inner side of the back of the heat dissipation cabinet, and the heat dissipation plate is fixedly installed on the inner side of the bottom of the heat dissipation cabinet;
the heat dissipation cabinet comprises a temperature sensor and a microcontroller, the temperature sensor is electrically connected with the microcontroller, the microcontroller is sequentially connected to the fan plate and the heat dissipation plate through a wire, heat dissipation fans are fixedly mounted at four corners of the edge of the fan plate and the axis of the fan plate, the heat dissipation plate comprises heat absorption fins, liquid conveying pipes, heat dissipation fins and liquid conveying pumps, two ends of each heat absorption fin are respectively fixedly connected to the heat dissipation fins and the liquid conveying pumps through the liquid conveying pipes, and the heat dissipation fins and the liquid conveying pumps are fixedly connected with the liquid conveying pipes.
Preferably, the heat absorbing fins, the heat radiating fins and the liquid delivery pump are connected with each other on the heat radiating plate in a 'return' shape structure through the liquid delivery pipes.
Preferably, the outer side of the heat dissipation cabinet is movably connected with a cabinet door through a hinge, and a handle is arranged at the edge position of the outer side face of the cabinet door.
Preferably, the top end of the heat dissipation cabinet is fixedly provided with a cabinet top, the cabinet top is of an umbrella-shaped structure, the cabinet top is provided with a plurality of water leakage grooves which are annularly arranged in a divergent manner in an inwards concave structure.
Preferably, four-corner bases are fixedly mounted at the bottom of the heat dissipation cabinet, and a sealing gasket is arranged between the bases and the heat dissipation cabinet.
The utility model has the advantages that:
the utility model discloses a be provided with temperature sensor and microcontroller in heat dissipation cabinet both sides, the temperature sensor is connected with the microcontroller electrical property, microcontroller is connected to fan board and heating panel through the wire in proper order, so accessible microcontroller automatically starts fan board and heating panel, labour saving and time saving, convenient and fast, the back inboard of heat dissipation cabinet is provided with the fan board, fan board four corners and well axis position fixed mounting have the heat dissipation fan, fan position reaches the reinforcing radiating effect through increasing heat dissipation fan number and adjustment heat dissipation.
The utility model discloses an inboard fixed mounting in heat dissipation cabinet bottom has the heating panel, the heating panel includes the heat sink, liquid delivery pipe, fin and liquid delivery pump, the heat sink passes through liquid delivery pipe both ends fixedly connected with fin and liquid delivery pump respectively, fin and liquid delivery pump pass through liquid delivery pipe fixed connection, through heat-conduction and rivers circulation, further strengthen the radiating effect, fan board back fixed mounting has the weather shield, the weather shield gets up the whole parcel of fan board and separates in with the fan board, effectually prevent sleet weather, inside the easy infiltration device of steam, corrode inside accurate part, lead to the organism trouble.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the whole structure of the vital energy regulating gel heat dissipating device of the present invention;
fig. 2 is a schematic structural view of the front side of the fan plate of the present invention;
fig. 3 is a schematic view of the internal structure of the heat dissipating plate of the present invention.
Wherein, 1, a cabinet top; 101. a water leakage groove; 2. a rain shield; 3. a heat dissipation cabinet; 301. a temperature sensor; 302. a microcontroller; 303. a cabinet door; 3031. a handle; 4. a fan plate; 401. a heat dissipation fan; 5. a heat dissipation plate; 501. a heat absorbing sheet; 502. a liquid delivery pipe; 503. a heat sink; 504. a liquid delivery pump; 6. a base.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, an embodiment of the present invention provides an aerogel heat dissipation device based on a microcontroller, including a rain shield 2, a heat dissipation cabinet 3, a fan plate 4 and a heat dissipation plate 5, wherein the rain shield 2 is fixedly installed at the back of the fan plate 4, the fan plate 4 is fixedly installed at the inner side of the back of the heat dissipation cabinet 3, and the heat dissipation plate 5 is fixedly installed at the inner side of the bottom of the heat dissipation cabinet 3;
the heat dissipation cabinet 3 comprises a temperature sensor 301 and a microcontroller 302, the temperature sensor 301 is electrically connected with the microcontroller 302, the microcontroller 302 is sequentially connected to a fan board 4 and a heat dissipation plate 5 through a conducting wire, four corners of the edge of the fan board 4 and an axis of the fan board are fixedly provided with heat dissipation fans 401, the heat dissipation plate 5 comprises heat absorption plates 501, liquid delivery pipes 502, heat dissipation plates 503 and liquid delivery pumps 504, two ends of each heat absorption plate 501 are respectively and fixedly connected to the heat dissipation plates 503 and the liquid delivery pumps 504 through the liquid delivery pipes 502, and the heat dissipation plates 503 and the liquid delivery pumps 504 are fixedly connected through the liquid delivery pipes 502.
The heat absorbing fins 501, the heat radiating fins 503 and the liquid delivery pump 504 are connected with each other on the heat radiating plate 5 in a 'return' shape structure through the liquid delivery pipe 502, space is saved for the heat radiating plate 5, space utilization rate is improved, the outer side of the heat radiating cabinet 3 is movably connected with the cabinet door 303 through a hinge, a handle 3031 is arranged at the edge position of the outer side surface of the cabinet door 303, the opening and closing of the cabinet door 303 of the heat radiating device are facilitated, time and labor are saved, the top end of the heat radiating cabinet 3 is fixedly provided with a cabinet top 1, the cabinet top 1 is in an umbrella shape structure, the cabinet top 1 is provided with a water leaking groove 101, the water leaking grooves 101 are provided with a plurality of strips which are arranged in an annular diffusion shape in an inward concave structure, when rain weather occurs, water drops can more easily slide down from the cabinet top 1 through the inward concave water leaking groove 101, the sealing washer enables the base 6 and the heat dissipation cabinet 3 to be connected more tightly, the base 6 enables the whole heat dissipation device to be separated from the ground, and the device is prevented from being affected with damp, so that the service life is prolonged.
The working principle is as follows: the utility model discloses a be provided with temperature sensor 301 and microcontroller 302 in 3 both sides of heat dissipation cabinet, temperature sensor 301 is connected with microcontroller 302 electrical property, microcontroller 302 is connected to fan board 4 and heating panel 5 in proper order through the wire, when putting into heat dissipation cabinet 3 containing the device of aerogel, earlier through temperature sensor 301 induced temperature, back temperature sensor 301 conveys information and gives microcontroller 302, microcontroller 302 starts fan board 4 and heating panel 5, it is whole to need not manual control heat dissipation, time saving and labor saving, convenient and fast, heat dissipation cabinet 3's back inboard is provided with fan board 4, fan board 4 edge four corners and axle center department fixed mounting have heat dissipation fan 401, the operation of microcontroller 302 control heat dissipation fan 401, reach reinforcing radiating effect through increasing heat dissipation fan 401 number and adjusting heat dissipation fan 401 position simultaneously, the inboard fixed mounting in heat dissipation cabinet 3 bottom has heating panel 5, heating panel 5 includes heat absorption piece 501, the heat absorption piece, The liquid conveying pipe 502, the radiating fin 503 and the liquid conveying pump 504 are respectively and fixedly connected with the heat absorbing fin 501 through two ends of the liquid conveying pipe 502, the radiating fin 503 and the liquid conveying pump 504 are fixedly connected through the liquid conveying pipe 502, the microcontroller 302 controls the operation of the liquid conveying pump 504, when the device containing aerogel is placed into the radiating cabinet 3, the heat absorbing fin 501 senses the temperature of the liquid in the liquid conveying pipe 502, the liquid in the liquid conveying pipe 502 flows through the pressure of the liquid conveying pump 504 and enters the radiating fin 503 area, the radiating area is increased, the cooling effect is enhanced, the liquid cooled later returns to the heat absorbing position through the liquid conveying pump 504 to achieve the radiating effect, because the specific heat capacity of water is larger and the temperature change is slow, the liquid adopts aqueous solution, and the aerogel further enhances the radiating effect through heat conduction and water flow circulation, 4 back fixed mounting of fan board has weather shield 2, and weather shield 2 gets up fan board 4 whole parcel and with fan board 4 well spaced apart, the effectual rainwater weather that has prevented, and the raindrop gets into inside organism damage that leads to of heat abstractor.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. The aerogel heat dissipation device based on the microcontroller is characterized by comprising a rain shield (2), a heat dissipation cabinet (3), a fan plate (4) and a heat dissipation plate (5), wherein the rain shield (2) is fixedly installed at the back of the fan plate (4), the fan plate (4) is fixedly installed at the inner side of the back of the heat dissipation cabinet (3), and the heat dissipation plate (5) is fixedly installed at the inner side of the bottom of the heat dissipation cabinet (3);
heat dissipation cabinet (3) include temperature sensor (301) and microcontroller (302), temperature sensor (301) with microcontroller (302) electric connection, microcontroller (302) connect gradually to through the wire fan board (4) and heating panel (5), fan board (4) edge four corners and axle center department fixed mounting have heat dissipation fan (401), heating panel (5) are including heat absorption piece (501), liquid delivery pipe (502), fin (503) and liquid delivery pump (504), the both ends of heat absorption piece (501) all pass through liquid delivery pipe (502) fixed connection respectively to fin (503) and liquid delivery pump (504), just fin (503) and liquid delivery pump (504) pass through liquid delivery pipe (502) fixed connection.
2. The heat dissipating device according to claim 1, wherein the heat absorbing fins (501), the heat dissipating fins (503) and the liquid feed pump (504) are connected to each other on the heat dissipating plate (5) in a zigzag configuration through the liquid feed pipe (502).
3. The heat dissipation device as claimed in claim 1, wherein a cabinet door (303) is movably connected to the outer side of the heat dissipation cabinet (3) through a hinge, and a handle (3031) is arranged at the edge position of the outer side surface of the cabinet door (303).
4. The heat dissipation device according to claim 2, wherein a top of the heat dissipation cabinet (3) is fixedly provided with a cabinet top (1), the cabinet top (1) is of an umbrella structure, the cabinet top (1) is provided with a plurality of water leaking grooves (101), and the water leaking grooves (101) are annularly arranged in a concave structure.
5. The heat dissipation device according to claim 1, wherein a four-corner base (6) is fixedly installed at the bottom of the heat dissipation cabinet (3), and a sealing gasket is arranged between the base (6) and the heat dissipation cabinet (3).
CN202021528900.0U 2020-07-29 2020-07-29 Aerogel heat abstractor based on microcontroller Active CN213094717U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021528900.0U CN213094717U (en) 2020-07-29 2020-07-29 Aerogel heat abstractor based on microcontroller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021528900.0U CN213094717U (en) 2020-07-29 2020-07-29 Aerogel heat abstractor based on microcontroller

Publications (1)

Publication Number Publication Date
CN213094717U true CN213094717U (en) 2021-04-30

Family

ID=75627182

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021528900.0U Active CN213094717U (en) 2020-07-29 2020-07-29 Aerogel heat abstractor based on microcontroller

Country Status (1)

Country Link
CN (1) CN213094717U (en)

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