CN213082231U - Flip-chip mould ejection mechanism - Google Patents
Flip-chip mould ejection mechanism Download PDFInfo
- Publication number
- CN213082231U CN213082231U CN202021491257.9U CN202021491257U CN213082231U CN 213082231 U CN213082231 U CN 213082231U CN 202021491257 U CN202021491257 U CN 202021491257U CN 213082231 U CN213082231 U CN 213082231U
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- pull rod
- plate
- fixed
- mold
- ejector pin
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Abstract
The utility model discloses an ejection mechanism of a flip-chip mold, which comprises a fixed mold bottom plate, a fixed mold plate, a movable mold plate, mold feet, a movable mold bottom plate, an ejector pin spring, an upper pull rod and a lower pull rod; the fixed die bottom plate is fixed together with the fixed die plate, and the fixed die plate is relative and establishes with the movable mould board, and movable mould board, moulding foot, movable mould bottom plate coincide in proper order and be fixed together, and the thimble board activity sets up between movable mould board and movable mould bottom plate, and the lower extreme of thimble is fixed on the thimble board, and thimble spring cup joints on the thimble and the both ends of thimble spring lean on respectively on movable mould board and thimble board, and the upper end of upper tie rod is fixed on the lateral wall of fixed die plate, and the lower extreme of lower tie rod is fixed on the thimble board. When the mold is closed, the upper pull rod and the lower pull rod are in a separation state, and after the mold is opened to a certain position, the upper pull rod and the lower pull rod are in an abutting state, so that the ejector plate can be driven to move, and a product is separated from a cavity through the ejector pins.
Description
Technical Field
The utility model relates to an injection mold especially relates to a flip-chip mould ejection mechanism.
Background
The plastic injection mold is a tool for producing plastic products and has wide application. Traditional injection mold advances system of gluing all is to advance from the cover half side of mould and glues, it is big to advance some areas of moulding plastics, and during the product of thickness thinner, because this type of product requires the surface smooth, no trace, so advance when gluing generally adopt the multiple spot side advance glue or advance gluey structure of hiding, nevertheless it advances gluey structure of gluing or advancing of hiding of multiple spot side, it advances gluey mouth and all sets up the side at the product, need design flip-chip mould among the injection mold of this type of product, because among the flip-chip mould, the ejector pin on the injection molding machine can't utilize, need design special product ejection mechanism.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a move reliable and stable flip-chip mould ejection mechanism.
In order to achieve the above object, the technical solution of the present invention is:
the utility model relates to an ejection mechanism of a flip-chip mold, which comprises a fixed mold bottom plate, a fixed mold plate, a movable mold plate, mold feet, a movable mold bottom plate, an ejector pin spring, an upper pull rod and a lower pull rod; the fixed die base plate and the fixed die plate are fixed together, the fixed die plate and the movable die plate are arranged oppositely, a cavity is arranged between the fixed die plate and the movable die plate, the die pins and the movable die base plate are sequentially overlapped and fixed together, the ejector pin plate is movably arranged between the movable die plate and the movable die base plate, the lower end of the ejector pin is fixed on the ejector pin plate, the upper end of the ejector pin extends into the cavity, the ejector pin spring is sleeved on the ejector pin, and two ends of the ejector pin spring respectively abut against the movable die plate and the ejector pin plate; the upper end of the upper pull rod is fixed on the side wall of the fixed die plate, the lower end of the lower pull rod is fixed on the ejector plate, and the lower end of the upper pull rod and the upper end of the lower pull rod form two working states of separation and abutting.
The lower end of the upper pull rod is provided with an upper hook protruding outwards from the side wall, the upper end of the lower pull rod is provided with a lower hook protruding outwards from the side wall, and the moving tracks of the upper hook of the upper pull rod and the lower hook of the lower pull rod are overlapped so that the upper hook of the upper pull rod is abutted against the lower hook of the lower pull rod.
The utility model also comprises a guard plate; the two ends of the guard plate are fixed on the side wall of the movable template, a groove is arranged in the middle of the guard plate, the groove is buckled in the middle of the upper pull rod and the lower pull rod, and gaps are formed between the groove and the upper pull rod and between the groove and the lower pull rod.
After the scheme is adopted, because the utility model discloses a cover half bottom plate, the fixed die plate, the movable mould board, the mold foot, the movable mould bottom plate, the thimble spring, go up the pull rod, the lower link, the upper end of going up the pull rod is fixed on the lateral wall of fixed die plate, the lower extreme of lower link is fixed on the thimble board, the lower extreme of going up the pull rod forms with the upper end of lower link and breaks away from and pushes up and lean on two kinds of operating condition, when closing the mould, it is in the off-state with the lower link to go up the pull rod, the die sinking is to a certain position after, it is in the state that pushes up pull rod and lower link, can remove and deviate from the die cavity with the product through the thimble to drive the thimble.
The invention will be further described with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is an isometric view of the present invention;
fig. 2 is a closed-mold state diagram of the present invention;
fig. 3 is a diagram of the mold opening state of the present invention.
Detailed Description
As shown in fig. 1-3, the utility model relates to a flip-chip mold ejection mechanism, including cover half bottom plate 1, cover half board 2, movable mould board 3, mould foot 4, movable mould bottom plate 5, thimble board 6, thimble 7, upper pull rod 8, lower link 9, thimble spring 10, backplate 20.
The fixed die base plate 1 is fixed with the fixed die plate 2, the fixed die plate 2 is arranged opposite to the movable die plate 3, a cavity is arranged between the fixed die plate 2 and the movable die plate 3, the die legs 4 and the movable die base plate 5 are sequentially overlapped and fixed together, the ejector pin plate 6 is movably arranged between the movable die plate 3 and the movable die base plate 5, the lower end of the ejector pin 7 is fixed on the ejector pin plate 6, the upper end of the ejector pin 7 extends into the cavity, the ejector pin spring 10 is sleeved on the ejector pin 7, and two ends of the ejector pin spring 10 are respectively abutted against the movable die plate 3 and the ejector pin plate 6; the upper end of the upper pull rod 8 is fixed on the side wall of the fixed die plate 2, the lower end of the lower pull rod 9 is fixed on the ejector plate 6, and the lower end of the upper pull rod 8 and the upper end of the lower pull rod 9 form two working states of separation and abutting. The two ends of the guard plate 20 are fixed on the side wall of the movable template 3, the middle of the guard plate 20 is provided with a groove 201, the groove 201 is buckled at the middle parts of the upper pull rod 8 and the lower pull rod 9, and gaps are arranged between the groove 201 and the upper pull rod 8, and between the groove 201 and the lower pull rod 9.
The lower end of the upper pull rod 8 is provided with an upper hook 81 protruding outwards from the side wall, the upper end of the lower pull rod 9 is provided with a lower hook 91 protruding outwards from the side wall, and the moving tracks of the upper hook 81 of the upper pull rod 8 and the lower hook 91 of the lower pull rod 9 are overlapped, so that the upper hook 81 of the upper pull rod 8 is abutted against the lower hook 91 of the lower pull rod 9.
The utility model discloses a theory of operation:
when the mold is opened, the fixed mold plate 2 is separated from the movable mold plate 3, after the fixed mold plate 2 is separated from the movable mold plate 3 by a certain distance, the upper hook 81 of the upper pull rod 8 abuts against the lower hook 91 of the lower pull rod 9, the upper pull rod 8 drives the lower pull rod 9 to move, then the ejector plate 6 connected with the lower pull rod 9 is driven to move, the ejector plate 6 drives the ejector pins 7 to move, and the product is separated from the mold cavity through the ejector pins 7.
The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.
Claims (3)
1. The utility model provides a flip-chip mould ejection mechanism which characterized in that: the device comprises a fixed die base plate, a fixed die plate, a movable die plate, a die pin, a movable die base plate, an ejector pin spring, an upper pull rod and a lower pull rod; the fixed die base plate and the fixed die plate are fixed together, the fixed die plate and the movable die plate are arranged oppositely, a cavity is arranged between the fixed die plate and the movable die plate, the die pins and the movable die base plate are sequentially overlapped and fixed together, the ejector pin plate is movably arranged between the movable die plate and the movable die base plate, the lower end of the ejector pin is fixed on the ejector pin plate, the upper end of the ejector pin extends into the cavity, the ejector pin spring is sleeved on the ejector pin, and two ends of the ejector pin spring respectively abut against the movable die plate and the ejector pin plate; the upper end of the upper pull rod is fixed on the side wall of the fixed die plate, the lower end of the lower pull rod is fixed on the ejector plate, and the lower end of the upper pull rod and the upper end of the lower pull rod form two working states of separation and abutting.
2. The flip-chip die ejection mechanism of claim 1, wherein: the lower end of the upper pull rod is provided with an upper hook protruding outwards from the side wall, the upper end of the lower pull rod is provided with a lower hook protruding outwards from the side wall, and the moving tracks of the upper hook of the upper pull rod and the lower hook of the lower pull rod are overlapped so that the upper hook of the upper pull rod is abutted against the lower hook of the lower pull rod.
3. The flip-chip die ejection mechanism of claim 1, wherein: the device also comprises a guard plate; the two ends of the guard plate are fixed on the side wall of the movable template, a groove is arranged in the middle of the guard plate, the groove is buckled in the middle of the upper pull rod and the lower pull rod, and gaps are formed between the groove and the upper pull rod and between the groove and the lower pull rod.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021491257.9U CN213082231U (en) | 2020-07-24 | 2020-07-24 | Flip-chip mould ejection mechanism |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021491257.9U CN213082231U (en) | 2020-07-24 | 2020-07-24 | Flip-chip mould ejection mechanism |
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CN213082231U true CN213082231U (en) | 2021-04-30 |
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CN202021491257.9U Active CN213082231U (en) | 2020-07-24 | 2020-07-24 | Flip-chip mould ejection mechanism |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113771268A (en) * | 2021-09-10 | 2021-12-10 | 湖北华鑫光电有限公司 | Mold equipment is used in high temperature material production |
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2020
- 2020-07-24 CN CN202021491257.9U patent/CN213082231U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113771268A (en) * | 2021-09-10 | 2021-12-10 | 湖北华鑫光电有限公司 | Mold equipment is used in high temperature material production |
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