CN213072879U - Infrared receiving circuit, infrared receiving system and television - Google Patents
Infrared receiving circuit, infrared receiving system and television Download PDFInfo
- Publication number
- CN213072879U CN213072879U CN202021899427.7U CN202021899427U CN213072879U CN 213072879 U CN213072879 U CN 213072879U CN 202021899427 U CN202021899427 U CN 202021899427U CN 213072879 U CN213072879 U CN 213072879U
- Authority
- CN
- China
- Prior art keywords
- pad
- circuit
- infrared
- transcoding
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Selective Calling Equipment (AREA)
- Details Of Television Systems (AREA)
Abstract
The utility model discloses an infrared receiving circuit, infrared receiving system and TV set for be connected with mainboard chip, include: a light receiving circuit for receiving an infrared signal; the coding selection circuit is used for selecting an input infrared coding format; the transcoding circuit is used for transcoding the infrared signal according to the coding format; the light receiving circuit and the code selection circuit are both connected with the transcoding circuit and the standby power supply circuit, and the transcoding circuit is further connected with the mainboard chip. The utility model discloses an infrared signal of specific coding form is received in the selection of code selection circuit selection to carry out the transcoding through the transcoding circuit, reach the mainboard chip again and carry out corresponding action, realize only receiving the purpose of the infrared signal of specific coding form.
Description
Technical Field
The utility model relates to an infrared circuit field, in particular to infrared receiving circuit, infrared receiving system and TV set.
Background
When an electronic manufacturer produces televisions of different brands with the same scheme, the electronic manufacturer generally configures remote controllers of different infrared coding formats for the televisions according to the requirements of customers to achieve the purpose of distinguishing the different brands.
However, in the existing infrared response method, response programs of different infrared remote control codes in the same scheme can be compatible to software of the same version, so that remote controllers of televisions of different brands can be remotely controlled mutually, and independent requirements of customer brands cannot be met.
Thus, the prior art has yet to be improved and enhanced.
SUMMERY OF THE UTILITY MODEL
In view of the foregoing disadvantages in the prior art, an object of the present invention is to provide an infrared receiving circuit, an infrared receiving system and a television, which select to receive the infrared signal of a specific coding format through a coding selection circuit, transcode the infrared signal through a transcoding circuit, and then transmit the infrared signal to a motherboard chip to execute a corresponding action, so as to achieve the purpose of receiving the infrared signal of the specific coding format only.
In order to achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides an infrared receiving circuit for be connected with mainboard chip, include: a light receiving circuit for receiving an infrared signal; the coding selection circuit is used for selecting and receiving the infrared signals of a specific infrared coding format; the transcoding circuit is used for transcoding the infrared signal according to the specific coding format; the light receiving circuit and the code selection circuit are both connected with the transcoding circuit and the standby power supply circuit, and the transcoding circuit is further connected with the mainboard chip.
The coding selection circuit comprises a plurality of welding pads for welding resistors, and the welding pads are respectively connected with the standby power supply circuit and the transcoding circuit.
The number of the welding pads is six, namely a first welding pad, a second welding pad, a third welding pad, a fourth welding pad, a fifth welding pad and a sixth welding pad; the one end of first pad with the one end of second pad, the one end and the standby power supply circuit of third pad are connected, the other end of first pad with the one end and the transcoding circuit of fourth pad are connected, the other end of second pad with the one end and the transcoding circuit of fifth pad are connected, the other end of third pad with the one end and the transcoding circuit of sixth pad are connected, the other end of fifth pad, the other end of sixth pad and the other end of seventh pad all ground connection.
The light receiving circuit comprises an infrared receiving head, a seventh resistor and a first capacitor; the first pin and the fourth pin of the infrared receiving head are grounded, the second pin of the infrared receiving head is connected with the standby power supply circuit, one end of the seventh resistor and one end of the first capacitor, the third pin of the infrared receiving head is connected with the other end of the seventh resistor and the transcoding circuit, and the other end of the first capacitor is grounded.
The transcoding circuit is including handling the chip, handle the first foot of chip with the light receiving circuit is connected, handle the second foot of chip with the other end of first pad and the one end of fourth pad are connected, handle the third foot of chip with the other end of second pad and the one end of fifth pad are connected, handle the fourth foot of chip with the other end of third pad and the one end of sixth pad are connected, handle the fifth foot of chip with the mainboard chip is connected.
At least one of the first bonding pad, the second bonding pad and the third bonding pad is welded with a resistor.
And the first bonding pad, the second bonding pad and the third bonding pad are not welded with resistors.
And a fourth resistor, a fifth resistor and a sixth resistor are welded on the fourth bonding pad, the fifth bonding pad and the sixth bonding pad respectively.
Based on foretell infrared receiving circuit, the utility model discloses still provide an infrared receiving system, including the infrared transmitting device who is used for launching the infrared signal of specific coding format and the infrared receiving device who is used for receiving the infrared signal of specific coding format, be provided with the circuit board among the infrared receiving device, be provided with on the circuit board as above infrared receiving circuit. The equipment body is also provided with a mainboard, a mainboard chip is arranged on the mainboard, and a processing chip in the infrared receiving circuit is connected with the mainboard chip and transmits the infrared signal with a specific coding format to the mainboard chip for processing. Optionally, the infrared receiving circuit may also be directly disposed on the motherboard and connected to the motherboard chip. Since the infrared receiving circuit has been described in detail above, it will not be described in detail here.
Based on the infrared receiving circuit, the television comprises a television body, wherein a television main board is arranged in the television body, and the television main board is provided with the infrared receiving circuit. And a processing chip in the infrared receiving circuit is connected with the mainboard chip and transmits the infrared signal with a specific coding format to the mainboard chip for processing. Optionally, the infrared receiving circuit may be separated from the main board and disposed on another circuit board. Since the infrared receiving circuit has been described in detail above, it will not be described in detail here.
Compared with the prior art, the utility model provides an infrared receiving circuit, infrared receiving system and TV set for be connected with mainboard chip, include: a light receiving circuit for receiving an infrared signal; the coding selection circuit is used for selecting an input infrared coding format; the transcoding circuit is used for transcoding the infrared signal according to the coding format; the light receiving circuit and the code selection circuit are both connected with the transcoding circuit and the standby power supply circuit, and the transcoding circuit is further connected with the mainboard chip. The utility model discloses an infrared signal of specific coding form is received in the selection of code selection circuit selection to carry out the transcoding through the transcoding circuit, reach the mainboard chip again and carry out corresponding action, realize only receiving the purpose of the infrared signal of specific coding form.
Drawings
Fig. 1 is a block diagram of an infrared receiving circuit provided by the present invention;
fig. 2 is a circuit diagram of an infrared receiving circuit of a television according to the present invention;
fig. 3 is a pin diagram of an example model of a processing chip provided by the present invention.
Detailed Description
The utility model provides an infrared receiving circuit, infrared receiving system and TV set select through the code selection circuit to receive the infrared signal of specific code format to carry out the transcoding through the transcoding circuit, reach the mainboard chip again and carry out corresponding action, realize only receiving the purpose of the infrared signal of specific code format.
The present invention is described in more detail in order to facilitate the explanation of the technical idea, the technical problem solved, the technical features of the technical solution, and the technical effects brought by the present invention. The embodiments are explained below, but the scope of the present invention is not limited thereto. Further, the technical features of the embodiments described below may be combined with each other as long as they do not conflict with each other.
For the convenience of understanding the embodiments of the present application, relevant elements related to the embodiments of the present application will be described first.
A main board chip: the utility model provides a mainboard chip indicates treater, microprocessor etc. that are not limited to infrared receiving equipment such as TV set.
Specific infrared encoding format: the utility model provides a specific infrared coding format indicates the infrared coding format that different brands' equipment in the same scheme used, and the procedure in the transcoding circuit is all compatible to these different infrared coding formats.
In the prior art, manufacturers can make response programs of different infrared remote control codes in the same scheme compatible with software of the same version, so that remote controllers of televisions of different brands can be remotely controlled mutually, and independent requirements of brands of customers cannot be met; moreover, when there are multiple televisions of different brands of the same scheme in the same space, control confusion may result.
In view of the above problems in the prior art, please refer to fig. 1, the present invention provides an infrared receiving circuit for connecting with a motherboard chip U2, including: a light receiving circuit 200 for receiving an infrared signal; a code selection circuit 100 for selecting to receive an infrared signal of a specific infrared code format; a transcoding circuit 300 for transcoding the infrared signal according to the specific encoding format; the light receiving circuit 200 and the code selecting circuit 100 are both connected to the transcoding circuit 300 and the standby power supply circuit, and the transcoding circuit 300 is further connected to a motherboard chip U2.
In specific implementation, in this embodiment, the infrared response program compatible with the infrared remote control codes of different brands in the prior art is stored in the transcoding circuit 300, and the program is not improved, so that the universality and compatibility of the program are maintained.
Specifically, in this embodiment, for the infrared receiving device of the corresponding brand to be produced, the coding format of the coding selection circuit 100 is set in advance, the coding format is adjusted to the required specific coding format, and the corresponding infrared remote controller is configured, where the infrared remote controller can transmit the infrared signal of the specific coding format. When the infrared remote control device is used, the infrared remote control device transmits the infrared signal coded by the specific coding format, the light receiving circuit 200 receives the infrared signal of the remote control device, the infrared signal is converted into an electric signal and transmitted to the transcoding circuit 300, the transcoding circuit 300 transcodes the infrared signal according to the specific coding format of the coding selection circuit 100 to obtain the infrared remote control code of the same format, and the infrared remote control code is transmitted to the mainboard chip U2 to execute corresponding operation. In the embodiment, the code selection circuit 100 selects a specific code format of a plurality of compatible schemes, and the transcoding circuit 300 transcodes the code according to the specific code format, so that the response of the unique code format can be realized without changing the universality and compatibility of the program. Optionally, in this embodiment, the model of the motherboard chip U2 is SC1401AJ1-03A, and a processor chip of another signal may also be selected.
Illustratively, the encoding selection circuit 100 includes a plurality of pads for the welding resistors, and the pads are respectively connected with the standby power supply circuit and the transcoding circuit 300.
In specific implementation, in the embodiment, in the production process, the code selection circuit 100 is set in the form of reserved pads, the number and the connection relationship of the pads in the code selection circuit 100 in the same scheme are the same, resistors are selectively welded on the corresponding pads according to each code format which needs to be compatible, and the number and/or the positions of the resistors welded on each brand are different, so that the infrared receiving devices provided with the code selection circuits 100 in different code formats cannot be remotely controlled through the same infrared remote controller while compatible identification of multiple code formats is realized.
For example, referring to fig. 2, six pads are provided, namely a first pad R1, a second pad R2, a third pad R3, a fourth pad R4, a fifth pad R5 and a sixth pad R6; the one end of first pad R1 with the one end of second pad R2, the one end and the standby power supply circuit of third pad R3 are connected, the other end of first pad R1 with the one end and the transcoding circuit 300 of fourth pad R4 are connected, the other end of second pad R2 with the one end and the transcoding circuit 300 of fifth pad R5 are connected, the other end of third pad R3 with the one end and the transcoding circuit 300 of sixth pad R6 are connected, the other end of fifth pad R5, the other end of sixth pad R6 and the other end of seventh pad all ground connection.
In this exemplary embodiment, six pads are provided, the first pad R1, the second pad R2, and the third pad R3 being format-encoded pads; the fourth pad R4, the fifth pad R5 and the sixth pad R6 are pull-down pads for soldering a pull-down resistor. Because 3 format coding pads are provided, 8 coding formats can be compatible at most, a brand corresponding to each coding format can be set during production, corresponding resistors are welded through the preset coding formats when infrared receiving equipment of corresponding brands are produced, unique coding format correspondence is realized through hardware, and meanwhile, the universality and compatibility of software are guaranteed. It should be noted that the number of the pads may be adjusted according to the number of actually generated brands, for example, if the number of products of different brands of the same solution generated by the manufacturer is greater than eight, and less than sixteen brands, eight pads may be provided, where four are format encoding pads, and the other four are pull-down pads.
For example, referring to fig. 2, the light receiving circuit 200 includes an infrared receiving head M1, a seventh resistor R7, and a first capacitor C1; the first pin and the fourth pin of the infrared receiving head M1 are both grounded, the second pin of the infrared receiving head M1 is connected with the standby power supply circuit, one end of a seventh resistor and one end of a first capacitor C1, the third pin of the infrared receiving head M1 is connected with the other end of the seventh resistor and the transcoding circuit 300, and the other end of the first capacitor C1 is grounded.
In specific implementation, in this embodiment, the first pin and the fourth pin of the infrared receiving head M1 are both grounding pins (as shown in fig. 2, GND1 and GND2 in M1); the second pin of the infrared receiving head M1 is a power pin (shown in fig. 2, Vs in M1) for accessing a power supply; the third pin of the infrared receiving head M1 is an infrared output pin (shown in fig. 2, Out in M1) for converting an infrared signal into an electrical signal and outputting the electrical signal to the transcoding circuit 300. In particular, the infrared receiving head M1 is a one-piece infrared receiving head M1, which may be selected from model HS0038HM4 TR.
For example, referring to fig. 2, the transcoding circuit 300 includes a processing chip U1, a first pin of the processing chip U1 is connected to the light receiving circuit 200, a second pin of the processing chip U1 is connected to the other end of the first pad R1 and one end of the fourth pad R4, a third pin of the processing chip U1 is connected to the other end of the second pad R2 and one end of the fifth pad R5, a fourth pin of the processing chip U1 is connected to the other end of the third pad R3 and one end of the sixth pad R6, and a fifth pin of the processing chip U1 is connected to the motherboard chip U2.
In specific implementation, as shown in fig. 2 and fig. 3, in this embodiment, the processing chip U1 is AN MCU, and AN optional model thereof is STM8S003F3, the first pin (PA 1 in fig. 2) of the processing chip U1 corresponds to a fifth pin (i.e., OSCIN/PA1 pin in fig. 3) of the MCU, the second pin (PD 1 in fig. 2) of the processing chip U1 corresponds to a eighteenth pin (i.e., PD1(HS)/SWIM pin in fig. 3) of the MCU, the third pin (PD 2 in fig. 2) of the processing chip U1 corresponds to a nineteenth pin (i.e., PD2(HS)/AN3/[ 2_ CH3] pin in fig. 3) of the MCU 1), the fourth pin (PD 3 in fig. 2) of the processing chip U1 corresponds to a twentieth pin (PD 9 (PD)/AN 68656/PC 8656) of the MCU, and the fifth pin (PC _ 867) of the processing chip U368672 is a PC chip U368672/PC 54, and the fifth pin (PC 867) of the processing chip U368653) of the MCU corresponds to a PD — h _ 26 [ TIM1_ CH1N ]).
Specifically, the specific coding format is accessed through the second pin, the third pin and the fourth pin of the processing chip U1, and the infrared signal transmitted from the infrared receiving head M1 is transcoded according to the specific coding format to obtain an infrared remote control code in a unified format, which can be directly identified by the motherboard chip U2, and corresponding operations are performed.
Specifically, at least one of the first pad R1, the second pad R2 and the third pad R3 is soldered with a resistor.
Illustratively, taking six pads as an example, the setting and identification of the encoding format will be explained:
the first format is as follows: resistors are not welded on the first bonding pad R1, the second bonding pad R2 and the third bonding pad R3, and a fourth resistor (not shown), a fifth resistor (not shown) and a sixth resistor (not shown) are welded on the fourth bonding pad R4, the fifth bonding pad R5 and the sixth bonding pad R6 respectively. In the present case, the second pin, the third pin, and the fourth pin of the processing chip U1 all receive a low level, that is, the current code is 000, which represents a code in the first format (i.e., format one), and when the processing chip U1 reads 000, the processing chip U1 calls a program in format one to transcode the infrared signal.
And a second format: resistors are not welded on the first bonding pad R1 and the second bonding pad R2, a third resistor (not shown in the figure) is welded on the third bonding pad R3, and a fourth resistor, a fifth resistor and a sixth resistor are welded on the fourth bonding pad R4, the fifth bonding pad R5 and the sixth bonding pad R6 respectively. In the present case, the second pin and the third pin of the processing chip U1 both receive a low level, the fourth pin of the processing chip U1 receives a high level, that is, the current code is 001, which represents a code of the second format (that is, format two), and when the processing chip U1 reads 001, the program of format two is called to transcode the infrared signal.
And a third format: the first pad R1 and the third pad are not soldered with resistors, the second pad R2 is soldered with a second resistor (not shown), and the fourth pad R4, the fifth pad R5 and the sixth pad R6 are soldered with a fourth resistor, a fifth resistor and a sixth resistor, respectively. In the present case, the third pin of the processing chip U1 receives a high level, the second pin and the fourth pin of the processing chip U1 both receive a low level, that is, the current code is 010, which represents a code in the third format (that is, format three), and when the processing chip U1 reads 010, the program in format three is called to transcode the infrared signal.
And a fourth format: the second pad R2 and the third pad R3 are respectively welded with a second resistor and a third resistor, the first pad R1 is not welded with a resistor, and the fourth pad R4, the fifth pad R5 and the sixth pad R6 are respectively welded with a fourth resistor, a fifth resistor and a sixth resistor. In the present case, the second pin of the processing chip U1 receives a low level, the third pin and the fourth pin of the processing chip U1 receive a high level, that is, the current code is 011, which represents a code of a fourth format (that is, format four), and when the processing chip U1 reads 011, a program of format four is called to transcode the infrared signal.
And a fifth format: the first pad R1 is soldered with a first resistor (not shown), the second pad R2 and the third pad R3 are not soldered with resistors, and the fourth pad R4, the fifth pad R5 and the sixth pad R6 are soldered with a fourth resistor, a fifth resistor and a sixth resistor, respectively. In the present case, the second pin and the third pin of the processing chip U1 both receive a low level, the fourth pin of the processing chip U1 receives a high level, that is, the current code is 100, which represents a code in the fifth format (that is, format five), and when the processing chip U1 reads 100, the program in format five is called to transcode the infrared signal.
And a sixth format: the first pad R1 and the third pad R3 are respectively welded with a first resistor and a third resistor, the second pad R2 is not welded with a resistor, and the fourth pad R4, the fifth pad R5 and the sixth pad R6 are respectively welded with a fourth resistor, a fifth resistor and a sixth resistor. In the present case, the third pin of the processing chip U1 receives a low level, the second pin and the fourth pin of the processing chip U1 both receive a high level, that is, the current code is 101, which represents a code in the sixth format (that is, format six), and when the processing chip U1 reads 101, a program in format six is called to transcode the infrared signal.
The seventh format: the first pad R1 and the second pad R2 are respectively soldered with a first resistor and a second resistor, the third pad R3 is not soldered with a resistor, and the fourth pad R4, the fifth pad R5 and the sixth pad R6 are respectively soldered with a fourth resistor, a fifth resistor and a sixth resistor. In the present case, the second pin and the third pin of the processing chip U1 both receive a low level, the fourth pin of the processing chip U1 receives a high level, that is, the current code is 110, which represents a code of a seventh format (that is, format seven), and when the processing chip U1 reads 110, a program of format seven is called to transcode the infrared signal.
The format eight: the first pad R1, the second pad R2 and the third pad R3 are respectively soldered with a first resistor, a second resistor and a third resistor, and the fourth pad R4, the fifth pad R5 and the sixth pad R6 are respectively soldered with a fourth resistor, a fifth resistor and a sixth resistor. In the present case, the second pin, the third pin, and the fourth pin of the processing chip U1 all receive a high level, that is, the current code is 111, which represents a code in the eighth format (i.e., format eight), and when the processing chip U1 reads 111, the program in format eight is called to transcode the infrared signal.
The embodiment can be compatible with the infrared remote control codes with different coding formats only by changing hardware, and simultaneously avoids the problem that the infrared receiving equipment can simultaneously respond to the infrared remote control codes with different coding formats. It should be noted that, according to different encoding circuits, different numbers of encoding formats may be set, so as to achieve compatibility of more or less encoding formats.
Based on foretell infrared receiving circuit, the utility model discloses still provide an infrared receiving system, including the infrared transmitting device who is used for launching the infrared signal of specific coding format and the infrared receiving device who is used for receiving the infrared signal of specific coding format, be provided with the circuit board among the infrared receiving device, be provided with on the circuit board as above infrared receiving circuit. Still be provided with the mainboard in the equipment body, be provided with mainboard chip U2 on the mainboard, processing chip U1 in the infrared receiving circuit with mainboard chip U2 is connected, transmits the infrared signal of specific coding format to mainboard chip U2 handles. Optionally, the infrared receiving circuit may also be directly disposed on the motherboard and connected to the motherboard chip U2. Since the infrared receiving circuit has been described in detail above, it will not be described in detail here.
Based on the infrared receiving circuit, the television comprises a television body, wherein a television main board is arranged in the television body, and the television main board is provided with the infrared receiving circuit. The processing chip U1 in the infrared receiving circuit is connected with the main board chip U2, and transmits the infrared signal with a specific coding format to the main board chip U2 for processing. Optionally, the infrared receiving circuit may be separated from the main board and disposed on another circuit board. Since the infrared receiving circuit has been described in detail above, it will not be described in detail here.
To sum up, the utility model provides a pair of infrared receiving circuit, infrared receiving system and TV set for be connected with mainboard chip, include: a light receiving circuit for receiving an infrared signal; the coding selection circuit is used for selecting an input infrared coding format; the transcoding circuit is used for transcoding the infrared signal according to the coding format; the light receiving circuit and the code selection circuit are both connected with the transcoding circuit and the standby power supply circuit, and the transcoding circuit is further connected with the mainboard chip. The utility model discloses an infrared signal of specific coding form is received in the selection of code selection circuit selection to carry out the transcoding through the transcoding circuit, reach the mainboard chip again and carry out corresponding action, realize only receiving the purpose of the infrared signal of specific coding form.
It should be understood that equivalent alterations and modifications can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such alterations and modifications should fall within the scope of the appended claims.
Claims (10)
1. An infrared receiving circuit, for connecting with a motherboard chip, comprising:
a light receiving circuit for receiving an infrared signal;
the coding selection circuit is used for selecting and receiving the infrared signals of a specific infrared coding format;
the transcoding circuit is used for transcoding the infrared signal according to the specific infrared coding format;
the optical receiving circuit is connected with the transcoding circuit and the standby power supply circuit, the coding selection circuit is connected with the transcoding circuit and the standby power supply circuit, and the transcoding circuit is further connected with the mainboard chip.
2. The ir receiving circuit of claim 1, wherein the code selection circuit comprises a plurality of pads for bonding resistors, the pads being connected to the standby power supply circuit and the transcoding circuit, respectively.
3. The infrared receiving circuit according to claim 2, wherein the pads are provided in six, a first pad, a second pad, a third pad, a fourth pad, a fifth pad, and a sixth pad, respectively;
the one end of first pad with the one end of second pad, the one end and the standby power supply circuit of third pad are connected, the other end of first pad with the one end and the transcoding circuit of fourth pad are connected, the other end of second pad with the one end and the transcoding circuit of fifth pad are connected, the other end of third pad with the one end and the transcoding circuit of sixth pad are connected, the other end of fifth pad, the other end of sixth pad and the other end of seventh pad all ground connection.
4. The infrared receiving circuit according to claim 1, wherein the light receiving circuit includes an infrared receiving head, a seventh resistor, and a first capacitor;
the first pin and the fourth pin of the infrared receiving head are grounded, the second pin of the infrared receiving head is connected with the standby power supply circuit, one end of the seventh resistor and one end of the first capacitor, the third pin of the infrared receiving head is connected with the other end of the seventh resistor and the transcoding circuit, and the other end of the first capacitor is grounded.
5. The infrared receiving circuit of claim 3, wherein the transcoding circuit includes a processing chip, a first pin of the processing chip is connected to the light receiving circuit, a second pin of the processing chip is connected to the other end of the first pad and one end of a fourth pad, a third pin of the processing chip is connected to the other end of the second pad and one end of a fifth pad, a fourth pin of the processing chip is connected to the other end of the third pad and one end of a sixth pad, and a fifth pin of the processing chip is connected to the motherboard chip.
6. The infrared receiving circuit of claim 3, wherein at least one of said first bonding pad, said second bonding pad, and said third bonding pad has a resistor bonded thereto.
7. The infrared receiving circuit according to claim 3, wherein none of said first bonding pad, said second bonding pad, and said third bonding pad is soldered with a resistor.
8. The infrared receiving circuit according to claim 6 or 7, wherein a fourth resistor, a fifth resistor and a sixth resistor are soldered to the fourth pad, the fifth pad and the sixth pad, respectively.
9. A television set, characterized by comprising a television set body, wherein the television set body is provided with a television main board, and the television main board is provided with the infrared receiving circuit according to any one of claims 1 to 8.
10. An infrared receiving system, comprising an infrared transmitting device for transmitting an infrared signal of a specific coding format and an infrared receiving device for receiving the infrared signal of the specific coding format, wherein a circuit board is arranged in the infrared receiving device, and the circuit board is provided with an infrared receiving circuit according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021899427.7U CN213072879U (en) | 2020-09-02 | 2020-09-02 | Infrared receiving circuit, infrared receiving system and television |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021899427.7U CN213072879U (en) | 2020-09-02 | 2020-09-02 | Infrared receiving circuit, infrared receiving system and television |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213072879U true CN213072879U (en) | 2021-04-27 |
Family
ID=75556521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021899427.7U Active CN213072879U (en) | 2020-09-02 | 2020-09-02 | Infrared receiving circuit, infrared receiving system and television |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213072879U (en) |
-
2020
- 2020-09-02 CN CN202021899427.7U patent/CN213072879U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5507668A (en) | Cable assembly for multiple electronic components | |
| US5836783A (en) | Communication cable used in a computer system | |
| EP2439942B1 (en) | Tv signal switching box and controlling method thereof | |
| CN202907115U (en) | Secondary remote control device, television and remote control system | |
| EP2375730A1 (en) | Television capable of implementing function extension | |
| CN1412668A (en) | Method and device of remote using personal computer | |
| KR101096682B1 (en) | Control device, smart card reading activation device and associated products | |
| CN213072879U (en) | Infrared receiving circuit, infrared receiving system and television | |
| CN203537473U (en) | Video signal change-over box | |
| CN106125626B (en) | Signal operation method and its hardware module for smart electronics building blocks | |
| CN203457231U (en) | Intelligent video signal switching device | |
| CN203445984U (en) | TV external control device and TV set | |
| US20080088739A1 (en) | USB hub with a TV receiver | |
| CN206237553U (en) | Analog video signal provides circuit, video decoder and system | |
| CN212137847U (en) | Multimedia playing terminal equipment | |
| US20080165021A1 (en) | Apparatus and method for determining the voltage level of an input signal | |
| CN220914598U (en) | Connector assembly and transmission line system | |
| CN101187833B (en) | USB pedal switch device | |
| KR20050056622A (en) | Flash rom download apparatus | |
| JP2005017817A (en) | Video signal supply device, video display terminal device, and signal input terminal selecting method for the same | |
| KR20050080604A (en) | Am image display device having combined hdmi-dvi function and method of controlling the same | |
| CN103067765B (en) | One is televised control system and method | |
| CN215577630U (en) | Multifunctional card sending system assembled in modular combination | |
| CN210518653U (en) | Intelligent set top box with infrared remote control household electrical appliance | |
| CN212659292U (en) | Display screen controller and display control system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |