CN213066624U - Contact heat exchange type semiconductor refrigeration assembly - Google Patents
Contact heat exchange type semiconductor refrigeration assembly Download PDFInfo
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- CN213066624U CN213066624U CN202022023766.5U CN202022023766U CN213066624U CN 213066624 U CN213066624 U CN 213066624U CN 202022023766 U CN202022023766 U CN 202022023766U CN 213066624 U CN213066624 U CN 213066624U
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Abstract
The utility model belongs to the technical field of the small-size refrigeration plant of semiconductor, especially, relate to a contact heat transfer formula semiconductor refrigeration subassembly. Comprises an aluminum heat dissipation plate, a heat dissipation fan set and a semiconductor refrigeration structure; the semiconductor refrigeration structure comprises a positioning frame pad, a plurality of refrigeration sheets arranged on the positioning frame pad, a copper heat conduction plate and a heat load; the refrigeration sheets are embedded in the holes of the positioning frame pad; the heat radiation fan group is fixed on the multi-grid plate structure through the bolt group. The utility model discloses a contact heat transfer formula semiconductor refrigeration subassembly is applicable to the quick heat dissipation refrigeration of all kinds of middle and small miniature heating device such as crystal plate and laser chip among all kinds of laser equipment, guarantee all kinds of laser equipment's normal steady operation, it fills up through the rubber frame that sets up in the refrigeration piece outside guaranteeing that refrigeration piece cold side and hot side can fully contact with copper heat-conducting plate and aluminium system heating panel respectively when, effectively increase the thermal resistance of copper heat-conducting plate and aluminium system heating panel, prevent the heat transfer between heating panel and the heat-conducting plate.
Description
Technical Field
The utility model belongs to the technical field of the small-size refrigeration plant of semiconductor, especially, relate to a contact heat transfer formula semiconductor refrigeration subassembly.
Background
The semiconductor refrigeration technology is also called thermoelectric refrigerator, which utilizes the thermoelectric effect of semiconductor to produce cold. Connecting two different metals by a conductor, and switching on direct current, so that the temperature of one joint is reduced, and the temperature of the other joint is increased; if the power supply is reversed, the temperature at the junction will change inversely. This phenomenon is known as the peltier effect, also known as the thermo-electric effect. Based on the characteristics, the semiconductor refrigeration equipment has the characteristics of no noise, no vibration, no need of refrigerant, small volume, light weight and the like, and is reliable in work, simple and convenient to operate and easy to adjust the cooling capacity. The common semiconductor cooler generally is the sheet-like structure now, though small in size convenient to use, nevertheless because the hot face of refrigeration piece both sides is very close with cold face distance, the heat load that is located refrigeration board both sides and the heat radiation structure of opposite side often can not be fine realize the isolation of heat transfer, the heat can't in time be eliminated simultaneously and is derived, the performance of refrigeration piece has been restrained in the heat transfer, influence the radiating effect, also can't effectively realize control and regulation to the radiating process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a can restrain cold face and hot face heat transfer, improve the hot face radiating effect to and improve the contact heat transfer formula semiconductor refrigeration subassembly of cold face heat transfer effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme.
A contact heat exchange type semiconductor refrigeration assembly comprises an aluminum heat dissipation plate 3, a heat dissipation fan set 1 arranged on one large end face of the aluminum heat dissipation plate 3, and a semiconductor refrigeration structure arranged on the other large end face of the aluminum heat dissipation plate 3; the semiconductor refrigeration structure comprises: the refrigeration device comprises a positioning frame pad 4 close to and tightly attached to the end face of an aluminum heat dissipation plate 3, a plurality of refrigeration sheets 5 arranged on the positioning frame pad 4, a copper heat conduction plate 6 covering the positioning frame pad 4 and tightly attached to the refrigeration sheets 5, and a heat load 7 arranged on the copper heat conduction plate 6;
the positioning frame cushion 4 is of a porous frame structure, and the refrigerating sheets 5 are embedded in holes of the positioning frame cushion 4;
one side of the aluminum heat dissipation plate 3, which is close to the heat dissipation fan set 1, is a multi-grid plate structure 3a, and the heat dissipation fan set 1 is fixed on the multi-grid plate structure 3a through a bolt set.
According to further improvement and optimization of the contact heat exchange type semiconductor refrigeration assembly, the positioning frame pad 4 is made of plastic material with low heat conductivity, and the peripheral edge of the positioning frame pad 4 extends outwards and can shield the copper heat conduction plate 6 to separate the copper heat conduction plate 6 from the aluminum heat dissipation plate 3.
The contact heat exchange type semiconductor refrigeration component is further improved and optimized, and the edge of the copper heat conduction plate 6 is provided with a plurality of heat storage areas, and the thickness of each heat storage area is increased to form a plurality of heat storage blocks 6 a;
the heat storage blocks 6a are uniformly arranged on the peripheral edge of the copper heat conduction plate or outside the heat dissipation core area of the heat load 7.
The further improvement and optimization of the contact heat exchange type semiconductor refrigeration component also comprises that the multi-grid plate structure 3a comprises a plurality of flat plate structures which are arranged in parallel, and a heat dissipation groove is formed in the space between the flat plate structures;
the cooling device also comprises a cold water tank arranged near the aluminum heat dissipation plate 3, wherein capillary lines are embedded at the bottom of the heat dissipation tank, and the other ends of the capillary lines extend and are immersed in water in the cold water tank; the capillary lines are rope-shaped or strip-shaped water absorption made of soft fibers.
The further improvement and optimization of the contact heat exchange type semiconductor refrigeration assembly further comprises that one side, close to the refrigeration sheet 5, of the aluminum heat dissipation plate 3 is provided with a plurality of main heat conducting grooves corresponding to the refrigeration sheet 5, and the periphery of each main heat conducting groove is provided with a plurality of auxiliary heat conducting grooves extending towards the edge of the aluminum heat dissipation plate 3;
the main heat conducting groove and the auxiliary heat conducting groove are embedded with copper embedded heat conducting plates and copper embedded heat conducting strips.
Further improvement and optimization of the contact heat exchange type semiconductor refrigeration assembly further comprises that the heat load 7 is a laser crystal; a plurality of U-shaped crystal fixing grooves 6b are formed in the copper heat conducting plate 6 in a welding or cutting mode, and a temperature measuring probe fixing structure 6c is arranged between the crystal fixing grooves 6 b.
The beneficial effects are that:
the utility model discloses a contact heat transfer formula semiconductor refrigeration subassembly is applicable to the quick heat dissipation refrigeration of all kinds of middle and small miniature heating device such as crystal plate and laser chip/crystal among all kinds of laser equipment, guarantees the normal steady operation of all kinds of laser equipment, and it is through setting up the rubber frame pad in the refrigeration piece outside guaranteeing that refrigeration piece cold side and hot side can fully contact with copper heat-conducting plate and aluminium system heating panel respectively, effectively increase the thermal resistance of copper heat-conducting plate and aluminium system heating panel, prevent the heat transfer between heating panel and the heat-conducting plate;
in further improvement, the performance of the heat dissipation plate is effectively improved by utilizing the heat conduction groove structure and the subsequent capillary evaporation structure, and the highest temperature of the heat dissipation plate is reduced;
in further improvement, the expansion heat capacity of the heat storage block is used as a buffer to prevent instantaneous over-high temperature of lasers and the like under high-energy impact;
in further improvement, the U-shaped crystal fixing groove is utilized, so that the contact area between the copper heat conducting plate and a heat load is increased, the heat transfer efficiency is improved, and the heat radiation and conduction speed is accelerated;
drawings
FIG. 1 is a schematic view of a contact heat exchange type semiconductor refrigeration assembly;
FIG. 2 is an assembly view of a contact heat exchange type semiconductor refrigeration assembly;
fig. 3 is a schematic diagram of an improved structure of a copper heat-conducting plate in a contact heat exchange type semiconductor refrigeration component.
Detailed Description
The present invention will be described in detail with reference to the following specific examples.
As shown in fig. 1, the present application provides a contact heat exchange type semiconductor refrigeration assembly, which is mainly used for various small-sized micro high-energy heat loads, such as a laser light source, and the like, and the basic structure of the assembly comprises an aluminum heat dissipation plate 3, a heat dissipation fan set 1 disposed on one large end face of the aluminum heat dissipation plate 3, and a semiconductor refrigeration structure disposed on the other large end face of the aluminum heat dissipation plate 3. The aluminum material has good heat dissipation effect, so that the heat dissipation of the hot end of the refrigerating sheet can be improved.
As shown in fig. 2, the semiconductor cooling structure includes: the refrigeration device comprises a positioning frame pad 4 close to and tightly attached to the end face of an aluminum heat dissipation plate 3, a plurality of refrigeration sheets 5 arranged on the positioning frame pad 4, a copper heat conduction plate 6 covering the positioning frame pad 4 and tightly attached to the refrigeration sheets 5, and a heat load 7 arranged on the copper heat conduction plate 6;
in order to avoid the situation that the aluminum heat dissipation plate and the copper heat conduction plate are released or close to each other, and meanwhile, the hot surface and the cold surface of the semiconductor refrigeration sheet are guaranteed to be in full contact with the heat dissipation plate and the heat conduction plate respectively, in the application, the positioning frame pad is adopted to achieve the functions, on one hand, the positioning frame pad 4 is of a porous frame structure, and the refrigeration sheet 5 is embedded in each hole of the positioning frame pad 4; each semiconductor refrigeration piece is positioned, limited and sealed through the frame body and is used as an isolation structure.
Meanwhile, as a preferred embodiment, in the present application, the positioning frame pad 4 is made of a plastic material with low thermal conductivity, on one hand, a small amount of soft extendable plastic material is used to improve the sealing connection effect, and cushion the dislocation between the internal structures caused by thermal deformation, and at the same time, the peripheral edge of the positioning frame pad 4 extends outward and can shield the copper heat conduction plate 6 to completely separate the copper heat conduction plate 6 from the aluminum heat dissipation plate 3.
As shown in fig. 1, as a further improvement to the foregoing structure, in a specific implementation, one side of the aluminum heat dissipation plate 3 close to the heat dissipation fan set 1 is designed as a multi-grid plate structure 3a, the heat dissipation fan set 1 is fixed on the multi-grid plate structure 3a through a bolt set, and the multi-grid plate can greatly increase the heat dissipation area of the aluminum heat dissipation plate, so as to improve the heat dissipation efficiency and prevent the hot end temperature of the cooling fins from rising too fast.
On the basis of the structure, the multi-grid plate structure 3a can be arranged to be composed of a plurality of parallel flat plate structures, and heat dissipation grooves are formed in spaces among the flat plate structures;
therefore, the solar water heater further comprises a cold water tank arranged near the aluminum heat dissipation plate 3, wherein capillary lines are embedded at the bottom of the heat dissipation groove, and the other ends of the capillary lines extend and are immersed in water in the cold water tank; the capillary lines are rope-shaped or strip-shaped water absorption made of soft fibers. Through above-mentioned structure, can utilize the adsorption of capillary lines to introduce the moisture in the cold water tank and make its evaporation that constantly absorbs heat, improve the heat-sinking capability of aluminium system heating panel, prevent that the heating panel temperature is too high, can effectively improve the instantaneous heat dissipation demand of elements such as laser instrument, light source crystal that the short-term high heat capacity gived off.
Considering that the rate of the refrigerating sheet in the refrigerating process is lower than the instantaneous heat dissipation of the heat load, which may cause the notification of the over-fast temperature rise or over-high temperature of the heat conducting sheet, and affect the use of the heat load and the refrigerating sheet, in this embodiment, the edge of the copper heat conducting plate 6 is provided with a plurality of heat storage areas, and the thickness of the heat storage areas is increased to form a plurality of heat storage blocks 6 a;
a plurality of main heat conducting grooves corresponding to the refrigerating sheets 5 are formed in one side, close to the refrigerating sheets 5, of the aluminum heat dissipation plate 3, and a plurality of auxiliary heat conducting grooves extending towards the edge of the aluminum heat dissipation plate 3 are formed in the periphery of each main heat conducting groove; the main heat conducting groove and the auxiliary heat conducting groove are internally provided with a copper embedded heat conducting plate 3c and an embedded heat conducting strip 3 d.
The heat load 7 is a laser crystal; a plurality of U-shaped crystal fixing grooves 6b are formed in the copper heat conducting plate 6 in a welding or cutting mode, and a temperature measuring probe fixing structure 6c is arranged between the crystal fixing grooves 6 b.
It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A contact heat exchange type semiconductor refrigeration assembly is characterized by comprising an aluminum heat dissipation plate (3), a heat dissipation fan set (1) arranged on one large end face of the aluminum heat dissipation plate (3), and a semiconductor refrigeration structure arranged on the other large end face of the aluminum heat dissipation plate (3); the semiconductor refrigeration structure comprises: the refrigerator comprises a positioning frame pad (4) close to and tightly attached to the end face of an aluminum heat dissipation plate (3), a plurality of refrigerating sheets (5) arranged on the positioning frame pad (4), a copper heat conduction plate (6) covering the positioning frame pad (4) and tightly attached to the refrigerating sheets (5), and a heat load (7) arranged on the copper heat conduction plate (6);
the positioning frame cushion (4) is of a porous frame structure, and the refrigerating sheets (5) are embedded in holes of the positioning frame cushion (4);
one side of the aluminum heat dissipation plate (3) close to the heat dissipation fan set (1) is provided with a multi-grid plate structure (3a), and the heat dissipation fan set (1) is fixed on the multi-grid plate structure (3a) through a bolt set.
2. A contact heat exchange type semiconductor refrigeration assembly according to claim 1, wherein the positioning frame pad (4) is made of a plastic material with low thermal conductivity, and the peripheral edge of the positioning frame pad (4) extends outwards and can shield the copper heat-conducting plate (6) to separate the copper heat-conducting plate (6) from the aluminum heat-dissipating plate (3).
3. A contact heat exchange type semiconductor refrigeration assembly according to claim 1, wherein the edge of the copper heat conducting plate (6) is provided with a plurality of heat storage areas, and the thickness of the heat storage areas is increased to form a plurality of heat storage blocks (6 a);
the heat storage blocks (6a) are uniformly arranged on the peripheral edge of the copper heat conducting plate or outside the heat dissipation core area of the heat load (7).
4. A contact heat exchange type semiconductor refrigeration assembly according to claim 1, wherein the multi-grid structure (3a) comprises a plurality of flat plate structures arranged in parallel, and the spaces between the flat plate structures form heat dissipation grooves; the cooling device is characterized by further comprising a cold water tank arranged near the aluminum heat dissipation plate (3), wherein capillary lines are embedded at the bottom of the heat dissipation groove, and the other ends of the capillary lines extend and are immersed in water in the cold water tank; the capillary lines are rope-shaped or strip-shaped water absorption made of soft fibers.
5. A contact heat exchange type semiconductor refrigeration assembly as claimed in claim 1, wherein a plurality of main heat conducting grooves corresponding to the positions of the refrigeration sheets (5) are formed in one side of the aluminum heat dissipation plate (3) close to the refrigeration sheets (5), and a plurality of auxiliary heat conducting grooves extending towards the edge of the aluminum heat dissipation plate (3) are formed in the periphery of the main heat conducting grooves; the main heat conducting groove and the auxiliary heat conducting groove are internally provided with copper embedded heat conducting plates (3c) and embedded heat conducting strips (3 d).
6. A contact heat exchange semiconductor refrigeration assembly according to claim 1, wherein the heat load (7) is a laser crystal; a plurality of U-shaped crystal fixing grooves (6b) are formed in the copper heat conducting plate (6) in a welding or cutting mode, and a temperature measuring probe fixing structure (6c) is arranged between the crystal fixing grooves (6 b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022023766.5U CN213066624U (en) | 2020-09-15 | 2020-09-15 | Contact heat exchange type semiconductor refrigeration assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022023766.5U CN213066624U (en) | 2020-09-15 | 2020-09-15 | Contact heat exchange type semiconductor refrigeration assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213066624U true CN213066624U (en) | 2021-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022023766.5U Active CN213066624U (en) | 2020-09-15 | 2020-09-15 | Contact heat exchange type semiconductor refrigeration assembly |
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| CN (1) | CN213066624U (en) |
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- 2020-09-15 CN CN202022023766.5U patent/CN213066624U/en active Active
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