CN213042899U - Automatic wafer pre-alignment device - Google Patents
Automatic wafer pre-alignment device Download PDFInfo
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- CN213042899U CN213042899U CN202021907916.2U CN202021907916U CN213042899U CN 213042899 U CN213042899 U CN 213042899U CN 202021907916 U CN202021907916 U CN 202021907916U CN 213042899 U CN213042899 U CN 213042899U
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Abstract
The utility model discloses an automatic pre-alignment device for wafers, which comprises a motor lifting rod, a first slide rail, a fixing frame, a top column, a wafer bearing platform, a first motor, a vacuum pump, a second slide rail, a second motor, a first fixed block, a first sensor, a second sensor, a nut block, a first fixed plate, a second fixed block, a backing plate, a first slider, a third fixed block, a lead screw, a second fixed plate, a first supporting plate, a second slider, a stop block, a shaft coupling, a cover plate, a second supporting plate, a bottom plate, a shell, a second groove and a fifth fixed block, wherein the vacuum pump is used for extracting air in an air suction port through a pipeline to realize that the wafers are adsorbed on the wafer bearing platform, thereby being beneficial to fast positioning and clamping of the wafers, the device uses the first motor to drive the wafers to move along the X direction, uses the lifting of the motor lifting rod to drive the wafers to move along the Y direction, and is matched with the detection of the, the automatic centering alignment of the wafer is realized, and the improvement of the working efficiency is facilitated.
Description
Technical Field
The utility model relates to a IC makes technical field, specifically is a wafer automatic pre-alignment device.
Background
The wafer pre-alignment is one of the important links in semiconductor manufacturing, and the pre-alignment machine is used to detect the eccentricity and gap (or trimming) of the wafer, and to realize the positioning of the single wafer and the consistency between the wafers, which plays an important role in ensuring the precision of semiconductor manufacturing.
Along with the improvement of the size of the wafer, the precision requirement on the wafer pre-alignment is correspondingly improved, so that the related technology of the wafer pre-alignment needs to be systematically researched, and a general stretched film ring wafer pre-alignment mechanism is complex in positioning and clamping, multiple in working procedures, low in working efficiency and time-consuming; the traditional stretched film ring wafer pre-alignment mechanism has low centering alignment precision and efficiency, and partial steps also need manual operation, so that automatic centering alignment cannot be realized.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an automatic pre-alignment device of wafer to solve the problem that proposes among the above-mentioned background art.
In order to solve the technical problem, the utility model provides a following technical scheme: an automatic wafer pre-alignment device comprises a motor lifting rod, a first slide rail, a fixing frame, a top column, a wafer bearing table, a first motor, a vacuum pump, a second slide rail, a second motor, a first fixing block, a first sensor, a second sensor, a nut block, a first fixing plate, a second fixing block, a backing plate, a first sliding block, a third fixing block, a lead screw, a second fixing plate, a first supporting plate, a second sliding block, a stop block, a coupler, a cover plate, a second supporting plate, a bottom plate, a shell, a first through hole, a second through hole, a fourth fixing block, a supporting arm, a fixing port, an air suction port, a first groove, a second groove and a fifth fixing block, wherein one side of the top of the bottom plate is welded with the bottom of the second supporting plate near the side edge, the bottom of one side of the second supporting plate is fixedly connected with the bottom of the first motor, the output end of the, the other end of the coupler is fixedly connected with one end of a screw rod, one side of the center of the screw rod penetrates through the center of a first fixed block, the first fixed block is rotatably connected with one end of the center of the screw rod through a bearing, the bottom of the first fixed block is fixedly connected with one side of the top of a second slide rail, the bottom of the second slide rail is welded with the top of a bottom plate, a nut block is sleeved in the middle of the screw rod, the other end of the screw rod is sleeved with the center of a third fixed block, the third fixed block is rotatably connected with the screw rod through a bearing, the bottom of the nut block is fixedly connected with the top of a first sliding block, the first sliding block is positioned above the second slide rail, the top of the nut block is fixedly connected with the bottom of a backing plate through a bolt, two sides of the top of the backing plate are welded with the bottom of the second fixed block, the, the output end of the second motor is fixedly connected with the bottom of the wafer bearing table, the center of the top of the wafer bearing table is provided with a plurality of air suction ports, one side of the air suction port is provided with a fixed port, the top of the bottom plate is positioned at one side adjacent to the second supporting plate and is fixedly connected with the bottom of the second fixed plate through a bolt, one side of the top of the second fixing plate is welded with the bottom of the first supporting plate, one side of the first supporting plate is fixedly connected with one side of the first slide rail, the top of one side of the first supporting plate is fixedly connected with one side of the stop block, the center of the top of the second fixing plate is welded with the bottom of the motor lifting rod, the output end of the motor lifting rod is fixedly connected with the bottom of the second slide block, one side of the second slide block is attached to the other side of the first slide rail, the top of the first sliding rail is fixedly connected with the bottom of the fixing frame through a bolt, the top of the fixing frame is fixedly connected with the bottom of the jacking column, and the top of the bottom plate is located on one side, opposite to the first supporting plate, of the bottom of the vacuum pump.
Furthermore, a plurality of first grooves are formed in four edge positions of the bottom plate respectively, one side of each first groove is attached to one side of the bottom of the shell, the bottom of the shell is fixedly connected with the bottom plate through bolts, one side of the top of the shell is fixedly welded to the bottom of the support arm, a second groove is formed in the center of the top of the support arm, one side of the bottom of the second groove is fixedly connected with the bottom of the fourth fixed block through bolts, the bottom of the fourth fixed block is fixedly connected with the top of the second sensor, the center of the bottom of the second groove is fixedly connected with the bottom of the fifth fixed block, the bottom of the fifth fixed block is fixedly connected with the top of the first sensor, the top of the support arm is fixedly connected with the bottom of the cover plate through bolts, a second through hole is formed in one.
Furthermore, the center of the top column and the center of the first through hole are on the same straight line, the output shaft of the second motor penetrates through the second through hole, and the bottom of the wafer bearing table is located 5-10cm above the top of the shell.
Furthermore, the fixed port and the air suction port are both connected with a vacuum pump through pipelines.
Furthermore, lubricating oil is coated on the joint of the first sliding rail and the second sliding block, the joint of the second sliding rail and the first sliding block, the joint of the screw rod and the nut block, the rotary joint of the screw rod and the first fixed block and the rotary joint of the screw rod and the third fixed block.
Compared with the prior art, the utility model discloses the beneficial effect who reaches is:
1. the utility model discloses an utilize the vacuum pump to pass through the inside air of pipeline extraction induction port, realize that the wafer is adsorbed on the wafer bearing platform, be favorable to the quick location clamping of wafer, be favorable to improving work efficiency.
2. The utility model discloses an utilize first motor to drive the wafer along the motion of X direction, utilize the lift of motor lifter to contract and drive the wafer along the motion of Y direction, drive the wafer through the second motor and rotate along the central point to the detection of cooperation first sensor and second sensor has realized the automatic centering of wafer and has aimed at, is favorable to improving work efficiency.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a perspective view of the present invention;
fig. 2 is a schematic structural diagram of the housing of the present invention;
FIG. 3 is a perspective view of the overall structure of the present invention;
fig. 4 is a partially enlarged view of the area a in fig. 1 according to the present invention;
fig. 5 is a partially enlarged view of the area B in fig. 1 according to the present invention;
in the figure: 1. a motor lifter; 2. a first slide rail; 3. a fixed mount; 4. a top pillar; 5. a wafer bearing table; 6. a first motor; 7. a vacuum pump; 8. a second slide rail; 9. a second motor; 10. a first fixed block; 11. a first sensor; 12. a second sensor; 13. a nut block; 14. a first fixing plate; 15. a second fixed block; 16. a base plate; 17. a first slider; 18. a third fixed block; 19. a screw rod; 20. a second fixing plate; 21. a first support plate; 22. a second slider; 23. a stopper; 24. a coupling; 25. a cover plate; 26. a second support plate; 27. a base plate; 28. a housing; 29. a first through hole; 30. a second through hole; 31. a fourth fixed block; 32. a support arm; 33. a fixed port; 34. an air suction port; 35. a first groove; 36. a second groove; 37. and a fifth fixed block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: an automatic wafer pre-alignment device comprises a motor lifting rod 1, a first slide rail 2, a fixed frame 3, a top column 4, a wafer bearing table 5, a first motor 6, a vacuum pump 7, a second slide rail 8, a second motor 9, a first fixed block 10, a first sensor 11, a second sensor 12, a nut block 13, a first fixed plate 14, a second fixed block 15, a backing plate 16, a first sliding block 17, a third fixed block 18, a screw rod 19, a second fixed plate 20, a first supporting plate 21, a second sliding block 22, a stop block 23, a coupler 24, a cover plate 25, a second supporting plate 26, a bottom plate 27, a shell 28, a first through hole 29, a second through hole 30, a fourth fixed block 31, a supporting arm 32, a fixed port 33, an air suction port 34, a first groove 35, a second groove 36 and a fifth fixed block 37, wherein one side of the top of the bottom plate 27 is welded with the bottom of the second supporting plate 26 near the side, the bottom of the second supporting plate 26 is fixedly connected with the bottom of, the output end of a first motor 6 is fixedly connected with one end of a coupler 24, the other end of the coupler 24 is fixedly connected with one end of a screw rod 19, one side of the center of the screw rod 19 penetrates through the center of a first fixed block 10, the first fixed block 10 is rotatably connected with one end of the center of the screw rod 19 through a bearing, the bottom of the first fixed block 10 is fixedly connected with one side of the top of a second slide rail 8, the bottom of the second slide rail 8 is welded with the top of a bottom plate 27, a nut block 13 is sleeved in the middle of the screw rod 19, the other end of the screw rod 19 is sleeved with the center of a third fixed block 18, the third fixed block 18 is rotatably connected with the screw rod 19 through a bearing, the bottom of the nut block 13 is fixedly connected with the top of a first slide block 17, the first slide block 17 is positioned above the second slide rail 8, the top of the nut block 13 is fixedly connected with the, the top of the first fixing plate 14 is fixedly connected with the bottom of the second motor 9 through bolts, the output end of the second motor 9 is fixedly connected with the bottom of the wafer bearing table 5, the center of the top of the wafer bearing table 5 is provided with a plurality of air suction ports 34, one side of each air suction port 34 is provided with a fixing port 33, the fixing ports 33 and the air suction ports 34 are both connected with the vacuum pump 7 through pipelines so as to be beneficial to sucking and loosening wafers, the top of the bottom plate 27 is positioned at one side adjacent to the second supporting plate 26 and fixedly connected with the bottom of the second fixing plate 20 through bolts, one side of the top of the second fixing plate 20 is welded with the bottom of the first supporting plate 21, one side of the first supporting plate 21 is fixedly connected with one side of the first slide rail 2, the top of one side of the first supporting plate 21 is fixedly connected with one side of the stop block 23, the center of the top of the second fixing plate 20 is, lubricating oil is coated at the joint of the first slide rail 2 and the second slide block 22, the joint of the second slide rail 8 and the first slide block 17, the joint of the screw rod 19 and the nut block 13, the rotary joint of the screw rod 19 and the first fixed block 10 and the rotary joint of the screw rod 19 and the third fixed block 18, which are favorable for the normal operation of the mechanism, the top of the first slide rail 2 is fixedly connected with the bottom of the fixed frame 3 through bolts, the top of the fixed frame 3 is fixedly connected with the bottom of the top post 4, the top of the bottom plate 27 is positioned at one side opposite to the first supporting plate 21 and fixedly connected with the bottom of the vacuum pump 7, a plurality of first grooves 35 are respectively arranged at the four sides of the bottom plate 27, one side of each first groove 35 is attached to one side of the bottom of the shell 28, the bottom of the shell 28 is fixedly connected with the bottom of the supporting arm 32 through bolts, the center of the top of the supporting arm 32 is provided with a, the bottom of a fourth fixing block 31 is fixedly connected with the top of a second sensor 12, the center of the bottom of a second groove 36 is fixedly connected with the bottom of a fifth fixing block 37, the bottom of the fifth fixing block 37 is fixedly connected with the top of a first sensor 11, the top of a support arm 32 is fixedly connected with the bottom of a cover plate 25 through a bolt, a second through hole 30 is formed in one side of the center of the top of a shell 28, the center of a top column 4 of a first through hole 29 and the center of the first through hole 29 are arranged on one side of the second through hole 30, an output shaft of a second motor 9 penetrates through the second through hole 30, and the bottom of a wafer bearing table 5 is located 5-10cm above the top of the shell 28; in the use process of the utility model, firstly, the wafer is hoisted to the wafer bearing platform 5 by the mechanical arm, then the vacuum pump 7 starts to work, the air between the wafer and the wafer bearing platform 5 is pumped out through the pipeline and the air inlet 34, the wafer is adsorbed on the wafer bearing platform 5, then the second motor 9 starts to work, the second motor 9 starts to rotate, then the wafer bearing platform 5 is driven to rotate, then the wafer is driven to rotate, the long edge and the short edge of the wafer are detected by the first sensor 11 and the second sensor 12, so as to find out the center of the wafer, at the moment, the vacuum pump 7 starts to work, air is fed between the wafer and the wafer bearing platform 5 through the pipeline and the fixing port 33, so as to loosen the adsorption of the wafer, which is beneficial to the quick positioning and clamping of the wafer, and is beneficial to improving the working efficiency, at the moment, the motor lifting rod 1 starts to produce, thereby driving, then the top post 4 is driven to move upwards to jack up the wafer, at this time, the first motor 6 starts to rotate, then the coupling 24 is driven to rotate, then the screw rod 19 is driven to rotate, as the screw rod 19 and the nut block 13 are connected in a spiral manner, the nut block 13 is driven to move along the X-axis direction by the limitation of the first slide block 17 and the second slide rail 8 at the bottom of the nut block 13, then the backing plate 16 is driven to move along the X-axis direction, so that the second fixed block 15 is driven to move along the X-axis direction, then the first fixed plate 14 is driven to move along the X-axis direction, so that the second motor 9 is driven to move along the X-axis direction, then the wafer bearing table 5 is driven to move along the X-axis direction, when the center of the wafer bearing table 5 moves to the center of the wafer, at this time, the motor lifting rod 1 starts to contract, then the wafer is driven to descend to the wafer bearing table 5, second motor 9 begins to rotate this moment, drives wafer platform 5 and rotates, then drives the wafer and rotates, thereby first sensor 11 and second sensor 12 detect out the breach position on the wafer, rotate the breach position on the wafer to fixed position back second motor 9 stop work, vacuum pump 7 begins to work this moment and admits air between wafer and the wafer platform 5, thereby loosen the wafer, the arm is with wafer centre gripping to next step this moment, be favorable to the automatic centering alignment of wafer, greatly improved work efficiency.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A wafer automatic pre-alignment device comprises a motor lifting rod (1), a first slide rail (2), a fixing frame (3), a top column (4), a wafer bearing table (5), a first motor (6), a vacuum pump (7), a second slide rail (8), a second motor (9), a first fixing block (10), a first sensor (11), a second sensor (12), a nut block (13), a first fixing plate (14), a second fixing block (15), a base plate (16), a first sliding block (17), a third fixing block (18), a lead screw (19), a second fixing plate (20), a first supporting plate (21), a second sliding block (22), a stop block (23), a coupler (24), a cover plate (25), a second supporting plate (26), a bottom plate (27), a shell (28), a first through hole (29), a second through hole (30), a fourth fixing block (31), a supporting arm (32), Fixed mouthful (33), induction port (34), first recess (35), second recess (36) and fifth fixed block (37), its characterized in that: the bottom plate (27) top one side is close to the side position and is welded with the bottom of the second support plate (26), the bottom of one side of the second support plate (26) is fixedly connected with the bottom of the first motor (6), the output end of the first motor (6) is fixedly connected with one end of the coupler (24), the other end of the coupler (24) is fixedly connected with one end of the screw rod (19), one side of the center of the screw rod (19) penetrates through the center of the first fixed block (10), the first fixed block (10) is rotatably connected with one end of the center of the screw rod (19) through a bearing, the bottom of the first fixed block (10) is fixedly connected with one side of the top of the second slide rail (8), the bottom of the second slide rail (8) is welded with the top of the bottom plate (27), the middle part of the screw rod (19) is sleeved with the nut block (13), the other end of the screw rod (19) is sleeved with the center of the third fixed block (18), the bottom of the nut block (13) is fixedly connected with the top of the first sliding block (17), the first sliding block (17) is positioned above the second sliding rail (8), the top of the nut block (13) is fixedly connected with the bottom of the backing plate (16) through a bolt, two sides of the top of the backing plate (16) are welded with the bottom of the second fixing block (15), the top of the second fixing block (15) is fixedly connected with the bottom of the first fixing plate (14) through a bolt, the top of the first fixing plate (14) is fixedly connected with the bottom of the second motor (9) through a bolt, the output end of the second motor (9) is fixedly connected with the bottom of the bearing table (5), a plurality of air suction ports (34) are formed in the center of the top of the bearing table (5), one side of each air suction port (34) is provided with a fixing port (33), the top of the bottom plate (27) is positioned on one side adjacent to the second supporting plate (26) and fixedly connected, second fixed plate (20) top one side and first backup pad (21) bottom welding, first backup pad (21) one side and first slide rail (2) one side fixed connection, first backup pad (21) one side top and dog (23) one side fixed connection, second fixed plate (20) top center and motor lifter (1) bottom welding, motor lifter (1) output and second slider (22) bottom fixed connection, second slider (22) one side and first slide rail (2) opposite side laminating, bolt fixed connection is passed through with mount (3) bottom in first slide rail (2) top, mount (3) top and fore-set (4) bottom fixed connection, bottom plate (27) top is located the relative one side of first backup pad (21) and vacuum pump (7) bottom fixed connection.
2. The automatic wafer pre-alignment apparatus as claimed in claim 1, wherein: the sensor is characterized in that a plurality of first grooves (35) are respectively formed in four side positions of the bottom plate (27), one side of each first groove (35) is attached to one side of the bottom of the shell (28), the bottom of the shell (28) is fixedly connected with the bottom plate (27) through bolts, one side of the top of the shell (28) is fixedly welded with the bottom of the supporting arm (32), a second groove (36) is formed in the center of the top of the supporting arm (32), one side of the bottom of the second groove (36) is fixedly connected with the bottom of the fourth fixing block (31) through bolts, the bottom of the fourth fixing block (31) is fixedly connected with the top of the second sensor (12), the center of the bottom of the second groove (36) is fixedly connected with the bottom of the fifth fixing block (37), the bottom of the fifth fixing block (37) is fixedly connected with the top of the first sensor (11), and the top of the supporting arm (32), a second through hole (30) is formed in one side of the center of the top of the shell (28), and a first through hole (29) is formed in one side of the second through hole (30).
3. The automatic wafer pre-alignment apparatus as claimed in claim 1, wherein: the center of the top column (4) and the center of the first through hole (29) are on the same straight line, the output shaft of the second motor (9) penetrates through the second through hole (30), and the bottom of the wafer bearing table (5) is located 5-10cm above the top of the shell (28).
4. The automatic wafer pre-alignment apparatus as claimed in claim 1, wherein: the fixed port (33) and the suction port (34) are both connected with the vacuum pump (7) through pipelines.
5. The automatic wafer pre-alignment apparatus as claimed in claim 1, wherein: lubricating oil is coated on the joint of the first sliding rail (2) and the second sliding block (22), the joint of the second sliding rail (8) and the first sliding block (17), the joint of the screw rod (19) and the nut block (13), the rotary joint of the screw rod (19) and the first fixed block (10) and the rotary joint of the screw rod (19) and the third fixed block (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021907916.2U CN213042899U (en) | 2020-09-04 | 2020-09-04 | Automatic wafer pre-alignment device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021907916.2U CN213042899U (en) | 2020-09-04 | 2020-09-04 | Automatic wafer pre-alignment device |
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| CN213042899U true CN213042899U (en) | 2021-04-23 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115831846A (en) * | 2023-02-15 | 2023-03-21 | 河北博特半导体设备科技有限公司 | Wafer pre-alignment device |
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2020
- 2020-09-04 CN CN202021907916.2U patent/CN213042899U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115831846A (en) * | 2023-02-15 | 2023-03-21 | 河北博特半导体设备科技有限公司 | Wafer pre-alignment device |
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