CN212991083U

CN212991083U - IGBT module

Info

Publication number: CN212991083U
Application number: CN202021425849.0U
Authority: CN
Inventors: 刘惠銮
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-17
Filing date: 2020-07-17
Publication date: 2021-04-16
Anticipated expiration: 2030-07-17

Abstract

The utility model provides an IGBT module, which comprises a base, a shell fixed on the base, an IGBT chip arranged on the base and positioned in a cavity between the base and the shell, a telescopic heat-conducting pipe fitting and a heat-radiating device; the telescopic heat-conducting pipe fitting is sleeved on the shell; the telescopic heat-conducting pipe fitting comprises a first pipe body, a second pipe body, a first telescopic pipe, a second telescopic pipe and an elastic connecting piece; the first pipe body and the second pipe body are in contact with the shell; the first telescopic port is communicated with the first port, the second telescopic port is communicated with the third port, and the first telescopic pipe is connected to the first pipe body and the second pipe body simultaneously; the second telescopic port is provided with a third telescopic port and a fourth telescopic port; the third telescopic port is communicated with the second port, the second telescopic port is communicated with the fourth port, and the second telescopic pipe is simultaneously connected to the first pipe body and the second pipe body; the elastic connecting piece is connected between the first pipe body and the second pipe body, and the purpose of radiating the IGBT module is achieved.

Description

IGBT module

Technical Field

The utility model belongs to the technical field of the power module, more specifically say, relate to an IGBT module.

Background

With the development of electronic technology, power modules are widely applied to various electronic products, especially IGBT modules, which are widely applied to various fields such as controllers with switching power supplies and electric vehicle controllers. An IGBT (Insulated Gate Bipolar Transistor) is a composite power electronic device, and structurally corresponds to a BJT (Bipolar Junction Transistor) having a thick base region driven by a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), and the IGBT has the characteristics of fast response, high input impedance, good thermal stability and simple driving circuit of the MOSFET, and also has the characteristics of high current density, reduced on-state voltage and high withstand voltage of the BJT, and is widely used in power electronic devices.

The existing IGBT module comprises a shell, a base fixed in the shell and an electronic component which is arranged on the top surface of the base and comprises an IGBT chip, wherein the top surface of the base is provided with a plurality of groups of positive electrodes corresponding to the IGBT chip and negative electrodes corresponding to the positive electrodes. The edge of base is provided with a plurality of mounting hole and passes the mounting hole and be used for being fixed in the mounting in the casing with the base, and the top surface of base still is provided with a plurality of recess, and every recess is located between a mounting hole and electronic components. The top surface of the base is provided with a plurality of insulating isolation layers, and each isolation layer is positioned between the positive electrode and the negative electrode of the IGBT chip on the base.

However, in the current IGBT module, a large amount of heat is easily generated during power-on use, and the performance of the IGBT module itself is affected.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the IGBT module is provided aiming at the technical problem that the performance of the IGBT module is influenced by a large amount of heat easily generated in the power-on use process of the existing IGBT module.

In order to achieve the above object, the utility model adopts the following technical scheme: the IGBT module comprises a base, a shell fixed on the base, an IGBT chip, a telescopic heat conduction pipe fitting and a heat dissipation device, wherein the IGBT chip is arranged in a cavity formed between the base and the shell;

the telescopic heat-conducting pipe fitting comprises a first pipe body, a second pipe body, a first telescopic pipe, a second telescopic pipe and an elastic connecting piece;

the first tube and the second tube are in contact with the housing;

the first tube has a first port and a second port;

the second tube has a third port and a fourth port;

the first telescopic pipe is provided with a first telescopic port and a second telescopic port;

the first telescopic port is communicated with the first port, the second telescopic port is communicated with the third port, and the first telescopic pipe is connected to the first pipe body and the second pipe body simultaneously;

the second telescopic port is provided with a third telescopic port and a fourth telescopic port;

the third telescopic port is communicated with the second port, the second telescopic port is communicated with the fourth port, and the second telescopic pipe is connected to the first pipe body and the second pipe body simultaneously;

the elastic connecting piece is connected between the first pipe body and the second pipe body and is used for providing elastic force for the first pipe body and the second pipe body to approach each other;

the heat dissipation device is connected with at least one of the first pipe body and the second pipe body, and the first telescopic pipe, the second telescopic pipe and the elastic connecting piece are arranged on the heat dissipation device.

Further, the elastic connecting piece comprises a first elastic piece, one end of the first elastic piece is connected to the first pipe body, the other end of the first elastic piece is connected to the second pipe body, and the first elastic piece is located in the first telescopic pipe.

Further, the elastic connecting piece comprises a second elastic piece, one end of the second elastic piece is connected to the first pipe body, the other end of the second elastic piece is connected to the second pipe body, and the second elastic piece is located in the second telescopic pipe.

Further, be equipped with the ring channel on the casing, the ring channel along the circumference setting of casing works as flexible heat conduction pipe fitting cover is established when on the casing, first body with second body joint in the ring channel.

Furthermore, the IGBT module further comprises a positioning block, the positioning block is fixed on each of the first tube body and the second tube body, and when the telescopic heat-conducting tube is sleeved on the shell, the positioning block is clamped on the shell.

Further, the positioning block is a heat conduction block, and the heat conduction block penetrates through the shell.

Furthermore, a heat conducting medium layer is arranged between the heat conducting block and the IGBT chip.

Further, the heat dissipation device comprises a heat dissipation fan and an air inlet pipe, an air inlet is formed in the first pipe, an air outlet is formed in the second pipe, and the air outlet side of the heat dissipation fan is connected to the air inlet of the first pipe through the air inlet pipe.

Further, heat abstractor includes water cooling plant, inlet tube and outlet pipe, be equipped with the water inlet on the first body, be equipped with the delivery port on the second body, water cooling plant's play water end passes through advance water piping connection in the water inlet of heat pipe, water cooling plant's the end of intaking passes through go out water piping connection in the delivery port of heat pipe.

Further, the first pipe body and the second pipe body are provided as a U-shaped pipe.

The utility model provides a pair of IGBT module's beneficial effect lies in: compared with the prior art, when the telescopic heat-conducting pipe fitting is required to be sleeved on the shell, a user pulls the first pipe body and the second pipe body simultaneously, so that the first pipe body and the second pipe body overcome the elasticity of the elastic connecting piece and are far away from each other, then the shell is placed between the first pipe body and the second pipe body, then the first pipe body and the second pipe body are loosened, the first pipe body and the second pipe body are close to each other under the acting force of the elastic connecting piece and are in contact with the shell, and the telescopic heat-conducting pipe is not easy to detach from the shell. When the telescopic heat conduction pipe fitting is sleeved on the shell and the IGBT chip works, a user opens the heat dissipation device, the heat dissipation device cools the telescopic heat conduction pipe, the heat on the shell is conducted to the external environment of the IGBT module through the cooled telescopic heat conduction pipe, and then the heat in the cavity is quickly diffused out of the shell. The first pipe body and the second pipe body are communicated through the first telescopic pipe and the second telescopic pipe, the cooling efficiency of the heat dissipation device on the telescopic heat conduction pipe fitting is improved, and the first pipe body and the second pipe body can be close to or far away from each other.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of an IGBT module according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken at A-A of FIG. 1;

fig. 3 is a schematic view of a partial structure of an IGBT module according to an embodiment of the present invention;

FIG. 4 is a cross-sectional view taken at B-B of FIG. 1;

fig. 5 is a schematic structural diagram ii of an IGBT module according to an embodiment of the present invention;

fig. 6 is a cross-sectional view at C-C in fig. 5.

Wherein, in the figures, the respective reference numerals:

1. a base; 2. a housing; 21. an annular groove; 3. a cavity; 4. an IGBT chip; 5. a telescopic heat-conducting pipe fitting; 51. a first pipe body; 511. a first port; 512. a second port; 513. an air inlet; 52. a second tube body; 521. a third port; 522. a fourth port; 523. an air outlet; 53. a first telescopic tube; 531. a first telescoping port; 532. a second telescoping port; 54. a second telescopic tube; 541. a third telescoping port; 542. a fourth telescoping port; 55. an elastic connecting member; 551. a first elastic member; 552. a second elastic member; 6. a heat sink; 61. a heat radiation fan; 62. an air inlet pipe; 63. a water cooling device; 64. a water inlet pipe; 65. a water outlet pipe; 7. positioning blocks; 8. a heat-conducting medium layer; 9. a guide member.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to fig. 4, an IGBT module according to the present invention will now be described. An IGBT module comprises a base 1, a shell 2 fixed on the base 1, an IGBT chip 4, a telescopic heat-conducting pipe 5 and a heat-radiating device 6, wherein the IGBT chip 4 is arranged in a cavity 3 formed between the base 1 and the shell 2;

the telescopic heat-conducting pipe 5 comprises a first pipe body 51, a second pipe body 52, a first telescopic pipe 53, a second telescopic pipe 54 and an elastic connecting piece 55;

the first tube 51 and the second tube 52 are in contact with the housing 2;

the first tube 51 has a first port 511 and a second port 512;

the second tube 52 has a third port 521 and a fourth port 522;

the first telescopic tube 53 has a first telescopic port 531 and a second telescopic port 532;

the first telescopic port 531 is communicated with the first port 511, the second telescopic port 532 is communicated with the third port 521, and the first telescopic pipe 53 is connected to the first pipe body 51 and the second pipe body 52 at the same time;

the second telescoping port 532 has a third telescoping port 541 and a fourth telescoping port 542;

the third telescopic port 541 is communicated with the second port 512, the second telescopic port 532 is communicated with the fourth port 522, and the second telescopic pipe 54 is connected to the first pipe body 51 and the second pipe body 52 at the same time;

an elastic connector 55 is connected between the first tube 51 and the second tube 52, the elastic connector 55 being used for providing an elastic force for the first tube 51 and the second tube 52 to approach each other;

the heat sink 6 is connected to at least one of the first tube 51 and the second tube 52, the first extension tube 53, the second extension tube 54, and the elastic connection member 55.

The utility model provides a pair of IGBT module, compared with the prior art, need establish flexible heat conduction pipe fitting 5 cover on casing 2, the user stimulates first body 51 and second body 52 simultaneously, the elasticity that makes first body 51 and second body 52 overcome elastic connection spare 55 keeps away from each other, then casing 2 is placed between first body 51 and second body 52, loosen first body 51 and second body 52 after that, first body 51 and second body 52 are close to each other and contact with casing 2 under elastic connection spare 55's effort, flexible heat pipe is difficult for dismantling from casing 2. When the 5 covers of flexible heat conduction pipe fitting establish on casing 2 and IGBT chip 4 at the during operation, the user opens heat abstractor 6, and heat abstractor 6 cools down flexible heat pipe, and the flexible heat pipe of cooling conducts the external environment of IGBT module with the heat on casing 2 in, and then the heat in the cavity 3 diffuses outside casing 2 fast. The first extension tube 53 and the second extension tube 54 ensure that the first tube 51 and the second tube 52 are communicated, so as to improve the cooling efficiency of the heat sink 6 on the telescopic heat-conducting pipe 5, and ensure that the first tube 51 and the second tube 52 can be close to or far away from each other.

Specifically, the heat sink 6 avoids the housing 2.

Further, referring to fig. 1 and fig. 2 together, as an embodiment of the present invention, the elastic connecting member 55 includes a first elastic member 551, one end of the first elastic member 551 is connected to the first tube 51, the other end is connected to the second tube 52, and the first elastic member 551 is located in the first telescopic tube 53.

The first elastic member 551 is disposed inside the first extension tube 53, so that the first elastic member 551 does not contact the housing 2, and at the same time, the first elastic member 551 is protected.

Specifically, the first elastic member 551 is configured as a tension spring or a bending plate.

Further, referring to fig. 1 and fig. 3, as a specific embodiment of the present invention, the elastic connecting member 55 includes a second elastic member 552, one end of the second elastic member 552 is connected to the first tube 51, the other end is connected to the second tube 52, and the second elastic member 552 is located in the second extension tube 54.

The second elastic member 552 is disposed inside the second telescopic tube 54 such that the second elastic member 552 does not contact the housing 2 while functioning to protect the second elastic member 552.

Specifically, the second elastic member 552 is provided as a tension spring or a bending plate.

Further, refer to fig. 1 and 4, as the utility model provides a pair of a concrete implementation of IGBT module is equipped with ring channel 21 on casing 2, ring channel 21 sets up along casing 2's circumference, and when the cover was established on casing 2 as flexible heat conduction pipe fitting 5 cover, first body 51 and second body 52 joint were in ring channel 21.

When the telescopic heat-conducting pipe 5 is sleeved on the housing 2, the first pipe 51 and the second pipe 52 are not easily separated from the annular groove 21, so that the stability of sleeving the telescopic heat-conducting pipe 5 is improved.

Further, please refer to fig. 1 and fig. 4, as the utility model provides a specific implementation of an IGBT module, the IGBT module still includes locating piece 7, all is fixed with locating piece 7 on first body 51 and the second body 52, when the 5 covers of flexible heat conduction pipe fittings cover is established on casing 2, locating piece 7 joint is on casing 2.

The locating block 7 is connected to the casing 2 in a clamped mode, the locating block 7 is not prone to being separated from the casing 2, therefore, the first pipe body 51 and the second pipe body 52 are not prone to being separated from the casing 2, and the stability of the telescopic heat conduction pipe fitting 5 in a sleeved mode is improved.

Further, please refer to fig. 1 and fig. 4, as a specific embodiment of the present invention, the positioning block 7 is a heat conducting block, and the heat conducting block is disposed through the housing 2.

The heat conduction piece improves the radiating speed of IGBT module on transmitting the heat in casing 2 to flexible heat conduction pipe fitting 5 fast.

Specifically, the heat conduction block is set to be a metal block.

Further, please refer to fig. 1 and fig. 4, as a specific embodiment of the IGBT module provided by the present invention, a heat conducting medium layer 8 is disposed between the heat conducting block and the IGBT chip 4.

The heat conducting medium layer 8 can transfer the heat of the IGBT chip 4 to the heat conducting block, and the IGBT chip 4 is cooled rapidly.

Specifically, the heat transfer medium is coated on the surface of the IGBT chip 4.

Further, please refer to fig. 1 and fig. 4, as a specific embodiment of the present invention, the heat dissipation device 6 includes a heat dissipation fan 61 and an air inlet pipe 62, the first pipe 51 is provided with an air inlet 513, the second pipe 52 is provided with an air outlet 523, and an air outlet side of the heat dissipation fan 61 is connected to the air inlet 513 of the first pipe 51 through the air inlet pipe 62.

The cooling fan 61 blows cold air flow into the telescopic heat conduction pipe fitting 5 through the air inlet pipe 62 and the air inlet 513, and the cold air flow absorbs heat in the telescopic heat conduction pipe fitting 5 and on the telescopic heat conduction pipe fitting 5 and then is discharged through the air outlet 523, so that the temperature in the telescopic heat conduction pipe fitting 5 and on the telescopic heat conduction pipe fitting 5 is reduced.

Further, please refer to fig. 5 and fig. 6, as a specific embodiment of the present invention, the heat dissipation device 6 includes a water cooling device 63, a water inlet pipe 64 and a water outlet pipe 65, a water inlet is disposed on the first pipe 51, a water outlet is disposed on the second pipe 52, a water outlet end of the water cooling device 63 is connected to the water inlet of the heat conduction pipe through the water inlet pipe 64, and a water inlet end of the water cooling device 63 is connected to the water outlet of the heat conduction pipe through the water outlet pipe 65.

The water cooling device 63 leads cooling liquid into the telescopic heat conduction pipe fitting 5 through the water inlet pipe 64 and the water inlet, the cooling liquid absorbs heat in the telescopic heat conduction pipe fitting 5 and on the telescopic heat conduction pipe fitting 5 and then flows back to the water inlet end of the water cooling device 63 through the water outlet and the water outlet pipe 65, and the IGBT module not only plays a role in heat dissipation, but also plays a role in recycling the cooling liquid.

Further, please refer to fig. 1 and fig. 5, as a specific embodiment of the present invention, the first pipe 51 and the second pipe 52 are U-shaped pipes, the first telescopic pipe 53, the second telescopic pipe 54, the elastic connecting member 55 and the U-shaped pipe form a telescopic heat conducting pipe 5, so as to improve the convenience of assembling the telescopic heat conducting pipe 5, and the inner side of the U-shaped pipe contacts with the housing 2, so as to improve the contact area with the housing 2.

Further, please refer to fig. 1 to fig. 3, as the utility model provides a pair of a specific implementation of IGBT module, IGBT module still includes guide 9, the one end of guide 9 is fixed on first body 51, other end sliding connection is on second body 52, guide 9 is sharp on second body 52 and slides, guide 9 avoids casing 2, when first body 51 is kept away from or is close to second body 52, first body 51 can drive guide 9 and slide on second body 52, guide 9 guarantees that first body 51 is sharp movable, play the effect of direction, improve the stability of flexible heat conduction pipe fitting 5 use.

Specifically, the first pipe body 51 and the second pipe body 52 are provided as metal pipes, which have a good heat conduction function.

Specifically, the guide 9 is located inside the telescopic heat-conducting tube 5.

The housing 2 is preferably provided as a metal body. The metal body has a good heat conduction effect, and can quickly transfer heat in the shell 2 to the outside of the shell 2. The metal body has a good magnetic shielding effect, so that the IGBT chip 4 is not easy to be influenced by magnetic components, and the normal work of the IGBT chip 4 is ensured. The base 1 is a metal base. The metal base has better heat conduction effect and can quickly transfer heat in the shell 2 to the outside of the shell 2. The metal base has a good magnetic shielding effect, so that the IGBT chip 4 is not easy to be influenced by magnetic components, and the normal work of the IGBT chip 4 is ensured.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. An IGBT module comprises a base, a shell fixed on the base and an IGBT chip, wherein the IGBT chip is arranged in a cavity formed between the base and the shell;

the first tube and the second tube are in contact with the housing;

the first tube has a first port and a second port;

the second tube has a third port and a fourth port;

2. The IGBT module according to claim 1, wherein the resilient connecting member comprises a first resilient member having one end connected to the first tube and the other end connected to the second tube, the first resilient member being located within the first bellows.

3. The IGBT module according to claim 2, wherein the resilient connecting member comprises a second resilient member, one end of the second resilient member being connected to the first tube and the other end being connected to the second tube, the second resilient member being located within the second bellows.

4. The IGBT module according to claim 1, wherein an annular groove is formed in the housing, the annular groove is formed along a circumferential direction of the housing, and when the telescopic heat-conducting pipe is fitted over the housing, the first pipe and the second pipe are engaged with the annular groove.

5. The IGBT module according to claim 1, further comprising a positioning block, wherein the positioning block is fixed to each of the first tube and the second tube, and when the telescopic heat-conducting tube is fitted over the housing, the positioning block is engaged with the housing.

6. The IGBT module of claim 5, wherein the positioning block is a heat-conducting block, and the heat-conducting block is disposed through the housing.

7. The IGBT module of claim 6, wherein a layer of heat-conducting medium is disposed between the heat-conducting block and the IGBT chip.

8. The IGBT module according to claim 1, wherein the heat dissipation device comprises a heat dissipation fan and an air inlet pipe, the first pipe has an air inlet, the second pipe has an air outlet, and an air outlet side of the heat dissipation fan is connected to the air inlet of the first pipe through the air inlet pipe.

9. The IGBT module according to claim 1, wherein the heat dissipation device comprises a water cooling device, an inlet pipe and an outlet pipe, the first pipe has a water inlet, the second pipe has a water outlet, the water outlet of the water cooling device is connected to the water inlet of the heat pipe through the inlet pipe, and the water inlet of the water cooling device is connected to the water outlet of the heat pipe through the outlet pipe.

10. The IGBT module according to any one of claims 1 to 9, wherein the first pipe body and the second pipe body are provided as a U-shaped pipe.