CN212976458U - Positioning die frame of stamping die - Google Patents
Positioning die frame of stamping die Download PDFInfo
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- CN212976458U CN212976458U CN202021353715.2U CN202021353715U CN212976458U CN 212976458 U CN212976458 U CN 212976458U CN 202021353715 U CN202021353715 U CN 202021353715U CN 212976458 U CN212976458 U CN 212976458U
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Abstract
The utility model provides a stamping die's positioning die frame, including the upper plate, the infrabasal plate, the guide pillar, the guide pin bushing, locating pin and mode locking hole, through at current upper plate, the infrabasal plate, the guide pillar, the guide pin bushing increases locating pin and mode locking hole, can use the accurate location of realization to the mould through locating pin and guide pillar, the cooperation of guide pin bushing on the one hand, and on the other hand uses the realization through the cooperation of locating pin and mode locking hole to fix the mould, prevents that the skew from appearing at the in-process mould of punching press to improve the punching press accuracy.
Description
Technical Field
The utility model relates to a stamping die fixes a position technical field, especially relates to a stamping die's positioning die frame.
Background
In the production process of the stamping die, the positioning frame of the die is generally matched and customized with a stamping machine tool. The existing stamping die generally comprises an upper plate, a lower plate, a guide sleeve fixedly arranged on the upper plate and a guide pillar fixedly arranged on the lower plate.
In the process of production, although stamping die's location can be carried out to current locating rack, the precision of location is very low, simultaneously because the stamping force of different materials is different, in the current locating rack use, the skew appears easily in the mould, leads to the mould precision of punching press to descend, influences production efficiency.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a stamping die's positioning die frame to solve the problem that current locating rack location precision is low and the skew of punching press locating rack.
Based on the above purpose, the utility model provides a stamping die's positioning die frame, include:
an upper plate which can move up and down;
the lower base plate is opposite to the upper plate and fixedly arranged on the machine table;
at least one guide post fixedly arranged on the lower substrate;
at least one guide sleeve is fixedly arranged on the upper plate and is movably connected with the guide pillar;
the positioning pin comprises a pin head and a pin column, one end of the pin column is fixedly connected with the lower substrate, the other end of the pin column is connected with the pin head, and a buckle groove is formed in the outer surface of the pin column;
and the die locking holes are uniformly distributed on the surface of the lower substrate, and the inner surface of each die locking hole is in a threaded shape.
Optionally, the mold locking holes are at least one group, and each group includes at least three lock holes.
Optionally, the locking holes are arranged in a straight line, a circle, a rectangle or a triangle.
Optionally, the mold locking holes are arranged in a circular, rectangular or triangular shape.
Optionally, the pin head and the pin column are integrally formed or are in threaded connection.
Optionally, the pin head is conical.
Optionally, a sliding plate is installed at a position where the positioning pin is fixedly connected with the lower substrate, the sliding plate is embedded in the lower substrate, and the sliding plate is connected with the lower substrate in a sliding manner.
From the above, can see out, the utility model provides a pair of stamping die's positioning die frame, including upper plate, infrabasal plate, guide pillar, guide pin bushing, locating pin and mode locking hole, through at current upper plate, infrabasal plate, guide pillar, guide pin bushing increase locating pin and mode locking hole, can use the accurate location of realization to the mould through the cooperation of locating pin and guide pillar, guide pin bushing on the one hand, on the other hand uses the realization through the cooperation in locating pin and mode locking hole to the fixed of mould, prevents that the skew from appearing in the in-process mould of punching press to improve the punching press accuracy.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of a positioning die carrier in an embodiment of the present invention;
FIG. 2 is a schematic view of an upper plate according to an embodiment of the present invention;
fig. 3 is a top view of a substrate according to an embodiment of the present invention;
fig. 4 is an installation schematic diagram of the positioning die carrier of the embodiment of the present invention;
fig. 5 is a schematic view of a pin head of a positioning pin according to an embodiment of the present invention.
1-upper plate, 2-lower plate, 11-guide sleeve, 12, 22-locking hole, 21-guide column, 23-positioning pin, 24-sliding plate, 231-pin head, 232-pin column and 233-clamping groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings.
It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present invention should have the ordinary meaning as understood by those having ordinary skill in the art to which the present disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
In order to solve the prior technical problem, the utility model relates to a stamping die's positioning die frame, include:
an upper plate which can move up and down;
the lower base plate is opposite to the upper plate and fixedly arranged on the machine table;
at least one guide post fixedly arranged on the lower substrate;
at least one guide sleeve is fixedly arranged on the upper plate and is movably connected with the guide pillar;
the positioning pin comprises a pin head and a pin column, one end of the pin column is fixedly connected with the lower substrate, the other end of the pin column is connected with the pin head, and a buckle groove is formed in the outer surface of the pin column;
and the die locking holes are uniformly distributed on the surface of the lower substrate, and the inner surface of each die locking hole is in a threaded shape.
Through increasing locating pin and mode locking hole at current upper plate, infrabasal plate, guide pillar, guide pin bushing, can use the accurate location of realization to the mould through the cooperation of locating pin and guide pillar, guide pin bushing on the one hand, on the other hand uses the realization to the fixed of mould through the cooperation of locating pin and mode locking hole, prevents that the skew from appearing at the in-process mould of punching press to improve the punching press accuracy.
Specifically, for example, the utility model relates to a stamping die's positioning die frame, as shown in fig. 1 ~ 5, include: the upper plate 1 can move up and down to stamp the die; fixed mounting has 4 guide pin bushings 11 on 4 angles of upper plate 1, the mode locking hole 12 that arranges according to different shapes in the surface distribution of upper plate 1 simultaneously, mode locking hole 12 is arranged in groups, each group has 3 lockholes, arrange between the lockhole can be the straight line, it is circular, rectangle or triangle-shaped are arranged, 3 lockholes are the straight line in the picture and arrange, the shape that the multiunit lockhole was arranged is the shape of mode locking hole 12 promptly, be circular, rectangle or triangle-shaped are arranged, be the rectangle in the picture, the benefit of arranging like this, be favorable to the fixed of positioning die carrier and the fixed of mould.
Corresponding to the upper plate 1, a lower substrate 2 is arranged at the lower side of the upper plate 1, and the lower substrate 2 is fixedly arranged on the machine platform; the four corners of the lower base plate 2 are fixedly provided with 4 guide posts 21 at positions corresponding to the upper plate 1, the guide sleeves 11 are movably connected with the guide posts 21 along with the up-and-down movement of the upper plate 1 to position the mold frame, corresponding mold locking holes 22 are also arranged at positions corresponding to the mold locking holes 12 of the upper plate 1 on the lower base plate 2, and the distribution and arrangement shapes of the mold locking holes 22 on the lower base plate 2 are the same as those on the upper plate 1. Meanwhile, for the convenience of installation, the inner surfaces of the clamping holes 12 and 22 are threaded.
For the accuracy of increase location and fixed fastness, central point at lower base plate 2 puts and is fixed with 2 locating pins 23, and locating pin 23 includes round pin head 231 and round pin post 232, and round pin post 232 one end and 2 fixed connection of infrabasal plates, the other end are connected with round pin head 231, and simultaneously for the fastening of bolt, the outer surface of round pin post 232 is equipped with buckle recess 233, at the in-process of installation mould, matches the location with the pinhole of locating pin 23 and mould bottom and fixes a position. The pin head 231 and the pin 232 are integrally formed or screwed, and the pin head 231 is conical.
In order to improve the mobility of the positioning pin 23 and increase the adaptability to different specifications of dies, a sliding plate 24 is installed at the position where the positioning pin 23 is fixedly connected with the lower substrate 2, the sliding plate 24 is embedded in the lower substrate 2, and the sliding plate 24 is connected with the lower substrate 2 through a slide way. The distance between the two positioning pins 23 is changed through sliding, so that the device is matched with dies of different specifications for use, and the application universality is improved.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the invention, also technical features in the above embodiments or in different embodiments can be combined, steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity.
The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (7)
1. The utility model provides a stamping die's location die carrier which characterized in that includes:
an upper plate which can move up and down;
the lower base plate is opposite to the upper plate and fixedly arranged on the machine table;
at least one guide post fixedly arranged on the lower substrate;
at least one guide sleeve is fixedly arranged on the upper plate and is movably connected with the guide pillar;
the positioning pin comprises a pin head and a pin column, one end of the pin column is fixedly connected with the lower substrate, the other end of the pin column is connected with the pin head, and a buckle groove is formed in the outer surface of the pin column;
and the die locking holes are uniformly distributed on the surface of the lower substrate, and the inner surface of each die locking hole is in a threaded shape.
2. The positioning die carrier of the stamping die as claimed in claim 1, wherein the die locking holes are at least one group, and each group comprises at least three lock holes.
3. The positioning die carrier of the stamping die as recited in claim 2, wherein the locking holes are arranged in a straight line, a circle, a rectangle or a triangle.
4. The positioning die carrier of the stamping die as recited in claim 1, wherein the die locking holes are arranged in a circle, a rectangle or a triangle.
5. The positioning die carrier of the stamping die as recited in claim 1, wherein the pin head and the pin column are integrally formed or screwed.
6. The positioning die carrier of a stamping die as recited in claim 1, wherein the pin head is conical.
7. The positioning die carrier of the stamping die as claimed in claim 1, wherein a sliding plate is installed at a position where the positioning pin is fixedly connected with the lower substrate, the sliding plate is embedded in the lower substrate, and the sliding plate is connected with the lower substrate by sliding.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021353715.2U CN212976458U (en) | 2020-07-11 | 2020-07-11 | Positioning die frame of stamping die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021353715.2U CN212976458U (en) | 2020-07-11 | 2020-07-11 | Positioning die frame of stamping die |
Publications (1)
Publication Number | Publication Date |
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CN212976458U true CN212976458U (en) | 2021-04-16 |
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CN202021353715.2U Active CN212976458U (en) | 2020-07-11 | 2020-07-11 | Positioning die frame of stamping die |
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CN (1) | CN212976458U (en) |
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2020
- 2020-07-11 CN CN202021353715.2U patent/CN212976458U/en active Active
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