CN212932482U

CN212932482U - Novel contact structure of oxygen sensor ceramic chip

Info

Publication number: CN212932482U
Application number: CN202022335812.5U
Authority: CN
Inventors: 蔡丰勇
Original assignee: Zhejiang Baian Technology Co ltd
Current assignee: Zhejiang Baian Technology Co ltd
Priority date: 2020-10-20
Filing date: 2020-10-20
Publication date: 2021-04-09
Anticipated expiration: 2030-10-20

Abstract

The utility model discloses a novel contact structure of oxygen sensor ceramic chip, including ceramic chip, the ceramic chip lower extreme is provided with first ceramic clamp, and first ceramic clamp lower extreme is provided with second ceramic clamp, and second ceramic clamp lower extreme is provided with third ceramic clamp, and the vertical chip jack that is provided with in first ceramic clamp middle part, the embedded probe that is provided with of chip jack, the integrative bow-type kink that is provided with of probe upper end, bow-type kink towards ceramic chip direction an organic whole are provided with the contact bump; a vertical through hole is vertically arranged in the second ceramic clamp, and a plurality of first probe through holes are arranged in the third ceramic clamp; the integrative bow-shaped portion of bending that is provided with of probe lower extreme when ceramic chip lower extreme inserts the position between the contact bump on two bow-type kinks of relative setting for ceramic chip lower extreme is cliied to the contact bump of probe upper end. Above-mentioned technical scheme, structural design is reasonable, the assembly is simple, convenient to use, connection are reliable and the practicality is good.

Description

Novel contact structure of oxygen sensor ceramic chip

Technical Field

The utility model relates to an oxygen sensor ceramic chip technical field, concretely relates to novel contact structure of oxygen sensor ceramic chip.

Background

Because the temperature of the heating part of the chip is very high when the oxygen sensor ceramic chip works, the traditional contact is that two separated ceramic pieces are respectively provided with the wire probe which is clamped on two sides of a contact disc of the ceramic chip, and the contact between the probe and the contact disc of the ceramic chip is realized by the fixation of a metal U-shaped clamp.

The conventional oxygen sensor ceramic chip contact structure is shown in fig. 1, and the structure has the following disadvantages: contact resistance between probe 01 and ceramic chip contact pad 04 depends on the power and the quality of metal U type clamp 02, and along with operating time extension, metal U type clamp 02 can be ageing, can let probe 01 and ceramic chip contact pad 04's contact resistance increase, influences product property ability: another disadvantage is that: receive structural limitation, the contact point of probe 01 is very little, leads to depending on the operating space of probe 01 deformation and ceramic chip contact dish 04's contact very limited, can not guarantee 5 points can be fine keep in contact simultaneously, still is subject to the self deformation of probe 01 and ceramic clamp 03, connects unreliable, and the practicality is poor.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a novel contact structure of oxygen sensor ceramic chip that structural design is reasonable, the assembly is simple, convenient to use, connection are reliable and the practicality is good.

In order to achieve the above purpose, the utility model provides a following technical scheme: a novel contact structure of an oxygen sensor ceramic chip comprises a ceramic chip, wherein a first ceramic clamp is arranged at the lower end of the ceramic chip, a second ceramic clamp is arranged at the lower end of the first ceramic clamp, a third ceramic clamp is arranged at the lower end of the second ceramic clamp, a chip jack is vertically arranged in the middle of the first ceramic clamp, a probe is embedded in the chip jack, an arch-shaped bent part is integrally arranged at the upper end of the probe, and a contact convex point is integrally arranged on the arch-shaped bent part towards the direction of the ceramic chip; a plurality of vertical through holes for fixing the positions of the probes are vertically arranged in the second ceramic clamp, and a plurality of first probe through holes are arranged in the third ceramic clamp; an arched bending part is integrally arranged at the lower end of the probe, penetrates through the aligned vertical through hole and then is inserted into the aligned first probe through hole; the contact salient points on the bow-shaped bending parts between the two oppositely arranged probes are oppositely arranged, and the distance between the contact salient points on the two oppositely arranged bow-shaped bending parts is less than the thickness of the ceramic chip; when the lower end of the ceramic chip is inserted into a position between the contact bumps on the two bow-shaped bending parts which are oppositely arranged, the bow-shaped bending part at the lower end of the probe is limited by the position of the first probe through hole, and only the bow-shaped bending part at the upper end of the probe is deformed and opened, so that the contact bumps at the upper end of the probe clamp the lower end of the ceramic chip.

The utility model discloses further set up to: first pottery clamp is cylindrical structure, and first pottery clamp is located chip jack both sides position and all is provided with a second probe through-hole, second probe through-hole is the rectangular hole.

The utility model discloses still further set up to: the second ceramic clamp is of a cylindrical structure, the vertical through hole is aligned to the second probe through hole, and the vertical through hole is a rectangular hole.

The utility model discloses still further set up to: the lower extreme an organic whole of second ceramic clamp is provided with a plurality of location lug, the up end of third ceramic clamp aligns every location lug position and all is provided with one and location lug assorted positioning groove.

The utility model discloses still further set up to: the third ceramic clamp is a cylindrical structure, and the vertical through hole setting is aimed at to first probe through-hole, first probe through-hole is the circular port.

The utility model has the advantages that: compared with the prior art, the structure of the utility model is more reasonable, the bow-shaped bending part is integrally arranged at the upper end of the probe, the contact salient points are integrally arranged at the bow-shaped bending part towards the ceramic chip, the distance between the contact salient points at the two oppositely arranged bow-shaped bending parts is less than the thickness of the ceramic chip, the contact force between the probe and the ceramic chip is increased, and the contact resistance is effectively reduced; because the deformation allowance of the bow-shaped bending part is larger, the deformation of a plurality of points at different degrees can ensure that a plurality of points can be in good contact at the same time; the assembling operation is simple, the original 6-7 assembling actions can be completed by one inserting action in the assembling of the ceramic chip, the assembling automation can be better realized, and the labor cost is greatly saved. The structure design is reasonable, the assembly is simple, the use is convenient, the connection is reliable, and the practicability is good.

The invention is further described with reference to the drawings and the specific embodiments.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

fig. 2 is a schematic structural diagram of an embodiment of the present invention;

fig. 3 is a schematic structural view of a first ceramic clip according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a second ceramic clip according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a third ceramic clip according to an embodiment of the present invention.

Detailed Description

In the description of the present embodiment, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", etc. appear, the indicated orientation or positional relationship thereof is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 2 to 5, the utility model discloses a novel contact structure of oxygen sensor ceramic chip, including ceramic chip 1, ceramic chip 1 lower extreme is provided with first ceramic clamp 2, first ceramic clamp 2 lower extreme is provided with second ceramic clamp 3, second ceramic clamp 3 lower extreme is provided with third ceramic clamp 4, vertical chip jack 21 that is provided with in the middle part of first ceramic clamp 2, embedded probe 5 that is provided with in chip jack 21, probe 5 upper end an organic whole is provided with bow-type kink 51, bow-type kink 51 is towards ceramic chip 1 direction an organic whole and is provided with contact bump 52; a plurality of vertical through holes 31 for fixing the positions of the probes 5 are vertically arranged in the second ceramic clamp 3, and a plurality of first probe through holes 41 are arranged in the third ceramic clamp 4; an arched bending part 53 is integrally arranged at the lower end of the probe 5, and the arched bending part 53 penetrates through the aligned vertical through hole 31 and then is inserted into the aligned first probe through hole 41; the contact salient points 52 on the bow-shaped bending parts 51 between the two oppositely arranged probes 5 are oppositely arranged, and the distance between the contact salient points 52 on the two oppositely arranged bow-shaped bending parts 51 is smaller than the thickness of the ceramic chip 1; when the lower end of the ceramic chip 1 is inserted into a position between the contact bumps 52 on the two oppositely arranged bow-shaped bending parts 51, the bow-shaped bending parts 53 at the lower end of the probe 5 are limited by the position of the first probe through hole 41, and only the bow-shaped bending parts 51 at the upper end of the probe 5 are deformed and opened, so that the contact bumps 52 at the upper end of the probe 5 clamp the lower end of the ceramic chip 1.

Preferably, a wire is further disposed in the first probe through hole 41, the wire is connected to the probe 5, the inner wall of the first probe through hole 41 faces the bow-shaped bending part 53 at the lower end of the probe 5 to limit, and the bow-shaped bending part 51 deforms to open, so that the contact bump 52 at the upper end of the probe 5 firmly clamps the lower end of the ceramic chip 1.

Preferably, the first ceramic clamp 2 is of a cylindrical structure, the positions of the first ceramic clamp 2, which are located on two sides of the chip jack 21, are both provided with a second probe through hole 22, and the second probe through hole 22 is a rectangular hole.

The second ceramic clamp 3 is a cylindrical structure, the vertical through hole 31 is aligned with the second probe through hole 22, and the vertical through hole 31 is a rectangular hole.

The lower end of the second ceramic clamp 3 is integrally provided with a plurality of positioning lugs 32, and the upper end face of the third ceramic clamp 4 is provided with a positioning groove 42 matched with each positioning lug in a position aligned with each positioning lug.

Third ceramic clamp 4 is cylindrical structure, and vertical through-hole 31 setting is aimed at to first probe through-hole 41, first probe through-hole 41 is the circular port.

In practical application, the upper end of the probe is integrally provided with the bow-shaped bending part, the bow-shaped bending part is integrally provided with the contact salient points towards the ceramic chip, the distance between the contact salient points on the two oppositely arranged bow-shaped bending parts is smaller than the thickness of the ceramic chip, the contact force between the probe and the ceramic chip is increased, and the contact resistance is effectively reduced; because the deformation allowance of the bow-shaped bending part is larger, the deformation of a plurality of points at different degrees can ensure that a plurality of points can be in good contact at the same time; the assembling operation is simple, the original 6-7 assembling actions can be completed by one inserting action in the assembling of the ceramic chip, the assembling automation can be better realized, and the labor cost is greatly saved. The structure design is reasonable, the assembly is simple, the use is convenient, the connection is reliable, and the practicability is good.

The above embodiments are only used for further explanation of the present invention, and it is not understood that the present invention is limited by the protection scope of the present invention, and the technical engineers in the field are right according to the above contents of the present invention.

Claims

1. The utility model provides a novel contact structure of oxygen sensor ceramic chip, includes ceramic chip (1), its characterized in that: the lower end of the ceramic chip (1) is provided with a first ceramic clamp (2), the lower end of the first ceramic clamp (2) is provided with a second ceramic clamp (3), the lower end of the second ceramic clamp (3) is provided with a third ceramic clamp (4), the middle of the first ceramic clamp (2) is vertically provided with a chip jack (21), a probe (5) is embedded in the chip jack (21), the upper end of the probe (5) is integrally provided with an arch-shaped bent part (51), and the arch-shaped bent part (51) is integrally provided with a contact convex point (52) towards the direction of the ceramic chip (1); a plurality of vertical through holes (31) used for fixing the positions of the probes (5) are vertically arranged in the second ceramic clamp (3), and a plurality of first probe through holes (41) are arranged in the third ceramic clamp (4); an arched bending part (53) is integrally arranged at the lower end of the probe (5), and the arched bending part (53) penetrates through the aligned vertical through hole (31) and then is inserted into the aligned first probe through hole (41); the contact salient points (52) on the bow-shaped bending parts (51) between the two oppositely arranged probes (5) are oppositely arranged, and the distance between the contact salient points (52) on the two oppositely arranged bow-shaped bending parts (51) is less than the thickness of the ceramic chip (1); when the lower end of the ceramic chip (1) is inserted into a position between the contact salient points (52) on the two oppositely-arranged bow-shaped bending parts (51), the bow-shaped bending part (53) at the lower end of the probe (5) is limited by the position of the first probe through hole (41), and only the bow-shaped bending part (51) at the upper end of the probe (5) deforms and opens, so that the contact salient points (52) at the upper end of the probe (5) clamp the lower end of the ceramic chip (1).

2. The novel contact structure of an oxygen sensor ceramic chip according to claim 1, wherein: first ceramic clamp (2) are cylindrical structure, and first ceramic clamp (2) are located chip jack (21) both sides position and all are provided with a second probe through-hole (22), the second probe through-hole is the rectangular hole.

3. The novel contact structure of an oxygen sensor ceramic chip according to claim 2, wherein: the second ceramic clamp (3) is of a cylindrical structure, the vertical through hole (31) is aligned to the second probe through hole (22), and the vertical through hole (31) is a rectangular hole.

4. The novel contact structure of an oxygen sensor ceramic chip according to claim 3, wherein: the lower extreme an organic whole of second ceramic clamp (3) is provided with a plurality of location lug (32), the up end of third ceramic clamp (4) is aimed at every location lug position and all is provided with one and location lug assorted positioning groove (42).

5. The novel contact structure of an oxygen sensor ceramic chip according to claim 4, wherein: third ceramic clamp (4) are cylindrical structure, and vertical through-hole (31) setting is aimed at in first probe through-hole (41), first probe through-hole (41) are the circular port.