CN212930299U - Miniature semiconductor air conditioner - Google Patents
Miniature semiconductor air conditioner Download PDFInfo
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- CN212930299U CN212930299U CN202021342504.9U CN202021342504U CN212930299U CN 212930299 U CN212930299 U CN 212930299U CN 202021342504 U CN202021342504 U CN 202021342504U CN 212930299 U CN212930299 U CN 212930299U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The application discloses miniature semiconductor air conditioner, including the radiator, set up in the module is heated in the refrigeration of radiator top, paste and locate cold-storage heat accumulator on the module is heated in the refrigeration, and set up in cold-storage heat accumulator rear and towards the fan of airing exhaust that the cold-storage heat accumulator bloied. The utility model provides a miniature semiconductor air conditioner sets up the refrigeration through the cooperation and heats the module, cold-storage heat accumulator and the fan of airing exhaust to adopt the semiconductor refrigeration piece as the refrigeration and heat the module, through the produced cold of little sub-semiconductor refrigeration and heat the module or the heat source, the rethread cold-storage heat accumulator passes with the fan of airing exhaust, do not need traditional compressor, the ice-cube, cold water to realize refrigeration effect, also do not need the heating wire to come the real effect of heating, high durability and convenient use, safety, environmental protection.
Description
Technical Field
The application relates to the technical field of intelligent electrical appliances, in particular to a miniature semiconductor air conditioner.
Background
The air conditioner is an indispensable electrical apparatus of people in modern life, and the kind of traditional air conditioner is a lot of, and is common including wall-hanging type air conditioner, vertical cabinet type air conditioner, window formula air conditioner, ceiling type air conditioner etc. and traditional air conditioner comprises structures such as compressor, condenser, cross valve, evaporimeter usually, and the volume is great relatively, and the mounted position is fixed, can't remove during the use, and the energy consumption is high.
With the development of science and technology, the cooling and heating fan appears in people's life as a new electrical apparatus that can refrigerate and heat, and current cooling and heating fan generally comprises motor, fan, water tank, heating wire, drive assembly etc. and the structure is complicated relatively, and the volume is still great, and it is inconvenient to remove, and the energy consumption is great.
Disclosure of Invention
The present application aims to solve at least one of the above technical problems to a certain extent.
The application provides a miniature semiconductor air conditioner, includes:
a housing;
a cooling and heating unit disposed in the housing; and
the control unit is connected with the refrigerating and heating unit to control the operation of the refrigerating and heating unit; the cooling and heating unit includes:
a heat sink;
the refrigerating and heating module is arranged above the radiator;
the cold and heat accumulation device is attached to the refrigerating and heating module; and
the air exhaust fan is arranged behind the cold accumulation heat accumulator and blows air towards the cold accumulation heat accumulator, an air outlet is formed in the shell, and the air blown out by the air exhaust fan is blown out from the air outlet after passing through the cold accumulation heat accumulator; the refrigerating and heating module adopts a semiconductor refrigerating sheet, and the semiconductor refrigerating sheet is attached to the radiator.
Furthermore, the cold and heat accumulation device is made of an aluminum material and is directly attached to the semiconductor refrigerating sheet.
Further, the cold accumulation heat accumulator is a mesh plate with a round through hole; or the cold and heat accumulator is a mesh plate with a hexagonal through hole.
Furthermore, the heat sink includes a plurality of fins disposed at intervals and a heat dissipation fan disposed on one side of the fins.
Further, the control unit includes:
a main control module; and
the cold and hot switching module is connected with the main control module and the refrigerating and heating module and used for controlling the refrigerating and heating module to refrigerate or heat according to an instruction sent by the main control module.
Furthermore, the control unit also comprises a temperature control module connected with the main control module; the temperature control module includes:
the temperature sensing module is used for sensing the refrigerating or heating temperature of the refrigerating and heating module; and the temperature adjusting module is used for presetting a temperature value so that the refrigerating and heating module works according to the preset temperature value.
Further, the temperature sensing module comprises a temperature sensor which is arranged on the cold storage heat accumulator to sense the current temperature of the cold storage heat accumulator.
Furthermore, the control unit also comprises a time regulation and control module which is connected with the main control module and used for limiting the working time of the refrigerating and heating unit.
Furthermore, the miniature semiconductor air conditioner also comprises a human-computer interaction unit which is connected with the control unit to realize human-computer interaction; the human-computer interaction unit comprises a display module and an operation module; the operation module adopts at least one of a key mode, a touch mode, a voice mode, a Bluetooth mode, a remote control mode and a Wifi mode.
Further, the miniature semiconductor air conditioner also comprises a power supply unit used for providing electric energy, wherein the power supply unit comprises a rechargeable battery and a charging interface electrically connected with the rechargeable battery to charge the rechargeable battery.
The beneficial effect of this application is: the refrigerating and heating module, the cold accumulation heat accumulator and the exhaust fan are arranged in a matched mode, the semiconductor refrigerating sheet is used as the refrigerating and heating module, cold or heat sources generated by the micro-quantum semiconductor refrigerating and heating module are transmitted through the cold accumulation heat accumulator and the exhaust fan, the refrigerating effect is realized without a traditional compressor, ice blocks and cold water, the heating effect is realized without an electric heating wire, and the refrigerating and heating module is convenient to use, safe and environment-friendly; meanwhile, the intelligent regulation and control of the refrigerating and heating unit are realized by arranging the cold-hot switching module, the temperature control module, the time regulation and control module and the man-machine interaction unit in a matching way, so that the use is more intelligent; through the power supply unit including the rechargeable battery, the miniature semiconductor air conditioner can be used anytime and anywhere, the use performance is further improved, and the product practicability is improved.
Drawings
Fig. 1 is a schematic perspective view of a micro semiconductor air conditioner according to the present invention.
Fig. 2 is an assembly structure diagram of the cooling and heating unit of the present application.
Fig. 3 is a schematic circuit diagram of the micro semiconductor air conditioner of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature therebetween; also, the first feature "on," "above" and "over" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature; the first feature being "under," "below," and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or merely indicates that the first feature is at a lower level than the second feature.
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.
Referring to fig. 1 to 3, the present application provides a micro semiconductor air conditioner, which includes a housing 10, a cooling and heating unit 20, a control unit 30, a human-computer interaction unit 40, and a power supply unit 50. The housing 10 is provided with an air outlet 11 for blowing out cold air or hot air generated by the cooling and heating unit 20.
The cooling and heating unit 20 includes a radiator 21, a cooling and heating module 22, a cold storage heat accumulator 23, and an exhaust fan 24.
The heat sink 21 has a heat sink structure, and includes a plurality of heat sinks 211 arranged at intervals in a stacked manner, and a heat dissipation fan 212 arranged on one side of the heat sinks 211. The cooling and heating module 22 is disposed above the radiator 21, and the radiator 21 is used for radiating heat of the cooling and heating module 22 when the cooling and heating module 22 works. The case 10 is provided with heat radiation holes 12 at positions corresponding to the heat sink 21.
The module 22 heats and refrigerates is used for accomplishing the work of refrigerating and heating, in this application, the module 22 heats and refrigerates and adopts the semiconductor refrigeration piece, the semiconductor refrigeration piece is directly pasted and is located on radiator 21. The semiconductor refrigerating piece can refrigerate and heat, can replace a traditional heating system and a traditional refrigerating system which are separated by one piece, and is simple and light in structure, high in efficiency and low in energy consumption.
The cold and heat storage device 23 is attached to the refrigerating and heating module 22 and is used for absorbing and concentrating a cold source or a heat source generated by the refrigerating and heating module 22. In the present application, the cold storage and heat accumulator 23 is made of an aluminum material, and is not required to be connected to a circuit, but directly physically attached to the refrigerating and heating module 22. As a best embodiment, the cold-storage heat accumulator 23 is preferably made of an aluminum mesh plate provided with a plurality of regularly arranged through holes, and the through holes on the mesh plate can be set to be circular, hexagonal or other suitable shapes.
The exhaust fan 24 is disposed behind the cold storage heat accumulator 23 and blows air toward the cold storage heat accumulator 23, and the air blown out by the exhaust fan 24 passes through the cold storage heat accumulator 23 and then is blown out by the air outlet 11 of the housing 10. When the air-conditioning device works, cold or heat generated by the refrigerating and heating module 22 is absorbed by the cold accumulation heat accumulator 23, and the exhaust fan 24 blows air towards the cold accumulation heat accumulator 23, so that the cold or heat absorbed by the cold accumulation heat accumulator 23 can be blown out of the air outlet 11 along with the air. In this application, the air outlet 11 of casing 10 sets up in the position department corresponding with cold-storage heat accumulator 23, be provided with out the aerofoil on the casing 10, it is identical with the through-hole on the cold-storage heat accumulator 23 that the air outlet 11 that offers on the aerofoil is preferred to set up, it can be used for separating the temperature on the one hand to go out the aerofoil, promotes the pleasing to the eye degree that user experience felt and outward appearance, and on the other hand also is used for forming the protection to cold-storage heat accumulator 23. It is understood that, in another embodiment, the housing 10 may not be provided with an air outlet plate separately, but may be directly provided with the cold storage heat accumulator 23 on the air outlet side, and the through hole on the cold storage heat accumulator 23 constitutes the air outlet 11.
The control unit 30 is connected to the cooling and heating unit 20 for controlling the operation of the cooling and heating unit 20. The control unit 30 includes a main control module 31, and a cold-hot switching module 32, a temperature control module 33 and a time control module 34 connected to the main control module 31.
The cold-hot switching module 32 is connected to the main control module 31 and the cooling and heating module 22, and the cold-hot switching module 32 is used for controlling the cooling and heating module 22 to cool or heat according to an instruction sent by the main control module 31. Specifically, after receiving a refrigeration instruction from a user, the main control module 31 sends a refrigeration signal to the cold-hot switching module 32, and after receiving the refrigeration signal, the cold-hot switching module 32 controls the refrigeration and heating module 22 to operate in a refrigeration state; after receiving a heating instruction from a user, the main control module 31 sends a heating signal to the cold-hot switching module 32, and after receiving the heating signal, the cold-hot switching module 32 controls the cooling and heating module 22 to operate in a heating state.
The temperature control module 33 is used for realizing intelligent temperature control. The temperature control module 33 includes a temperature sensing module 331 and a temperature adjusting module 332, the temperature sensing module 331 is used for sensing the current refrigerating or heating temperature of the refrigerating and heating module 22, and the temperature adjusting module 332 is used for presetting a temperature value so that the refrigerating and heating module 22 works according to the preset temperature value. In the present application, the temperature sensing module 331 includes a temperature sensor provided on the cold storage heat accumulator 23 to sense the current temperature of the cold storage heat accumulator 23. It is understood that the temperature sensor may be disposed at other suitable positions as another embodiment.
The time control module 34 is configured to limit an operation time of the cooling and heating unit 20, so that the cooling and heating unit 20 can operate according to a preset operation time.
The human-computer interaction unit 40 is used for realizing instruction and information transmission between a user and a machine. In this application, the human-computer interaction unit 40 includes a display module and an operation module. The display module is used for displaying relevant information extracted by the main control module 31, such as temperature information, time information, electric quantity information and the like. The operation module is configured to send an instruction to the main control module 31 so as to control each other functional module to perform corresponding work through the main control module 31. In the application, the operation module can adopt at least one of a key mode, a touch mode, a voice mode, a bluetooth mode, a remote control mode and a Wifi mode. In the embodiment shown in fig. 1, the display module includes a display 13 disposed on the housing 10, and the operation module includes a key 14 disposed on the housing 10.
The power supply unit 50 is used for supplying electric energy to the whole microelectronic air conditioner. In this application, the power supply unit 50 includes a rechargeable battery, and a charging interface electrically connected to the rechargeable battery to charge the rechargeable battery. Through setting up rechargeable battery can realize the portable use of the miniature semiconductor air conditioner of this application, effectively promotes miniature semiconductor air conditioner's application range and practicality. Of course, in other embodiments, the power supply unit 50 may not be provided with a rechargeable battery, and may be directly connected to the power socket via a power cord.
The utility model provides a miniature semiconductor air conditioner, set up refrigeration and heat module 22 through the cooperation, cold-storage heat accumulator 23 and exhaust fan 24, and adopt the semiconductor refrigeration piece as refrigeration and heat module 22, heat the produced cold or heat source of module 22 through the refrigeration of trace sub-semiconductor, and pass through cold-storage heat accumulator 23 and exhaust fan 24 and pass out, do not need traditional compressor, the ice-cube, cold water realizes the refrigeration effect, also do not need the heating wire to come real heating effect, high durability and convenient use, safety, environmental protection. Meanwhile, the cold-hot switching module 32, the temperature control module 33, the time regulation and control module 34 and the man-machine interaction unit 40 are arranged in a matched mode, so that the intelligent regulation and control of the refrigerating and heating unit 20 are realized, and the use is more intelligent; through the arrangement of the power supply unit 50 comprising the rechargeable battery, the miniature semiconductor air conditioner can be used anytime and anywhere, the service performance is further improved, and the product practicability is improved.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is a more detailed description of the present application in connection with specific embodiments thereof, and it is not intended that the present application be limited to the specific embodiments thereof. It will be apparent to those skilled in the art from this disclosure that many more simple derivations or substitutions can be made without departing from the spirit of the disclosure.
Claims (10)
1. A miniature semiconductor air conditioner, comprising:
a housing;
a cooling and heating unit disposed in the housing; and
the control unit is connected with the refrigerating and heating unit to control the operation of the refrigerating and heating unit; the cooling and heating unit includes:
a heat sink;
the refrigerating and heating module is arranged above the radiator;
the cold and heat accumulation device is attached to the refrigerating and heating module; and
the air exhaust fan is arranged behind the cold accumulation heat accumulator and blows air towards the cold accumulation heat accumulator, an air outlet is formed in the shell, and the air blown out by the air exhaust fan is blown out from the air outlet after passing through the cold accumulation heat accumulator; the refrigerating and heating module adopts a semiconductor refrigerating sheet, and the semiconductor refrigerating sheet is attached to the radiator.
2. The micro-semiconductor air conditioner according to claim 1, wherein the cold-storage heat accumulator is made of an aluminum material and directly attached to the semiconductor cooling sheet.
3. The micro-semiconductor air conditioner according to claim 2, wherein the cold-storage heat accumulator is a mesh plate having a circular shape of a through hole; or the cold and heat accumulator is a mesh plate with a hexagonal through hole.
4. The micro-semiconductor air conditioner according to claim 1, wherein the heat sink comprises a plurality of fins arranged at intervals and a heat dissipating fan arranged at one side of the fins.
5. The micro semiconductor air conditioner according to claim 1, wherein the control unit comprises:
a main control module; and
the cold and hot switching module is connected with the main control module and the refrigerating and heating module and used for controlling the refrigerating and heating module to refrigerate or heat according to an instruction sent by the main control module.
6. The micro-semiconductor air conditioner according to claim 1, wherein the control unit further comprises a temperature control module connected to the main control module; the temperature control module includes:
the temperature sensing module is used for sensing the refrigerating or heating temperature of the refrigerating and heating module; and
the temperature adjusting module is used for presetting a temperature value so that the refrigerating and heating module works according to the preset temperature value.
7. The micro-semiconductor air conditioner according to claim 6, wherein the temperature sensing module comprises a temperature sensor disposed on the cold-storage heat accumulator to sense a current temperature of the cold-storage heat accumulator.
8. The micro-semiconductor air conditioner according to claim 1, wherein the control unit further comprises a time control module connected to the main control module for limiting the operation time of the cooling and heating unit.
9. The micro semiconductor air conditioner according to any one of claims 1 to 8, further comprising a human-computer interaction unit connected to the control unit to realize human-computer interaction; the human-computer interaction unit comprises a display module and an operation module; the operation module adopts at least one of a key mode, a touch mode, a voice mode, a Bluetooth mode, a remote control mode and a Wifi mode.
10. The micro-semiconductor air conditioner according to any one of claims 1 to 8, further comprising a power supply unit for supplying power, the power supply unit comprising a rechargeable battery, and a charging interface electrically connected to the rechargeable battery for charging the rechargeable battery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021342504.9U CN212930299U (en) | 2020-07-09 | 2020-07-09 | Miniature semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021342504.9U CN212930299U (en) | 2020-07-09 | 2020-07-09 | Miniature semiconductor air conditioner |
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| Publication Number | Publication Date |
|---|---|
| CN212930299U true CN212930299U (en) | 2021-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021342504.9U Active CN212930299U (en) | 2020-07-09 | 2020-07-09 | Miniature semiconductor air conditioner |
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| CN (1) | CN212930299U (en) |
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