CN212917981U - Die head structure suitable for multi-chip - Google Patents

Abstract

The utility model relates to a moulding-die head structure suitable for multicore piece, it includes moulding-die body (1), moulding-die body (1) includes two at least tin pressing face (2), tin pressing face (2) are including central pattern (21) and peripheral moulding-die wall (22), peripheral moulding-die wall (22) between two adjacent tin pressing face (2) form and block tin wall (3). The utility model relates to a moulding-die head structure suitable for multicore piece, it can effectively improve production efficiency, avoids soldering tin to connect, improves the mounting roughness.

Description

Die head structure suitable for multi-chip

Technical Field

The utility model relates to a moulding-die head structure suitable for multicore piece belongs to semiconductor packaging technology field.

Background

In the chip mounting process in the packaging factory, at first, a die head is used to press soldering tin into a uniform thickness and shape, and then a chip is attached to the soldering tin and then is soldered. The die head is used for adjusting the flatness, thickness and width of the soldering tin between the chip and the substrate. When the single-base island and double-chip products are subjected to chip mounting operation, a single-pattern die head is generally used, and two schemes of tin discharging and die pressing are adopted by the single-pattern die head:

and in the first scheme, tin is fed twice, the first soldering tin corresponding to the first chip is extruded by using a die head, the second soldering tin corresponding to the second chip is extruded by using the die head, then the chips are sequentially placed on the soldering tin, and the chips are pressed downwards to form the welding of the chips and the substrate island. Since two chips are soldered, the solder corresponding to the two chips is pressed out twice, and then the chip soldering operation is performed twice.

And secondly, performing primary tin removal, performing tin soldering reshaping by using a pressing die with the size larger than that of the double chips, placing the first chip on the tin soldering and pressing down to form a chip to be welded with the base island, and placing the second chip on the tin soldering and pressing down to form a chip to be welded with the base island.

The above conventional scheme has the following disadvantages:

1. the first scheme is as follows: and (5) tin is coated twice, and the die pressing and shaping are carried out twice. Firstly, the efficiency is low; in addition, when second soldering tin is extruded, the die head can be pressed to the boundary of first soldering tin, and the soldering tin that twice moulding dies formed here easily causes to link together and the soldering tin adsorbs each other under the effect of backward flow to cause higher in the middle of two chips, the lower chip slope in both sides, thereby cause ball welding equipment visual system effectively discernment in the next process, thereby can not carry out the problem of bonding wire operation.

2. Scheme II: because soldering tin links together, when carrying out the second chip dress piece, soldering tin is to peripheral evacuation, leads to first chip wherein one side soldering tin thickness on the wrong side, and the centre of whole tin area is high, and both sides are low, and the chip takes place the slope to cause ball-welding equipment vision system in the next process and can't effectively discern, thereby can't carry out the problem of bonding wire operation.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that a moulding-die head structure suitable for multicore piece is provided to above-mentioned prior art, and it can effectively improve production efficiency, avoids soldering tin to connect, improves the mounting roughness.

The utility model provides a technical scheme that above-mentioned problem adopted does: a die head structure for multiple chips comprises a die body, wherein the die body comprises at least two tin pressing surfaces, the tin pressing surfaces comprise a central pattern and peripheral die walls, and the peripheral die walls between two adjacent tin pressing surfaces form tin blocking walls.

Preferably, the central pattern is provided with at least two die steps, and a diversion trench is formed between two adjacent die steps.

Preferably, the die step has a trapezoidal shape.

Preferably, the flow guide groove is coplanar with the central pattern.

Preferably, the die step is provided with a deep groove at a position close to the peripheral die wall.

Preferably, the material of the tin blocking wall is a hard metal material.

Preferably, the material of the tin blocking wall is a high-temperature resistant elastic material.

Compared with the prior art, the utility model has the advantages of:

1. the utility model discloses a die head structure suitable for multicore piece, need not many moulding-die plastic, the die efficiency is high;

2. the utility model discloses a die head structure suitable for multicore piece, it can once moulding-die form the dress piece soldering tin region that a plurality of chips correspond, sets up tin blocking wall between two adjacent chips, after the backward flow, two adjacent soldering tin regions are cut apart effectively, and regional tin volume of each is guaranteed, each other does not influence;

3. the utility model discloses a moulding-die head structure suitable for multicore piece, once adorn piece and secondary dress piece under tin district be in the surrounding die wall and block tin wall and surround the interval, can not flow tin each other between two adjacent tin districts, the tin volume is fixed during the moulding-die, the moulding-die levels, promotes next bonding wire process operation nature.

Drawings

Fig. 1 is a schematic diagram of a die head structure suitable for a dual chip of the present invention.

Wherein:

moulding-die body 1

Tin pressing surface 2

Center pattern 21

Peripheral die wall 22

Die step 23

Flow guide groove 24

Deep groove 25

Tin blocking wall 3

Detailed Description

The present invention will be described in further detail with reference to the following embodiments.

As shown in fig. 1, the utility model relates to a die head structure suitable for multi-chip, it includes die body 1, die body 1 includes two at least tin pressing surfaces 2, tin pressing surface 2 includes central pattern 21 and peripheral die wall 22, peripheral die wall 22 between two adjacent tin pressing surfaces 2 forms tin blocking wall 3;

the central pattern 21 is provided with at least two trapezoidal die steps 23, and a diversion trench 24 is formed between every two adjacent die steps 23;

the diversion trench 24 is coplanar with the central pattern 21;

the die step 23 is provided with a deep groove 25 at a position close to the peripheral die wall 22;

the material of the tin blocking wall can be hard metal material and can also be high-temperature resistant elastic material.

In addition, the present invention also includes other embodiments, and all technical solutions formed by equivalent transformation or equivalent replacement modes should fall within the protection scope of the claims of the present invention.

Claims (7)

1. A die head structure suitable for multiple chips is characterized in that: the tin pressing die comprises a die body (1), wherein the die body (1) comprises at least two tin pressing surfaces (2), each tin pressing surface (2) comprises a central pattern (21) and a peripheral die wall (22), and the peripheral die wall (22) between every two adjacent tin pressing surfaces (2) forms a tin blocking wall (3).

2. The die head structure of claim 1, wherein: the central pattern (21) is provided with at least two die steps (23), and a diversion trench (24) is formed between every two adjacent die steps (23).

3. The die head structure of claim 2, wherein: the die step (23) is trapezoidal.

4. The die head structure of claim 2, wherein: the diversion trench (24) is coplanar with the central pattern (21).

5. The die head structure of claim 2, wherein: the die step (23) is provided with a deep groove (25) at a position close to the peripheral die wall (22).

6. The die head structure of claim 1, wherein: the tin blocking wall (3) is made of hard metal materials.

7. The die head structure of claim 1, wherein: the tin blocking wall (3) is made of high-temperature resistant elastic material.

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