CN212907415U - Lead type capacitor packaging structure led out axially - Google Patents

Abstract

The utility model discloses an axial lead wire formula capacitor packaging structure who draws forth, including capacitor body and shell, capacitor body sets up in the shell, and the shell is equipped with the breach on the side that supplies the lead-out wire to wear out and with breach assorted baffle, be provided with the pin hole that supplies the lead-out wire to stretch out on baffle bottom and the breach. The utility model discloses a method that shell and baffle were assembled each other realizes that the lead-out wire of capacitor is drawn forth to the axial draws forth from the product shell side, adopts epoxy embedment shell inner chamber, forms the capacitor encapsulation structure that has higher mechanical strength, and this kind of encapsulation structure is compared in traditional sticky tape encapsulation structure, has strengthened the mechanical strength that the capacitor outer envelope layer was drawn forth to the axial, can avoid in condenser installation process metal clamp etc. to extrude the body or damage the body easily, use the problem that causes the hidden danger to the product.

Description

Lead type capacitor packaging structure led out axially

Technical Field

The utility model relates to a capacitor package structure, in particular to axial lead wire formula capacitor package structure of drawing forth.

Background

Capacitors are basic electronic components and are used in electronic circuits in large quantities. The lead type capacitor mainly refers to a type of capacitor which adopts metal round straight lines, flat lines, wiring terminals (sheets), plastic leads (single strands or multiple strands) and the like and is electrically connected through perforation welding or bolt locking, and can be subdivided into a radial lead-out type (direct plug-in type) and an axial lead-out type.

For the axial lead-out type capacitor, in order to reduce the volume and weight of the product, the encapsulation structure of wrapping the insulating tape 2 on the surface of the capacitor body 1 and pouring the epoxy resin at the end is mainly adopted, as shown in fig. 1, when the encapsulation structure of wrapping the insulating tape and pouring the epoxy resin at the end is adopted for the lead-out type capacitor, since the thickness of the wrapped insulating tape 2 is usually not more than 0.2mm, the encapsulation size is more favorable to be reduced, but the following disadvantages are brought about: (1) because the encapsulating layer is the insulating adhesive tape, the mechanical strength of the encapsulating layer is weak, and when the body is installed and fixed on a product, the body is easily extruded and deformed or damaged by a metal clamp and the like, so that hidden dangers are caused to the use of the product; (2) the wrapped adhesive tape is easy to wrinkle due to uneven stress, poor bonding (degumming or loose bonding and the like) is easy to occur between the layers of the adhesive tape and between the adhesive tape and the body of the product, the appearance of the product is influenced, the tightness of the wrapping is influenced, and the characteristics of the product such as high-pressure insulation, moisture resistance and the like are influenced; (3) at present, the product wrapping adhesive tape is mainly manually operated, two ends of the product need to be respectively filled, and the process time is long.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a structural design is reasonable, and encapsulated layer mechanical strength is better, the high axial lead-out's of leakproofness and high voltage insulation formula capacitor packaging structure.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model discloses a lead wire formula capacitor packaging structure that axial was drawn forth, including capacitor body and shell, capacitor body sets up in the shell, the shell be equipped with the breach on the side that supplies the lead-out wire to wear out and with breach assorted baffle, be provided with the pin hole that supplies the lead-out wire to stretch out on baffle bottom and the breach.

Preferably, the housing notch and the baffle are both rectangular.

Preferably, both sides of the baffle are provided with I-shaped grooves, both sides of the shell notch are provided with convex edges matched with the I-shaped grooves, and the baffle and the shell are connected in an inserted mode through the convex edges and the I-shaped grooves.

Preferably, the shell and the baffle are made of high-temperature resistant plastics such as PBT, PC, PPS, PEEK or PEI.

Preferably, the bottom of the baffle and the bottom of the notch are both provided with semicircular holes, and the semicircular holes form the lead holes.

Compared with the prior art, the utility model has the advantages of: the utility model discloses a method that shell and baffle were assembled each other realizes that the lead-out wire of capacitor is drawn forth to the axial is drawn forth from the product shell side, adopt epoxy embedment shell inner chamber, form the capacitor encapsulation structure that has higher mechanical strength, this kind of encapsulation structure is compared in traditional sticky tape encapsulation structure, the mechanical strength of capacitor outer envelope has been drawn forth to the axial has been strengthened, can avoid metal clamp etc. in the condenser installation easily with body extrusion deformation or damage body, use the problem that causes the hidden danger to the product, and simultaneously, the outward appearance uniformity of product is good, leakproofness and high-pressure insulation nature are also showing and improve, and when adopting the condenser of this technique to fill, only once fill the operation, fill the process time and compare and to transmit the package sticky tape mode and save half.

Drawings

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic structural view of the present invention;

FIG. 3 is a schematic structural view of the housing of FIG. 2;

fig. 4 is a schematic structural view of the baffle plate in fig. 2.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings.

Referring to fig. 2, 3 and 4, the axial lead-out type capacitor package structure of the present invention includes a capacitor body 1 and a case 2, the capacitor body 1 is arranged in the shell 2, the shell 2 is provided with a notch 8 and a baffle 4 matched with the notch 8 on the side surface through which the outgoing line penetrates, the bottom of the baffle 4 and the notch 8 are provided with lead holes 7 through which the outgoing line 3 extends, the notch 8 and the baffle 4 are both rectangular, the I-shaped groove 5 is arranged on both sides of the baffle 4, the convex edge 6 matched with the I-shaped groove 5 is arranged on both sides of the notch 8, the baffle 4 is spliced with the shell 2 through the convex edge 6 and the I-shaped groove 5, the shell 2 and the baffle 4 are made of high-temperature resistant plastics such as PBT, PC, PPS, PEEK or PEI, and semicircular holes are formed in the bottoms of the baffle 4 and the notch 8, and the two semicircular holes form the lead holes 7.

The shell 2 of the lead type capacitor which is axially led out adopts the design structure of the invention, namely, a gap 8 is arranged on the side surface of the shell 2 through which the lead wire 3 passes, the bottom of the gap 8 is provided with a semi-circular hole with the shape of a half lead wire 3, the opposite side edge is flush with the opening end side line of the shell 2, two convex edges 6 are arranged on two side lines of the gap 8 on the shell 2 which are vertical to the bottom surface, the baffle 4 is corresponding to the shape of the gap 8 on the shell 2 and is rectangular, the two side lines are provided with an I-shaped groove 5, the I-shaped groove 5 is matched with the two convex edges 6 on the shell 2 in a plugging manner, the bottom of the baffle 4 is provided with a semi-circular hole with the shape of a half lead wire 3, the semi-circular hole on the bottom of the baffle 4 and the semi-circular hole at.

During product assembly, pack into shell 2 with capacitor body 1 earlier in, the lead-out wire 3 of condenser is placed on shell 2 and is reserved pin hole 7 simultaneously, adjust the position well with two beads 6 of 2 breachs 8 of shell 5 of worker shape groove of baffle 4, insert baffle 4 on 2 breachs 8 of shell, the semicircular hole on 4 bases of baffle is in the same place with the semicircular hole concatenation on the 8 bottoms of 2 breachs of shell, form complete pin hole 7, at this moment, lead-out wire 3 has been installed in the middle of the hole, and simultaneously, the top of baffle 4 keeps flushing with the open end sideline of shell 2.

Claims (5)

1. The utility model provides an axial lead wire formula capacitor package structure of drawing forth, includes capacitor body and shell, its characterized in that: the capacitor body is arranged in the shell, the shell is provided with a notch and a baffle matched with the notch on the side surface through which the outgoing line penetrates out, and the bottom of the baffle and the notch are provided with lead holes through which the outgoing line extends out.

2. The axial leaded capacitor package of claim 1, wherein: the shell gap and the baffle are both rectangular.

3. The axial leaded capacitor package of claim 1, wherein: both sides of the baffle are provided with I-shaped grooves, both sides of the shell gap are provided with convex edges matched with the I-shaped grooves, and the baffle and the shell are connected in an inserted mode through the convex edges and the I-shaped grooves.

4. The axial leaded capacitor package of claim 1, wherein: the shell and the baffle are made of high-temperature resistant plastics such as PBT, PC, PPS, PEEK or PEI.

5. The axial leaded capacitor package of claim 1, wherein: and semicircular holes are formed in the bottom of the baffle and the bottom of the notch, and the two semicircular holes form the lead holes.

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