CN212902148U - Semiconductor refrigerating sheet for heat-preservation medicine box - Google Patents

Abstract

The utility model relates to the technical field of semiconductor refrigeration, and discloses a semiconductor refrigeration sheet for a heat preservation medicine box, which comprises a plurality of P-type semiconductors, a plurality of N-type semiconductors, two heat-conducting plates, an electrifying part and a drying part, wherein the electrifying part is used for providing electric energy to electrify the N-type semiconductors and the P-type semiconductors, the two heat-conducting plates are arranged in parallel, the P-type semiconductors and the N-type semiconductors are arranged between the two heat-conducting plates, and the P-type semiconductors and the N-type semiconductors are alternately arranged, the utility model can effectively refrigerate the medicines by arranging the electrification of the N-type semiconductors and the P-type semiconductors, and does not need to put in liquid nitrogen or ice blocks when cooling the medicines each time, thereby improving the practicability of the product, and simultaneously can absorb condensed water, place the medicines to be affected with damp and pass through the hot end of the, the hard silica gel plate full of water can be dehydrated.

Description

Semiconductor refrigerating sheet for heat-preservation medicine box

Technical Field

The utility model relates to a semiconductor refrigeration technology field, more specifically the semiconductor refrigeration piece that says so relates to a be used for heat preservation medicine case.

Background

The semiconductor refrigerator is a device for producing cold by using the thermoelectric effect of a semiconductor, and is also called as a thermoelectric refrigerator. Connecting two different metals by a conductor, and switching on direct current, so that the temperature of one joint is reduced, and the temperature of the other joint is increased;

along with the rapid development of the society, more and more medicines need to be transported to each place, in the process of transporting some medicines, the medicines often need to be kept warm, the traditional medicine incubator usually uses modes such as liquid nitrogen and ice cubes to refrigerate, the refrigeration effect is good by using the mode, but the problem that the ice cubes or the liquid nitrogen are needed to be added in each use is solved, the medicines often need to be kept dry in the transporting process, and the problem that condensed water is caused by the fact that the temperature of some existing heat preservation medicine boxes is too low.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a semiconductor refrigeration piece for keeping warm medicine case for overcome the above-mentioned defect among the prior art.

In order to achieve the above purpose, the utility model provides a following technical scheme: a semiconductor refrigeration piece for a heat-preservation medicine box comprises a plurality of P-type semiconductors, a plurality of N-type semiconductors, two heat-conducting plates, an electrifying part and a drying part, wherein the electrifying part is used for providing electric energy to electrify the N-type semiconductors and the P-type semiconductors, the two heat-conducting plates are arranged in parallel, the P-type semiconductors and the N-type semiconductors are arranged between the two heat-conducting plates, the P-type semiconductors and the N-type semiconductors are alternately arranged, a cold-end conducting piece is electrically connected between the top surface of each P-type semiconductor and the top surface of one adjacent N-type semiconductor, a hot-end conducting piece is electrically connected between the bottom surface of each P-type semiconductor and the bottom surface of one adjacent N-type semiconductor, so that the N-type semiconductors and the P-type semiconductors are connected in series through the cold-end and the hot-end conducting pieces, the cold end conducting strip with the hot junction conducting strip all with heat-conducting plate fixed connection, the dry portion including set up in two hard silica gel plates of heat-conducting plate back to the back off-plane, when giving through circular telegram portion P type semiconductor with when N type semiconductor circular telegram, be close to the cold end conducting strip hard silica gel plate absorbs the comdenstion water, be close to the hot junction conducting strip hard silica gel plate thermal desorption comdenstion water, hard silica gel plate all can with the cold end conducting strip with the hot junction conducting strip can dismantle the connection.

As the utility model discloses a further improvement, the drying part includes two cold junction fixed plates and two hot junction fixed plates, two the equal fixed mounting of cold junction fixed plate is close to the cold junction conducting strip the both sides of heat-conducting plate, two the opposite face of cold junction fixed plate all is provided with the recess, hard silica gel plate is used for inserting between two recesses, two the equal fixed mounting of hot junction fixed plate is close to the hot junction conducting strip the both sides of heat-conducting plate, two the opposite face of hot junction fixed plate all is provided with the recess.

As a further improvement of the present invention, two heat dissipation fins are provided between the hot end fixing plates.

As a further improvement of the present invention, the conducting portion includes two wires, one of them the wire with hot junction conducting strip electric connection, another the wire with cold junction conducting strip electric connection, two the wire all is connected with the power.

As a further improvement of the utility model, the P type semiconductor with be provided with insulating heat insulating board between the N type semiconductor.

As a further improvement of the utility model, two fixedly connected with baffle between the heat-conducting plate, the baffle is back the font setting, so that will the P type semiconductor the N type semiconductor the cold junction conducting strip with the hot junction conducting strip surrounds.

As a further improvement of the utility model, the heat conducting plate is made of ceramic.

The utility model has the advantages that: the utility model discloses a set up the circular telegram of N type semiconductor and P type semiconductor, can refrigerate for the medicine effectively, when not needing to cool off the medicine at every turn, put into liquid nitrogen or ice-cube, improved the practicality of product, simultaneously through setting up hard silica gel board, can absorb the comdenstion water, place the medicine and wet, through the hot junction of semiconductor, can dewater the hard silica gel board that absorbs water moreover.

Drawings

Fig. 1 is a front view structural section view of the present invention;

figure 2 is a side view of the present invention in figure 1.

Reference numerals: 11. a cold end conducting strip; 12. a hot end conductive sheet; 13. a P-type semiconductor; 14. an N-type semiconductor; 15. a heat conducting plate; 16. insulating and heat insulating boards; 17. heat dissipation fins; 18. a baffle plate; 2. an energizing part; 21. a wire; 3. a drying section; 31. a cold end fixing plate; 32. a hot end fixing plate; 33. hard silica gel plate.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "bottom" and "top," "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

Referring to fig. 1 and 2, a semiconductor refrigeration sheet for a thermal insulation medicine box of the present embodiment includes a plurality of P-type semiconductors 13, a plurality of N-type semiconductors 14, two heat-conducting plates 15, an energizing part 2 and a drying part 3, the energizing part 2 is used for providing electric energy to energize the N-type semiconductors 14 and the P-type semiconductors 13, the two heat-conducting plates 15 are arranged in parallel, the P-type semiconductors 13 and the N-type semiconductors 14 are both arranged between the two heat-conducting plates 15, the P-type semiconductors 13 and the N-type semiconductors 14 are alternately arranged to facilitate electrical connection of the P-type semiconductors 13 and the N-type semiconductors 14, a cold-end conductive sheet 11 is electrically connected between the top surface of each P-type semiconductor 13 and the top surface of one of the adjacent N-type semiconductors 14, a hot end 12 is electrically connected between the bottom surface of each P-type semiconductor 13 and the bottom surface of one of the adjacent N-type semiconductors, so that a plurality of N-type semiconductors 14 and a plurality of P-type semiconductors 13 are all connected in series through the cold end conducting plate 11 and the hot end conducting plate 12, when the cold end conducting plate 11 and the hot end conducting plate 12 are electrified, the N-type semiconductors 14 and the P-type semiconductors 13 can be electrified to refrigerate, the cold end conducting plate 11 and the hot end conducting plate 12 are both fixedly connected with the heat conducting plate 15, the drying part 3 comprises two hard silica gel plates 33 arranged on the opposite surfaces of the heat conducting plate 15, when the P-type semiconductors 13 and the N-type semiconductors 14 are electrified through the electrifying part 2, the hard silica gel plate 33 close to the cold end conducting plate 11 absorbs condensate water, the hard silica gel plate 33 close to the hot end conducting plate 12 thermally desorbs the condensate water, the hard silica gel plates 33 can be detachably connected with the cold end conducting plate 11 and the hot end conducting plate 12, and therefore, when, meanwhile, when the hard silica gel plate 33 cannot absorb water, the water can be removed through the heat release of the semiconductor, so that the recycling function is achieved.

In one embodiment, the hard silica gel plate 33 is provided with a plurality of small holes, the small holes all penetrate through the hard silica gel plate 33 from top to bottom, and the absorption rate of the condensed water can be improved through the arranged small holes.

Referring to fig. 1, the drying part 3 includes two cold end fixing plates 31 and two hot end fixing plates 32, the two cold end fixing plates 31 are both fixedly installed at both sides of the heat conducting plate 15 near the cold end conducting plate 11, the opposite surfaces of the two cold end fixing plates 31 are both provided with grooves, the hard silica gel plate 33 is used for being inserted between the two grooves, the two hot end fixing plates 32 are both fixedly installed at both sides of the heat conducting plate 15 near the hot end conducting plate 12, the opposite surfaces of the two hot end fixing plates 32 are both provided with grooves, the hard silica gel plate 33 is used for being inserted between the two grooves, through the arrangement of the cold end fixing plates, the hard silica gel plate 33 can be conveniently replaced and fixed, the heat radiating fins 17 are arranged between the two hot end fixing plates 32, and through the arrangement of the heat radiating fins 17, the heat radiation efficiency of the heat conduction plate 15 can be effectively improved, thereby indirectly improving the refrigeration efficiency of the N-type semiconductor 14 and the P-type semiconductor 13.

In one embodiment, the heat sink fins 17 are provided with a fan, and the fan is electrically connected to the power supply, so that the heat dissipation efficiency of the heat sink fins 17 can be effectively improved by the fan.

Referring to fig. 1, the conducting portion 2 includes two wires 21, one of the two wires 21 is electrically connected to the hot-end conductive sheet 12, the other wire 21 is electrically connected to the cold-end conductive sheet 11, and both the two wires 21 are connected to a power supply.

Referring to fig. 1, an insulating board 16 is disposed between the P-type semiconductor 13 and the N-type semiconductor 14, and the insulating board 16 can effectively prevent electric leakage between the P-type semiconductor 13 and the N-type semiconductor 14, and at the same time, heat can be prevented from flowing back through the insulating board 16, thereby improving the cooling efficiency.

Referring to fig. 1, a baffle 18 is fixedly connected between the two heat conducting plates 15, the baffle 18 is arranged in a shape of a Chinese character 'hui', so as to surround the P-type semiconductor 13, the N-type semiconductor 14, the cold-end conducting plate 11 and the hot-end conducting plate 12, and the P-type semiconductor 13 and the N-type semiconductor 14 can be prevented from water inlet and damage in the practical process by the baffle 18.

In one embodiment, the material of the heat-conducting plate 15 includes, but is not limited to, ceramic, slate, and other insulating materials.

The working principle is as follows: firstly, inserting the dehydrated hard silica gel plate 33 between the cold end fixing plates 31, and inserting the water-absorbed hard silica gel plate 33 between the hot end fixing plates 32;

when the direct current power supply needs to be connected to the lead 21, the current flows from the N-type semiconductor 14 to the joint of the P-type semiconductor 13 to absorb heat and becomes a cold end; the joint that flows to N type semiconductor 14 by P type semiconductor 13 releases the heat, becomes the hot junction to heat-conducting plate 15 near cold junction conducting strip 11 cools down, cools off the medicine, and heat-conducting plate 15 near hot junction conducting strip 12 heats up, dewaters for the hard silica gel board 33 after will absorbing water, and during this period, the hard silica gel board 33 after the dehydration can adsorb the comdenstion water, prevents that the medicine from weing.

Above only the utility model discloses an it is preferred embodiment, the utility model discloses a scope of protection not only limits in above-mentioned embodiment, and the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (7)

1. The utility model provides a semiconductor refrigeration piece for keeping warm medicine case which characterized in that: the solar cell comprises a plurality of P-type semiconductors (13), a plurality of N-type semiconductors (14), two heat conduction plates (15), an electrifying part (2) and a drying part (3), wherein the electrifying part (2) is used for providing electric energy to electrify the N-type semiconductors (14) and the P-type semiconductors (13), the two heat conduction plates (15) are arranged in parallel, the P-type semiconductors (13) and the N-type semiconductors (14) are arranged between the two heat conduction plates (15), the P-type semiconductors (13) and the N-type semiconductors (14) are alternately arranged, a conducting plate (11) is electrically connected between the top surface of each P-type semiconductor (13) and the top surface of one adjacent N-type semiconductor (14), a hot end (12) is electrically connected between the bottom surface of each P-type semiconductor (13) and the bottom surface of one adjacent N-type semiconductor (14), so that a plurality of N-type semiconductors (14) and a plurality of P-type semiconductors (13) are connected in series through the cold-end conducting strip (11) and the hot-end conducting strip (12), the cold end conducting strip (11) and the hot end conducting strip (12) are both fixedly connected with the heat conducting plate (15), the drying part (3) comprises two hard silica gel plates (33) arranged on the opposite surfaces of the heat conducting plate (15), when the P-type semiconductor (13) and the N-type semiconductor (14) are energized through the energizing portion (2), the hard silica gel plate (33) close to the cold end conducting strip (11) absorbs the condensed water, the hard silica gel plate (33) close to the hot end conducting strip (12) thermally desorbs the condensed water, the hard silica gel plate (33) can be detachably connected with the cold end conducting strip (11) and the hot end conducting strip (12).

2. The semiconductor refrigeration piece for the heat preservation medicine box as claimed in claim 1, wherein: drying portion (3) include two cold junction fixed plates (31) and two hot junction fixed plates (32), two equal fixed mounting in cold junction fixed plate (31) is close to cold junction conducting strip (11) the both sides of heat-conducting plate (15), two the opposite face of cold junction fixed plate (31) all is provided with the recess, hard silica gel plate (33) are used for inserting between two recesses, two equal fixed mounting in hot junction fixed plate (32) is close to hot junction conducting strip (12) the both sides of heat-conducting plate (15), two the opposite face of hot junction fixed plate (32) all is provided with the recess.

3. The semiconductor refrigeration piece for the thermal insulation medicine box as claimed in claim 2, wherein: and a heat radiating fin (17) is arranged between the two hot end fixing plates (32).

4. The semiconductor refrigeration piece for the heat preservation medicine box as claimed in claim 1, wherein: the conducting part (2) comprises two wires (21), one of the wires (21) is electrically connected with the hot end conducting strip (12), the other wire (21) is electrically connected with the cold end conducting strip (11), and the two wires (21) are both connected with a power supply.

5. The semiconductor refrigeration piece for the heat preservation medicine box as claimed in claim 1, wherein: an insulating and heat insulating plate (16) is arranged between the P-type semiconductor (13) and the N-type semiconductor (14).

6. The semiconductor refrigeration piece for the heat preservation medicine box as claimed in claim 1, wherein: a baffle (18) is fixedly connected between the two heat conducting plates (15), and the baffle (18) is arranged in a shape like a Chinese character 'hui', so that the P-type semiconductor (13), the N-type semiconductor (14), the cold-end conducting plate (11) and the hot-end conducting plate (12) are surrounded.

7. The semiconductor refrigeration piece for the heat preservation medicine box as claimed in claim 1, wherein: the heat conducting plate (15) is made of ceramic.

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