CN212876177U - High heat conduction printed circuit board - Google Patents
High heat conduction printed circuit board Download PDFInfo
- Publication number
- CN212876177U CN212876177U CN202021507596.1U CN202021507596U CN212876177U CN 212876177 U CN212876177 U CN 212876177U CN 202021507596 U CN202021507596 U CN 202021507596U CN 212876177 U CN212876177 U CN 212876177U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- copper sheet
- printed circuit
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a high heat conduction printed circuit board, including the circuit board, be connected with heat radiation structure on the circuit board, circuit board internal connection has the copper sheet, is connected with the fin on the heat radiation structure, and the circuit board includes two panels, all is connected with the heat pipe in every panel, and heat radiation structure has set up four perpendicular stands, the utility model provides a, beneficial effect lies in: erect the stand and run through in two panels, and with heat pipe and copper sheet fixed connection, the heat on heat pipe and the copper sheet, through erectting the post and transmitting to the external world, erect in the heat that the post transmission came out passes into the butt joint post, disperse through fixing the fin on the butt joint post, thereby the temperature on the rapid reduction circuit board, can be with the heat dispersion of every panel through the heat pipe, increase the radiating efficiency, and the heat pipe can make the faster quilt dispersion of heat with the copper sheet cooperation, the even distribution of heat is on the circuit board, avoid local overheat and cause some problems.
Description
Technical Field
The utility model relates to a circuit board, in particular to high heat conduction printed circuit board belongs to printed circuit board heat conduction technical field.
Background
The circuit board is a control board used in various electric devices, and as long as various elements for controlling the electric devices are integrated together and then the elements are supplied with power through the circuit preset in the board, the types of the circuit boards are various along with the development of science and technology, and the circuit boards relate to various fields.
The circuit board can be used for integrated control in the current printer, because a large amount of current can be passed through on the circuit board, the node on the circuit board carries out shunt control on the current, each element can both obtain the function energy supply of electricity, the passing through of a large amount of current just means that the circuit board can produce heat, if the heat is not in time derived the temperature that can make the circuit board higher and higher, the circuit board is in long-time high temperature state, can directly influence the operation of circuit board, make the performance of printer descend, can make the printer stop the operation even.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the high heat conduction printed circuit board who provides, through heat pipe and fin, can also use the circuit board to carry out integrated control in the foretell present printing machine of effectual solution, because can pass through a large amount of electric currents on the circuit board, the node on through the circuit board carries out shunt control to the electric current, make every component can both obtain electric function energy supply, the passing through of a large amount of electric currents just means the circuit board can produce the heat, can make the temperature of circuit board more and more high if the heat is not timely derivation, the circuit board is in long-time high temperature state, can directly influence the function of circuit board, make the performance of printing machine descend, can make the printing machine stop the technical problem of function even.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the high-thermal-conductivity printed circuit board comprises a circuit board, wherein a heat dissipation structure is connected to the circuit board, a copper sheet is connected to the interior of the circuit board, a heat dissipation sheet is connected to the heat dissipation structure, the circuit board comprises two plates, each plate is internally connected with a heat conduction pipe, and four vertical columns are arranged on the heat dissipation structure.
Preferably, two the mounting groove has all been seted up in the middle of the relative both sides lateral wall of panel, copper sheet detachable connects in the mounting groove.
Preferably, an inner groove is formed in the middle of the interior of each plate, the heat conduction pipes are fixedly connected in the inner grooves, and the two plates are fixed together.
Preferably, one end of each vertical column is inserted into the two plates, the four vertical columns are respectively inserted into four corners of the circuit board, the positions, close to the top ends, of the two side walls, opposite to the two vertical columns, are fixedly connected with the butting columns, and the radiating fins are uniformly and fixedly connected to the butting columns.
Preferably, the vertical column is of a hollow cylindrical structure, the heat conduction pipe is of a hollow serpentine pipe structure, and the vertical column and the heat conduction pipe are both made of brass.
Preferably, one end of the upright column positioned in the circuit board is sequentially inserted into the heat conduction pipe and the copper sheet, and the heat conduction pipe and the copper sheet transfer heat through the upright column.
The utility model provides a, beneficial effect lies in: erect the stand and run through in two panels, and with heat pipe and copper sheet fixed connection, the heat on heat pipe and the copper sheet, through erectting the post and transmitting to the external world, erect in the heat transmission butt joint post that the post transmission comes out, disperse through fixing the fin on the butt joint post, thereby the temperature on the rapid reduction circuit board, can be with the heat dispersion of every panel through the heat pipe, increase the radiating efficiency, and the heat pipe can make the heat faster by the dispersion with the copper sheet cooperation, the even distribution of heat is on the circuit board, avoid local overheat and cause some problems, can be to end heat transmission through high heat, consequently, after erecting stand and fin cooling, heat in heat pipe and the copper sheet can continue to erecting post transmission heat, consequently, realize continuously conducting heat, can carry out efficient heat conduction through the heat pipe.
Drawings
Fig. 1 is a schematic perspective view of a high thermal conductivity printed circuit board according to the present invention;
fig. 2 is a schematic exploded perspective view of a high thermal conductivity printed circuit board according to the present invention;
fig. 3 is a schematic diagram of an internal structure of a board of a high thermal conductivity printed circuit board according to the present invention;
fig. 4 is the schematic diagram of the internal structure of the circuit board of the high thermal conductivity printed circuit board according to the present invention.
In the figure: 1. a circuit board; 11. a plate material; 111. an inner tank; 112. a heat conducting pipe; 13. mounting grooves; 14. a copper sheet; 2. a heat dissipation structure; 21. erecting a column; 22. butting columns; 23. and a heat sink.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, a high thermal conductivity printed circuit board includes a circuit board 1, a heat dissipation structure 2 is connected to the circuit board 1, a copper sheet 14 is connected to the circuit board 1, a heat sink 23 is connected to the heat dissipation structure 2, the circuit board 1 includes two boards 11, a heat pipe 112 is connected to each board 11, and four vertical columns 21 are set up in the heat dissipation structure 2.
One end of the vertical upright post 21 positioned in the circuit board 1 is sequentially inserted in the heat conduction pipe 112 and the copper sheet 14, the heat conduction pipe 112 and the copper sheet 14 transmit heat through the vertical upright post 21 and transmit the heat to the outside through the vertical upright post 21, the heat transmitted by the vertical upright post 21 is transmitted into the butt-joint post 22 and is dispersed through the heat dissipation sheet 23 fixed on the butt-joint post 22, so as to rapidly reduce the temperature on the circuit board 1, an inner groove 111 is arranged in the middle of the inside of each board 11, the heat conduction pipe 112 is fixedly connected in the inner groove 111, the two boards 11 are fixed together and can conduct heat efficiently through the heat conduction pipe 112, one end of the vertical upright post 21 is inserted in the two boards 11, the four vertical upright posts 21 are respectively inserted in four corners of the circuit board 1, wherein the positions of the side walls of two opposite sides of the two vertical upright posts 21 and close to the top end, mounting groove 13 has all been seted up in the middle of the relative both sides lateral wall of two panels 11, copper sheet 14 detachable connection is in mounting groove 13, it is hollow cylindrical structure to erect stand 21, heat pipe 112 is hollow coiled pipe structure, it is the brass preparation to erect stand 21 and heat pipe 112, can be with the heat dispersion of every panel 11 through heat pipe 112, increase the radiating efficiency, and heat pipe 112 can make the faster quilt of heat disperse with the cooperation of copper sheet 14, the even distribution of heat is on circuit board 1, avoid local overheat and cause some problems.
The working principle is as follows: the circuit board 1 is divided into two boards 11, mounting grooves 13 are respectively formed in the middle of the side walls of two opposite sides of the two boards 11, copper sheets 14 are connected in the mounting grooves 13, then the two boards 11 are combined to form the complete circuit board 1, heat generated on the boards 11 can be uniformly diffused through the copper sheets 14, heat concentration is avoided, damage to the circuit board 11 caused by heat is reduced, a fine heat conduction pipe 112 is fixedly connected in each board 11, the heat of each board 11 can be dispersed through the heat conduction pipe 112, the heat dissipation efficiency is improved, the heat can be rapidly dispersed through the cooperation of the heat conduction pipe 112 and the copper sheets 14, the heat is uniformly distributed on the circuit board 1, problems caused by local overheating are avoided, vertical columns 21 are respectively connected at four corners of one board 11 in a penetrating manner, the vertical columns 21 penetrate through the two boards 11 and are fixedly connected with the heat conduction pipes 112 and the copper sheets 14, the heat on the heat conduction pipe 112 and the copper sheet 14 is transferred to the outside through the vertical columns 21, the butting columns 22 are fixedly connected between the two opposite side walls of the two vertical columns 21 and at the positions close to the top ends, the plurality of radiating fins 23 are uniformly and fixedly connected to the butting columns 22, the heat transferred from the vertical columns 21 is transferred into the butting columns 22 and is dispersed through the radiating fins 23 fixed to the butting columns 22, so that the temperature on the circuit board 1 is rapidly reduced, the problem that the circuit board 1 has negative problems due to overhigh temperature is effectively avoided, the heat is transferred to the bottom heat through high heat, and after the vertical columns 21 and the radiating fins 23 are cooled, the heat in the heat conduction pipe 112 and the copper sheet 14 is continuously transferred to the vertical columns 21, so that continuous heat conduction is realized, and efficient heat conduction can be realized through the heat conduction pipe 112.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The high-heat-conductivity printed circuit board is characterized by comprising a circuit board (1), wherein a heat dissipation structure (2) is connected onto the circuit board (1), a copper sheet (14) is connected into the circuit board (1), a heat dissipation sheet (23) is connected onto the heat dissipation structure (2), the circuit board (1) comprises two boards (11), each board (11) is internally connected with a heat conduction pipe (112), and four vertical columns (21) are arranged on the heat dissipation structure (2).
2. The high thermal conductivity printed circuit board according to claim 1, wherein a mounting groove (13) is formed in the middle of each of two opposite side walls of the two boards (11), and the copper sheets (14) are detachably connected in the mounting grooves (13).
3. A high thermal conductivity printed circuit board according to claim 1, wherein an inner groove (111) is formed in the middle of each of the plates (11), the heat pipe (112) is fixedly connected to the inner groove (111), and the two plates (11) are fixed together.
4. The printed circuit board with high thermal conductivity according to claim 1, wherein one end of each of the vertical columns (21) is inserted into two plates (11), four vertical columns (21) are respectively inserted into four corners of the circuit board (1), wherein the positions of the two opposite side walls of the two vertical columns (21) near the top end are fixedly connected with butt-jointed columns (22), and the heat dissipation fins (23) are uniformly and fixedly connected to the butt-jointed columns (22).
5. A high thermal conductivity printed circuit board according to claim 1, wherein the vertical pillars (21) are hollow cylindrical structures, the heat conducting pipes (112) are hollow serpentine structures, and the vertical pillars (21) and the heat conducting pipes (112) are made of brass.
6. The high-heat-conductivity printed circuit board according to claim 1, wherein the end of the vertical column (21) located in the circuit board (1) is inserted into the heat pipe (112) and the copper sheet (14) in sequence, and the heat pipe (112) and the copper sheet (14) transfer heat through the vertical column (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021507596.1U CN212876177U (en) | 2020-07-28 | 2020-07-28 | High heat conduction printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021507596.1U CN212876177U (en) | 2020-07-28 | 2020-07-28 | High heat conduction printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212876177U true CN212876177U (en) | 2021-04-02 |
Family
ID=75217459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021507596.1U Active CN212876177U (en) | 2020-07-28 | 2020-07-28 | High heat conduction printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212876177U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891545A (en) * | 2021-09-18 | 2022-01-04 | 惠州中京电子科技有限公司 | High heat conduction PCB board reaches novel display device including high heat conduction PCB board |
-
2020
- 2020-07-28 CN CN202021507596.1U patent/CN212876177U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113891545A (en) * | 2021-09-18 | 2022-01-04 | 惠州中京电子科技有限公司 | High heat conduction PCB board reaches novel display device including high heat conduction PCB board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203883667U (en) | Thyristor self-cooling power module | |
| CN205882126U (en) | Lithium ion battery wraps heat -transfer device | |
| CN212876177U (en) | High heat conduction printed circuit board | |
| CN110146956B (en) | Internal heat transport microstructure of optical module | |
| CN207425975U (en) | A kind of power battery module with heat management device | |
| CN209119077U (en) | A kind of ion wind radiator | |
| CN218996854U (en) | Iron lithium energy storage battery pack structure | |
| CN208060644U (en) | A kind of electronic load test device | |
| CN203015356U (en) | Liquid-cooling radiator | |
| CN203641947U (en) | LED lamp with cooling function | |
| CN215300074U (en) | Cable connection cabinet for photovoltaic power generation system | |
| CN211476363U (en) | Electronic refrigerating device | |
| CN215073124U (en) | High heat conduction printed circuit board | |
| CN203660990U (en) | Cooling device of power amplifier | |
| CN210980947U (en) | Heat collector and thermoelectric generator | |
| CN207340419U (en) | Energy-saving, environment-friendly and high-efficiency heat-transfer device | |
| CN219575750U (en) | Liquid cooling subassembly and battery module | |
| CN108122866B (en) | A kind of integrated power module | |
| CN104901514B (en) | A kind of high-density power modular structure | |
| CN212573098U (en) | Durable type circuit board suitable for fill electric pile | |
| CN214177037U (en) | Motor with waterproof performance | |
| CN216260598U (en) | Circulating air cooling zero-emission device of paste mixing machine | |
| CN220068129U (en) | Power IC heat radiation structure | |
| CN109560053A (en) | A kind of ion wind radiator | |
| CN215955006U (en) | Finned radiator for transformer with efficient heat dissipation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |