CN212805391U - Semiconductor LED lamp heat radiation structure - Google Patents
Semiconductor LED lamp heat radiation structure Download PDFInfo
- Publication number
- CN212805391U CN212805391U CN202022180363.1U CN202022180363U CN212805391U CN 212805391 U CN212805391 U CN 212805391U CN 202022180363 U CN202022180363 U CN 202022180363U CN 212805391 U CN212805391 U CN 212805391U
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- Prior art keywords
- lamp
- heat
- heat dissipation
- shell
- motor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 230000005855 radiation Effects 0.000 title abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 43
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 241000883990 Flabellum Species 0.000 claims description 5
- 210000005056 cell body Anatomy 0.000 claims 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 4
- 230000000694 effects Effects 0.000 abstract description 11
- 238000009423 ventilation Methods 0.000 abstract description 8
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 241001465382 Physalis alkekengi Species 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a heat radiation structure of a semiconductor LED lamp, the circuit board is provided with the heat conduction post, the box body is provided with a through hole, one end of the heat conduction post, far away from the circuit board, penetrates through the through hole and is fixedly connected with the heat radiation plate, the rotating shaft is rotatably connected with the shell and is positioned at one side of the heat radiation plate, far away from the electric control box, the motor is electrically connected with the circuit board, the output end sleeve of the motor is provided with the rotating shaft, the fan blade is arranged on the rotating shaft, the shell is provided with a ventilation opening, the ventilation opening corresponds to the heat radiation device, the heat conduction post transmits the heat in the circuit board to the heat radiation plate, the motor drives the rotating shaft to rotate, thereby driving the fan blade to rotate, enhancing the air circulation rate of the heat radiation plate, the ventilation opening on the shell further strengthens the air circulation effect, so that the heat dissipation effect is further strengthened.
Description
Technical Field
The utility model relates to a LED lamps and lanterns technical field especially relates to a semiconductor LED lamps and lanterns heat radiation structure.
Background
The LED lamp has the advantages of energy conservation, high brightness, long service life and the like, and gradually replaces incandescent lamps, fluorescent lamps and the like to become a new generation of lighting source, certainly has the defects of the incandescent lamps, and has the main problem that if the heat dissipation effect of the LED lamp is poor, the temperature of an LED chip can be rapidly increased to influence the service life of the LED chip, even the LED chip can be burnt, so the problem that the heat dissipation of the LED lamp is the premise that the lamp has long service life is solved, and the existing LED lamp is generally made of aluminum materials into heat dissipation fins so as to dissipate heat and has poor heat dissipation effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor LED lamps and lanterns heat radiation structure, the LED lamps and lanterns that aim at solving current among the prior art adopt the aluminum product to make into heat radiation fins generally to dispel the heat, the relatively poor technical problem of radiating effect.
In order to achieve the above object, the utility model discloses a pair of semiconductor LED lamp heat radiation structure, including lamp shade, shell, lamp stand, lamp body, automatically controlled box, heat conduction post, heating panel and heat abstractor, the shell with the connection can be dismantled to the lamp stand, automatically controlled box with the heating panel is located in the shell, be provided with in the lamp stand the lamp body, automatically controlled box is located one side of lamp stand, the lamp stand upper shield is equipped with the lamp shade, automatically controlled box includes circuit board and box body, the box body with lamp stand fixed connection, the circuit board is located in the box body, the circuit board with lamp body electric connection, be provided with on the circuit board the heat conduction post, be provided with the through-hole on the box body, the heat conduction post is kept away from the one end of circuit board is passed the through-hole, and with heating panel fixed connection, heat abstract, Pivot and flabellum, the pivot with the shell rotates to be connected, and is located the heating panel is kept away from one side of automatically controlled box, the motor with shell fixed connection, and be located the inside of shell, the motor with circuit board electric connection, the output pot head of motor is equipped with the pivot, be provided with in the pivot the flabellum, be provided with the vent on the shell, the vent with heat abstractor is corresponding.
The lampshade comprises a connecting frame and a cover body, the connecting frame is connected with the lamp holder in a sliding mode, the cover body is fixedly connected with the connecting frame and located on one side, away from the lamp holder, of the connecting frame, a clamping block is arranged on the connecting frame, a clamping groove is formed in the lamp holder, and the clamping block corresponds to the clamping groove.
The lamp holder comprises a holder body and two connecting blocks, the holder body is fixedly connected with the box body, each connecting block is respectively located on two sides of the holder body, a groove body is arranged on the holder body, the lamp body is located in the groove body, each connecting block is provided with a threaded hole, and the connecting blocks are in threaded connection with the shell.
The number of the heat conduction columns is multiple, and the heat conduction columns are uniformly distributed at four end points of the circuit board.
The number of the heat dissipation devices is multiple, and the heat dissipation devices are uniformly distributed in the shell.
The lamp body and the groove body are in multiple numbers, the lamp body and the groove body are in the same number, and the multiple lamp bodies are distributed in the groove body in an array mode.
And a heat dissipation coating is coated in each groove body.
The heat dissipation device comprises a shell, a motor and a plurality of heat dissipation devices, wherein the shell is provided with a placing plate, the placing plate is fixedly connected with the motor and is positioned below the motor, the heat dissipation devices further comprise a plurality of motor protection covers, each motor protection cover is detachably connected with the placing plate and is positioned above the placing plate and covers the outside of the motor.
The beneficial effects of the utility model are embodied in: the heat-conducting column is arranged on the circuit board, the box body is provided with a through hole, one end of the heat-conducting column, far away from the circuit board, penetrates through the through hole to be fixedly connected with the heat-radiating plate, the rotating shaft is rotatably connected with the shell and is positioned at one side of the heat-radiating plate, far away from the electric control box, the motor is electrically connected with the circuit board, the rotating shaft is sleeved at the output end of the motor, the fan blade is arranged on the rotating shaft, the shell is provided with a ventilation opening, the ventilation opening corresponds to the heat-radiating device, the heat-conducting column conducts the heat in the circuit board to the heat-radiating plate, the motor drives the rotating shaft to rotate so as to drive the fan blade to rotate, the air circulation rate of the heat-radiating plate is enhanced, the heat-, so that the heat dissipation effect is further enhanced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of the heat dissipation structure of the semiconductor LED lamp of the present invention.
Fig. 2 is a structural sectional view taken along line a-a of fig. 1 according to the present invention.
Fig. 3 is a schematic structural view of the heat dissipation structure of the semiconductor LED lamp of the present invention when the lamp cover is not installed.
Fig. 4 is a schematic structural diagram of the heat dissipation device of the present invention.
1-lampshade, 2-shell, 3-lamp holder, 4-lamp body, 5-electric control box, 6-heat conducting column, 7-heat radiating plate, 8-heat radiating device, 51-circuit board, 52-box body, 53-through hole, 81-motor, 82-rotating shaft, 83-fan blade, 21-ventilation opening, 11-connecting frame, 12-cover body, 13-clamping block, 31-clamping groove, 32-seat body, 33-connecting block, 34-groove body, 35-threaded hole, 36-heat radiating coating, 22-placing plate and 811-motor protecting cover.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 4, the present invention provides a heat dissipation structure for a semiconductor LED lamp, including a lamp cover 1, a housing 2, a lamp holder 3, a lamp body 4, an electronic control box 5, a heat conduction column 6, a heat dissipation plate 7 and a heat dissipation device 8, wherein the housing 2 is detachably connected to the lamp holder 3, the electronic control box 5 and the heat dissipation plate 7 are located in the housing 2, the lamp body 4 is disposed in the lamp holder 3, the electronic control box 5 is located at one side of the lamp holder 3, the lamp cover 1 is disposed on the lamp holder 3, the electronic control box 5 includes a circuit board 51 and a box 52, the box 52 is fixedly connected to the lamp holder 3, the circuit board 51 is located in the box 52, the circuit board 51 is electrically connected to the lamp body 4, the heat conduction column 6 is disposed on the circuit board 51, a through hole 53 is disposed on the box 52, one end of the heat conduction column 6 far from the circuit board 51 passes, and with heating panel 7 fixed connection, heat abstractor 8 includes motor 81, pivot 82 and flabellum 83, pivot 82 with shell 2 rotates to be connected, and is located heating panel 7 is kept away from one side of automatically controlled box 5, motor 81 with shell 2 fixed connection, and is located the inside of shell 2, motor 81 with circuit board 51 electric connection, motor 81's output pot head is equipped with pivot 82, be provided with on the pivot 82 flabellum 83, be provided with vent 21 on the shell 2, vent 21 with heat abstractor 8 is corresponding.
In this embodiment, the heat conducting post 6 is disposed on the circuit board 51, the box 52 is disposed with a through hole 53, one end of the heat conducting post 6 far away from the circuit board 51 passes through the through hole 53 and is fixedly connected with the heat dissipating plate 7, the heat dissipating device 8 includes a motor 81, a rotating shaft 82 and fan blades 83, the rotating shaft 82 is rotatably connected with the housing 2 and is located at one side of the heat dissipating plate 7 far away from the electronic control box 5, the motor 81 is fixedly connected with the housing 2 and is located inside the housing 2, the motor 81 is electrically connected with the circuit board 51, the output end of the motor 81 is sleeved with the rotating shaft 82, the fan blades 83 are disposed on the rotating shaft 82, the housing 2 is disposed with a vent 21, the vent 21 corresponds to the heat dissipating device 8, the heat conducting post 6 conducts the heat in the circuit board 51 to the heat dissipating plate 7, the motor 81 drives the rotating shaft 82 to rotate, so that the fan blades 83 are driven to rotate, the air circulation rate of the heat dissipation plate 7 is increased, the heat dissipation effect is accelerated, and the ventilation opening 21 in the shell 2 further increases the air circulation effect, so that the heat dissipation effect is further increased.
Further, the lamp shade 1 includes a connection frame 11 and a cover body 12, the connection frame 11 with 3 sliding connection of lamp stand, the cover body 12 with 11 fixed connection of connection frame, and be located the connection frame 11 is kept away from one side of lamp stand 3, be provided with fixture block 13 on the connection frame 11, be provided with draw-in groove 31 on the lamp stand 3, fixture block 13 with draw-in groove 31 is corresponding.
In the present embodiment, the fixture block 13 is disposed on the lamp housing 1, the slot 31 is disposed on the lamp holder 3, and the fixture block 13 only needs to be engaged with the slot 31 when the lamp housing 1 is installed, so that the operation is very convenient,
further, the lamp holder 3 includes a base 32 and two connecting blocks 33, the base 32 with the box body 52 is fixedly connected, each connecting block 33 is located respectively at two sides of the base 32, a groove 34 is provided on the base 32, the lamp body 4 is located in the groove 34, each connecting block 33 is provided with a threaded hole 35, and the connecting block 33 is in threaded connection with the housing 2.
In this embodiment, the two connecting blocks 33 and the seat body 32 are both fixedly connected, and are integrally formed during production, so that the structure is firmer.
Further, the number of the heat conduction columns 6 is plural, and the plural heat conduction columns 6 are uniformly distributed at four end points of the circuit board 51.
In the present embodiment, the number of the heat conduction columns 6 is plural, so that the rate of conducting the heat on the circuit board 51 to the heat dissipation plate 7 is faster.
Further, the number of the heat dissipation devices 8 is plural, and the plural heat dissipation devices 8 are uniformly distributed in the interior of the housing 2.
In this embodiment, the number of the heat dissipating devices 8 is plural, and the air flow rate on the surface of the heat dissipating plate 7 is further increased, so that the heat dissipating effect is improved.
Further, the number of the lamp bodies 4 and the number of the slots 34 are both multiple, the number of the lamp bodies 4 is the same as that of the slots 34, and the multiple lamp bodies 4 are distributed in the slots 34 in an array manner.
In this embodiment, the plurality of lamp bodies 4 are arrayed in the groove 34, so that the light source is stronger and the irradiation effect is better.
Further, a heat dissipation coating 36 is coated in each groove 34.
In this embodiment, the heat dissipation coating 36 is a radiation heat dissipation coating, and the radiation heat dissipation coating has the characteristics of good self-cleaning property, insulation property, corrosion resistance, water resistance, acid and alkali resistance, and convenience in construction while achieving radiation cooling.
Further, a placing plate 22 is arranged on the housing 2, the placing plate 22 is fixedly connected with the motor 81 and is located below the motor 81, the heat dissipation device 8 further comprises a plurality of motor protection covers 811, each motor protection cover 811 is detachably connected with the placing plate 22 and is located above the placing plate 22 and covers the outside of each motor 81.
In the present embodiment, the motor protection cover 811 protects the motor 81 from dust that enters the housing 2 through the ventilation opening 21 in the housing 2 from the outside, thereby increasing the service life of the motor 81.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A heat dissipation structure of a semiconductor LED lamp is characterized in that,
the lamp comprises a lampshade, a shell, a lamp holder, a lamp body, an electric control box, a heat conducting column, a heat radiating plate and a heat radiating device, wherein the shell is detachably connected with the lamp holder, the electric control box and the heat radiating plate are positioned in the shell, the lamp body is arranged in the lamp holder, the electric control box is positioned on one side of the lamp holder, the lampshade is covered on the lamp holder, the electric control box comprises a circuit board and a box body, the box body is fixedly connected with the lamp holder, the circuit board is positioned in the box body, the circuit board is electrically connected with the lamp body, the heat conducting column is arranged on the circuit board, a through hole is formed in the box body, one end, far away from the circuit board, of the heat conducting column penetrates through the through hole and is fixedly connected with the heat radiating plate, the heat radiating device comprises a motor, a rotating shaft and fan blades, the motor with shell fixed connection to be located the inside of shell, the motor with circuit board electric connection, the output pot head of motor is equipped with the pivot, be provided with in the pivot the flabellum, be provided with the vent on the shell, the vent with heat abstractor is corresponding.
2. The semiconductor LED lamp heat dissipation structure of claim 1,
the lampshade comprises a connecting frame and a cover body, the connecting frame is in sliding connection with the lamp holder, the cover body is fixedly connected with the connecting frame and is located on one side, away from the lamp holder, of the connecting frame, a clamping block is arranged on the connecting frame, a clamping groove is formed in the lamp holder, and the clamping block corresponds to the clamping groove.
3. The semiconductor LED lamp heat dissipation structure of claim 1,
the lamp holder includes pedestal and two connecting blocks, the pedestal with box body fixed connection, every the connecting block is located respectively the both sides of pedestal, be provided with the cell body on the pedestal, the lamp body is located in the cell body, every all be provided with the screw hole on the connecting block, the connecting block with shell threaded connection.
4. The semiconductor LED lamp heat dissipation structure of claim 1,
the number of the heat conduction columns is multiple, and the heat conduction columns are uniformly distributed at four end points of the circuit board.
5. The semiconductor LED lamp heat dissipation structure of claim 3,
the number of the heat dissipation devices is multiple, and the heat dissipation devices are uniformly distributed in the shell.
6. The semiconductor LED lamp heat dissipation structure of claim 3,
the lamp body with the quantity of cell body is a plurality of, the lamp body with the quantity of cell body is the same, and a plurality of the lamp body array distributes in the cell body.
7. The semiconductor LED lamp heat dissipation structure of claim 6,
and a heat dissipation coating is coated in each groove body.
8. The semiconductor LED lamp heat dissipation structure of claim 5,
the heat dissipation device comprises a shell, and is characterized in that a placing plate is arranged on the shell, the placing plate is fixedly connected with a motor and is located below the motor, the heat dissipation device further comprises a plurality of motor protection covers, and each motor protection cover is respectively detachably connected with the placing plate and is located above the placing plate and respectively covered with each motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022180363.1U CN212805391U (en) | 2020-09-28 | 2020-09-28 | Semiconductor LED lamp heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022180363.1U CN212805391U (en) | 2020-09-28 | 2020-09-28 | Semiconductor LED lamp heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212805391U true CN212805391U (en) | 2021-03-26 |
Family
ID=75090286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022180363.1U Expired - Fee Related CN212805391U (en) | 2020-09-28 | 2020-09-28 | Semiconductor LED lamp heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212805391U (en) |
-
2020
- 2020-09-28 CN CN202022180363.1U patent/CN212805391U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210326 |