CN212694226U - Driving display chip and display module - Google Patents
Driving display chip and display module Download PDFInfo
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- CN212694226U CN212694226U CN202021418482.XU CN202021418482U CN212694226U CN 212694226 U CN212694226 U CN 212694226U CN 202021418482 U CN202021418482 U CN 202021418482U CN 212694226 U CN212694226 U CN 212694226U
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Abstract
The embodiment of the utility model discloses drive display chip and display module assembly, this drive display chip include the chip body, the chip body includes: the chip pins are arranged on one side of the chip body; the first bonding pad is provided with a plurality of first bonding pad binding terminals and is arranged on one side of the chip body, which is far away from the chip pins; and the chip pins and the first bonding pad binding terminals are electrically connected in a one-to-one corresponding mode through the first connecting structures. The embodiment of the utility model provides a pair of drive display chip and display module assembly can reduce the frame width on the basis that does not change the linewidth to in can being applicable to various chip packaging technology, can also integrate mutually with cover plate glass simultaneously, wholly reduce display module assembly's frame.
Description
Technical Field
The embodiment of the utility model provides a relate to display panel technical field, especially relate to a drive display chip and display module assembly.
Background
In daily life, electronic devices play an increasingly important role, and users have increasingly strict requirements on display panels of electronic devices, and are particularly favored for display panels with full-screen and narrow frames.
In the prior art, the frame is usually reduced by reducing the line width distance, the chip package size and the size of the binding area, but for a small-size model, the lower frame is still wider, exemplarily, fig. 1 is a schematic diagram of a display panel size structure in the prior art, as shown in fig. 1, an Incell model includes a color film substrate 1, an array substrate 2, a driving chip 3, a flexible circuit board 4 and a display area 5, a lower frame a of the color film substrate is 1.2mm, a lower frame B of the array substrate is 2.8mm, and the whole lower frame reaches 4 mm.
The mode of reducing the frame is realized by reducing the line width and line distance, reducing the chip packaging size and binding the area, the reduction space is limited, the safety test of a high-temperature high-humidity test system is required, and meanwhile, the damage and the scrapping of products are easily caused, so that the yield is low.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a drive display chip and display module assembly, its aim at reduces the frame width on the basis that does not reduce the linewidth.
To achieve the above object, in a first aspect, an embodiment of the present invention provides a driving display chip, which includes a chip body, the chip body includes:
the chip pins are arranged on one side of the chip body;
the first bonding pad is provided with a plurality of first bonding pad binding terminals and is arranged on one side of the chip body, which is far away from the chip pins;
and the chip pins and the first bonding pad binding terminals are electrically connected in a one-to-one corresponding mode through the first connecting structures.
Optionally, the driving display chip further includes a first flexible circuit board; the first flexible circuit board comprises a second bonding pad and a second connecting structure, and a plurality of second bonding pad binding terminals are arranged in the second bonding pad; the second bonding pad is arranged on one side, far away from the first bonding pad, of the first flexible circuit board;
the second bonding pad comprises a chip driving bonding pad and a panel driving bonding pad; chip drive bonding pad binding terminals in the chip drive bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures; and panel driving bonding pad binding terminals in the panel driving bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures, the first bonding pads and the first connecting structures.
Optionally, an arrangement period of the chip driving pad binding terminals in the chip driving pads is less than an arrangement period of the panel driving pad binding terminals in the panel driving pads.
Optionally, the first connection structure includes a via or a metal trace penetrating through the chip body; the second connecting structure comprises a via hole or a metal wire penetrating through the first flexible circuit board.
Optionally, the driving display chip further includes a second flexible circuit board; the second flexible circuit board is arranged on one side, far away from the chip body, of the first flexible circuit board, and comprises a third bonding pad, and a plurality of third bonding pad binding terminals are arranged in the third bonding pad; and the second flexible circuit board is bound with the second bonding pad, so that a third bonding pad binding terminal in the third bonding pad is electrically connected with a panel driving bonding pad binding terminal in the panel driving bonding pad in a one-to-one correspondence manner.
In a second aspect, an embodiment of the present invention further provides a display module, where the display module includes the driving display chip according to any one of the first aspect, and further includes a display panel;
the display panel comprises an array substrate, the array substrate comprises a display area and a non-display area surrounding the display area, and a fourth bonding pad is arranged in the non-display area; the fourth bonding pad is internally provided with a plurality of fourth bonding pad binding terminals, and the driving display chip is bound on the fourth bonding pad, so that a plurality of chip pins on the driving display chip are electrically connected with the fourth bonding pad binding terminals in the fourth bonding pad in a one-to-one correspondence manner.
Optionally, the display module further includes a third flexible circuit board, where the third flexible circuit board is disposed on a side of the driving display chip away from the display panel;
the third flexible circuit board comprises a fifth bonding pad, and a plurality of fifth bonding pad binding terminals are arranged in the fifth bonding pad;
and the third flexible circuit board is bound with the first bonding pad, so that fifth buccal tablet binding terminals in the fifth bonding pad are electrically connected with chip pins in the driving display chip in a one-to-one correspondence manner.
Optionally, the driving display chip further includes a first flexible circuit board;
the first flexible circuit board comprises a second bonding pad and a second connecting structure, and a plurality of second bonding pad binding terminals are arranged in the second bonding pad; the second bonding pad is arranged on one side, far away from the first bonding pad, of the first flexible circuit board;
the second bonding pad comprises a chip driving bonding pad and a panel driving bonding pad; chip drive bonding pad binding terminals in the chip drive bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures; the panel driving bonding pad binding terminals in the panel driving bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures, the first bonding pads and the first connecting structures;
the display module further comprises a fourth flexible circuit board, and the fourth flexible circuit board is arranged on one side, far away from the display panel, of the first flexible circuit board; the fourth flexible circuit board comprises a sixth bonding pad, and a plurality of sixth bonding pad binding terminals are arranged in the sixth bonding pad;
and the fourth flexible circuit board is bound with the second bonding pad, so that a sixth bonding pad binding terminal in the sixth bonding pad is electrically connected with a panel driving bonding pad binding terminal in the panel driving bonding pad in a one-to-one correspondence manner.
Optionally, the display module further comprises a glass cover plate, and the glass cover plate is attached to the light-emitting side of the display panel;
the glass cover plate comprises a first surface facing one side of the display panel, the first surface is provided with a touch control routing line, a seventh bonding pad and an eighth bonding pad which are arranged in an edge area, and a plurality of seventh bonding pad binding terminals and eighth bonding pad binding terminals are respectively arranged in the seventh bonding pad and the eighth bonding pad;
the eighth bonding pad comprises a display bonding pad and a touch bonding pad, a display bonding pad bonding terminal in the display bonding pad is electrically connected with a seventh bonding pad bonding terminal in the seventh bonding pad through a wire, and a touch bonding pad bonding terminal of the touch bonding pad is electrically connected with the touch wire through a wire;
the first bonding pad of the driving display chip is attached to the first surface of the glass cover plate through various special-shaped conductive adhesives, and the first bonding pad binding terminal of the first bonding pad is electrically connected with the seventh bonding pad binding terminal of the seventh bonding pad in a one-to-one correspondence mode.
Optionally, the touch trace includes a plurality of touch driving electrodes and a plurality of touch sensing electrodes;
the touch driving electrodes and the touch sensing electrodes are mutually insulated and crossed;
one ends of the touch driving electrodes and one ends of the touch sensing electrodes are respectively and electrically connected with the touch binding pad binding terminals in the touch binding pads in a one-to-one correspondence mode.
The embodiment of the utility model discloses drive display chip and display module assembly, through setting up first pad and a plurality of chip pin respectively on the different two sides of chip body to bind the terminal one-to-one electricity through first connection structure with the first pad in chip pin and the first pad and be connected, can utilize first pad to set up flexible circuit board on the chip, thereby eliminated the distance between chip and the flexible circuit board in the traditional design, and then reduced display module assembly's frame width. Moreover, through the design, the chip can be suitable for various modules with reduced frames, and has universal applicability.
Drawings
FIG. 1 is a schematic diagram of a prior art display panel size structure;
fig. 2 is a schematic structural diagram of a driving display chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another driving display chip according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another driving display chip according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a display module according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of another display module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another display module according to an embodiment of the present invention;
fig. 8 is a partial top view of a second bonding pad provided by an embodiment of the present invention;
fig. 9 is a schematic structural diagram of another display module according to an embodiment of the present invention;
fig. 10 is a schematic view of a cover glass routing according to an embodiment of the present invention.
The reference numerals are explained below:
a chip body-10; chip pin-11; a first pad binding terminal-12; a first connecting structure-13; a first flexible circuit board-20; a second pad binding terminal-22; a second connecting structure-23; panel driver pad binding terminal-221; chip driver pad bonding terminal-222; a second flexible circuit board-30; third pad binding terminal-32; display area-100; non-display area-200; driving a display chip-40; a display panel-50; an array substrate-51; a color film substrate-52; optical cement-53; a glass cover plate-54; a liquid crystal layer-55; fourth pad binding terminal-56; a third flexible circuit board-60; a fifth pad binding terminal-62; a fourth flexible circuit board-70; a sixth pad binding terminal-72; a flexible circuit board-90; a glass cover plate-101; a seventh pad bonding terminal-102; eighth pad binding terminal-103; displaying a bonding pad bonding terminal-1031; touch bonding pad bonding terminal-1032; touch drive electrode-TX; touch sensing electrode-RX
Detailed Description
In order to make the technical problem solved, the technical solution adopted and the technical effect achieved by the embodiments of the present invention clearer, the technical solution of the present invention is further described below by referring to the accompanying drawings and by means of specific embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the relevant portions of the present invention are shown in the drawings.
Fig. 2 is a schematic structural diagram of a driving display chip provided in an embodiment of the present invention, as shown in fig. 2, a driving display chip, including a chip body 10, the chip body 10 includes:
the chip pins 11 are arranged on one side of the chip body 10;
the chip comprises a first bonding pad, a second bonding pad and a plurality of bonding pads, wherein the first bonding pad is provided with a plurality of first bonding pad binding terminals 12 and is arranged on one side of a chip body 10 far away from chip pins 11;
the first connection structures 13, the chip pins 11 and the first pad bonding terminals 12 are electrically connected in a one-to-one correspondence through the first connection structures 13.
A pin refers to a connection that is drawn from within the integrated circuit to connect with peripheral circuitry. The embodiment of the utility model discloses a drive display chip, through setting up chip pin 11 and first pad respectively in the both sides of chip body 10, and bind terminal 12 through first connection structure 13 with the first pad in chip pin 11 and the first pad and be connected, make first pad and a plurality of chip pin 11 intercommunication, can set up the flexible circuit board on the chip, the width of module frame has been reduced greatly, and can not change the line width of line connection, can reduce the interval between chip and the flexible circuit board on the one hand, realize narrow frame, on the other hand, guarantee the line width of interconnecting link, improve the stability of circuit. And simultaneously, the embodiment of the utility model provides a pair of drive display chip can be applicable to among the various display panel that have the narrow frame demand, has universal relevance nature.
Optionally, fig. 3 is a schematic structural diagram of another driving display chip provided in the embodiment of the present invention, and as shown in fig. 3, the driving display chip further includes a first flexible circuit board 20; the first flexible circuit board 20 includes a second land in which a plurality of second land binding terminals 22 are disposed, and a second connection structure 23; the second pad is arranged on one side of the first flexible circuit board 20 far away from the first pad;
the second bonding pad comprises a chip driving bonding pad and a panel driving bonding pad; the chip driving pad binding terminals 222 in the chip driving pads are electrically connected with the chip pins 11 in a one-to-one correspondence manner through the second connection structures 23; the panel driving pad binding terminals 221 among the panel driving pads are electrically connected to the chip pins 11 through the second connection structures 23, the first pads, and the first connection structures 13 in a one-to-one correspondence.
The embodiment of the utility model provides a pair of drive display chip, can directly set up first flexible circuit board 20 on drive display chip, wherein, first flexible circuit board 20 is connected with chip body 10 through first pad, first pad is connected with part chip pin 11 again through first connection structure 13, thereby make in chip design process, first flexible circuit board 20 can directly be connected with part chip pin 11, make with man-hour, can directly be with first flexible circuit board 20 and chip body 10 integrated into one piece, when binding drive display chip, can bind flexible circuit board simultaneously, save the process flow, work load is bound in the reduction, reduce whole regional width of binding. Illustratively, the pins 11 on the chip body 10 are led to the first pads above the chip body 10 through the first connection structures 13, and meanwhile, the pins of the first flexible circuit board 20 are bound with the first pads, so as to achieve the purpose that the first flexible circuit board 20 is disposed on the chip body 10.
Further, the first flexible circuit board 20 further includes a second bonding pad and a second connection structure 23, and the second bonding pad is disposed on a side of the first flexible circuit board 20 away from the first bonding pad, so that the first flexible circuit board 20 can be further bound with other components in the system, and functions of the first flexible circuit board 20 are expanded. Illustratively, the first flexible circuit board 20 may also be bound to circuit boards in the system. The second pad is divided into a chip driving pad and a panel driving pad, and the chip driving pad is connected to the chip pin 11 through the second connection structure 23, so that a signal is input to the inside of the chip, and the panel driving pad is connected to the chip pin 11 through the second connection structure 23, the first pad and the first connection structure 13, so that a signal is input to the driving circuit.
Alternatively, the arrangement period of the chip driving pad binding terminals 222 in the chip driving pads is shorter than the arrangement period of the panel driving pad binding terminals 221 in the panel driving pads.
Illustratively, as shown in fig. 3, the chip driving pads and the panel driving pads are distributed in a trapezoid, the period C1 of the chip driving pad bonding terminal 222 is set to 60um, and the period C2 of the panel driving pad bonding terminal 221 is set to 120 um. By arranging the second bonding pad binding terminal 22 above the first flexible circuit board 20, the problem of difficulty in integration caused by too small size of the driving display chip or too many pins is avoided, the difficulty in integration is simplified, and the production is facilitated.
Optionally, the first connection structure 13 includes a via or a metal trace penetrating through the chip body 10; the second connection structure 23 includes a via or a metal trace that penetrates the first flexible circuit board 20.
Set up first connection structure 13 and walk the line for the via hole or the metal that run through chip body 10, make things convenient for the pin of chip body 10 to pass, based on the same reason, set up second connection structure 23 and walk the line for the via hole or the metal that run through first flexible circuit board 20, made things convenient for the pin of first flexible circuit board 20 to pass first flexible circuit board 20. Illustratively, the first connection structure 13 is a via hole penetrating through the chip body 10, through which a pin of the chip body 10 simply and conveniently penetrates through the chip body to be electrically connected with the first flexible circuit board 20; the second connecting structure 23 is a via hole penetrating through the first flexible circuit board 23, and through the via hole, the pin of the first flexible circuit board 20 simply and conveniently penetrates through the flexible circuit board 20 to be connected with the chip body 10.
Optionally, fig. 4 is a schematic structural diagram of another driving display chip provided in the embodiment of the present invention, and as shown in fig. 4, the driving display chip further includes a second flexible circuit board 30;
the second flexible circuit board 30 is arranged on one side of the first flexible circuit board 20 far away from the chip body 10, the second flexible circuit board 30 comprises a third bonding pad, and a plurality of third bonding pad binding terminals 32 are arranged in the third bonding pad;
the second flexible circuit board 30 is bonded to the second pad such that the third pad bonding terminals 32 in the third pad are electrically connected to the panel driving pad bonding terminals 221 in a one-to-one correspondence.
Through setting up second flexible circuit board 30, and set up second flexible circuit board 30 and have the third pad, can make second flexible circuit board 30 be connected with first flexible circuit board 20, it is concrete, second flexible circuit board 30 binds terminal 221 one-to-one electricity through the third pad and binds terminal 32 and the panel drive pad in the second pad and is connected, make first flexible circuit board 20 not only can be connected with the drive display chip electricity, can also be connected with second flexible circuit board electricity, the integration level is improved, the simplified process production, and the efficiency is improved.
Fig. 5 is a schematic structural view of a display module according to an embodiment of the present invention, and as shown in fig. 5, a display module includes a driving display chip 40 as described above, and further includes a display panel 50;
the display panel 50 includes an array substrate 51, the array substrate 51 includes a display area 100 and a non-display area 200 surrounding the display area, and a fourth pad is disposed in the non-display area 200;
the fourth bonding pad is provided with a plurality of fourth bonding pad binding terminals 56, and the driving display chip 40 is bound on the fourth bonding pad, so that a plurality of chip pins on the driving display chip 40 are electrically connected with the fourth bonding pad binding terminals 56 in the fourth bonding pad in a one-to-one correspondence manner.
Illustratively, the display panel 50 includes a liquid crystal display panel, which includes a glass cover 54, an optical adhesive 53, a color filter substrate 52, an array substrate 51, and a liquid crystal layer 55. The fourth bonding pad is arranged on one side, located on the non-display area 200, of the array substrate 51, the terminals 56 are bound by the aid of the fourth bonding pads in the fourth bonding pad, the driving display chip 40 is bound, simplicity and convenience are achieved, and manufacturing difficulty is reduced.
Optionally, fig. 6 is a schematic structural diagram of another display module according to an embodiment of the present invention, and as shown in fig. 6, the display module further includes a third flexible circuit board 60, where the third flexible circuit board 60 is disposed on a side of the driving display chip 40 away from the display panel;
the third flexible circuit board 60 includes a fifth land in which a plurality of fifth land binding terminals 62 are disposed;
the third flexible circuit board 60 is bonded to the first bonding pad, so that the fifth bonding pad bonding terminal 62 in the fifth bonding pad is electrically connected to the chip pin in the driving display chip 40 in a one-to-one correspondence manner.
Set up third flexible circuit board 60 in the display module assembly alone to set up the fifth pad at third flexible circuit board 60, bind terminal 62 through a plurality of fifth pads on the fifth pad, be connected third flexible circuit board 60 and the chip pin one-to-one in the drive display chip 40 is connected, can conveniently change third flexible circuit board 60 at any time, do benefit to the maintenance.
Optionally, fig. 7 is a schematic structural diagram of another display module provided in an embodiment of the present invention, and fig. 8 is a partial top view of a second pad provided in an embodiment of the present invention, as shown in fig. 7 and fig. 8, the driving display chip 40 further includes a first flexible circuit board 20;
the first flexible circuit board 20 includes a second land in which a plurality of second land binding terminals 22 are disposed, and a second connection structure 23; the second pad is arranged on one side of the first flexible circuit board 20 far away from the first pad;
the second bonding pad comprises a chip driving bonding pad and a panel driving bonding pad; the chip driving pad binding terminals 222 in the chip driving pads are electrically connected with the chip pins 11 in a one-to-one correspondence manner through the second connection structures 23; the panel driving pad binding terminals 221 in the panel driving pads are electrically connected with the chip pins 11 through the second connection structures 23, the first pad binding terminals 12 and the first connection structures 13 in a one-to-one correspondence manner;
the display module further includes a fourth flexible circuit board 70, wherein the fourth flexible circuit board 70 is disposed on a side of the first flexible circuit board 20 away from the display panel 50; the fourth flexible circuit board 70 includes a sixth pad in which a plurality of sixth pad binding terminals 72 are disposed;
the fourth flexible circuit board 70 is bonded to the second pad such that the sixth pad bonding terminal 72 of the sixth pad is electrically connected to the panel driving pad bonding terminal 221 of the panel driving pad in a one-to-one correspondence.
By arranging the first flexible circuit board 20 on the driving display chip, the process flow of binding the first flexible circuit board 20 on the driving display chip is reduced in the manufacturing process of the display module, the whole process manufacturing flow is improved, and the method of binding the first flexible circuit board 20 on the driving display chip is not repeated here. Further, the display module may further include a fourth flexible circuit board 70, and the sixth pad is disposed in the fourth flexible circuit board 70, so that the fourth flexible circuit board 70 can be connected with the second pad through the sixth pad binding terminal 72 in the sixth pad in a one-to-one correspondence manner, the binding process is simplified, and the overall width of the binding area is reduced.
Optionally, fig. 9 is a schematic structural view of another display module provided in an embodiment of the present invention, and fig. 10 is a schematic view of a cover glass routing provided in an embodiment of the present invention, as shown in fig. 9 and fig. 10, the display module further includes a glass cover plate 101, and the glass cover plate 101 is attached to the light-emitting side of the display panel 50;
the glass cover plate 101 includes a first surface facing one side of the display panel 50, the first surface is provided with a touch trace, and a seventh pad and an eighth pad which are arranged in an edge area, the seventh pad is provided with a plurality of seventh pad binding terminals 102, and the eighth pad is also provided with a plurality of eighth pad binding terminals 103;
the eighth pad comprises a display bonding pad and a touch bonding pad, a display bonding pad bonding terminal 1031 in the display bonding pad is electrically connected with a seventh pad bonding terminal 102 in the seventh pad through a wire, and a touch bonding pad bonding terminal 1032 of the touch bonding pad is electrically connected with a touch wire through a wire;
the first bonding pad of the driving display chip 40 is attached to the first surface of the glass cover plate 101 through various special-shaped conductive adhesives, and the first bonding pad binding terminal of the first bonding pad is electrically connected with the seventh bonding pad binding terminal 102 of the seventh bonding pad in a one-to-one correspondence manner.
Through setting up glass apron 101, can realize passing through glass apron 101 and drive display chip 40 the realization of the flexible circuit board of original integrated on array substrate and bind, further reduce the width of frame on array substrate 51. The driving display chip 40 is attached to the glass cover plate 101 through the special-shaped conductive adhesive, and the driving display chip 40 is electrically connected with a seventh bonding pad binding terminal 102 in seventh bonding pads on the glass cover plate 101 through a first bonding pad binding terminal on the first bonding pad, so that the driving display chip 40 is communicated with the glass cover plate 101. The flexible circuit board 90 is attached to the glass cover plate 101 through the special-shaped conductive adhesive, the flexible circuit board 90 is communicated with the display binding pad, further, the display binding pad binding terminal 1031 in the display binding pad is electrically connected with the seventh pad binding terminal 102 in the seventh pad, the purpose of electrically connecting the flexible circuit board 90 with the driving display chip 40 is achieved, the space for binding the flexible circuit board 90 on one side of the array substrate 51 is saved, and the width of the binding area is further saved. In addition, the touch binding pad binding terminal 1032 is arranged to be electrically connected with the touch routing wire through the routing wire, so that the touch controllability of the display module is realized, the functions of the display module are enriched, and the user experience is improved.
Optionally, with continued reference to fig. 9, the touch trace includes a plurality of touch driving electrodes TX and a plurality of touch sensing electrodes RX;
the touch driving electrodes TX and the touch sensing electrodes RX are mutually insulated and crossed;
one ends of the touch driving electrodes TX and one ends of the touch sensing electrodes RX are electrically connected to the touch bonding pad bonding terminals 1032 of the touch bonding pads in a one-to-one correspondence manner, respectively.
For example, by adopting the design of 1TX × 1RX, one end of each of the plurality of touch electrodes TX and the plurality of touch sensing electrodes RX is respectively and electrically connected to the touch bonding pad bonding terminals 1032 in the touch bonding pad in a one-to-one correspondence manner, so that the touch driving electrodes TX are only distributed on one side, the lead of the touch driving electrode TX on the other side does not need to be pulled out, the space of the bonding area is saved, and only one flexible circuit board is needed to implement the touch and display functions.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.
Claims (10)
1. The utility model provides a drive display chip, includes the chip body, its characterized in that, the chip body includes:
the chip pins are arranged on one side of the chip body;
the first bonding pad is provided with a plurality of first bonding pad binding terminals and is arranged on one side of the chip body, which is far away from the chip pins;
and the chip pins and the first bonding pad binding terminals are electrically connected in a one-to-one corresponding mode through the first connecting structures.
2. The driving display chip according to claim 1, wherein the driving display chip further comprises a first flexible circuit board; the first flexible circuit board comprises a second bonding pad and a second connecting structure, and a plurality of second bonding pad binding terminals are arranged in the second bonding pad; the second bonding pad is arranged on one side, far away from the first bonding pad, of the first flexible circuit board;
the second bonding pad comprises a chip driving bonding pad and a panel driving bonding pad; chip drive bonding pad binding terminals in the chip drive bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures; and panel driving bonding pad binding terminals in the panel driving bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures, the first bonding pads and the first connecting structures.
3. The driving display chip according to claim 2, wherein an arrangement period of the chip driving pad bonding terminals among the chip driving pads is shorter than an arrangement period of the panel driving pad bonding terminals among the panel driving pads.
4. The driving display chip according to claim 2, wherein the first connection structure comprises a via or a metal trace penetrating the chip body; the second connecting structure comprises a via hole or a metal wire penetrating through the first flexible circuit board.
5. The driving display chip according to claim 2, wherein the driving display chip further comprises a second flexible circuit board;
the second flexible circuit board is arranged on one side, far away from the chip body, of the first flexible circuit board, and comprises a third bonding pad, and a plurality of third bonding pad binding terminals are arranged in the third bonding pad;
and the second flexible circuit board is bound with the second bonding pad, so that a third bonding pad binding terminal in the third bonding pad is electrically connected with a panel driving bonding pad binding terminal in the panel driving bonding pad in a one-to-one correspondence manner.
6. A display module comprising the driving display chip of any one of claims 1 to 5, and further comprising a display panel;
the display panel comprises an array substrate, the array substrate comprises a display area and a non-display area surrounding the display area, and a fourth bonding pad is arranged in the non-display area;
the fourth bonding pad is internally provided with a plurality of fourth bonding pad binding terminals, and the driving display chip is bound on the fourth bonding pad, so that a plurality of chip pins on the driving display chip are electrically connected with the fourth bonding pad binding terminals in the fourth bonding pad in a one-to-one correspondence manner.
7. The display module according to claim 6, further comprising a third flexible circuit board disposed on a side of the driving display chip away from the display panel;
the third flexible circuit board comprises a fifth bonding pad, and a plurality of fifth bonding pad binding terminals are arranged in the fifth bonding pad;
and the third flexible circuit board is bound with the first bonding pad, so that a fifth bonding pad binding terminal in the fifth bonding pad is electrically connected with chip pins in the driving display chip in a one-to-one correspondence manner.
8. The display module of claim 6, wherein the driving display chip further comprises a first flexible circuit board;
the first flexible circuit board comprises a second bonding pad and a second connecting structure, and a plurality of second bonding pad binding terminals are arranged in the second bonding pad; the second bonding pad is arranged on one side, far away from the first bonding pad, of the first flexible circuit board;
the second bonding pad comprises a chip driving bonding pad and a panel driving bonding pad; chip drive bonding pad binding terminals in the chip drive bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures; the panel driving bonding pad binding terminals in the panel driving bonding pads are electrically connected with the chip pins in a one-to-one correspondence mode through the second connecting structures, the first bonding pads and the first connecting structures;
the display module further comprises a fourth flexible circuit board, and the fourth flexible circuit board is arranged on one side, far away from the display panel, of the first flexible circuit board; the fourth flexible circuit board comprises a sixth bonding pad, and a plurality of sixth bonding pad binding terminals are arranged in the sixth bonding pad;
and the fourth flexible circuit board is bound with the second bonding pad, so that a sixth bonding pad binding terminal in the sixth bonding pad is electrically connected with a panel driving bonding pad binding terminal in the panel driving bonding pad in a one-to-one correspondence manner.
9. The display module according to claim 6, further comprising a glass cover plate attached to the light exit side of the display panel;
the glass cover plate comprises a first surface facing one side of the display panel, the first surface is provided with a touch control routing line, a seventh bonding pad and an eighth bonding pad which are arranged in an edge area, and a plurality of seventh bonding pad binding terminals and eighth bonding pad binding terminals are respectively arranged in the seventh bonding pad and the eighth bonding pad;
the eighth bonding pad comprises a display bonding pad and a touch bonding pad, a display bonding pad bonding terminal in the display bonding pad is electrically connected with a seventh bonding pad bonding terminal in the seventh bonding pad through a wire, and a touch bonding pad bonding terminal of the touch bonding pad is electrically connected with the touch wire through a wire;
the first bonding pad of the driving display chip is attached to the first surface of the glass cover plate through various special-shaped conductive adhesives, and the first bonding pad binding terminal of the first bonding pad is electrically connected with the seventh bonding pad binding terminal of the seventh bonding pad in a one-to-one correspondence mode.
10. The display module as claimed in claim 9, wherein the touch trace comprises a plurality of touch driving electrodes and a plurality of touch sensing electrodes;
the touch driving electrodes and the touch sensing electrodes are mutually insulated and crossed;
one ends of the touch driving electrodes and one ends of the touch sensing electrodes are respectively and electrically connected with the touch binding pad binding terminals in the touch binding pads in a one-to-one correspondence mode.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021418482.XU CN212694226U (en) | 2020-07-17 | 2020-07-17 | Driving display chip and display module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021418482.XU CN212694226U (en) | 2020-07-17 | 2020-07-17 | Driving display chip and display module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113053846A (en) * | 2021-03-19 | 2021-06-29 | 云南创视界光电科技有限公司 | Chip and display module with same |
| CN113991376A (en) * | 2021-09-30 | 2022-01-28 | 歌尔光学科技有限公司 | DMD assembly, DLP optical machine module and DLP projector |
-
2020
- 2020-07-17 CN CN202021418482.XU patent/CN212694226U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113053846A (en) * | 2021-03-19 | 2021-06-29 | 云南创视界光电科技有限公司 | Chip and display module with same |
| CN113991376A (en) * | 2021-09-30 | 2022-01-28 | 歌尔光学科技有限公司 | DMD assembly, DLP optical machine module and DLP projector |
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