CN212676004U - Detection resistor and mainboard - Google Patents
Detection resistor and mainboard Download PDFInfo
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- CN212676004U CN212676004U CN202021512071.7U CN202021512071U CN212676004U CN 212676004 U CN212676004 U CN 212676004U CN 202021512071 U CN202021512071 U CN 202021512071U CN 212676004 U CN212676004 U CN 212676004U
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Abstract
The utility model provides a pair of detection resistance and mainboard relates to electronic equipment technical field to optimize the structure of detection resistance to a certain extent, avoid the side of detection resistance to receive the influence of soldering tin among the welding process. The utility model provides a detection resistor, which comprises a base body, an electrode and a resistor; the electrodes comprise a first electrode and a second electrode, the first electrode and the second electrode extend along a first direction and are oppositely arranged on the substrate along a second direction, and the resistor is positioned on the substrate between the first electrode and the second electrode; an insulating layer is arranged between the first electrode and the second electrode, and an accommodating cavity is formed between the insulating layer and the substrate so as to coat the resistor in the accommodating cavity; the two ends of the first electrode are provided with first barrier layers, and the first barrier layers completely cover the side parts of the first electrode; two ends of the second electrode are provided with second barrier layers, and the second barrier layers completely cover the side parts of the second electrode; the first barrier layer and the second barrier layer are both formed of a non-tin material.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment technique and specifically relates to a detect resistance and mainboard.
Background
Along with the development of electronic products such as electronic information complete machines, household appliances, communication equipment and the like, the industry competition is higher, and the performance of the products is emphasized while the cost performance is emphasized. Among them, the performance requirements for high-precision chip current detection resistor products are getting higher and higher.
The precision detection resistor is mostly installed on the main board in a tin soldering mode, and the side part of the electrode in the detection resistor is mostly in an exposed state, so that the side part of the electrode in the exposed state is also welded by the soldering tin during welding, and the resistance precision of the resistor connected with the electrode is influenced.
Therefore, it is desirable to provide a detection resistor and a motherboard to solve the problems in the prior art to some extent.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a detection resistance and mainboard to optimize the structure of detecting resistance to a certain extent, avoid the tin welding in-process to detect the side of resistance and receive the influence of soldering tin.
The utility model provides a detecting resistor, which comprises a base body, an electrode and a resistor; the electrodes comprise a first electrode and a second electrode, the first electrode and the second electrode extend along a first direction and are oppositely arranged on the substrate along a second direction, and the resistor is positioned on the substrate between the first electrode and the second electrode; an insulating layer is arranged between the first electrode and the second electrode, and an accommodating cavity is formed between the insulating layer and the substrate so as to coat the resistor in the accommodating cavity; the two ends of the first electrode are provided with first barrier layers, and the first barrier layers completely cover the side parts of the first electrode; two ends of the second electrode are provided with second barrier layers, and the second barrier layers completely cover the side parts of the second electrode; the first barrier layer and the second barrier layer are both formed of a non-tin bonding material.
The substrate is provided with a plurality of electrodes, the electrodes can be arranged at intervals along the first direction and/or the second direction, and the resistors are arranged corresponding to the electrodes.
Specifically, the thickness of the first barrier layer is consistent with the thickness of the first electrode, and the thickness of the second barrier layer is consistent with the thickness of the second electrode.
The first electrode and the second electrode both comprise an electrode body and a plating layer; the cladding material cover in the electrode body deviates from the one side of base member, the electrode body with resistance laminates mutually, just the electrode body with resistance all adopts the same metal material to form.
Specifically, the plating layer comprises a pure copper layer, a pure nickel layer and a pure tin layer; the pure copper layer is in contact with the electrode body, the pure nickel layer covers the pure copper layer, and the pure tin layer covers the pure nickel layer.
The electrode, the resistor and the barrier layer are connected with the substrate through the adhesive layer.
Specifically, a first side electrode layer attached to a side portion of the first electrode and a side portion of the substrate is formed between the first barrier layers at both ends of the first electrode; and a second side electrode layer attached to the side part of the second electrode and the side part of the substrate is formed between the second barrier layers at the two ends of the second electrode.
Furthermore, the first side electrode layer and the second side electrode layer respectively comprise a pure copper layer, a pure nickel layer and a pure tin layer which are arranged from inside to outside along the side.
Further, the substrate is formed of a ceramic material.
Compared with the prior art, the utility model provides a detection resistance has following advantage:
the utility model provides a detection resistor, which comprises a base body, an electrode and a resistor; the electrodes comprise a first electrode and a second electrode, the first electrode and the second electrode extend along a first direction and are oppositely arranged on the substrate along a second direction, and the resistor is positioned on the substrate between the first electrode and the second electrode; an insulating layer is arranged between the first electrode and the second electrode, and an accommodating cavity is formed between the insulating layer and the substrate so as to coat the resistor in the accommodating cavity; the two ends of the first electrode are provided with first barrier layers, and the first barrier layers completely cover the side parts of the first electrode; two ends of the second electrode are provided with second barrier layers, and the second barrier layers completely cover the side parts of the second electrode; the first barrier layer and the second barrier layer are both formed of a non-tin material.
From this analysis, it can be known that, through the first barrier layer and the second barrier layer completely wrapping both ends of the first electrode and the second electrode, the side faces of both ends of the first electrode and the second electrode in the first direction can be blocked, so that the problem that the side faces of the first electrode and the second electrode are in an exposed state is avoided.
Because soldering tin solidifies and can produce the pulling force effect to holistic detection resistance, consequently, connect the first barrier layer and the second barrier layer that the material formed through the non-tin in this application, first barrier layer and second barrier layer all can not welded by soldering tin when having guaranteed the welding, and make the soldering tin that melts only exist in the region between first barrier layer and the second barrier layer and solidify, and then make holistic detection resistance only receive the effect of the effect on the first direction, make the welding back more regular.
Furthermore, the utility model also provides a mainboard, including foretell detecting resistance.
This application provides and is equipped with the regularity and the product precision that whole product can be promoted to the mainboard that is equipped with a plurality of sense resistors in this application.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of an overall structure of a detection resistor according to an embodiment of the present invention;
fig. 2 is a schematic view of an overall structure of a first viewing angle of a detection resistor according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second view angle of the detection resistor according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a third view angle of a detection resistor according to an embodiment of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
fig. 6 is a partially enlarged view of B in fig. 4.
In the figure: 1-a substrate; 2-a first electrode; 3-a second electrode; 4-resistance; 5-an insulating layer; 6-a first barrier layer; 7-a second barrier layer; 8-a pure copper layer; 9-pure nickel layer; 10-pure tin layer; 11-a sticky layer; 12-a first side electrode layer; 13-a second side electrode layer; 14-an electrode body;
s1 — first direction; s2-second direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
In the description of the embodiments of the present application, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that are conventionally placed when the products of the present invention are used, and are only used for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements indicated must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the embodiments of the present application, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As used herein, the term "and/or" includes any one of the associated listed items and any combination of any two or more of the items.
For ease of description, spatial relationship terms such as "above … …," "upper," "below … …," and "lower" may be used herein to describe one element's relationship to another element as illustrated in the figures. Such spatial relationship terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.
The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The singular forms also are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, quantities, operations, elements, components, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and/or combinations thereof.
Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, may be expected. Thus, the examples described herein are not limited to the particular shapes shown in the drawings, but include changes in shape that occur during manufacturing.
The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. Further, while the examples described herein have a variety of configurations, other configurations are possible, as will be apparent after understanding the disclosure of the present application. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
Fig. 1 is a schematic view of an overall structure of a detection resistor according to an embodiment of the present invention; fig. 2 is a schematic view of an overall structure of a first viewing angle of a detection resistor according to an embodiment of the present invention; fig. 3 is a schematic structural diagram of a second view angle of the detection resistor according to an embodiment of the present invention; fig. 4 is a schematic structural diagram of a third view angle of a detection resistor according to an embodiment of the present invention.
As shown in fig. 1-4, the present invention provides a detection resistor, which includes a substrate 1, an electrode and a resistor 4; the electrodes comprise a first electrode 2 and a second electrode 3, the first electrode and the second electrode both extend along a first direction S1 and are oppositely arranged on the substrate 1 along a second direction S2, and the resistor 4 is positioned on the substrate 1 between the first electrode 2 and the second electrode 3; an insulating layer 5 is arranged between the first electrode 2 and the second electrode 3, and an accommodating cavity is formed between the insulating layer 5 and the substrate 1 so as to coat the resistor 4 in the accommodating cavity; the both ends of first electrode 2 are equipped with first barrier layer 6, and the lateral part at first electrode 2 both ends is wrapped completely to first barrier layer 6, and the both ends of second electrode 3 are equipped with second barrier layer 7, and the lateral part at second electrode 3 both ends is wrapped completely to second barrier layer 7.
Compared with the prior art, the utility model provides a detection resistance has following advantage:
the utility model provides a detection resistance through the complete cladding at first barrier layer 6 and the second barrier layer 7 at first electrode 2 and second electrode 3' S both ends, can carry out the separation to the side at the both ends of first electrode 2 and second electrode 3 on first direction S1 to the side of having avoided first electrode 2 and second electrode 3 is in the problem of the state of exposing.
Because soldering tin solidifies and can produce the pulling force effect to holistic detection resistance, consequently, connect the first barrier layer 6 and the second barrier layer 7 that the material formed through the non-tin through the setting in this application, thereby first barrier layer 6 and second barrier layer 7 all can not welded by soldering tin when having guaranteed the welding, and make the soldering tin that melts only exist in the region between first barrier layer 6 and the second barrier layer 7 and solidify, and then make holistic detection resistance only receive the effect of the power on the first direction S1, make the welding back more regular.
It should be added that the non-tin-based material in the present application is ceramic (epoxy resin) or other inorganic materials such as glass/silica gel, and preferably, the non-tin-based material adopted in the present application is a non-conductor, so that the accuracy of the overall detection resistance can be ensured to some extent.
And the insulating layer 5 that forms between first electrode 2 and second electrode 3 can form with the cooperation of base member 1 and hold the chamber, makes resistance 4 hold the intracavity and is connected with first electrode 2 and second electrode 3 to, owing to set up first barrier layer 6 and second barrier layer 7, guaranteed the distribution of the current density line between resistance 4 and the electrode, thereby guaranteed the resistance precision of resistance 4 to a certain extent.
Because the area of base member 1 is greater than the area of first electrode 2 and second electrode 3, consequently, when gluing first electrode 2, second electrode 3 and resistance 4, glue glutinous layer 11 and can bulge in first electrode 2 and the both ends of second electrode 3 on first direction S1, through setting up first barrier layer 6 and second barrier layer 7, not only can make the part that bulges in first electrode 2 and second electrode 3 both ends glue glutinous layer 11 and obtain the protection, can utilize the part that bulges in first electrode 2 and second electrode 3 both ends to glue glutinous layer 11 and make first barrier layer 6 and second barrier layer 7 be connected with base member 1.
As shown in fig. 1 to 4, a plurality of electrodes are provided on the substrate 1, the plurality of electrodes can be arranged at intervals along the first direction S1 and/or the second direction S2, and the resistors 4 are arranged corresponding to the electrodes.
Because the first electrode 2 and the second electrode 3 are disposed at an interval in the present application, the first barrier layer 6 corresponding to the first electrode 2 and the second barrier layer 7 corresponding to the second electrode 3 are disposed at an interval, and between adjacent electrodes, the first barrier layer 6 of one electrode and the second barrier layer 7 of the other electrode are disposed at an interval, and the second barrier layer 7 of one electrode and the first barrier layer 6 of the other electrode are disposed at an interval.
Specifically, as shown in fig. 1 to 4, the thickness of the first barrier layer 6 is the same as the thickness of the first electrode 2, and the thickness of the second barrier layer 7 is the same as the thickness of the second electrode 3.
Preferably, the thickness of first electrode 2 is the same with the thickness of second electrode 3 in this application to make the thickness of first barrier layer 6 and the thickness of second barrier layer 7 all the same, and then make the whole detection resistance after the welding can be located same level, make the product after the welding more regular.
Fig. 5 is a partial enlarged view of a portion a in fig. 4.
As shown in fig. 1 to 5, the first electrode 2 and the second electrode 3 both include an electrode body 14 and a plating layer; the plating layer covers one surface of the electrode body 14, which is far away from the substrate 1, the electrode body 14 is attached to the resistor 4, and the electrode body 14 and the resistor 4 are both made of the same metal material.
It should be noted that the thickness of the first barrier layer 6 and the second barrier layer 7 in the present application corresponds to the total thickness of the electrode body 14 and the plating layer.
Fig. 6 is a partially enlarged view of B in fig. 4.
As shown in fig. 6, first side electrode layers 12 attached to the side portions of the first electrode 2 and the substrate 1 are formed between the first barrier layers 6 at both ends of the first electrode 2, and second side electrode layers 13 attached to the side portions of the second electrode 3 and the substrate 1 are formed between the second barrier layers 7 at both ends of the second electrode 3.
Preferably, the first side electrode layer 12 and the second side electrode layer 13 each include a pure copper layer 8, a pure nickel layer 9, and a pure tin layer 10, which are sequentially arranged from inside to outside.
In this application, the pure copper layer 8 of the first side electrode layer 12 is respectively laminated with the first electrode 2 and the matrix 1, the pure copper layer 8 of the second side electrode layer 13 is respectively laminated with the second electrode 3 and the matrix 1, the pure nickel layer 9 of the first side electrode layer 12 and the second side electrode covers on the pure copper layer 8, and the pure tin layer 10 covers on the pure nickel layer 9.
The pure tin layer 10 in this application is located the outermost layer of first side electrode layer 12 and second side electrode layer 13 and can promote overall structure's solderability to a certain extent.
In addition, the application also provides a mainboard comprising the detection resistor.
The mainboard in this application can be equipped with a plurality of detection resistance on, and a plurality of detection resistance can be arranged along first direction S1 and second direction S2.
The mainboard that is equipped with a plurality of sense resistors that this application provided can promote the regularity and the product precision of whole product.
The first direction S1 and the second direction S2 are perpendicular to each other in the present application.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A detection resistor is characterized by comprising a substrate, an electrode and a resistor;
the electrodes comprise a first electrode and a second electrode, the first electrode and the second electrode extend along a first direction and are oppositely arranged on the substrate along a second direction, and the resistor is positioned on the substrate between the first electrode and the second electrode;
an insulating layer is arranged between the first electrode and the second electrode, and an accommodating cavity is formed between the insulating layer and the substrate so as to coat the resistor in the accommodating cavity;
the two ends of the first electrode are provided with first barrier layers, and the first barrier layers completely cover the side parts of the first electrode;
two ends of the second electrode are provided with second barrier layers, and the second barrier layers completely cover the side parts of the second electrode;
the first barrier layer and the second barrier layer are both formed of a non-tin bonding material.
2. A detection resistor as claimed in claim 1, wherein said substrate is provided with a plurality of electrodes, said plurality of electrodes can be arranged at intervals along said first direction and/or said second direction, and said resistor is arranged corresponding to said electrodes.
3. The detection resistor as claimed in claim 2, wherein the thickness of the first blocking layer is substantially equal to the thickness of the first electrode, and the thickness of the second blocking layer is substantially equal to the thickness of the second electrode.
4. The detection resistor as claimed in claim 1, wherein the first electrode and the second electrode each comprise an electrode body and a plating layer;
the cladding material cover in the electrode body deviates from the one side of base member, the electrode body with resistance laminates mutually, just the electrode body with resistance all adopts the same metal material to form.
5. The detection resistor as claimed in claim 4, wherein the plating layer comprises a pure copper layer, a pure nickel layer and a pure tin layer;
the pure copper layer is in contact with the electrode body, the pure nickel layer covers the pure copper layer, and the pure tin layer covers the pure nickel layer.
6. The detection resistor as claimed in claim 1, wherein an adhesive layer is formed on the substrate, and the electrode, the resistor and the barrier layer are connected to the substrate through the adhesive layer.
7. The detection resistor as claimed in claim 1, wherein a first side electrode layer is formed between the first barrier layers at two ends of the first electrode and attached to a side of the first electrode and a side of the substrate;
and a second side electrode layer attached to the side part of the second electrode and the side part of the substrate is formed between the second barrier layers at the two ends of the second electrode.
8. The detecting resistor as claimed in claim 7, wherein said first side electrode layer and said second side electrode layer each comprise a pure copper layer, a pure nickel layer and a pure tin layer arranged from inside to outside.
9. The detection resistor as claimed in any one of claims 1-8, wherein said substrate is formed of a ceramic material.
10. A motherboard comprising a detection resistor according to any of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021512071.7U CN212676004U (en) | 2020-07-27 | 2020-07-27 | Detection resistor and mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021512071.7U CN212676004U (en) | 2020-07-27 | 2020-07-27 | Detection resistor and mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212676004U true CN212676004U (en) | 2021-03-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021512071.7U Active CN212676004U (en) | 2020-07-27 | 2020-07-27 | Detection resistor and mainboard |
Country Status (1)
| Country | Link |
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| CN (1) | CN212676004U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024022300A1 (en) * | 2022-07-26 | 2024-02-01 | 钧崴电子科技股份有限公司 | Resistor structure and method for manufacturing same |
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2020
- 2020-07-27 CN CN202021512071.7U patent/CN212676004U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024022300A1 (en) * | 2022-07-26 | 2024-02-01 | 钧崴电子科技股份有限公司 | Resistor structure and method for manufacturing same |
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Address after: 529000 floor 3 and 4, block 202, phase 2, new fortune environmental protection electroplating base, yamen Town, Xinhui District, Jiangmen City, Guangdong Province Patentee after: Junwei Electronic Technology Co.,Ltd. Address before: 529000 floor 3 and 4, block 202, phase 2, new fortune environmental protection electroplating base, yamen Town, Xinhui District, Jiangmen City, Guangdong Province Patentee before: JIANGMEN JUNWEI ELECTRONIC TECHNOLOGY CO.,LTD. |
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