CN212628642U - Silica gel plate is pasted to apron is glued to SMT point - Google Patents
Silica gel plate is pasted to apron is glued to SMT point Download PDFInfo
- Publication number
- CN212628642U CN212628642U CN202021702841.4U CN202021702841U CN212628642U CN 212628642 U CN212628642 U CN 212628642U CN 202021702841 U CN202021702841 U CN 202021702841U CN 212628642 U CN212628642 U CN 212628642U
- Authority
- CN
- China
- Prior art keywords
- silica gel
- apron
- buffer layer
- cover plate
- smt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 239000000741 silica gel Substances 0.000 title claims abstract description 33
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 33
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims 3
- 239000000463 material Substances 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012928 buffer substance Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model relates to a silica gel board is pasted to SMT point gum apron, which comprises an apron, be provided with a plurality of constant head tanks on the apron, the position department that the constant head tank was avoided on the apron surface is provided with the silica gel buffer layer. A silica gel buffer layer is arranged on the surface of the cover plate at a position avoiding the positioning groove; the silica gel board of special shape, thickness and material of customization is installed the silica gel board on the tool according to the assigned position to components and parts damage on the PCB board has been avoided.
Description
Technical Field
The utility model relates to a plate body, in particular to apron subsides silica gel board is glued to SMT point.
Background
SMT, also known as Surface Mount Technology (Surface Mount Technology) (abbreviation), called Surface Mount or Surface Mount Technology; the surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by means of reflow soldering, dip soldering and the like.
In the production of electronic products, need some underfill to consolidate the device, strengthen BGA encapsulated chip's anti falling performance, simultaneously for waterproof needs, need do whole board coating waterproof to the exposed device on the semi-manufactured goods mainboard, in-process of the production operation is glued to the point, need will wait to glue the board and place on some glue apron, but current some glue apron is only a special customized aluminum plate, but this kind of plate, the surface does not have buffer substance, easily hinders the components and parts that have installed on the PCB board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a silica gel board is pasted to apron is glued to SMT point.
The above technical purpose of the present invention can be achieved by the following technical solutions: the utility model provides a silica gel board is pasted to apron is glued to SMT point, includes the apron, be provided with a plurality of constant head tanks on the apron, the position department that the constant head tank was avoided on the apron surface is provided with the silica gel buffer layer.
Preferably, the silica gel buffer layer extends with the position department that the constant head tank corresponds and is provided with U type buffer layer, U type buffer layer joint is in the constant head tank.
Preferably, the silica gel buffer layer is provided with a groove, and the positioning groove is formed in the groove.
Preferably, the thickness of the silica gel buffer layer is 0.5 mm.
Preferably, the cover plate is an aluminum plate.
Preferably, the silica gel buffer layer is adhered to the cover plate.
To sum up, the utility model discloses following beneficial effect has:
1. a silica gel buffer layer is arranged on the surface of the cover plate at a position avoiding the positioning groove; the silica gel board of special shape, thickness and material of customization is installed the silica gel board on the tool according to the assigned position to components and parts damage on the PCB board has been avoided.
Drawings
FIG. 1 is a schematic view of the overall structure of the embodiment;
FIG. 2 is a sectional view of a part of the structure in the embodiment.
In the figure, 1, a cover plate; 11. positioning a groove; 12. a silica gel buffer layer; 121. a U-shaped buffer layer; 122. and (4) a groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Example (b):
an SMT dispensing cover plate silica gel plate, as shown in figure 1, comprises a cover plate 1, a plurality of positioning grooves 11 are arranged on the cover plate 1, and a silica gel buffer layer 12 is arranged on the surface of the cover plate 1 at a position avoiding the positioning grooves 11; customizing the silica gel plate with special shape, thickness and material, and installing the silica gel plate on the jig according to the specified position.
As shown in fig. 1, a U-shaped buffer layer 121 extends from a position of the silica gel buffer layer 12 corresponding to the positioning slot 11, and the U-shaped buffer layer 121 is clamped in the positioning slot 11; one end of the U-shaped buffer layer 121 is connected to the silica gel buffer layer 12, and the other end of the U-shaped buffer layer passes through the positioning groove 11 and is fixed on the top of the cover plate 1.
As shown in fig. 1, the cover plate 1 is provided with a groove 122, and the positioning groove 11 is disposed in the groove 122.
As shown in fig. 1, the thickness of the silicone cushion layer 12 is 0.5 mm.
As shown in fig. 1, the cover plate 1 is an aluminum plate.
As shown in fig. 1, the silicone buffer layer 12 is adhered to the cover plate 1.
The working principle is as follows:
a silica gel buffer layer 12 is arranged on the surface of the cover plate 1 at a position avoiding the positioning groove 11; the silica gel board of special shape, thickness and material of customization is installed the silica gel board on the tool according to the assigned position to components and parts damage on the PCB board has been avoided.
Claims (6)
1. The utility model provides a silica gel plate is pasted to apron is glued to SMT point, includes apron (1), its characterized in that: be provided with a plurality of constant head tanks (11) on apron (1), the position department that the constant head tank (11) was avoided on apron (1) surface is provided with silica gel buffer layer (12).
2. The SMT glue-dispensing cover plate silicon rubber plate according to claim 1, wherein: silica gel buffer layer (12) and the position department that constant head tank (11) correspond extend and are provided with U type buffer layer (121), U type buffer layer (121) joint is in constant head tank (11).
3. The SMT glue-dispensing cover plate silicon rubber plate according to claim 2, wherein: be provided with recess (122) on apron (1), constant head tank (11) set up in recess (122).
4. The SMT glue-dispensing cover plate silicon rubber plate according to claim 3, wherein: the thickness of the silica gel buffer layer (12) is 0.5 mm.
5. The SMT glue-dispensing cover plate silicone plate according to claim 4, wherein: the cover plate (1) is an aluminum plate.
6. The SMT glue-dispensing cover plate silicone plate according to claim 5, wherein: the silica gel buffer layer (12) is adhered to the cover plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021702841.4U CN212628642U (en) | 2020-08-14 | 2020-08-14 | Silica gel plate is pasted to apron is glued to SMT point |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021702841.4U CN212628642U (en) | 2020-08-14 | 2020-08-14 | Silica gel plate is pasted to apron is glued to SMT point |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212628642U true CN212628642U (en) | 2021-02-26 |
Family
ID=74713223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021702841.4U Expired - Fee Related CN212628642U (en) | 2020-08-14 | 2020-08-14 | Silica gel plate is pasted to apron is glued to SMT point |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212628642U (en) |
-
2020
- 2020-08-14 CN CN202021702841.4U patent/CN212628642U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210226 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |