CN212610896U - Nickel-palladium-gold and nickel-gold melting combined equipment - Google Patents
Nickel-palladium-gold and nickel-gold melting combined equipment Download PDFInfo
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- CN212610896U CN212610896U CN202020650531.6U CN202020650531U CN212610896U CN 212610896 U CN212610896 U CN 212610896U CN 202020650531 U CN202020650531 U CN 202020650531U CN 212610896 U CN212610896 U CN 212610896U
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Abstract
The utility model belongs to the technical field of the circuit board is made, a nickel palladium gold and nickel gold use equipment together is related to, including the transfer device of linear circuit board stores pylon to and presoaked bath, activation groove, first wash bowl, back immersion bath, second wash bowl, change nickel bath, third wash bowl, palladium bath, fourth wash bowl and the first gold groove that sets gradually along the direction of transportation in the transfer device below, transfer device can be controlled the order that gets into each groove. The equipment shares most of the groove bodies manufactured by the nickel-palladium-gold and nickel-gold melting processes, can switch two working states, saves equipment investment, improves equipment utilization rate, and greatly reduces cost expenditure of company liquid medicine, clean water, electricity, manpower, wastewater treatment and the like.
Description
Technical Field
The utility model relates to a circuit board makes technical field, in particular to nickel palladium gold and nickel immersion gold equipment of using simultaneously.
Background
Electroless Nickel Gold (ENIG) is prepared by replacing palladium on the surface of copper by a chemical reaction, then plating a Nickel-phosphorus alloy layer on the basis of palladium core, and then plating a Gold layer on the surface of Nickel by a replacement reaction.
Nickel Palladium Gold (electrode Nickel Immersion Palladium Immersion Gold, abbreviated as ENIPIG) is formed by depositing a layer of Palladium between a Nickel layer and a Gold layer, so that mutual migration between Nickel and Gold can be prevented, black PAD can not appear, the bonding capability of wire bonding is realized, the reliability of welding spots is good, multiple reflow soldering can be resisted, the storage time is excellent, and the like, and various different assembly requirements can be met correspondingly.
The two processes cannot be commonly used on equipment in the past, although the nickel palladium gold wire can also be used for producing the nickel gold plate through program change, the cost of the chemical solution in the nickel palladium gold wire gold groove is greatly different from the cost of the chemical solution in the gold groove required by the nickel gold wire, and the two processes are compared as follows:
at present, nickel-palladium gold wires in the market are produced singly and independently, the nickel-palladium gold wires mainly produce camera module series material numbers, the capacity is not fully loaded temporarily, the equipment utilization rate is about 30 percent, and the waste of the productivity is caused.
Therefore, it is necessary to provide a new structure of the apparatus to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The main object of the present invention is to provide a nickel-palladium-gold and nickel-gold combined equipment, which can switch two processes of nickel-palladium-gold and nickel-gold, and save the equipment investment.
The utility model discloses a following technical scheme realizes above-mentioned purpose: the utility model provides a nickel palladium gold and nickel gold use equipment together, includes the transfer device of linear circuit board stores pylon to and the presoaked bath, activation tank, first wash bowl, back dip tank, second wash bowl, nickel melting tank, third wash bowl, palladium groove, fourth wash bowl, first gold groove and the second gold groove that set gradually along the direction of transportation in transfer device below, transfer device can be controlled the order that gets into each groove.
Specifically, a gold recovery tank and a fifth washing tank are arranged behind the second gold tank.
Specifically, the front end of the pre-soaking tank is also provided with a micro-etching tank, a seventh rinsing tank, a pickling tank and an eighth rinsing tank which are connected in sequence.
Furthermore, a degreasing tank, a hot water washing tank and a sixth washing tank which are connected in sequence are further arranged at the front end of the micro-etching tank.
Adopt above-mentioned technical scheme beneficial effect to be:
the equipment shares most of the groove bodies of the nickel-palladium-gold and nickel-gold melting processes, can switch two working states, saves equipment investment, and greatly reduces cost expenditure of liquid medicine, cleaning water, electricity, manpower, wastewater treatment and the like of companies.
Drawings
FIG. 1 is a piping diagram of an apparatus for combining NiPdAu with NiAu;
FIG. 2 is a schematic flow chart of two operation modes of the Ni-Pd-Au and Ni-Au alloy combined equipment.
The figures in the drawings represent:
1-a transfer device; 2-a pre-soaking tank; 3-activating tank; 4 a-a first water washing tank, 4 b-a second water washing tank, 4 c-a third water washing tank, 4 d-a fourth water washing tank, 4 e-a fifth water washing tank, 4 f-a sixth water washing tank, 4 g-a seventh water washing tank, and 4 h-an eighth water washing tank; 5-post-soaking the tank; 6-nickel bath; 7-a palladium tank; 8 a-first gold groove, 8 b-second gold groove; 9-gold recovery tank; 10-a degreasing tank; 11-hot water washing tank; 12-micro etching groove; 13-pickling tank.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
Example (b):
as shown in fig. 1 and 2, the utility model relates to a nickel palladium gold and nickel gold combined equipment, including the transfer device 1 of linear circuit board stores pylon to and at the presoaking groove 2, activation tank 3, first wash bowl 4a, back dip bowl 5, second wash bowl 4b, nickel melting tank 6, third wash bowl 4c, palladium groove 7, fourth wash bowl 4d, first gold groove 8a and second gold groove 8b that transfer device 1 below set gradually along the direction of transportation, transfer device 1 can be controlled the order that gets into each groove. The transfer device 1 carries the circuit board rack with the circuit board plates to move along one direction. Because the nickel-palladium-gold process and the nickel-gold process are all used in the pre-soaking tank 2, the activation tank 3, the first rinsing tank 4a, the nickel-plating tank 6 and the third rinsing tank 4c, they can be used together to reduce the equipment investment. When the equipment is used for nickel-palladium-gold processing, the transfer device 1 carries a circuit board hanger to be sequentially immersed into the pre-soaking tank 2, the activation tank 3, the first rinsing tank 4a, the post-soaking tank 5, the second rinsing tank 4b, the nickel dissolving tank 6, the third rinsing tank 4c, the palladium tank 7, the fourth rinsing tank 4d and the first gold tank 8a as shown by thick arrows in fig. 2; when the equipment carries out the nickel-gold melting process, the transfer device 1 carries a circuit board hanger to be sequentially immersed into the presoaking tank 2, the activation tank 3, the first rinsing tank 4a, the nickel melting tank 6, the third rinsing tank 4c and the second gold tank 8b, and the difference of the process compared with the previous process is shown by thin arrows in fig. 2. This makes a equipment can switch two kinds of operating condition, has saved equipment input. The transfer device 1 is controlled by a program, and the equipment only modifies the program correspondingly so as to accord with the working sequence of the nickel-palladium-gold process and the nickel-gold process without difficulty in realization. The cycle time of the new process can be effectively optimized, the nickel-palladium-gold cycle is shortened from 21.5 min/hanging to 10 min/hanging, the equipment utilization rate is improved to 100%, and the cost expenditure of liquid medicine, clean water, electricity, manpower, wastewater treatment and the like of a company is greatly reduced.
As shown in FIGS. 1 and 2, a gold recovery tank 9 and a fifth washing tank 4e are provided after the second gold tank 8 b. Therefore, no matter the nickel-gold melting process or the nickel-palladium-gold process, the redundant gold can be directly recovered finally, and the gold waste and the emission pollution are reduced.
As shown in fig. 1 and 2, a microetching bath 12, a seventh rinsing bath 4g, a pickling bath 13, and an eighth rinsing bath 4h are provided at the front end of the pre-immersion bath 2, which are connected in this order. The above parts are used for surface treatment of the plate surface, so that the plate surface is easier to react.
As shown in fig. 1 and 2, a degreasing tank 10, a hot water washing tank 11, and a sixth water washing tank 4f are provided at the front end of the microetching tank 12. The parts above are used for cleaning the board surface so as to prevent the product quality from being influenced by dirt.
What has been described above are only some embodiments of the invention. For those skilled in the art, without departing from the inventive concept, several modifications and improvements can be made, which are within the scope of the invention.
Claims (4)
1. A nickel palladium gold and nickel gold melting combined equipment is characterized in that: the circuit board rack comprises a linear transfer device of a circuit board rack, and a presoaking tank, an activation tank, a first rinsing tank, a post-soaking tank, a second rinsing tank, a nickel-plating tank, a third rinsing tank, a palladium tank, a fourth rinsing tank, a first gold tank and a second gold tank which are sequentially arranged along the conveying direction below the transfer device, wherein the transfer device can be controlled to enter the sequence of each tank.
2. The nickel-palladium-gold and nickel-gold combination device as claimed in claim 1, wherein: and a gold recovery tank and a fifth washing tank are also arranged behind the second gold tank.
3. The nickel-palladium-gold and nickel-gold combination device as claimed in claim 1, wherein: the front end of the pre-soaking tank is also provided with a micro-etching tank, a seventh rinsing tank, a pickling tank and an eighth rinsing tank which are connected in sequence.
4. The nickel-palladium-gold and nickel-gold combination device as claimed in claim 3, wherein: the front end of the micro-etching tank is also provided with a degreasing tank, a hot water washing tank and a sixth washing tank which are connected in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020650531.6U CN212610896U (en) | 2020-04-26 | 2020-04-26 | Nickel-palladium-gold and nickel-gold melting combined equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020650531.6U CN212610896U (en) | 2020-04-26 | 2020-04-26 | Nickel-palladium-gold and nickel-gold melting combined equipment |
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| Publication Number | Publication Date |
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| CN212610896U true CN212610896U (en) | 2021-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020650531.6U Active CN212610896U (en) | 2020-04-26 | 2020-04-26 | Nickel-palladium-gold and nickel-gold melting combined equipment |
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| CN (1) | CN212610896U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111501031A (en) * | 2020-04-26 | 2020-08-07 | 柏承科技(昆山)股份有限公司 | Nickel-palladium-gold and nickel-gold melting combined equipment and control method thereof |
-
2020
- 2020-04-26 CN CN202020650531.6U patent/CN212610896U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111501031A (en) * | 2020-04-26 | 2020-08-07 | 柏承科技(昆山)股份有限公司 | Nickel-palladium-gold and nickel-gold melting combined equipment and control method thereof |
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