CN212598515U

CN212598515U - Bending equipment for pins of electronic components of circuit board

Info

Publication number: CN212598515U
Application number: CN202021429917.0U
Authority: CN
Inventors: 李涛; 刘飞云
Original assignee: Huizhou Apl Electronic Co ltd
Current assignee: Huizhou Apl Electronic Co ltd
Priority date: 2020-07-20
Filing date: 2020-07-20
Publication date: 2021-02-26
Anticipated expiration: 2030-07-20

Abstract

The utility model discloses a bending device for pins of electronic components of a circuit board, which comprises a workbench, a bending mechanism, a fixing clamp and a pressing and positioning mechanism; the bending mechanism is arranged on the workbench; the fixing clamp is arranged on the bending mechanism and corresponds to the bending mechanism; the pressing and positioning mechanism is arranged on the workbench, is positioned above the bending mechanism and corresponds to the fixing clamp; the bending mechanism comprises two bakelite pads, a bending assembly and a bending driving assembly; the two bakelite pads are arranged on the workbench and positioned below the fixed clamp, and the two bakelite pads are arranged in parallel; the bending assembly is arranged on the two bakelite pads, the fixing clamp is arranged on and corresponds to the bending assembly, and the bending driving assembly is connected with and drives the bending assembly. The utility model discloses a circuit board electronic components pin equipment of bending simple structure, convenient operation, the electronic components pin of bending is quick accurate, alleviates enterprise's staff's intensity of labour, reduces the manufacturing cost of enterprise, and enterprise's production circuit board quality is unified to be guaranteed.

Description

Bending equipment for pins of electronic components of circuit board

Technical Field

The utility model relates to a circuit board production facility technical field especially relates to a circuit board electronic components pin equipment of bending.

Background

The circuit board is also called a printed circuit board, and a printed circuit is formed on a substrate according to a designed circuit printed circuit, a printed element or a conductive pattern formed by combining the circuit printed circuit and the printed element. With the continuous development of electronic technology, electronic products enter the era of component miniaturization, high-density installation and high-heat-generation assembly, and further, circuit boards are required to be continuously developed in the directions of miniaturization, multiple layers and high density. In the production process of the circuit board, the electronic components are installed at preset positions of the circuit board, and then pins of the electronic components are bent and fixed. The bending mode of the electronic component pin is that a worker holds the clamp to clamp the electronic component pin, and then the worker bends the electronic component pin to a preset direction to fix the electronic component. Due to the bending mode of the pins of the electronic components, the operation of workers is inconvenient, the pins of the electronic components are easy to break, the electronic components are damaged, and the production cost of enterprises is increased; moreover, the labor intensity of workers is high, and the attention of the workers often cannot be concentrated, so that the production quality of enterprises is uneven.

SUMMERY OF THE UTILITY MODEL

Therefore, the bending equipment for the pins of the electronic components of the circuit board is needed to solve the technical problem of bending the pins of the electronic components.

A pin bending device for electronic components of a circuit board comprises a workbench, a bending mechanism, a fixing clamp and a pressing and positioning mechanism; the bending mechanism is arranged on the workbench; the fixing clamp is arranged on the bending mechanism and corresponds to the bending mechanism; the pressing and positioning mechanism is arranged on the workbench, is positioned above the bending mechanism and corresponds to the fixing clamp;

the bending mechanism comprises two bakelite pads, a bending assembly and a bending driving assembly; the two bakelite pads are arranged on the workbench and positioned below the fixed clamp, and the two bakelite pads are arranged in parallel; the bending assemblies are arranged on the two bakelite pads, the fixing clamp is arranged on and corresponds to the bending assemblies, and the bending driving assembly is connected with and drives the bending assemblies.

In one embodiment, the fixing clamp has a substrate fixing plate disposed on the bending assembly.

In one embodiment, the substrate fixing plate has a circuit board fixing groove corresponding to the bending member.

In one embodiment, the downward pressing and positioning mechanism comprises two guide shafts, a positioning moving member, a positioning top plate, a pressing plate, a plurality of pressing blocks and a downward pressing cylinder; one end of each of the two guide shafts is fixed on the workbench, and the bending mechanism and the fixing clamp are positioned between the two guide shafts; the positioning moving piece is sleeved on the two guide shafts through a flange shaft sleeve and is positioned above the fixed clamp; the positioning top plate is arranged at the other ends of the two guide shafts and is positioned above the positioning moving piece; the pressing plate is arranged on the side surface of the positioning moving piece close to the fixed clamp; the pressing blocks are arranged on the pressing plate and correspond to the fixing clamp; the downward-pressing air cylinder is arranged on the positioning top plate and drives the positioning moving piece to move along the two guide shafts.

In one embodiment, the pressing blocks are respectively provided with positioning grooves corresponding to electronic components of the circuit board.

In one embodiment, the bending assembly comprises a rack sliding plate, a cover plate, a bending gear set, a bending piece and a driving rack; the rack sliding plate is arranged on the two bakelite pads; the cover plate is arranged between the rack sliding plate and the fixing clamp and is provided with a line groove; the bending gear set is arranged on the rack sliding plate and is positioned in the slide groove, and the bending piece is arranged on the bending gear set, is positioned in the slide groove and corresponds to the fixing clamp; the driving rack is arranged on the rack sliding plate and meshed with the bending gear set, and the driving rack is connected with the bending driving assembly.

In one embodiment, the rack slide has a rack slot in which the drive rack is located.

In one embodiment, the bending gear set comprises a bending gear and a bending rack; the bending gear is arranged on the rack sliding plate, is positioned in the line position groove and is meshed with the driving rack; the bending rack is positioned in the slide groove and meshed with the bending gear, and the bending piece is arranged on the bending rack.

In one embodiment, the bending driving assembly comprises a rack driving part and a rack driving cylinder; the rack driving piece is connected with the driving rack; the rack driving cylinder is connected with and drives the rack driving piece.

The bending equipment for the pins of the electronic components of the circuit board has the advantages of simple structure and convenient operation, the pins of the electronic components can be quickly and accurately bent, the labor intensity of workers in an enterprise is reduced, the production cost of the enterprise is reduced, and the quality of the circuit board produced by the enterprise is unified and guaranteed; and, circuit board electronic components pin equipment of bending adopts the cylinder to combine gear and rack drive, and is not fragile all for a long time using, and the pin that the effectual manual work of preventing bend electronic components pin caused damages.

Drawings

Fig. 1 is a schematic structural view of the pin bending device for electronic components of the circuit board of the present invention;

fig. 2 is another schematic structural diagram of the pin bending apparatus for electronic components of circuit board according to the present invention;

fig. 3 is a schematic structural view of a bending mechanism in the present invention;

fig. 4 is a schematic view of a partial structure of the middle bending assembly of the present invention;

fig. 5 is a schematic structural view of the fixing clamp of the present invention;

fig. 6 is a schematic structural view of the middle pressing positioning mechanism of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, fig. 1 is a schematic structural view of a pin bending apparatus 1 for a circuit board electronic component according to the present invention; fig. 2 is another schematic structural diagram of the pin bending apparatus 1 for electronic components of a circuit board according to the present invention; fig. 3 is a schematic structural diagram of the bending mechanism 11 of the present invention; fig. 4 is a schematic view of a partial structure of the middle bending assembly 11 of the present invention; fig. 5 is a schematic structural view of the fixing clamp 12 according to the present invention; fig. 6 is a schematic structural diagram of the middle pressing positioning mechanism 13 according to the present invention. As shown in the figure, the utility model discloses a circuit board electronic components pin equipment 1 of bending, it is arranged in the circuit board production process, and circuit board electronic components pin equipment 1 of bending bends the electronic components's of circuit board pin, bends secure, guarantees that enterprise's production circuit board quality is unified. The bending equipment 1 for the pins of the electronic components of the circuit board comprises a workbench 10, a bending mechanism 11, a fixing clamp 12 and a pressing and positioning mechanism 13. The bending mechanism 11 is provided on the table 10. The fixing jig 12 is provided in the bending mechanism 11, and the fixing jig 12 corresponds to the bending mechanism 11. The press positioning mechanism 13 is provided on the table 10, the press positioning mechanism 13 is located above the bending mechanism 11, and the press positioning mechanism 13 corresponds to the fixing jig 12. Firstly, a worker places a circuit board 2 on a fixing clamp 12, and one side surface of the circuit board 2 with pins of electronic components corresponds to the fixing clamp 12; then, the press-down positioning mechanism 13 moves downwards to fix and position the electronic component of the circuit board 2, so that the situation that the pin bending effect of the electronic component is not ideal or the pin is not bent in place due to the looseness of the electronic component in the process of bending the pin of the electronic component is prevented; finally, the bending mechanism 11 bends the pins of the electronic component according to the predetermined direction, thereby completing the pin bending work of the electronic component.

Referring to fig. 3 and 4 again, the bending mechanism 11 includes two bakelite pads 110, a bending assembly 111 and a bending driving assembly 112. Two bakelite pads 110 are arranged on the workbench 10, the two bakelite pads 110 are located below the fixing fixture 12, the two bakelite pads 110 are arranged in parallel, the two bakelite pads 110 support the bending assembly 111 and the fixing fixture 12, and the two bakelite pads 110 play a role in buffering and unloading in the process of pressing down the electronic component by the pressing-down positioning mechanism 13. The bending assembly 111 is disposed on the two bakelite pads 110, the fixing clamp 12 is disposed on and corresponding to the bending assembly 111, and the bending driving assembly 112 is connected to and drives the bending assembly 111. Bending assembly 111 includes rack sled 1110, cover plate 1111, bending gear set 1112, bending member 1113, and drive rack 1114. The rack slide 1110 is provided to the two bakelite pads 110, and the rack slide 1110 has a rack groove 1110 a. Cover 1111 is disposed between rack sliding plate 1110 and fixing jig 12, and cover 1111 has a aligning groove 1111 a. The bending gear set 1112 comprises a bending gear 1115 and a bending rack 1116, the bending gear 1115 is arranged on the rack sliding plate 1110, the bending gear 1115 is located in the row position groove 1111a, the bending gear 1115 is meshed with the driving rack 1114, the bending rack 1116 is located in the row position groove 1111a, the bending rack 1116 is meshed with the bending gear 1115, a bending piece 1113 is arranged on the bending rack 1116, the bending piece 1113 is located in the row position groove 1111a, and the bending piece 1113 corresponds to the fixing clamp 12; the driving rack 1114 is disposed in the rack groove 1110a, the driving rack 1114 is engaged with the bending gear set 1112, and the driving rack 1114 is connected to the bending driving assembly 112. The bending driving assembly 112 includes a rack driving member 1120 and a rack driving cylinder 1121; the rack driving member 1120 is connected with the driving rack 1114; the rack drive cylinder 1121 is connected to and drives the rack drive member 1120. Push down positioning mechanism 13 and move down, after the electronic components of fixed and location circuit board 2, rack drive cylinder 1121 drives rack driving piece 1120 and removes, and rack driving piece 1120 drives and drives driving rack 1114 and remove along line position groove 1111a, drives rack 1114 and removes the in-process, drives rack 1114 and drives gear 1115 rotation of bending, and gear 1115 drives and drives driving rack 1114 and remove, drives rack 1114 and removes the in-process and drive the pin that piece 1113 bent electronic components that bends.

Referring to fig. 5, the fixing clamp 12 has a substrate fixing plate 120, and the substrate fixing plate 120 is disposed on the cover 1111. The substrate fixing plate 120 has a circuit board fixing groove 1200, and the circuit board fixing groove 1200 corresponds to the bending member 1113. The staff arranges circuit board 2 in circuit board fixed slot 1200, and circuit board fixed slot 1200 is fixed circuit board 2, prevents that circuit board 2 from moving at the pin in-process of bending, causes the unsatisfactory or not in place condition appearance of bending of electronic components pin effect. The formation and structure of the circuit board fixing groove 1200 are matched according to the circuit board 2 to be bent, the structure of the circuit board 2 is different, and the formation and structure of the circuit board fixing groove 1200 are correspondingly changed.

Referring back to fig. 6, the pressing and positioning mechanism 13 includes two guide shafts 130, a positioning moving member 131, a positioning top plate 132, a pressing plate 133, a plurality of pressing blocks 134, and a pressing cylinder 135. One end of each of the two guide shafts 130 is fixed to the table 10, the bending mechanism 11 and the fixing jig 12 are located between the two guide shafts 130, and the two guide shafts 130 guide the movement of the press positioning mechanism 13. The positioning moving piece 131 is sleeved on the two guide shafts 130 through a flange shaft sleeve 136, and the positioning moving piece 131 is positioned above the fixed clamp 12; the positioning top plate 132 is arranged at the other end of the two guide shafts 130, and the positioning top plate 132 is positioned above the positioning moving member 131; the pressing plate 133 is arranged on the side surface of the positioning moving piece 131 close to the fixed clamp 12; the pressing blocks 134 are arranged on the pressing plate 133, the pressing blocks 134 correspond to the fixed clamp 12, and the pressing blocks 134 are provided with positioning grooves 1340 corresponding to the appearance of the electronic component; the down-pressing cylinder 135 is disposed on the positioning top plate 132, and the down-pressing cylinder 135 drives the positioning moving member 131 to move along the two guide shafts 130. The staff places circuit board 2 in circuit board fixed slot 1200, and circuit board fixed slot 1200 fixes circuit board 2, and meanwhile, push down air cylinder 135 drive location moving member 131 and move down to preset position along two guiding axles 130, and location moving member 131 drives location roof 132, clamp plate 133 and a plurality of briquetting 134 and moves down to preset position along two guiding axles 130, and at this moment, electronic components is located constant head tank 1340, and constant head tank 1340 prevents that electronic components is not hard up at the pin bending in-process. In a specific application, the number of the pressing blocks 134 is matched according to the number of the electronic components to be bent, and the shape and the specification of the positioning groove 1340 are also matched according to the shape and the specification of the bent electronic components.

In summary, in one or more embodiments of the present invention, the bending device for pins of electronic components of circuit boards of the present invention has a simple structure, is convenient to operate, can quickly and accurately bend the pins of electronic components, reduces the labor intensity of enterprise workers, reduces the production cost of enterprises, and ensures the quality of the circuit boards produced by the enterprises; and, circuit board electronic components pin equipment of bending adopts the cylinder to combine gear and rack drive, and long-term the use is not fragile.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A bending device for pins of electronic components of circuit boards is characterized by comprising a workbench, a bending mechanism, a fixing clamp and a pressing and positioning mechanism; the bending mechanism is arranged on the workbench; the fixing clamp is arranged on the bending mechanism and corresponds to the bending mechanism; the pressing and positioning mechanism is arranged on the workbench, is positioned above the bending mechanism and corresponds to the fixing clamp;

2. The apparatus of claim 1, wherein the fixture has a substrate fixing plate, and the substrate fixing plate is disposed on the bending assembly.

3. The device for bending pins of electronic components on circuit boards according to claim 2, wherein the substrate fixing plate is provided with a circuit board fixing groove corresponding to the bending component.

4. The device for bending the pins of the circuit board electronic component according to claim 1, wherein the downward pressing and positioning mechanism comprises two guide shafts, a positioning moving member, a positioning top plate, a pressing plate, a plurality of pressing blocks and a downward pressing cylinder; one end of each of the two guide shafts is fixed on the workbench, and the bending mechanism and the fixing clamp are positioned between the two guide shafts; the positioning moving piece is sleeved on the two guide shafts through a flange shaft sleeve and is positioned above the fixed clamp; the positioning top plate is arranged at the other ends of the two guide shafts and is positioned above the positioning moving piece; the pressing plate is arranged on the side surface of the positioning moving piece close to the fixed clamp; the pressing blocks are arranged on the pressing plate and correspond to the fixing clamp; the downward-pressing air cylinder is arranged on the positioning top plate and drives the positioning moving piece to move along the two guide shafts.

5. The device for bending the pins of the circuit board electronic component according to claim 4, wherein the plurality of pressing blocks are respectively provided with positioning grooves corresponding to the circuit board electronic component.

6. The device for bending the pins of the circuit board electronic component according to claim 1, wherein the bending assembly comprises a rack sliding plate, a cover plate, a bending gear set, a bending piece and a driving rack; the rack sliding plate is arranged on the two bakelite pads; the cover plate is arranged between the rack sliding plate and the fixing clamp and is provided with a line groove; the bending gear set is arranged on the rack sliding plate and is positioned in the slide groove, and the bending piece is arranged on the bending gear set, is positioned in the slide groove and corresponds to the fixing clamp; the driving rack is arranged on the rack sliding plate and meshed with the bending gear set, and the driving rack is connected with the bending driving assembly.

7. The apparatus for bending pins of electronic components on a circuit board according to claim 6, wherein the rack slide has a rack slot, and the driving rack is located in the rack slot.

8. The device for bending the pins of the circuit board electronic component according to claim 7, wherein the bending gear set comprises a bending gear and a bending rack; the bending gear is arranged on the rack sliding plate, is positioned in the line position groove and is meshed with the driving rack; the bending rack is positioned in the slide groove and meshed with the bending gear, and the bending piece is arranged on the bending rack.

9. The device for bending the pins of the circuit board electronic component according to claim 8, wherein the bending driving assembly comprises a rack driving part and a rack driving cylinder; the rack driving piece is connected with the driving rack; the rack driving cylinder is connected with and drives the rack driving piece.