CN212570942U - Cleaning and drying device after laser wafer cutting - Google Patents
Cleaning and drying device after laser wafer cutting Download PDFInfo
- Publication number
- CN212570942U CN212570942U CN202021861107.2U CN202021861107U CN212570942U CN 212570942 U CN212570942 U CN 212570942U CN 202021861107 U CN202021861107 U CN 202021861107U CN 212570942 U CN212570942 U CN 212570942U
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- Prior art keywords
- water
- cleaning
- flusher
- laser wafer
- drawer
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- 238000004140 cleaning Methods 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 title claims abstract description 17
- 238000001035 drying Methods 0.000 title claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 93
- 238000007664 blowing Methods 0.000 claims abstract description 12
- 238000011010 flushing procedure Methods 0.000 claims abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000000861 blow drying Methods 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a cleaning and blow-drying device after laser wafer cutting, which comprises a box body, a controller and a motor, wherein the upper part of the box body is provided with a feed inlet, the left side of a residue drawer is provided with a drawer handle, the lower end of the drawer handle is provided with a water inlet, the water inlet is arranged at the left end of a water tank, the upper part of the left end of the water tank is provided with a water feeding pipe, the lower end of a water pump is provided with a water dividing pipe, the left end of the water dividing pipe is connected with a first flusher through a water pipe, the right end of the water dividing pipe is connected with a second flusher through a water pipe, the lower end of the second flusher is provided with a second flushing nozzle, the lower end of the box body is provided with a bracket, the cleaning and blow-drying device after laser wafer cutting has reasonable structure, the lower end of the feed inlet, the lower end of the air blowing port is provided with a conveying belt, so that the machine is automated.
Description
Technical Field
The utility model relates to a wafer body processing technology field specifically is a device weathers after laser wafer cutting washs.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the original material thereof is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. At present, domestic wafer production lines are mainly 8 inches and 12 inches.
In the prior art, residues are easily generated when the wafer is cut by laser and need to be cleaned, and the existing cleaning device after laser wafer cutting only can be provided with a cleaning device, cannot be dried and is not easy to store, so that the wafer body is easily affected with damp.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem lie in overcoming current laser wafer cutting back belt cleaning device, only can dispose belt cleaning device, can not weather, and difficult preserve, the wafer body defect of weing easily.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a wash after laser wafer cutting and weather device, the power distribution box comprises a box body, a controller and a motor, box upper portion is provided with the feed inlet, and the feed inlet lower extreme is provided with the filter, the filter lower extreme is provided with the residue drawer, and residue drawer internally mounted has the drawer filter screen, residue drawer left side is provided with the drawer handle, and drawer handle lower extreme is provided with the water inlet, the water inlet sets up at the water tank left end, water tank left end upper portion is provided with the upper hose, and the upper hose is connected on the water pump, the water pump lower extreme sets up the distributive pipe, the distributive pipe left end has first flusher through water piping connection, and first flusher lower extreme sets up first washing terminals, the distributive pipe right-hand member has the second flusher through water piping connection, and second flusher lower.
Preferably, first flusher right side is provided with first cleaning brush, and the second flusher right-hand member is provided with the second cleaning brush, and the brush head is installed to first cleaning brush and second cleaning brush lower extreme to brush first upper end sets up detachable construction.
Preferably, the right side of the upper end of the box body is provided with a water blower, the lower end of the water blower is provided with a water blowing pipeline, the lower end of the water blowing pipeline is provided with a water blowing opening, and the right side of the water blower is provided with a water blower heat dissipation window.
Preferably, the controller is arranged at the upper end of the right side of the box body and is electrically connected with the water pump and the motor, a discharge hole is formed in the lower end of the controller, and a discharge auxiliary plate is arranged at the lower end of the discharge hole.
Preferably, the motor is connected with the conveying roller through a shaft rod, the conveying roller is provided with a belt, the upper end of the belt is provided with a conveying belt, and the conveying belt is made of heat-resistant rubber.
Preferably, the filter plate is of a honeycomb structure made of stainless steel, the thickness of the filter plate is 5cm, the radius of a small hole of the honeycomb structure is 3cm, a Z-shaped turning block is arranged in the middle of the filter plate, and the Z-shaped turning block is of a solid structure made of stainless steel.
Compared with the prior art, the beneficial effects of the utility model are that: this device weathers is washd after laser wafer cutting, the structure sets up rationally, sets up the filter at the feed inlet lower extreme, and the filter upper end sets up first flusher and second flusher, and the filter lower extreme sets up the residue drawer, sets up the upper hose on the water tank and is equipped with the water pump, can realize cyclic utilization, sets up the transportation area at the mouth lower extreme of blowing for the machine is automatic.
Drawings
FIG. 1 is a schematic side view of the structure of the present invention;
FIG. 2 is a front view of the structure of the present invention;
FIG. 3 is a schematic view of the structural filter plate of the present invention;
fig. 4 is a schematic view of the residue drawer of the present invention.
In the figure: 1. a box body; 2. a feed inlet; 3. a filter plate; 4. a residue drawer; 5. a drawer filter screen; 6. a drawer handle; 7. a water tank; 8. a water inlet; 9. a water feeding pipe; 10. a water pump; 11. a water diversion pipe; 12. a first flusher; 13. a first washing nozzle; 14. a second flusher; 15. a second washing nozzle; 16. a first cleaning brush; 17. a second cleaning brush; 18. a water blower; 19. a water blowing pipeline; 20. a water blowing port; 21. a heat radiation window of the water blower; 22. a controller; 23. a discharge port; 24. a discharge auxiliary plate; 25. a motor; 26. a transport roller; 27. a belt; 28. a conveyor belt; 29. and (4) a bracket.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a cleaning and blow-drying device after laser wafer cutting comprises a box body 1, a controller 22 and a motor 25, wherein a feed inlet 2 is arranged at the upper part of the box body 1, a filter plate 3 is arranged at the lower end of the feed inlet 2, a residue drawer 4 is arranged at the lower end of the filter plate 3, a drawer filter screen 5 is arranged in the residue drawer 4, a drawer handle 6 is arranged at the left side of the residue drawer 4, a water inlet 8 is arranged at the lower end of the drawer handle 6, the water inlet 8 is arranged at the left end of a water tank 7, a water feeding pipe 9 is arranged at the upper part of the left end of the water tank 7, the water feeding pipe 9 is connected to a water pump 10, a water distribution pipe 11 is arranged at the lower end of the water pump 10, a first flusher 12 is connected at the left end of the water distribution pipe 11 through a water pipe, a first flushing sprayer 13 is arranged at the lower end of the first flushing, the right side of the first flusher 12 is provided with a first cleaning brush 16, the right end of the second flusher 14 is provided with a second cleaning brush 17, the lower ends of the first cleaning brush 16 and the second cleaning brush 17 are provided with brush heads, the upper ends of the brush heads are provided with a detachable structure, the right side of the upper end of the box body 1 is provided with a water blower 18, the lower end of the water blower 18 is provided with a water blower pipe 19, the lower end of the water blower pipe 19 is provided with a water blower port 20, the right side of the water blower 18 is provided with a water blower heat dissipation window 21, a controller 22 is arranged at the upper end of the right side of the box body 1, the controller 22 is electrically connected with a water pump 10 and a motor 25, the lower end of the controller 22 is provided with a discharge port 23, the lower end of the discharge port 23 is provided with a discharge auxiliary plate 24, the motor 25 is connected with a transport roller 26, the thickness is 5cm, the radius of the honeycomb structure pore is 3cm, and the middle of the filter plate 3 is provided with a Z-shaped turning block which is a stainless steel solid structure.
The working principle is as follows: when the cleaning and drying device is used after the laser wafer is cut, the water pump 10, the motor 25 and the water blower are turned on by the controller, the water inlet 8 feeds water into the water tank 7, the water tank stops feeding water after being filled with water, the water pump 10 feeds water into the water distribution pipe 11 through the water feeding pipe 9, the water distribution pipe 11 distributes water into the first flusher 12 and the second flusher 14 respectively, the first flusher 13 and the second flusher start spraying water, the motor 25 drives the transport roller 26 to rotate, the transport roller 26 rotates to drive the belt 27 to rotate, the belt 27 drives the transport belt 28 to rotate, the water blower 18 blows hot air to the air blowing port 20 when working, the air blowing port 20 blows air to the transport belt 28, the wafer enters the box body 1 through the feed inlet 2, reaches the filter plate 3 after the first flusher 12 washes, the wafer residue is filtered into the residue drawer 4 under the action of gravity, the wafer reaches the transport belt 28 under the action of gravity, the conveyer belt 28 sends the wafer body to the discharge port 23, which is the cleaning and drying device after the laser wafer cutting.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a laser wafer cutting back washs and weathers device, includes box (1), controller (22) and motor (25), its characterized in that: the upper part of the box body (1) is provided with a feed inlet (2), the lower end of the feed inlet (2) is provided with a filter plate (3), the lower end of the filter plate (3) is provided with a residue drawer (4), a drawer filter screen (5) is installed inside the residue drawer (4), the left side of the residue drawer (4) is provided with a drawer handle (6), the lower end of the drawer handle (6) is provided with a water inlet (8), the water inlet (8) is arranged at the left end of a water tank (7), the upper part of the left end of the water tank (7) is provided with a water feeding pipe (9), the water feeding pipe (9) is connected onto a water pump (10), the lower end of the water pump (10) is provided with a water diversion pipe (11), the left end of the water diversion pipe (11) is connected with a first flusher (12) through a water pipe, the lower end of the first flusher (12) is, and the lower end of the second flusher (14) is provided with a second flushing nozzle (15), and the lower end of the box body (1) is provided with a bracket (29).
2. The device for cleaning and drying the laser wafer after cutting as claimed in claim 1, wherein: first flusher (12) right side is provided with first cleaning brush (16), and second flusher (14) right-hand member is provided with second cleaning brush (17), and the brush head is installed to first cleaning brush (16) and second cleaning brush (17) lower extreme to brush first upper end sets up detachable construction.
3. The device for cleaning and drying the laser wafer after cutting as claimed in claim 1, wherein: the water blower is characterized in that a water blower (18) is arranged on the right side of the upper end of the box body (1), a water blowing pipeline (19) is arranged at the lower end of the water blower (18), a water blowing opening (20) is arranged at the lower end of the water blowing pipeline (19), and a water blower heat dissipation window (21) is arranged on the right side of the water blower (18).
4. The device for cleaning and drying the laser wafer after cutting as claimed in claim 1, wherein: the controller (22) is arranged at the upper end of the right side of the box body (1), the controller (22) is electrically connected with the water pump (10) and the motor (25), the lower end of the controller (22) is provided with a discharge hole (23), and the lower end of the discharge hole (23) is provided with a discharge auxiliary plate (24).
5. The device for cleaning and drying the laser wafer after cutting as claimed in claim 1, wherein: the motor (25) is connected with the conveying roller (26) through a shaft rod, a belt (27) is installed on the conveying roller (26), a conveying belt (28) is installed at the upper end of the belt (27), and the conveying belt (28) is made of heat-resistant rubber.
6. The device for cleaning and drying the laser wafer after cutting as claimed in claim 1, wherein: the filter (3) is stainless steel's honeycomb, and thickness is 5cm, and the radius of honeycomb aperture is 3cm to set up Z shape turning block in the middle of filter (3), Z shape turning block is stainless steel material solid structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021861107.2U CN212570942U (en) | 2020-08-31 | 2020-08-31 | Cleaning and drying device after laser wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021861107.2U CN212570942U (en) | 2020-08-31 | 2020-08-31 | Cleaning and drying device after laser wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212570942U true CN212570942U (en) | 2021-02-19 |
Family
ID=74621811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021861107.2U Active CN212570942U (en) | 2020-08-31 | 2020-08-31 | Cleaning and drying device after laser wafer cutting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212570942U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117804199A (en) * | 2024-03-01 | 2024-04-02 | 江苏亚电科技股份有限公司 | Method and system for controlling flow of blowing gas in wafer cleaning process |
-
2020
- 2020-08-31 CN CN202021861107.2U patent/CN212570942U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117804199A (en) * | 2024-03-01 | 2024-04-02 | 江苏亚电科技股份有限公司 | Method and system for controlling flow of blowing gas in wafer cleaning process |
| CN117804199B (en) * | 2024-03-01 | 2024-05-03 | 江苏亚电科技股份有限公司 | Method and system for controlling flow of blowing gas in wafer cleaning process |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214400, 1st to 2nd floors, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu General Semiconductor Co.,Ltd. Country or region after: China Address before: No.a130-10, 1st floor, No.2 entrepreneurship center, No.96 Ruida Road, high tech Industrial Development Zone, Zhengzhou City, Henan Province, 450001 Patentee before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |