CN212519542U - Novel combined power supply substrate - Google Patents
Novel combined power supply substrate Download PDFInfo
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- CN212519542U CN212519542U CN202021258033.3U CN202021258033U CN212519542U CN 212519542 U CN212519542 U CN 212519542U CN 202021258033 U CN202021258033 U CN 202021258033U CN 212519542 U CN212519542 U CN 212519542U
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Abstract
The application provides a novel combined power supply substrate, which comprises a first substrate; a support structure disposed on the first substrate; a second substrate coupled to the support structure; the first substrate is a heat-conducting substrate and is used for placing components needing good heat conduction; the second substrate is used for placing circuits without requirements on heat conductivity, and the circuits comprise a control circuit and a protection circuit. The first substrate is connected with the second substrate through a supporting structure; components requiring good thermal conductivity may be placed on the first substrate, while circuits that do not require thermal conductivity, such as control circuits and protection circuits, may be disposed on the second substrate. Through this power supply combination base plate, both can carry out complicated wiring, also can dispel the heat for heating element well, improved the efficiency and the reliability of power.
Description
Technical Field
The application relates to the technical field of power supply circuit boards, in particular to a novel combined power supply substrate.
Background
At present, substrates are generally used in the market of power modules as carriers of electronic components, and the substrates mainly used include FR4 substrates and ceramic substrates. However, heat on the FR4 substrate needs to be transferred outward by copper wires, heat conductive paste, and the like, which easily causes thermal damage to semiconductor devices, and particularly, reliability of electronic devices cannot be guaranteed under the current trend of greatly increasing power density. Although the ceramic substrate has good heat dissipation, it cannot be used for complicated wiring and high-density component placement, so that it is necessary to provide a solution for improving the performance and reliability of the power supply.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a novel combined power supply base plate for realize the technological effect who improves the performance and the reliability of power.
The embodiment of the application provides a novel combined power supply substrate, which comprises a first substrate; a support structure disposed on the first substrate; a second substrate coupled to the support structure; the first substrate is a heat-conducting substrate and is used for placing components needing heat conduction; the second substrate is used for placing circuits without requirements on heat conductivity, and the circuits comprise a control circuit and a protection circuit.
Optionally, the first substrate is detachably connected to the support structure; the second substrate is detachably connected with the supporting structure.
Optionally, the support structure includes at least 3 support pillars disposed on the first substrate, and first ends of the support pillars are connected to corresponding threaded holes disposed on the first substrate through disposed threads; and the second end of the supporting column is connected with a threaded hole correspondingly arranged on the second substrate through a set thread.
Optionally, the first substrate is an aluminum substrate or a copper substrate.
Optionally, the first substrate is a ceramic substrate.
Optionally, the second substrate is an FR4 substrate.
Optionally, the second substrate is an FR5 substrate.
The beneficial effect that this application can realize is: the novel combined power supply substrate comprises a first substrate with thermal conductivity and a second substrate used for placing a circuit without requirements on the thermal conductivity, wherein the first substrate is connected with the second substrate through a supporting structure; components that need to conduct heat may be placed on the first substrate, while circuits that do not require thermal conductivity, such as control circuits and protection circuits, may be disposed on the second substrate. Through this power supply combination base plate, both can carry out complicated wiring, also can dispel the heat for heating element well, improved the efficiency and the reliability of power.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a front view of a novel combined power supply substrate provided in an embodiment of the present application;
fig. 2 is a top view of a novel combined power supply substrate according to an embodiment of the present disclosure;
fig. 3 is a left side view of a novel combined power supply substrate according to an embodiment of the present application.
Icon: 10-novel combined power supply substrate; 100-a first substrate; 200-a support structure; 300-second substrate.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a front view of a novel combined power supply substrate according to an embodiment of the present disclosure; fig. 2 is a top view of a novel combined power supply substrate according to an embodiment of the present disclosure; fig. 3 is a left side view of a novel combined power supply substrate according to an embodiment of the present application.
The novel combined power supply substrate 10 provided by the embodiment of the application comprises: a first substrate 100; a support structure 200 disposed on the first substrate 100; a second substrate 300 connected with the support structure 200; the first substrate 100 is a heat-conductive substrate for placing components requiring heat conduction; the second substrate 300 is used to place circuits having no requirement for thermal conductivity, including a control circuit and a protection circuit.
The first substrate 100 and the second substrate 300 in the novel combined power supply substrate 10 provided by the embodiment of the application are connected through the supporting structure 200; components requiring thermal conductivity may be placed on the first substrate 100, and circuits having no requirement for thermal conductivity, such as control circuits and protection circuits, may be disposed on the second substrate 300. Through this power supply combination base plate, both can carry out complicated wiring, also can dispel the heat for heating element well, improved the efficiency and the reliability of power.
In one embodiment, the first substrate 100 is detachably connected to the support structure 200 for easy assembly and component inspection on each substrate; the second substrate 300 is detachably coupled to the support structure 200.
Exemplarily, the support structure 200 includes at least 3 support columns disposed on the first substrate 100, and first ends of the support columns are connected to corresponding threaded holes disposed on the first substrate 100 through disposed threads; the second end of the supporting column is connected with a threaded hole correspondingly arranged on the second substrate 300 through the arranged threads. Specifically, as shown in fig. 1, 2 and 3, the first substrate 100 and the second substrate 300 may be rectangular, 4 support pillars may be disposed at four corners of the first substrate 100 and the second substrate 300, and first ends of the support pillars are connected to corresponding threaded holes disposed on the first substrate 100 through disposed threads; the second end of the supporting column is connected with a threaded hole correspondingly arranged on the second substrate 300 through the arranged threads.
It should be noted that the first substrate 100 and the second substrate 300 may also be configured as a circle or other types of polygons; the number and the position of the supporting columns can be set according to actual requirements. For example, the first substrate 100 and the second substrate 300 may also be configured in a circular shape, and the support columns may be configured in an equilateral triangle arrangement.
In one embodiment, the first substrate 100 may be an aluminum substrate or a copper substrate, and the components on the substrate may be rapidly cooled by using the aluminum substrate or the copper substrate with heat conductivity.
In one embodiment, a ceramic substrate may be used as the first substrate 100. The ceramic substrate is used, so that on one hand, the components can be well radiated; on the other hand, the insulation effect can also be achieved.
In one embodiment, the second substrate 300 may be an FR4 substrate. Since complicated wiring can be performed on the FR4 substrate, circuits such as a control circuit and a protection circuit of the power module, which do not require heat conductivity, can be provided on the FR4 substrate.
In one embodiment, the FR5 substrate may be used instead of the FR4 substrate, so that the second substrate 300 has better heat resistance.
In summary, the present application provides a novel combined power supply substrate, including a first substrate; a support structure disposed on the first substrate; a second substrate coupled to the support structure; the first substrate is a heat-conducting substrate and is used for placing components needing heat conduction; the second substrate is used for placing circuits without requirements on heat conductivity, and the circuits comprise a control circuit and a protection circuit. The first substrate is connected with the second substrate through a supporting structure; components that need to conduct heat may be placed on the first substrate, while circuits that do not require thermal conductivity, such as control circuits and protection circuits, may be disposed on the second substrate. Through this power supply combination base plate, both can carry out complicated wiring, also can dispel the heat for heating element well, improved the efficiency and the reliability of power.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (7)
1. A novel combined power supply substrate is characterized by comprising: a first substrate; a support structure disposed on the first substrate; a second substrate coupled to the support structure; the first substrate is a heat-conducting substrate and is used for placing components needing heat conduction; the second substrate is used for placing circuits without requirements on heat conductivity, and the circuits comprise a control circuit and a protection circuit.
2. The novel modular power supply substrate of claim 1, wherein said first substrate is removably attached to said support structure; the second substrate is detachably connected with the supporting structure.
3. The novel combined power supply substrate as claimed in claim 1 or 2, wherein the supporting structure comprises at least 3 supporting pillars disposed on the first substrate, and first ends of the supporting pillars are connected with corresponding threaded holes disposed on the first substrate through disposed threads; and the second end of the supporting column is connected with a threaded hole correspondingly arranged on the second substrate through a set thread.
4. The novel combined power supply substrate as claimed in claim 1, wherein the first substrate is an aluminum substrate or a copper substrate.
5. The novel composite power supply substrate according to claim 1, wherein the first substrate is a ceramic substrate.
6. The novel composite power substrate as claimed in claim 1, wherein the second substrate is an FR4 substrate.
7. The novel composite power substrate as claimed in claim 1, wherein the second substrate is an FR5 substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021258033.3U CN212519542U (en) | 2020-07-01 | 2020-07-01 | Novel combined power supply substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021258033.3U CN212519542U (en) | 2020-07-01 | 2020-07-01 | Novel combined power supply substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212519542U true CN212519542U (en) | 2021-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021258033.3U Active CN212519542U (en) | 2020-07-01 | 2020-07-01 | Novel combined power supply substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212519542U (en) |
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2020
- 2020-07-01 CN CN202021258033.3U patent/CN212519542U/en active Active
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