CN212446195U - Injection mold injection monitoring equipment - Google Patents

Injection mold injection monitoring equipment Download PDF

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Publication number
CN212446195U
CN212446195U CN202020882920.1U CN202020882920U CN212446195U CN 212446195 U CN212446195 U CN 212446195U CN 202020882920 U CN202020882920 U CN 202020882920U CN 212446195 U CN212446195 U CN 212446195U
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injection mold
pressure sensor
injection
temperature sensor
data acquisition
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李辉
葛晓宏
黄桂美
林智雄
林华涛
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Xiamen University of Technology
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Xiamen University of Technology
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Abstract

The utility model discloses an injection mold supervisory equipment that moulds plastics, a serial communication port for monitor injection mold's state, include: the injection mold comprises a first pressure sensor, a second pressure sensor, a first temperature sensor, a second temperature sensor, a data acquisition card and monitoring equipment, wherein the first pressure sensor is placed at a main sprue of a mold cavity of the injection mold; the data output ends of the first pressure sensor, the second pressure sensor, the first temperature sensor and the second temperature sensor are connected to the data input end of the data acquisition card, and the data output end of the data acquisition card is connected to the monitoring equipment. The utility model discloses can effectively monitor the state in the mould at the in-process of moulding plastics to guarantee the quality of moulding plastics.

Description

Injection mold injection monitoring equipment
Technical Field
The utility model relates to a bathroom field of moulding plastics especially relates to an injection mold supervisory equipment that moulds plastics.
Background
The traditional injection molding product development is completed by a trial method, for a long time, the injection molding process and the mold design mostly depend on limited experience and simple formulas, and whether the mold design and the production process are reasonable or not is verified by repeatedly repairing the mold, so that the plastic product has long manufacturing period, high cost and difficult quality guarantee. With the shortening of the product distribution period and the improvement of the quality requirement, the traditional production mode cannot meet the requirements of modern development.
The advanced CAE technology of injection molding establishes a mathematical physical model of the flow and heat transfer of plastic melt in a mold cavity according to the basic theories of plastic processing rheology and heat transfer, uses a numerical calculation theory solving method, uses a computer graphics technology to vividly and intuitively simulate the speed, pressure, temperature, shear rate, shear stress distribution and the orientation state of a filler when the melt flows in a pouring system and the mold cavity in actual molding on a computer screen, predicts the position and size of a weld mark and an air pocket, and predicts the shrinkage rate, the warping deformation degree and the structural stress distribution of a plastic part, thereby judging whether the given mold, product design scheme and molding process scheme are reasonable or not.
The injection molding CAE technology is utilized to analyze and simulate a mold design scheme in a computer before a mold is manufactured so as to replace an actual mold test and predict potential defects in design, break through the traditional constraint of repeated mold test and mold repair on an injection molding machine and provide scientific basis for designers to modify the design. The direct benefits of the CAE technology applied in the mold design are time saving and labor saving, the times of mold testing and repairing are reduced, the rejection rate of the mold is reduced, the design and manufacturing period of the mold is shortened, the cost is reduced, and the product quality is improved.
Although the CAE software is applied, the structure of the plastic part, the structure of the injection mold and the injection molding flow can be verified and optimized before formal production, the influence of the wall thickness, the sprue position, the material and the change of the geometric shape on the product molding process and the final quality can be shown through simulation setting and result clarification, unnecessary loss is avoided through advance prediction, and the cost is saved. However, the assumption of ideal models and simulation conditions causes a certain deviation of the simulation result from the actual result, which is not allowed in the molding process of high-quality and zero-defective products.
However, the mold is a black box, and the change process of the melt state in the mold cavity is not clear in the injection molding production process, so that online prediction and control cannot be performed in the production process.
SUMMERY OF THE UTILITY MODEL
To the problem, an object of the utility model is to provide an injection mold supervisory equipment that moulds plastics can effectively monitor the state in the mould at the in-process of moulding plastics to guarantee the quality of moulding plastics.
The embodiment of the utility model provides an injection mold supervisory equipment that moulds plastics for monitor injection mold's state, include: the injection mold comprises a first pressure sensor, a second pressure sensor, a first temperature sensor, a second temperature sensor, a data acquisition card and monitoring equipment, wherein the first pressure sensor is placed at a main sprue of a mold cavity of the injection mold; the data output ends of the first pressure sensor, the second pressure sensor, the first temperature sensor and the second temperature sensor are connected to the data input end of the data acquisition card, and the data output end of the data acquisition card is connected to the monitoring equipment.
Preferably, the first and second pressure sensors are indirect type pressure sensors.
Preferably, the data acquisition card is an NIM series-high precision multifunctional data acquisition card.
Preferably, the first temperature sensor and the second temperature sensor are DS18B20 type sensors.
Preferably, the first pressure sensor, the second pressure sensor, the first temperature sensor and the second temperature sensor are all connected to the data acquisition card through cables.
Preferably, the monitoring device is a computer.
In the above embodiment, the corresponding pressure sensor and the corresponding temperature sensor are arranged at the corresponding positions of the injection mold, so that the temperature change and the temperature change of each key position of the injection mold in the injection molding process are monitored, an operator can timely acquire the temperature change information and the pressure change information in the injection mold, and the adjustment can be timely performed, so that the qualification rate of products is improved, and the like.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, and obviously, the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an injection mold injection monitoring device provided by the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
For better understanding of the technical solutions of the present invention, the following detailed descriptions of the embodiments of the present invention are provided with reference to the accompanying drawings.
It should be understood that the described embodiments are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
In the embodiments, the references to "first \ second" are merely to distinguish similar objects and do not represent a specific ordering for the objects, and it is to be understood that "first \ second" may be interchanged with a specific order or sequence, where permitted. It should be understood that "first \ second" distinct objects may be interchanged under appropriate circumstances such that the embodiments described herein may be practiced in sequences other than those illustrated or described herein.
Referring to fig. 1, an embodiment of the present invention provides an injection mold injection monitoring device, which is used for monitoring a state of an injection mold, and includes: the injection mold comprises a first pressure sensor 10 placed at a main sprue of a mold cavity of the injection mold, a second pressure sensor 20 placed in the mold cavity of the injection mold, a first temperature sensor 30 placed at the inner side wall of the mold cavity, a second temperature sensor 40 placed at the outer side wall of the mold cavity, a data acquisition card 50 and monitoring equipment 60; the data output ends of the first pressure sensor 10, the second pressure sensor 20, the first temperature sensor 30 and the second temperature sensor 40 are connected to the data input end of the data acquisition card 50, and the data output end of the data acquisition card 50 is connected to the monitoring device 60.
In the present embodiment, the first pressure sensor 10 and the second pressure sensor 20 are indirect pressure sensors.
Currently, there are two types of pressure sensors used in mold cavities, namely the flush type and the indirect type. The flush-mounted sensor is inserted into the mold cavity by drilling a mounting hole in the back of the mold cavity, with its top flush with the surface of the mold cavity, and with its cable passing through the mold to interface with a monitoring system located on the outer surface of the mold. The advantage of this sensor is that it is not disturbed by the pressure during demoulding, but it is easily damaged at high temperatures, making installation difficult.
For this reason, the present embodiment employs an indirect type pressure sensor, which is divided into a sliding type and a button type. They all transmit the pressure of the plastic melt on the ejector or fixed pin to a sensor on the ejector plate or moving platen of the mold. The slide sensor is typically mounted on the ejector plate under an existing pusher pin. When high temperature molding is performed, or when a low pressure sensor is used for the small ejector pin, the slide sensor is generally mounted on the moving platen of the mold, with the ejector pin acting through the ejector sleeve or with a transition pin. The transition pin has two functions, one is that it can protect the slide sensor from interference from the ejection pressure in the case of using the existing ejector. The other function is that when the production period is short and the demoulding speed is high, the sensor can not be influenced by the rapid acceleration and deceleration of the ejector plate.
In the present embodiment, the first pressure sensor 10 is disposed at a main gate of a cavity of the injection mold for detecting an injection pressure of the melt, and the second pressure sensor 20 is disposed in the cavity of the injection mold for detecting a holding pressure in the cavity.
In the present embodiment, the first temperature sensor 30 and the second temperature sensor 40 are DS18B20 type sensors. In particular, a cable type DS18B20 sensor.
In this embodiment, the data acquisition card 50 may be a NIM series-high precision multifunctional data acquisition card.
The first pressure sensor 10, the second pressure sensor 20, the first temperature sensor 30 and the second temperature sensor 40 are all connected to the data acquisition card 50 through cables, and the data acquisition card 50 automatically acquires data detected by the sensors and sends the data to the monitoring equipment 60 serving as an upper computer for analysis and processing. The data acquisition card can be connected to the monitoring device 60 through buses such as USB, PXI, PCI Express, firewire (1394), PCMCIA, ISA, Compact Flash, 485, 232, ethernet, various wireless networks, and the like.
The operation principle of the present embodiment is described in detail below.
In this embodiment, when the injection mold needs to be monitored, the first pressure sensor 10, the second pressure sensor 20, the first temperature sensor 30 and the second temperature sensor 40 are respectively disposed at corresponding positions of the injection mold, and are connected to the data acquisition card 50. In the injection molding process, each sensor sends acquired data to the monitoring device 60 through the data acquisition card 50, and the monitoring device 60 receives the data and forms a corresponding temperature curve and a corresponding pressure curve, so that an operator can acquire temperature change information and pressure change information in an injection mold in time, and the adjustment can be performed in time, the qualification rate of products is improved, and the like.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.

Claims (6)

1. The utility model provides an injection mold supervisory equipment that moulds plastics for to injection mold's state is monitored, include: the injection mold comprises a first pressure sensor, a second pressure sensor, a first temperature sensor, a second temperature sensor, a data acquisition card and monitoring equipment, wherein the first pressure sensor is placed at a main sprue of a mold cavity of the injection mold; the data output ends of the first pressure sensor, the second pressure sensor, the first temperature sensor and the second temperature sensor are connected to the data input end of the data acquisition card, and the data output end of the data acquisition card is connected to the monitoring equipment.
2. An injection mold injection monitoring apparatus as claimed in claim 1 wherein said first and second pressure sensors are indirect type pressure sensors.
3. The injection mold injection monitoring device of claim 1, wherein the data acquisition card is a NIM series-high precision multifunctional data acquisition card.
4. An injection mold injection monitoring apparatus as claimed in claim 1 wherein said first and second temperature sensors are DS18B20 type sensors.
5. The injection mold monitoring device of claim 1, wherein the first pressure sensor, the second pressure sensor, the first temperature sensor, and the second temperature sensor are all connected to the data acquisition card by cables.
6. An injection mold injection monitoring device as claimed in claim 1, wherein the monitoring device is a computer.
CN202020882920.1U 2020-05-22 2020-05-22 Injection mold injection monitoring equipment Active CN212446195U (en)

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Application Number Priority Date Filing Date Title
CN202020882920.1U CN212446195U (en) 2020-05-22 2020-05-22 Injection mold injection monitoring equipment

Publications (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113619029A (en) * 2021-07-29 2021-11-09 中山诗兰姆汽车零部件有限公司 Injection mold with temperature sensing and pressure sensing functions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113619029A (en) * 2021-07-29 2021-11-09 中山诗兰姆汽车零部件有限公司 Injection mold with temperature sensing and pressure sensing functions

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