CN212402469U - Feeding equipment for semiconductor elements after packaging by means of lever feeding - Google Patents

Abstract

The utility model discloses a blanking device after semiconductor element packaging by lever feeding, the structure of which comprises a device main body, an operation box, a supporting frame, a mounting plate, a feeding disc, a track, a clamping feeder, a frame, a discharging port and a packaging bin, the utility model is used for conveying semiconductor elements from the track to the clamping feeder on the surface of the butt-joint packaging bin, according to the requirement of packaging ration, the interval time of a timing module corresponds to the single blanking time, the front end of a touch frame is mechanically connected with a lever head to form a movable structure body with liftable height by combination, the vertical lines on the two sides of the clamping plate are parallel when the two parts are in butt joint, the blanking operation of conveying the semiconductor elements is convenient by an open groove, otherwise, the clamping plate on the upper part of a positioning seat is inclined inwards towards the two sides of the middle part to stop the semiconductor elements, and the function of reducing collision impact between the parts is, the conveying and blanking safety factor of the semiconductor element can be effectively improved.

Description

Feeding equipment for semiconductor elements after packaging by means of lever feeding

Technical Field

The utility model relates to an unloading equipment after semiconductor element packing of dependence lever pay-off belongs to equipment for packing unloading technical field.

Background

The semiconductor element is widely applied in the electronic field, and needs to be transported after production so as to facilitate subsequent packaging operation, and the semiconductor element is loaded into a packaging material through equipment, so that the use of a semiconductor can be facilitated.

However, the existing blanking equipment needs to convey semiconductor elements with different sizes, and in the process that the semiconductor elements enter the track, the semiconductor elements vibrate under the track operation factor, so that the collision force between the semiconductor and the track is increased during blanking, and the semiconductor elements are easy to fall off.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a rely on unloading equipment after semiconductor element packing of lever pay-off to solve current unloading equipment and need carry the semiconductor element of equidimension not, semiconductor element gets into orbital in-process, because semiconductor element vibrates under the track operation factor, semiconductor and rail impact dynamics increase during the unloading, lead to the problem that semiconductor element dropped easily.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a semiconductor element's unloading equipment after packing that relies on lever pay-off, its structure includes equipment principal, control box, support frame, mounting panel, feed table, track, centre gripping feeder, frame, discharge gate, packing storehouse, be equipped with the control box that the combination was used in the equipment principal, the equipment principal is last to have the integrative packing storehouse of assembly, equipment principal structure top has set the feed table, the export is connected with the track on the feed table, the equipment principal left side sets the highly unchangeable mounting panel in position, the support frame is connected with the frame, the packing storehouse feed opening has set the centre gripping feeder.

Further, the centre gripping feeder includes timing module, touches the frame, lever head, grip block, positioning seat, stop and connect pole, flexible groove block, joint spare, the timing module is led mutually and is touched the frame, touch frame front end mechanical connection lever head, lever head looks gomphosis joint spare, joint spare lower extreme activity touches flexible groove block surface recess, flexible groove block is established on stopping the pole top end and connects the head, stop and connect the pole and hang down to establish in positioning seat structure groove department, positioning seat recess upper portion is equipped with the grip block, the movable mid point of grip block is through stopping pole looks pressure joint lever head, the continuous operation case of timing module wire, the positioning seat is installed in packing storehouse surface feed opening department.

Further, the feed tray is arranged on the surface of the groove of the mounting plate.

Further, the mounting plate is provided at a position above the surface of the support frame.

Further, the packaging bin channel groove integrally forms a discharge hole.

Further, the track is arranged at the feeding position of the packaging bin.

Furthermore, the central line opening of the telescopic groove block penetrates through the corresponding positioning seat hollow layer.

Furthermore, the positioning seat groove penetrates through the butt joint rail and the packaging bin up and down.

Advantageous effects

The utility model relates to an unloading equipment after semiconductor element packing of rely on lever pay-off, semiconductor element carries the centre gripping feeder department of butt joint packing storehouse surface from the track, according to packing quantitative demand, it is long when corresponding single unloading when timing module interval, it connects the lever head to touch a front end machinery, the combination constitutes the movable structure body of liftable height, then the grip block both sides plumb line is parallel when both are to the butt joint coincidence, the unloading operation that open groove semiconductor element carried is convenient for, otherwise through joint spare embedding flexible groove piece surface midpoint department when the displacement descends, make the grip block on positioning seat upper portion lean on in to middle part both sides slope, semiconductor element has been caught, the collision impact function between reduction part has, can effectively improve semiconductor element's transport unloading factor of safety.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of the blanking device for semiconductor element packaging by lever feeding of the present invention;

FIG. 2 is a schematic view of the outward-opening structure of the holding feeder of the present invention;

fig. 3 is a schematic view of the internal condensation structure of the holding feeder of the present invention.

In the figure: the device comprises a device main body-1, an operation box-2, a support frame-3, a mounting plate-4, a feeding tray-5, a rail-6, a clamping feeder-7, a timing module-730, a touch frame-731, a lever head-732, a clamping plate-733, a positioning seat-734, a blocking rod-735, a telescopic groove block-736, a clamping piece-737, a frame-8, a discharge hole-9 and a packaging bin-10.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1-3, the present invention provides a technical solution: the blanking equipment comprises an equipment main body 1, an operation box 2, a support frame 3, a mounting plate 4, a feeding disc 5, a rail 6, a clamping feeder 7, a rack 8, a discharge port 9 and a packaging bin 10, wherein the operation box 2 used in combination is arranged on the equipment main body 1, the packaging bin 10 integrated with the equipment main body 1 is arranged on the equipment main body 1, the feeding disc 5 is arranged at the top of the structure of the equipment main body 1, an upper outlet of the feeding disc 5 is connected with the rail 6, the mounting plate 4 with the same height is arranged at the left side of the equipment main body 1, the support frame 3 is connected with the rack 8, the clamping feeder 7 is arranged at the discharge port of the packaging bin 10, and the clamping feeder 7 comprises a timing module 730, a touch frame 731, a lever head 732, a clamping plate 733, a positioning seat 734, a blocking 735 connecting rod, a telescopic groove block 736, Joint 737, timing module 730 leads contact moves frame 731 mutually, touch frame 731 front end mechanical coupling lever head 732, lever head 732 gomphosis joint 737 mutually, joint 737 lower extreme activity touches flexible groove block 736 surface recess, flexible groove block 736 is established at the head of hindering to connect pole 735 top, hinder and connect pole 735 and hang down to establish groove department under the positioning seat 734 structure, positioning seat 734 recess upper portion is equipped with grip block 733, grip block 733 activity midpoint is through hindering the pole 735 and pressing the lever head 732 mutually, timing module 730 wire links to each other control box 2, positioning seat 734 installs at packing storehouse 10 surface feed opening department, feed table 5 establishes on mounting panel 4 recess surface, mounting panel 4 establishes in support frame 3 surface top department, packing storehouse 10 passageway recess an organic whole constitutes discharge gate 9, track 6 sets up in packing storehouse 10 feed opening department, the central line opening of the telescopic groove block 736 passes through the corresponding positioning seat 734 hollow layer, and the positioning seat 734 groove passes through the butt joint rail 6 and the packaging bin 10 from top to bottom.

The touch frame 731 and the lever head 732 are combined to form a movable structure with height adjustable, when they are mated, the vertical lines on both sides of the clamping plate 733 are parallel, otherwise, when the displacement is lowered, both sides of the clamping plate 733 are inclined and opposite.

For example: when the semi-conductor component feeding device is used, the semi-conductor component is conveyed to a clamping feeder 7 on the surface of an abutting packaging bin 10 from a rail 6, according to the requirement of packaging quantification, the interval time of a timing module 730 is long corresponding to the time of single blanking, a lever head 732 is mechanically connected to the front end of a touch frame 731, a movable structure body with a height capable of being lifted is formed by combination, when the timing module and the clamping module are abutted, vertical lines on two sides of a clamping plate 733 are parallel, an opening groove is convenient for blanking operation of conveying the semi-conductor component, otherwise, when the displacement is lowered, the clamping plate 733 on the upper portion of a positioning seat 734 is embedded into the middle point of the surface of a telescopic groove block 736 through a clamping piece 737, so that the clamping plate 733 on the upper portion of.

The utility model provides a problem be that current unloading equipment need carry not the semiconductor element of equidimension, and semiconductor element gets into orbital in-process, because semiconductor element vibrates under the track operation factor, and semiconductor and track collision dynamics increase during the unloading, leads to semiconductor element to drop easily, the utility model discloses a combination of each other of above-mentioned part relies on lever feeding mechanism, has realized pay-off, has the collision shock function that reduces between the part, can effectively improve semiconductor element's transport unloading factor of safety.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (6)

1. The utility model provides a rely on unloading equipment after semiconductor element packing of lever pay-off, its structure includes equipment main part (1), control box (2), support frame (3), mounting panel (4), feed table (5), track (6), centre gripping feeder (7), frame (8), discharge gate (9), packing bin (10), its characterized in that:

the device is characterized in that an operation box (2) used in a combined mode is arranged on the device main body (1), a packaging bin (10) integrated with the device main body (1) in an assembling mode is arranged on the device main body (1), a feeding disc (5) is arranged at the structural top of the device main body (1), an outlet in the feeding disc (5) is connected with a rail (6), a mounting plate (4) with the unchanged position and height is arranged on the left side of the device main body (1), the supporting frame (3) is connected with a rack (8), and a clamping feeder (7) is arranged at a feed opening of the packaging bin (10.

2. A semiconductor element packaged blanking apparatus according to claim 1, wherein: the clamping feeder (7) comprises a timing module (730), a touch frame (731), a lever head (732), a clamping plate (733), a positioning seat (734), a blocking rod (735), a telescopic groove block (736) and a clamping piece (737), wherein the timing module (730) is in conductive contact with the movable frame (731), the front end of the touch frame (731) is mechanically connected with the lever head (732), the lever head (732) is embedded with the clamping piece (737), the lower end of the clamping piece (737) is movably in contact with a surface groove of the telescopic groove block (736), the telescopic groove block (736) is arranged on the top end of the blocking rod (735), the blocking rod (735) is vertically arranged at a lower groove of the positioning seat (734) structure, the clamping plate (733) is arranged on the upper portion of the groove of the positioning seat (734), the clamping plate (733) is movably in contact with the lever head (732) through the blocking rod (735), the timing module (730) is connected with an operation box (2) through a lead, the positioning seat (734) is arranged at a feed opening on the surface of the packaging bin (10).

3. A semiconductor element packaged blanking apparatus according to claim 1, wherein: the feeding plate (5) is arranged on the groove surface of the mounting plate (4).

4. A semiconductor element packaged blanking apparatus according to claim 1, wherein: the mounting plate (4) is arranged above the surface of the support frame (3).

5. A semiconductor element packaged blanking apparatus according to claim 1, wherein: the channel groove of the packaging bin (10) is integrated to form a discharge hole (9).

6. A semiconductor element packaged blanking apparatus according to claim 1, wherein: the rail (6) is arranged at the feeding position of the packaging bin (10).

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