CN212399982U - Crystal cutting device - Google Patents
Crystal cutting device Download PDFInfo
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- CN212399982U CN212399982U CN202021602120.6U CN202021602120U CN212399982U CN 212399982 U CN212399982 U CN 212399982U CN 202021602120 U CN202021602120 U CN 202021602120U CN 212399982 U CN212399982 U CN 212399982U
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Abstract
The utility model discloses a crystal cutting device, which comprises a pay-off roller, a wire collecting roller, a cutting wire, a wire net driving mechanism and a crystal fixing device, wherein the cutting wire discharged by the pay-off roller is wound on the wire collecting roller after bypassing the wire net driving mechanism; be equipped with the cell body on the gauze actuating mechanism, the line of cut is convoluteed in order to form the cutting wire net along the cell body on the gauze actuating mechanism, and crystal fixing device is located one side of cutting wire net, crystal fixing device includes that lifting unit, brilliant hold in the palm, crystal fixing device still includes: the connecting plate is connected with one end of the lifting component; the deflection adjusting component is used for driving the connecting plate to deflect so as to adjust the cutting position of the crystal to be cut by the wire mesh, and the deflection adjusting component is matched with the connecting plate; the crystal support connecting assembly is fixed with the connecting plate and matched with the crystal support. The utility model has the advantages of the crystal orientation of the silicon chip that makes the cutting obtains the promotion.
Description
Technical Field
The utility model relates to a crystal cutting technical field, concretely relates to crystal cutting device.
Background
CN108501232A discloses a cutting method of a diamond wire cutting device for polycrystalline silicon, which comprises wire feeding by a pay-off roller: the paying-off roller and the winding roller rotate, a wire storage section of the paying-off roller pays off to the winding roller, the wire arranging swing arm deflects, and under the guide of the wire arranging wheel, a k kilometer diamond wire is wound on the winding wheel; wire feeding by a take-up pulley: the paying-off roller and the taking-up roller rotate reversely, the taking-up wheel pays off the paying-off wheel, the wire arranging swing arm swings, and the diamond wire of m kilometers is wound on the paying-off wheel under the guidance of the wire arranging wheel; cutting incoming wires: the wire take-up wheel continuously releases the diamond wires of n kilometers to the wire release wheel, and the crystal support descends at the same time, so that the crystal bar is pressed downwards towards the wire mesh until the crystal bar is cut into a plurality of pieces by the wire mesh; wire returning of the paying-off wheel and the wire winding wheel: the crystal support rises to drive the crystal bar to be separated from the wire net, the pay-off roller and the take-up roller rotate, and the pay-off wheel pays off wires to the take-up wheel, so that the (m + n) kilometers of diamond wires on the pay-off wheel are all recovered and wound on the take-up wheel; paying off the diamond wire storage section of the paying-off roller by the take-up pulley, and completely recovering and winding the k kilometers of diamond wire on the take-up pulley onto the wire storage section of the paying-off roller; paying off the wire storage section of the paying-off roller to the wire storage section of the wire collecting roller so that the wire storage section of the wire collecting roller is wound with a diamond wire of k-m-n kilometers; the pay-off roller stores up the empty line of line section: the paying-off roller and the winding roller rotate, and the paying-off roller wire storage section emits the diamond wire of h kilometers to the winding roller wire storage section under the guide of the winding swing arm.
Due to various characteristics of the crystal (polycrystalline silicon), people have different crystal orientation precision requirements on the use of various crystals, different crystal faces have different hardness, elastic modulus and breaking strength in the cutting process, and the thickness difference and the warping rate of the cut material are also greatly different. For silicon wafers with high cutting requirements, such as silicon wafers used for the preparation of chips, the cutting needs to be carried out in a specific manner. For the cutting method, the problems of tool entering TTV, tool entering warping, line marks and the like caused by old line cutting are avoided. However, since the positions of the diamond wire and the silicon rod used for dicing are fixed and cannot be adjusted, the CN108501232A document cannot cut the silicon wafer in the crystal orientation arrangement, and the crystal orientation accuracy of the silicon wafer obtained by dicing is low.
SUMMERY OF THE UTILITY MODEL
The utility model provides a crystal cutting device that the crystal orientation that enables the silicon chip obtains the promotion.
The technical scheme for solving the technical problems is as follows:
the crystal cutting device comprises a pay-off roller, a take-up roller, a cutting line, a wire mesh driving mechanism and a crystal fixing device, wherein the cutting line paid off by the pay-off roller is wound on the take-up roller after bypassing the wire mesh driving mechanism; be equipped with the cell body on the gauze actuating mechanism, the line of cut is convoluteed in order to form the cutting wire net along the cell body on the gauze actuating mechanism, and crystal fixing device is located one side of cutting wire net, crystal fixing device includes that lifting unit, brilliant hold in the palm, crystal fixing device still includes:
the connecting plate is connected with one end of the lifting component;
the deflection adjusting component is used for driving the connecting plate to deflect so as to adjust the cutting position of the crystal to be cut by the wire mesh, and the deflection adjusting component is matched with the connecting plate;
the crystal support connecting assembly is fixed with the connecting plate and matched with the crystal support.
The utility model discloses a beat adjusting part is to the connecting plate drive for the connecting plate beat, the brilliant support coupling assembling and hold in the palm the brilliant support that coupling assembling is connected with this brilliant along with connecting plate 7 synchronous beat, thereby change the position of crystal, because the position of cutting wire net is fixed unchangeable, after the position change of crystal, the position that the crystal was cut by cutting wire net has just changed, through such adjustment, can make the crystal cut according to the crystal orientation range, and then the crystal orientation precision that makes the silicon chip that the cutting obtained obtains improves.
The utility model discloses in, combine to the line of cut adopt the structure that has two driving rollers in diamond wire and the gauze actuating mechanism, the crystal cutting of specially adapted 8 inches.
Drawings
FIG. 1 is a schematic structural diagram of a crystal cutting apparatus;
FIG. 2 is a schematic view of a part of the base of FIG. 1 after being hidden;
FIG. 3 is a schematic view of a part of the base of FIG. 2 after being hidden;
FIG. 4 is an assembly view of the connection plate and the wafer holder connection assembly and the guide member;
FIG. 5 is a schematic view of the structure of the guide member;
reference numbers in the drawings:
the automatic wire drawing device comprises a paying-off roller 1, a wire drawing roller 2, a cutting wire 3, a rotary driving mechanism 4, a transmission roller 5, a lifting component 6, a connecting plate 7, an adjusting block 8, a mounting hole 8a, a first clamping component 9, a first supporting portion 9a, a second clamping component 10, a second supporting portion 10a, a wedge portion 10b, a sliding space 11, a jacking bolt 12, a jacking block 13, a jacking block 14, a guiding component 14a, a first side surface 14b, a second side surface 15, an intermediate connecting component 15, a bottom plate 16, a resin mounting plate 17 and a crystal.
Detailed Description
The present invention will be described with reference to fig. 1 to 5.
The utility model discloses a crystal cutting device, which comprises a pay-off roller 1, a take-up roller 2, a cutting line 3, a wire net driving mechanism and a crystal fixing device, wherein the cutting line 3 released by the pay-off roller 1 bypasses the wire net driving mechanism and then is wound on the take-up roller 2; diamond wire is preferably used as the cutting wire 3. The wire mesh driving mechanism is provided with a groove body, the cutting wire 3 is wound along the groove body on the wire mesh driving mechanism to form a cutting wire mesh (not shown in the figure), the wire mesh driving mechanism comprises a rotary driving mechanism 4 and two driving rollers 5 which are arranged in parallel, and the rotary driving mechanism 4 is connected with one of the driving rollers 5. The rotary driving mechanism 4 preferably adopts a structure consisting of a motor and a belt transmission mechanism, and the groove body is arranged on the transmission roller 5.
The crystal fixing device is positioned on one side of the cutting wire net and comprises a lifting component 6 and a crystal support, wherein the lifting component 6 comprises a lifting motor, a screw rod mechanism and a lifting workbench, the lifting motor is connected with the screw rod mechanism, and the screw rod mechanism is connected with the lifting workbench. When cutting is performed, the lifting and lowering member 6 drives the crystal a to be fed in the longitudinal direction (the up-down direction in fig. 1).
The crystal support comprises a guide component 14, an intermediate connecting component 15, a bottom plate 16 and a resin mounting plate 17, wherein the guide component 14 and the intermediate connecting component 15 are preferably fixed by screws, the intermediate connecting component 15 and the bottom plate 16 are preferably fixed by screws, the resin mounting plate 17 and the bottom plate 16 are preferably fixed by adopting a bonding mode, and the resin mounting plate 17 is used for bonding and fixing the crystal A.
Crystal fixing device still includes connecting plate 7, drive connecting plate 7 beat carries out the beat adjusting part of cutting position adjustment with adjustment crystal A by the cutting gauze, brilliant support coupling assembling, connecting plate 7 is connected with the one end of elevating part 6, connecting plate 7 passes through fastening bolt with elevating part 6 and fixes, beat adjusting part and connecting plate 7 cooperation, brilliant support coupling assembling is fixed with connecting plate 7, brilliant support coupling assembling and brilliant support cooperation, preferably, the cooperation of guide part 14 and brilliant support coupling assembling in the brilliant support.
The connecting plate 7 is driven by the deflection adjusting assembly, so that the connecting plate 7 deflects, the crystal support connecting assembly and the crystal support connected with the crystal support connecting assembly synchronously deflect along with the connecting plate 7, and the position of the crystal A is changed.
The deflection adjusting assemblies are two groups, each deflection adjusting assembly comprises an adjusting block 8 and an adjusting screw (not shown in the figure), the adjusting blocks 8 are fixedly connected with the lifting component 6 preferentially by fastening screws, and the adjusting blocks 8 and the lifting component 6 can also be fixed by rivets or welding. The adjusting block 8 is provided with a mounting hole 8a for connecting an adjusting screw, and the adjusting screw is matched with the connecting plate 7 to drive the connecting plate 7 to swing. Preferably, the adjusting screw abuts against the connecting plate 7 during adjustment.
When the adjusting screw in one of the deflection adjusting assemblies is kept still and the adjusting screw in the other deflection adjusting assembly is fed, one end of the connecting plate 7 is acted by the feeding action force of the adjusting screw, so that the connecting plate 7 can deflect by taking the abutting part of the adjusting screw abutting against the other end as a rotation center. After the required position is adjusted, the connecting plate 7 is fixed with the lifting component 6 by fastening bolts. In the adjusting process, the crystal orientation of the crystal A is detected by matching with a crystal orientation detection instrument so as to finally determine the position of the fixed connection between the connecting plate 7 and the lifting component 6. The utility model adopts the above structure beat adjusting part is adjusted connecting plate 7 is manual, does benefit to the position of adjusting and controls to crystal orientation detecting instrument detects crystal A, helps confirming crystal A's position fast like this, makes the regulation reach quick controllable purpose.
The crystal support connecting assembly comprises a first clamping part 9, a second clamping part 10 and a jacking assembly, wherein the first clamping part 9 is provided with a first supporting part 9a for supporting the crystal support, the first clamping part 9 is fixed with the connecting plate 7, the second clamping part 10 is provided with a second supporting part 10a for supporting the crystal support, the second clamping part 10 is fixed with the connecting plate 7, a sliding space 11 for the crystal support to slide is formed between the first clamping part 9 and the second clamping part 10, and a guide part 14 in the crystal support is inserted into the sliding space 11 and then is supported by the first supporting part 9a and the second supporting part 10a respectively.
The jacking assembly is arranged on the first clamping part 9 and/or the second clamping part 10, preferably, the jacking assembly is arranged on the first clamping part 9, and after the crystal support is matched in the sliding space 11, the crystal support abuts against the jacking assembly, the connecting plate 7 and the first clamping part 9 or the second clamping part 10 respectively. Preferably, a groove is formed in the connecting plate 7, and one end of the crystal support connecting assembly is fixed to the connecting plate 7 after being fitted in the groove, that is, one end of each of the first clamping component 9 and the second clamping component 10 is fitted in the groove of the connecting plate 7.
The second clamping part 10 is provided with a wedge-shaped portion 10b at a location opposite to the first clamping part 9, at least a first side 14a of the portion of the wafer holder located in the sliding space 11 is a slope, the first side 14a is a face corresponding to the wedge-shaped portion 10b, preferably, a guide part 14 is located in the sliding space 11, the first side 14a of the guide part 14 is preferably provided as a slope, and the first side 14a cooperates with the wedge-shaped portion 10 b.
The jacking assembly comprises a plurality of jacking bolts 12 in threaded connection with the first clamping part 9 or the second clamping part 10 and a jacking block 13, one end of the jacking block 13 is matched with the jacking bolts 12, the other end of the jacking block 13 is matched with the crystal support, the surface of the crystal support matched with the jacking block 13 is a second side surface 14b of the crystal support, the second side surface 14b is an inclined surface, and the jacking block 13 is a wedge-shaped block.
After one crystal A is cut, when another crystal A needs to be replaced, the puller bolt 12 is loosened, the crystal support is taken out of the crystal support connecting assembly, the resin mounting plate 17 bonded with the crystal A is bonded on the bottom plate 16, the guide part 14 is inserted into the sliding space 11, the guide part 14 is supported by the first supporting part 9a and the second supporting part 10a respectively, and the guide part 14 abuts against the puller assembly, the connecting plate 7 and the first clamping part 9 or the second clamping part 10 respectively through the puller bolt 12 and the abutting block 13, so that the crystal support is fixed.
Claims (10)
1. The crystal cutting device comprises a pay-off roller, a take-up roller, a cutting line, a wire mesh driving mechanism and a crystal fixing device, wherein the cutting line paid off by the pay-off roller is wound on the take-up roller after bypassing the wire mesh driving mechanism; be equipped with the cell body on the gauze actuating mechanism, the line of cut is convoluteed in order to form the cutting wire net along the cell body on the gauze actuating mechanism, and crystal fixing device is located one side of cutting wire net, crystal fixing device includes that lifting unit, brilliant hold in the palm, its characterized in that, crystal fixing device still includes:
the connecting plate is connected with one end of the lifting component;
the deflection adjusting component is used for driving the connecting plate to deflect so as to adjust the cutting position of the crystal to be cut by the wire mesh, and the deflection adjusting component is matched with the connecting plate;
the crystal support connecting assembly is fixed with the connecting plate and matched with the crystal support.
2. The crystal cutting device according to claim 1, wherein the deflection adjusting assemblies are two groups, each group of deflection adjusting assemblies comprises an adjusting block and an adjusting screw, the adjusting block is fixedly connected with the lifting component, the adjusting block is provided with a mounting hole for connecting the adjusting screw, and the adjusting screw is matched with the connecting plate to drive the connecting plate to deflect.
3. Crystal cutting device according to claim 2, characterized in that the adjusting screw abuts against the connecting plate during adjustment.
4. The crystal slicing apparatus of claim 1, wherein the wafer support connection assembly comprises:
the first clamping component is provided with a first supporting part for supporting the crystal support and is fixed with the connecting plate;
the second clamping component is provided with a second supporting part for supporting the crystal support, the second clamping component is fixed with the connecting plate, and a sliding space for the crystal support to slide is formed between the first clamping component and the second clamping component;
the jacking assembly is arranged on the first clamping part and/or the second clamping part;
after the crystal support is matched in the sliding space, the crystal support is respectively abutted against the abutting assembly, the connecting plate and the first clamping part or the second clamping part.
5. The crystal cutting device according to claim 4, wherein the second clamping member is provided with a wedge portion at a portion thereof opposite to the first clamping member, and at least a first side surface of a portion of the wafer holder located in the sliding space is a slope surface, the first side surface being engaged with the wedge portion.
6. The crystal cutting apparatus of claim 4, wherein the puller assembly comprises:
a plurality of tightening bolts threadedly coupled to the first clamping member or the second clamping member;
and one end of the propping block is matched with the propping bolt, and the other end of the propping block is matched with the crystal support.
7. The crystal cutting device according to claim 6, wherein the surface of the wafer support matched with the abutting block is a second side surface of the wafer support, the second side surface is an inclined surface, and the abutting block is a wedge-shaped block.
8. The crystal cutting device of claim 1, wherein the connecting plate is provided with a groove, and one end of the crystal support connecting assembly is fixed with the connecting plate after being matched in the groove.
9. The crystal cutting apparatus of claim 1, wherein the wire mesh drive mechanism comprises a rotary drive mechanism and two drive rollers arranged in parallel, the rotary drive mechanism being connected to one of the drive rollers.
10. The crystal slicing apparatus of claim 1, wherein the cutting line is a diamond wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021602120.6U CN212399982U (en) | 2020-08-05 | 2020-08-05 | Crystal cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021602120.6U CN212399982U (en) | 2020-08-05 | 2020-08-05 | Crystal cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212399982U true CN212399982U (en) | 2021-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021602120.6U Active CN212399982U (en) | 2020-08-05 | 2020-08-05 | Crystal cutting device |
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| Country | Link |
|---|---|
| CN (1) | CN212399982U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115041995A (en) * | 2022-06-27 | 2022-09-13 | 青岛高测科技股份有限公司 | Feeding device and cutting equipment |
-
2020
- 2020-08-05 CN CN202021602120.6U patent/CN212399982U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115041995A (en) * | 2022-06-27 | 2022-09-13 | 青岛高测科技股份有限公司 | Feeding device and cutting equipment |
| CN115041995B (en) * | 2022-06-27 | 2023-11-17 | 青岛高测科技股份有限公司 | Feeding device and cutting equipment |
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