CN212393042U

CN212393042U - Bendable metal-based printed circuit board

Info

Publication number: CN212393042U
Application number: CN202021168384.5U
Authority: CN
Inventors: 钟辉
Original assignee: Shenzhen Maslan Circuit Technology Industrial Development Co ltd
Current assignee: Shenzhen Maslan Circuit Technology Industrial Development Co ltd
Priority date: 2020-06-22
Filing date: 2020-06-22
Publication date: 2021-01-22
Anticipated expiration: 2030-06-22

Abstract

The utility model discloses a metal matrix printed circuit board that can buckle, including flexible substrate, bonding layer piece, the fixed cover film that is provided with in side of flexible substrate, the fixed first row of pegging graft of isosceles trapezoid that is provided with in flexible substrate one end side that covers the film outside, L shape screens groove has been seted up to the side symmetry that flexible substrate one end was kept away from to first row of pegging graft, flexible substrate keeps away from first row of pegging graft one end side and fixes and be provided with the second row of pegging graft, bonding layer piece vertical even fixed sets up the flexible substrate side between first row of pegging graft and second row of pegging graft, bonding layer piece inner chamber is provided with the conducting layer with flexible substrate's junction vertical fixation. The utility model discloses a guarantee performance when hard and soft alternate circuit board structure can satisfy the demand of buckling in succession, and cover the membrane and avoid buckling in succession when can strengthen insulating nature and influence circuit structure, excellent in use effect.

Description

Bendable metal-based printed circuit board

Technical Field

The utility model relates to a printed circuit board technical field specifically is a metal matrix printed circuit board that can buckle.

Background

Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The printed circuit board is generally denoted as "PCB" and cannot be called "PCB board". Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. Since printed circuit boards are not typical end products, they are somewhat confusing in the definition of names such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry. By printed circuit board we generally say bare board-i.e. a circuit board without upper components. The existing bendable printed circuit board is mostly bent by arranging a cutting groove and utilizing an insulating layer in the groove, for example, the application number is 201320101653.X, and the name is a patent of the bendable metal-based printed circuit board, so that the bendable metal-based printed circuit board is poor in repeated operability, difficult to meet the continuous bending requirement and poor in practicability.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a metal matrix printed circuit board that can buckle to solve the problem among the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a metal matrix printed circuit board that can buckle, includes flexible substrate, bonding layer piece, the fixed cover film that is provided with in side of flexible substrate, the fixed first row that inserts of isosceles trapezoid shape that is provided with in flexible substrate one end side of covering the film outside, the side symmetry that flexible substrate one end was kept away from to first row of pegging graft has seted up L shape screens groove, flexible substrate keeps away from first row of pegging graft one end side and fixes and be provided with the second row of pegging graft, the bonding layer piece is vertical evenly fixed to be set up the flexible substrate side between first row of pegging graft and second row of pegging graft, bonding layer piece inner chamber and flexible substrate's junction vertical fixation are provided with the conducting layer.

Preferably, the flexible substrate is a glass fiber cloth-based copper-clad laminate, and the cover film is an insulating film made of polyimide.

Preferably, the first socket row is a double-sided electrode connecting plate, and the second socket row is a single-sided electrode connecting plate.

Preferably, the adhesive layer sheet is a rigid member formed of an aluminum material or stainless steel and is bonded to the wiring layer of the flexible base material by an electrically conductive adhesive.

Preferably, the adhesive layer pieces are integrated with the side surface of the flexible base material into a whole by an addition method, and the bending angle range between two adjacent adhesive layer pieces on the side surface of the flexible base material is-15 degrees.

Preferably, the conductive layer is formed by combining a signal layer, an insulating layer and an internal electrical layer.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the flexible substrate side between row and the second row of pegging graft is vertically evenly equipped with a plurality of bonding layers through the conducting layer at first row of pegging graft, and the flexible substrate side between adjacent bonding layers is equipped with respectively and covers the membrane, guarantees performance when just hard and soft alternate circuit board structure can satisfy the demand of buckling in succession, and covers the membrane and avoid buckling in succession when can strengthening insulating nature and influence circuit structure, excellent in use effect.

2. The conducting layer between the bonding layer sheet and the flexible base material is formed by combining the signal layer, the insulating layer and the inner electric layer, the power connection reliability is guaranteed while the conducting requirement is met, and the practicability is high.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a cross-sectional view of the surface structure of the flexible substrate of the present invention.

In the figure: 1. a flexible substrate; 2. bonding the layer sheet; 3. covering the film; 4. a first patch panel; 5. a clamping groove; 6. a second patch panel; 7. a conductive layer; 8. a signal layer; 9. an insulating layer; 10. an internal electrical layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 and 2, in an embodiment of the present invention, a bendable metal-based printed circuit board includes a flexible substrate 1 and a bonding layer sheet 2, a cover film 3 is fixedly disposed on a side surface of the flexible substrate 1, an isosceles trapezoid-shaped first socket row 4 is fixedly disposed on a side surface of one end of the flexible substrate 1 outside the cover film 3, L-shaped clamping grooves 5 are symmetrically disposed on a side surface of the first socket row 4 away from the end of the flexible substrate 1, a second socket row 6 is fixedly disposed on a side surface of one end of the flexible substrate 1 away from the first socket row 4, the bonding layer sheet 2 is longitudinally and uniformly fixed on a side surface of the flexible substrate 1 between the first socket row 4 and the second socket row 6, and a conductive layer 7 is longitudinally and fixedly disposed at a connection position of an inner cavity of the bonding layer sheet 2 and the flexible substrate; the flexible substrate 1 is a glass fiber cloth-based copper foil-clad plate, and the cover film 3 is an insulating film made of polyimide, so that the electricity utilization performance of the circuit board during bending is met; the first plug-in row 4 is a double-sided electrode connecting plate, and the second plug-in row 6 is a single-sided electrode connecting plate, so that the assembly operation is convenient; the adhesive layer sheet 2 is a rigid member formed by aluminum materials or stainless steel and is adhered with the routing layer of the flexible substrate 1 through a conductive adhesive, so that the use requirement of the circuit board is met; the adhesive layer pieces 2 are integrated with the side surface of the flexible base material 1 into a whole by adopting an addition method, and the bending angle range between two adjacent adhesive layer pieces 2 on the side surface of the flexible base material 1 is-15 degrees, so that the bending use performance is ensured; the conductive layer 7 is composed of a signal layer 8, an insulating layer 9 and an internal electrical layer 10, and meets the power connection requirement.

The utility model discloses a theory of operation and use flow: the bonding layer piece 2 is vertically arranged on the side face of the flexible substrate 1 through the conducting layer 7, the service performance is guaranteed when the rigid-flexible circuit board structure can meet the continuous bending requirement, the cover film 3 can enhance insulativity and avoid continuous bending to influence the circuit structure, and the using effect is good.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A bendable metal-based printed circuit board comprising a flexible base material (1), an adhesive layer sheet (2), characterized in that: the side of flexible substrate (1) is fixed and is provided with cover membrane (3), cover the fixed first row of pegging graft (4) of isosceles trapezoid shape that is provided with in flexible substrate (1) one end side in membrane (3) outside, the side symmetry of keeping away from flexible substrate (1) one end in first row of pegging graft (4) has seted up L shape screens groove (5), flexible substrate (1) is kept away from first row of pegging graft (4) one end side and is fixed and is provided with second row of pegging graft (6), bonding layer piece (2) vertically evenly fix set up flexible substrate (1) side between first row of pegging graft (4) and second row of pegging graft (6), the junction of bonding layer piece (2) inner chamber and flexible substrate (1) is vertically fixed and is provided with conducting layer (7).

2. The bendable metal-base printed circuit board of claim 1, wherein: the flexible substrate (1) is a glass fiber cloth-based copper foil-clad plate, and the cover film (3) is an insulating film made of polyimide.

3. The bendable metal-base printed circuit board of claim 1, wherein: the first plug-in row (4) is a double-sided electrode connecting plate, and the second plug-in row (6) is a single-sided electrode connecting plate.

4. The bendable metal-base printed circuit board of claim 1, wherein: the adhesive layer sheet (2) is a rigid member formed of aluminum material or stainless steel and is bonded to the wiring layer of the flexible substrate (1) by an electrically conductive adhesive.

5. The bendable metal-base printed circuit board of claim 1, wherein: the bonding layer pieces (2) are integrated with the side face of the flexible base material (1) into a whole by an addition method, and the bending angle range between two adjacent bonding layer pieces (2) on the side face of the flexible base material (1) is-15 degrees.

6. The bendable metal-base printed circuit board of claim 1, wherein: the conducting layer (7) is formed by combining a signal layer (8), an insulating layer (9) and an inner electric layer (10).