CN212371373U - Intelligent disassembling and sorting system for waste circuit board devices - Google Patents
Intelligent disassembling and sorting system for waste circuit board devices Download PDFInfo
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- CN212371373U CN212371373U CN202021911317.8U CN202021911317U CN212371373U CN 212371373 U CN212371373 U CN 212371373U CN 202021911317 U CN202021911317 U CN 202021911317U CN 212371373 U CN212371373 U CN 212371373U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The utility model discloses an intelligent disassembling and sorting system for waste circuit board devices, which comprises a feeding mechanism and a control panel, wherein the discharge end of the feeding mechanism is provided with a blast drier, one side of the blast drier is provided with a high-pressure air heater, one side of the high-pressure air heater is provided with disassembling equipment, the discharge end of the disassembling equipment is provided with a screening device, the discharge end of the screening device is provided with a performance detection device, and the discharge end of the performance detection device is provided with a discharge mechanism for conveying materials; the feeding mechanism, the blast drier, the high-pressure air heater, the disassembling equipment, the screening device, the performance detection device and the discharging mechanism are all electrically connected with the control panel. The utility model discloses a breaker carries out the second grade breakage to the abandonment circuit board, realizes the recovery of abandonment circuit board valuable metal through high-pressure eddy current technology separation technique, full automation and pollution-free can realize the environmental protection type of valuable metal on the abandonment circuit board and retrieve and the regeneration of high utilization ratio.
Description
Technical Field
The utility model relates to a disassemble and select separately the system field, specifically be a useless circuit board device intelligence is disassembled and is selected separately system.
Background
According to the investigation of relevant departments, 10 hundred million abandoned mobile phones are deposited in China at present, and other abandoned household appliances such as computers, televisions, refrigerators, air conditioners and the like which are replaced every year are not few. In 2016, the 14 products entering the subsidy list generate 1038 ten thousand tons of waste electronic products, and in 2020, the waste electronic products will reach 1550 ten thousand tons, and in 2030 or more than 2000 ten thousand tons. The average annual growth rate is about 7.5%, and the increase of waste electronic and electric products is accompanied by the sharp increase of waste circuit boards. At present, the total amount of the waste circuit boards in China reaches over 50 million tons every year, and the waste circuit boards are continuously increased at a rate of 13 percent, so that the waste circuit boards have a very wide market prospect of recycling renewable resources.
The waste circuit board is provided with a large number of high-value components, including a Surface Mounted Device (SMD) and a plug-in device (THD), such as various Integrated Circuits (ICs), diodes, triodes, photoelectric devices, capacitance resistors, various slot interfaces and the like, so that the waste circuit board is always the focus of resource utilization attention of waste electrical and electronic products.
The method for disassembling the waste PCB by adopting a high-temperature heating technology is a mainstream technology for efficiently and nondestructively disassembling components at present, and at present, more researches at home and abroad mainly focus on the aspects of various heating process flows and method principles, such as an infrared heating technology, a fluid heating technology, laser heating and the like. The principle of the disassembling technology is that high-temperature heating is adopted to melt soldering tin, and then external force is adopted to separate components. They share a common disadvantage: the plastic package IC chip on the component is easily layered due to moisture caused by directly disassembling the waste circuit board at high temperature, so that the reliability of the chip is seriously damaged. At present, more advanced nondestructive disassembly methods for components at home and abroad comprise an appearance size image recognition detection method, a component grinding self-adaptive disassembly method and the like.
In order to improve the disassembling and recycling efficiency of waste circuit board devices, an intelligent disassembling and sorting system for the waste circuit board devices is provided.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model provides a useless circuit board device intelligence is disassembled and sorting system, including feed mechanism, feed mechanism's discharge end is provided with the blast air drier, one side of blast air drier is provided with high-pressure air heater, one side of high-pressure air heater is provided with disassembles equipment, the discharge end of disassembling equipment is provided with screening plant, screening plant's discharge end is provided with the performance detection device, the discharge end of performance detection device is provided with the discharge mechanism who is used for transporting the material.
As a preferred technical scheme of the utility model, still including being used for controlling feed mechanism, blast drier, high-pressure air heater, disassembling equipment, screening plant, performance detection device and discharge mechanism moving control panel, feed mechanism, blast drier, high-pressure air heater, disassembling equipment, screening plant, performance detection device and discharge mechanism all with control panel electric connection.
As an optimal technical scheme of the utility model, high pressure air heater with disassemble and be provided with between the equipment and be used for carrying out the infrared pipe that heats for the welding.
As a preferred technical scheme of the utility model, feed mechanism's both sides fixedly connected with prevents the first baffle that the material dropped at the material loading in-process.
As a preferred technical scheme of the utility model, discharge mechanism's both sides fixedly connected with prevents the second baffle that the material dropped at ejection of compact in-process.
The utility model has the advantages that:
the intelligent disassembling and sorting system for the waste circuit board devices intelligently disassembles the components from the waste circuit boards, can realize the recycling of the components, is easy to treat toxic and harmful substances, is convenient for the disassembled PCB to realize the recycling of precious metals and non-metal materials, and greatly improves the resource utilization efficiency of the waste circuit boards.
Two, the utility model discloses a breaker carries out the second grade breakage to the abandonment circuit board to realize the recovery of abandonment circuit board valuable metal through high-pressure eddy current technology separation technique, full automation and pollution-free realize the environmental protection type of valuable metal on the abandonment circuit board and retrieve and the regeneration of high utilization.
Thirdly, the utility model discloses combine the structure and the assembly characteristic of circuit board to high added value components and parts are reused as the target, and the technique of components and parts and sorting is gone up to the old and useless printed circuit board is disassembled to an intelligence of research and development, solves the layering difficult problem of disassembling in-process plastic envelope IC chip to carry out the technological process that the performance detected to components and parts, make the components and parts function and the performance of disassembling not receive the harm basically.
Fourthly, the utility model discloses can realize the intelligent recovery of components and parts and recycle to easily handle poisonous and harmful substance, eliminate the natural environment pollution of circuit board disassembling in-process, improve the operational environment that old and useless circuit board disassembled the operation, have high economic benefits and environmental significance.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a layout schematic diagram of an intelligent disassembling and sorting system for waste circuit board devices of the present invention;
FIG. 2 is a process flow diagram of an intelligent disassembling and sorting system for waste circuit board devices of the present invention;
in the figure: 1. a feeding mechanism; 2. a forced air drier; 3. a high pressure hot air blower; 4. an infrared tube; 5. disassembling the equipment; 6. a screening device; 7. a performance detection device; 8. a discharging mechanism; 9. a control panel.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example (b): as shown in fig. 1, an intelligent disassembling and sorting system for waste circuit board devices comprises a feeding mechanism 1, wherein a blowing dryer 2 is arranged at the discharging end of the feeding mechanism 1, a high-pressure hot air blower 3 is arranged on one side of the blowing dryer 2, a disassembling device 5 is arranged on one side of the high-pressure hot air blower 3, a screening device 6 is arranged at the discharging end of the disassembling device 5, a performance detection device 7 is arranged at the discharging end of the screening device 6, and a discharging mechanism 8 for conveying materials is arranged at the discharging end of the performance detection device 7. An infrared tube 4 for heating welding is arranged between the high-pressure air heater 3 and the disassembling equipment 5.
The device is characterized by further comprising a control panel 9 for controlling the operation of the feeding mechanism 1, the blast drier 2, the high-pressure hot air blower 3, the disassembling equipment 5, the screening device 6, the performance detection device 7 and the discharging mechanism 8, wherein the feeding mechanism 1, the blast drier 2, the high-pressure hot air blower 3, the disassembling equipment 5, the screening device 6, the performance detection device 7 and the discharging mechanism 8 are all electrically connected with the control panel 9.
The two sides of the feeding mechanism 1 are fixedly connected with first baffle plates for preventing materials from falling in the feeding process. And the two sides of the discharging mechanism 8 are fixedly connected with second baffles for preventing the materials from falling in the discharging process.
As shown in fig. 2, the method comprises the following steps:
s1, heating and disassembling the circuit board of the plug-in component, specifically:
s1-1, baking and dehumidifying the circuit board with the plugged components through a blast drying box; s1-2, removing components in a non-welding mode, straightening pins of the plug-in components to be removed on the circuit board as far as possible, purging the pins of the plug-in components by high-pressure hot air, and reducing damage of high temperature to the components to the maximum extent, wherein the heating part is a welding spot;
s1-3, judging the melting point temperature of the solder used by the circuit board, and heating the solder by adopting an infrared tube until the solder is fully melted; the infrared tube is adopted to heat the welding material, so that the problem of uneven heating caused by the difference of the sizes and the heat capacities of the components can be solved;
and S1-4, removing the solder by using an air knife to form compressed hot air and collecting the solder.
S2, heating and disassembling the patch component circuit board, specifically:
s2-1, baking and dehumidifying the patch component circuit board through a blast drying box;
s2-2, judging the melting point temperature of the solder used by the circuit board, heating by hot air convection, and gradually raising the temperature and heating through three stages of preheating, high-temperature heating and heat preservation, so as to reduce thermal shock to the maximum extent until the solder is fully melted; a subarea temperature heating mode is adopted when the circuit board of the surface mounted device is disassembled, the temperature control is accurate, the heating is uniform, and the damage of the device caused by overhigh local temperature is effectively prevented;
s2-3, disassembling the chip components by adopting a vibration impact disassembling method, and disassembling the inserted components by adopting a horizontal sweeping disassembling method.
S3, detecting the performance of the plug-in component and the patch component, specifically:
s3-1, appearance inspection, and defective components and parts are removed; screening by adopting an image fuzzy recognition mode, and detecting the passing of normal component fuzzy set with membership degree greater than 0.9;
s3-2, performing impedance curve comparison on the electrical performance of the patch component;
s3-3, carrying out on-off test on the plug-in component;
and S3-4, testing capacitance and leakage resistance of the capacitor.
And S3-5, carrying out reliability detection on the tested components.
And S4, classifying the plug-in components and the chip components.
In order to realize reusing of components and parts on the abandonment circuit board, the utility model discloses on the basis of analysis circuit board equipment and structural feature, to the unsolder technology, the temperature distribution of the components and parts on the circuit board that the quantitative analysis used paster components and parts to be the main has confirmed the heating technology of the circuit board of the same type. Aiming at the connection mode of the circuit board and the components, models of component disassembly acceleration, separation displacement and disassembly energy are established, a component reuse-oriented waste circuit board disassembly process is provided, and corresponding disassembly equipment is developed respectively aiming at the circuit board mainly comprising the patch components and the circuit board mainly comprising the plug-in components.
The utility model discloses dismantle components and parts from old and useless circuit board intelligence, both can realize the recovery of components and parts and recycle, the easy to handle contains poisonous and harmful substance, and the PCB after convenient to detach realizes precious metal recovery and non-metallic material's recycle again, has improved the utilization efficiency of abandonment circuit board's resources greatly.
The utility model discloses a breaker of research design optimization by oneself carries out the second grade breakage to the abandonment circuit board to realize the recovery of abandonment circuit board valuable metal through high-pressure eddy current technology separation technique, full automation and pollution-free realize that the environmental protection of valuable metal on the abandonment circuit board is retrieved, high regeneration utilization is rateed, and social is showing. Furthermore, the utility model discloses can realize the intelligent recovery of components and parts and recycle to easily handle poisonous and harmful substance, eliminate the natural environment pollution of circuit board disassembling in-process, improve the operational environment that the operation was disassembled to old and useless circuit board, have high economic benefits and environmental significance.
The working principle is as follows: aiming at the defect that the plastic package IC chip is damaged in a layering way due to the circuit board disassembling process which is popular in the domestic industry at present, two key technologies, namely a waste circuit board heating process and a waste circuit board disassembling process which mainly use plug-in components and patch components, are researched respectively.
The infrared radiation heating technology of the waste circuit board comprises the following steps: the infrared tube is adopted to directly heat the solder, so that the damage of components due to uneven temperature rise or high temperature caused by large size and large heat capacity difference and uneven distribution of the components on the circuit board is avoided.
The hot air convection heating technology of the waste circuit board comprises the following steps: by adopting the partitioned temperature control, the temperature control is accurate and uniform, and the uniform distribution of the heating temperature of the surface mounted components packaged in different packages on the circuit board is ensured through the three-stage heating process of preheating, high-temperature heating and heat preservation, so that the problem that the IC chip is heated to generate the layering defect and the like is avoided.
The technology for intelligently tin-removing and disassembling components comprises the following steps: the removal and the collection of solder can be realized to the hot air that can adopt the air knife to form the compression, effectively avoids directly disassembling components and parts and needs too much energy, and furthest reduces and disassembles the energy consumption, can reduce the harm that high temperature disassembled the process and led to the fact components and parts effectively again, and then has effectively guaranteed the reusability of disassembling back components and parts.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a useless circuit board device intelligence is disassembled and is selected separately system, includes feed mechanism (1), its characterized in that, the discharge end of feed mechanism (1) is provided with air-blast drying machine (2), one side of air-blast drying machine (2) is provided with hot-blast air heater (3), one side of hot-blast air heater (3) is provided with disassembles equipment (5), the discharge end of disassembling equipment (5) is provided with screening plant (6), the discharge end of screening plant (6) is provided with performance detection device (7), the discharge end of performance detection device (7) is provided with discharge mechanism (8) that are used for transporting the material.
2. The intelligent disassembling and sorting system for the waste circuit board devices according to claim 1, further comprising a control panel (9) for controlling the operation of the feeding mechanism (1), the blast dryer (2), the high-pressure hot air blower (3), the disassembling equipment (5), the screening device (6), the performance detection device (7) and the discharging mechanism (8), wherein the feeding mechanism (1), the blast dryer (2), the high-pressure hot air blower (3), the disassembling equipment (5), the screening device (6), the performance detection device (7) and the discharging mechanism (8) are all electrically connected with the control panel (9).
3. The intelligent disassembling and sorting system for the waste circuit board devices according to claim 1, characterized in that an infrared pipe (4) for heating welding is arranged between the high-pressure hot air blower (3) and the disassembling equipment (5).
4. The intelligent disassembling and sorting system for the waste circuit board devices according to claim 1, wherein first baffles for preventing the materials from falling off in the feeding process are fixedly connected to two sides of the feeding mechanism (1).
5. The intelligent disassembling and sorting system for the waste circuit board devices as claimed in claim 1, wherein second baffles for preventing the materials from falling off during the discharging process are fixedly connected to both sides of the discharging mechanism (8).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021911317.8U CN212371373U (en) | 2020-09-04 | 2020-09-04 | Intelligent disassembling and sorting system for waste circuit board devices |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021911317.8U CN212371373U (en) | 2020-09-04 | 2020-09-04 | Intelligent disassembling and sorting system for waste circuit board devices |
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| CN212371373U true CN212371373U (en) | 2021-01-19 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111940867A (en) * | 2020-09-04 | 2020-11-17 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting method for waste circuit board devices |
| CN114951216A (en) * | 2022-05-12 | 2022-08-30 | 清远市金运再生资源有限公司 | Wet recovery system and method for metal in waste circuit board |
-
2020
- 2020-09-04 CN CN202021911317.8U patent/CN212371373U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111940867A (en) * | 2020-09-04 | 2020-11-17 | 清远市东江环保技术有限公司 | Intelligent disassembling and sorting method for waste circuit board devices |
| CN114951216A (en) * | 2022-05-12 | 2022-08-30 | 清远市金运再生资源有限公司 | Wet recovery system and method for metal in waste circuit board |
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