CN212363444U - Heat distribution monitoring system - Google Patents
Heat distribution monitoring system Download PDFInfo
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- CN212363444U CN212363444U CN201922487704.7U CN201922487704U CN212363444U CN 212363444 U CN212363444 U CN 212363444U CN 201922487704 U CN201922487704 U CN 201922487704U CN 212363444 U CN212363444 U CN 212363444U
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Abstract
The invention discloses a thermal distribution monitoring system, which comprises an infrared temperature array sensor, an MCU (microprogrammed control unit) module, a communication module, an upper computer, a display module and a storage module, wherein the infrared temperature array sensor is used for acquiring temperature information of a to-be-detected surface of a cabinet, and the MCU module is used for reading the temperature information of the infrared temperature array sensor and filtering the read temperature value; the communication module is used for realizing information interaction between the MCU module and the upper computer and transmitting the temperature information after filtering processing to the upper computer; the upper computer is used for receiving the temperature information sent by the MCU module and sending the temperature information to the display module for displaying and alarming; the storage module is used for storing the temperature information sent by the MCU module. According to the invention, the temperature distribution of one surface of the equipment can be measured only by one infrared temperature array sensor module, so that the cost is reduced, and complicated wiring is omitted.
Description
Technical Field
The invention relates to a temperature measurement technology, in particular to a heat distribution monitoring system and a detection method thereof.
Background
When the high-power equipment is used, the internal power device can generate a large amount of heat, so that the temperature of an internal heating point of the high-power equipment needs to be detected, and the equipment is prevented from being damaged. The existing temperature measurement mode adopts a cable to connect the temperature measurement sensor for temperature measurement, the wiring is complex, the assembly and disassembly are inconvenient, the maintenance cost is high when the temperature measurement mode is used for multipoint measurement, the position of the temperature measurement sensor needs to be correspondingly adjusted aiming at different heating points in a cabinet, and the universality is poor.
Disclosure of Invention
The invention aims to provide a thermal distribution monitoring system and a detection method thereof.
The technical solution for realizing the purpose of the invention is as follows: a thermal distribution monitoring system comprises an infrared temperature array sensor, an MCU module, a communication module, an upper computer, a display module and a storage module, wherein the infrared temperature array sensor is used for collecting temperature information of a surface to be measured of a cabinet, and the MCU module is used for reading the temperature information of the infrared temperature array sensor and filtering the read temperature value; the communication module is used for realizing information interaction between the MCU module and the upper computer and transmitting the temperature information after filtering processing to the upper computer; the upper computer is used for receiving the temperature information sent by the MCU module and sending the temperature information to the display module for displaying and alarming; the storage module is used for storing the temperature information sent by the MCU module.
The temperature detection method based on the thermal distribution monitoring system comprises the following steps:
step 1, temperature information acquisition: the infrared temperature array sensor collects temperature information of a surface to be measured and transmits the temperature information to the MCU module;
step 2, optimization treatment: the MCU module reads temperature information acquired by the infrared temperature array sensor, performs filtering processing on temperature data and transmits the temperature data to the upper computer through the communication module;
step 3, temperature early warning: the upper computer receives the temperature information sent by the MCU module, performs interpolation processing on the temperature information after optimization processing to obtain the temperature information of the whole to-be-side surface, namely a heat distribution cloud picture, performs temperature early warning, and transmits the temperature information to the display module for displaying.
Compared with the prior art, the invention has the remarkable advantages that: 1) the temperature distribution of one surface of the equipment can be measured only by one infrared temperature array sensor module, so that the cost is reduced, and complicated wiring is omitted; 2) The camera module shoots a measured surface as a background picture, the heat distribution cloud picture is displayed on the background picture, and the heat distribution is visual and clear.
Drawings
FIG. 1 is a block diagram of the components of the thermal distribution monitoring system of the present invention.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings.
As shown in fig. 1, a thermal distribution monitoring system includes an infrared temperature array sensor, an MCU module, a communication module, an upper computer, a display module, and a storage module, wherein the infrared temperature array sensor is used to collect temperature information of a surface to be measured of a cabinet, and the MCU module is used to read temperature information of the infrared temperature array sensor and perform filtering processing on the read temperature value; the communication module is used for realizing information interaction between the MCU module and the upper computer and transmitting the temperature information after filtering processing to the upper computer; the upper computer is used for receiving the temperature information sent by the MCU module, generating a human distribution cloud picture and sending the human distribution cloud picture to the display module for displaying and alarming; the storage module is used for storing the heat distribution cloud picture.
In some embodiments, the infrared temperature array sensor is provided with a camera module, the camera module is connected with the display module and is used for shooting a measuring surface of the infrared temperature array sensor as a background picture, temperature information is displayed on the background picture, and heat distribution is visual and clear. The layout position and the angle of the infrared temperature array sensor can influence the detection range, the side face can be completely covered in order to ensure the detection range of the infrared temperature array sensor, and when the mounting height and the mounting angle of the infrared temperature array sensor are adjusted, whether the infrared temperature array sensor completely covers the detected surface can be confirmed by observing a display picture.
In some embodiments, the infrared temperature array sensor is selected from MLX90640 available from Melexis corporation. The resolution of this sensor is 32 x 24, the working temperature range is-40 ℃ to 85 ℃, the measurable object temperature range is-40 ℃ to 300 ℃, the typical target object temperature precision of +/-1 ℃ can be provided, and the sensor is suitable for various safe and convenient applications and is a preferred embodiment. But other types of infrared temperature array sensors can be selected according to the test and cost requirements of application scenes.
In some embodiments, the MCU module and the infrared temperature array sensor are connected through an I2C bus, and although the software implementation is complex, the hardware is quite simple.
In some embodiments, the MCU module performs filtering processing on the temperature information collected by the infrared temperature array sensor, so as to suppress noise signals while ensuring the heat distribution data is real. The filtering algorithm adopts a weight average method. I.e. the value of each pixel is modified to the weighted average of the pixel itself and the surrounding neighbors. If the pixel P (i, j) is corrected by 3 × 3 filtering (i is the column number and j is the row number), i.e. taking 3 × 3 with P (i, j) as the center, the new value of P (i, j) is calculated for 9 pixels. Pixel point Pi,jThe distribution is as follows:
by weight averaging, P (i, j) has the greatest weight, and pixels at greater distances have smaller weights, the weight Ki,jThe distribution is as follows:
the new value of pixel P (i, j) is then:
in the above embodiment, the weight average method is only one of the filtering algorithms, and other algorithms such as an average method, a median method, a gaussian filtering method, and the like may also be used in actual use, and only the weight value of each pixel is changed.
In the above embodiment, the 3 × 3 filtering is only one algorithm demonstration, and in actual use, 4 × 4, 5 × 5 or even higher pixel filtering algorithms may be used according to actual situations.
In some embodiments, the storage module can set and store the thermal distribution cloud picture at regular time through the upper computer, or store the thermal distribution cloud picture when early warning occurs, so that data sorting and analysis can be conveniently performed at a later stage.
The temperature detection method based on the thermal distribution monitoring system comprises the following steps:
step 1, temperature information acquisition: the infrared temperature array sensor collects temperature information of a surface to be measured and transmits the temperature information to the MCU module;
step 2, optimization treatment: the MCU module reads temperature information acquired by the infrared temperature array sensor, performs filtering processing on temperature data and transmits the temperature data to the upper computer through the communication module;
step 3, temperature early warning: the upper computer receives the temperature information sent by the MCU module, performs interpolation processing on the temperature information after optimization processing to obtain the temperature information of the whole to-be-side surface, namely a heat distribution cloud picture, performs temperature early warning, and transmits the temperature information to the display module for displaying.
Claims (4)
1. A thermal distribution monitoring system is characterized by comprising an infrared temperature array sensor, an MCU module, a communication module, an upper computer, a display module and a storage module, wherein the infrared temperature array sensor is used for collecting temperature information of a surface to be measured of a cabinet, and the MCU module is used for reading the temperature information of the infrared temperature array sensor and filtering the read temperature value; the communication module is used for realizing information interaction between the MCU module and the upper computer and transmitting the temperature information after filtering processing to the upper computer; the upper computer is used for receiving the temperature information sent by the MCU module and sending the temperature information to the display module for displaying and alarming; the storage module is used for storing the temperature information sent by the MCU module.
2. The thermal distribution monitoring system of claim 1, wherein a camera module is disposed on the infrared temperature array sensor, and connected to the display module, for capturing a background image of the measurement surface of the infrared temperature array sensor, and displaying the temperature information on the background image.
3. The thermal distribution monitoring system of claim 1 wherein the infrared temperature array sensor is selected from MLX90640 available from Melexis corporation.
4. The thermal distribution monitoring system of claim 1, wherein the MCU module and the infrared temperature array sensor are connected via an I2C bus.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922487704.7U CN212363444U (en) | 2019-12-31 | 2019-12-31 | Heat distribution monitoring system |
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| CN201922487704.7U CN212363444U (en) | 2019-12-31 | 2019-12-31 | Heat distribution monitoring system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111272293A (en) * | 2019-12-31 | 2020-06-12 | 扬州海通电子科技有限公司 | Heat distribution monitoring system and detection method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111272293A (en) * | 2019-12-31 | 2020-06-12 | 扬州海通电子科技有限公司 | Heat distribution monitoring system and detection method thereof |
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