CN212302423U - Fixing device of radiator and heat radiating device applied by fixing device - Google Patents

Abstract

The utility model provides a fixing device of radiator and heat abstractor who uses thereof, the fixing device of radiator includes: the method comprises the following steps: the first fixed end is arranged on the radiator substrate; the second fixed end is fixed on an external device, is positioned below the radiator substrate and has a gap with the lower surface of the radiator substrate; a connection device, comprising: the first connecting end is connected with the first fixed end on the radiator substrate; the lower end of the second connecting end sequentially penetrates through the first fixing end and the radiator substrate and is connected with the second fixing end; and the control end controls the connection between the first connecting end and the first fixed end and the connection between the second connecting end and the second fixed end. The utility model discloses can effectively solve between two fixed mounting faces of distal end radiator and near-end radiator because the problem of the CPU chip that brings by the tolerance and near-end radiator contact failure.

Description

Fixing device of radiator and heat radiating device applied by fixing device

Technical Field

The utility model relates to a heat dissipation technical field especially relates to radiator technical field.

Background

In the cloud computing era, the performance requirement on a server is higher and higher, in order to meet the high-performance computing processing and graphic processing functions, the power consumption of a CPU chip is higher and higher, the power consumption of a new platform CPU chip issued by intel is more than 300W, the conventional common 2U radiator cannot meet the heat dissipation of the high-power CPU chip, the heat cannot be dissipated in time, the CPU chip is over-temperature, the frequency of the CPU chip is reduced, and even the CPU chip is damaged due to overheating. Similarly, in the server, various problems of the case motherboard are also caused by overheating of the CPU, on one hand, the motherboard is also at risk of being burned out by overheating, on the other hand, the performance of the CPU chip is reduced, which also causes performance faults of the memory and the hard disk, on the other hand, the fan of the case needs a stronger rotating speed to relieve the heat problem of the CPU, thereby causing serious noise and power consumption problems.

In order to efficiently radiate the CPU chip, on one hand, the heat of the CPU chip is transmitted to the far end with concentrated air quantity and relatively abundant space in the radiating device through the far-end radiator, on the other hand, the space around the CPU chip is fully utilized, and the near-end radiator is arranged to perform auxiliary radiation.

As shown in fig. 1, in the remote heat sink 110, both ends of a remote heat sink substrate 111 need to be fixed, one end of the remote heat sink substrate 111 needs to be fixed to a CPU chip 120 mounted on a PCB 121, and the other end needs to be fixed to an external device such as a chassis including a chassis wall 130, which applies the CPU chip 120 and the heat sink, through a connecting device such as a screw 112, so that the remote heat sink 110 does not float up and down. However, there is usually a large tolerance between the fixing and mounting surfaces of the two ends, and after the CPU chip 120 is fixed by the spring screws, the fixing surface of the far-end heat sink (i.e. the far-end heat sink substrate 111) and the chassis stud 113 mounted on the chassis wall do not adhere well.

One situation is that as shown in fig. 2, there is a gap between the far-end heat sink substrate 111 and the chassis stud 113, that is, there is a tolerance offset in the length of the chassis stud 113, and then the screw 112 connecting the far-end heat sink substrate 111 and the chassis stud 113 will lock down all the time, and press the far-end heat sink substrate 111 down, so as to form the installation state shown in fig. 2, and thus the surface contact between the near-end heat sink and the CPU chip 120 is not good, and the heat dissipation problem occurs.

Alternatively, as shown in fig. 3, if the length of the chassis stud 113 has an upper tolerance, the chassis stud 113 will push up the far-end heat sink substrate 111, and the mounting state shown in fig. 3 will cause the near-end heat sink to have a poor surface contact with the CPU chip 120, which may cause heat dissipation problems.

It can be seen that when the far-end heat spreader 110 is locked in the above two cases, the near-end heat spreader substrate at the CPU chip 120 is lifted or tilted, resulting in poor contact between the near-end heat spreader substrate and the CPU chip 120.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a fixing device for a heat sink and a heat sink using the same, which are used to solve the problem of poor contact between a CPU chip and a near-end heat sink caused by the length tolerance of a mounting stud of a far-end heat sink in the prior art.

To achieve the above and other related objects, the present invention provides a fixing device for a heat sink, including: the first fixed end is arranged on the radiator substrate; the second fixed end is fixed on an external device, is positioned below the radiator substrate and has a gap with the lower surface of the radiator substrate; a connection device, comprising: the first connecting end is connected with the first fixed end on the radiator substrate; and the lower end of the second connecting end sequentially penetrates through the first fixed end and the radiator substrate and is connected with the second fixed end. And the control end controls the connection between the first connecting end and the first fixed end and the connection between the second connecting end and the second fixed end.

In an embodiment of the present invention, the first fixed end is a hollow first externally threaded post; the first connecting end is connected to the lower surface edge of the control end, is arranged outside the first fixing end and is a hollow first internal thread column matched with the first external thread column.

In an embodiment of the present invention, the second fixed end is a hollow second internal threaded column; the second connecting end is connected to the middle of the lower surface of the control end, has a gap with the first connecting end, is arranged in the second fixing end and is a second external thread column matched with the second internal thread column.

In an embodiment of the present invention, the second fixed end is a third externally threaded post; the second connecting end is connected to the middle of the lower surface of the control end, has a gap with the first connecting end, is arranged outside the second fixing end, and is a hollow third internal threaded column matched with the third external threaded column.

In an embodiment of the present invention, the first fixed end is a hollow fourth internal threaded column; the first connecting end is connected to the middle of the lower surface of the control end, is arranged in the first fixing end and is a fourth external thread column matched with the fourth internal thread column.

In an embodiment of the present invention, the second fixed end is a hollow fifth internal threaded column; the second connecting end is connected to the bottom of the first connecting end, is arranged in the second fixing end and is a fifth external threaded column matched with the fifth internal threaded column.

In an embodiment of the present invention, the first connecting end and the second connecting end are integrally formed as an external threaded post.

In an embodiment of the present invention, the second fixed end is a sixth externally threaded post; the second connecting end is connected to the bottom of the first connecting end, is arranged outside the second fixing end and is a hollow sixth internal threaded column matched with the sixth external threaded column.

In an embodiment of the present invention, the first connecting end and the second connecting end are integrally formed as a threaded body, an upper portion of which is an external threaded column, and a lower portion of which is a hollow internal threaded column.

In an embodiment of the present invention, the first fixing end is an internal thread formed in the heat sink substrate and penetrating through the heat sink substrate; the first connecting end is an external thread column which is connected to the lower surface of the control end and matched with the internal thread in the radiator substrate; the second connecting end is positioned on the external thread column or the internal thread column on the lower surface of the first connecting end.

The utility model also provides a heat abstractor, include: the near-end radiator is arranged around the device to be radiated; and one end of the far-end radiator is connected with the device to be radiated, and the other end of the far-end radiator is fixed with an external device through the fixing device of the radiator.

As described above, the utility model discloses a fixing device of radiator and heat abstractor who uses thereof has following beneficial effect:

the utility model discloses an install a double-screw bolt stiff end on the distal end radiator base plate, and subtract the length of the double-screw bolt stiff end of installing on the short-cut external device, the upper portion and the distal end radiator base plate with connecting device (screw) are fixed, the double-screw bolt fixed end of installing on the lower part of connecting device (screw) and the external device is fixed, realize the fixed of distal end radiator, can effectively solve between two fixed mounting face of distal end radiator and near-end radiator because the problem of the CPU chip that the installation double-screw bolt length tolerance of distal end radiator brought and near-end radiator contact failure.

Drawings

Fig. 1 is a schematic view illustrating a fixing manner of a substrate of a remote heat sink in the prior art.

Fig. 2 is a schematic diagram illustrating a fixing manner of a substrate of a remote heat sink when there is a tolerance deviation in the stud length of a chassis in the prior art.

Fig. 3 is a schematic diagram illustrating a fixing manner of a base plate of a remote heat sink when there is an upper tolerance in the stud length of a chassis in the prior art.

Fig. 4 and fig. 5 are schematic views showing a structural connection relationship between the first fixed end and the first connection end, and between the second fixed end and the second connection end in the fixing device of the middle heat sink of the present invention.

Fig. 6 is a schematic view of another structural connection manner of the second fixed end and the second connection end in the fixing device of the heat sink of the present invention, which is different from the structural connection relationship between the second fixed end and the second connection end in fig. 4 and 5.

Fig. 7 is a schematic view showing another connection relationship between the first fixed end and the first connection end, and between the first fixed end and the second connection end of the fixing device of the heat sink of the present invention.

Fig. 8 is a schematic view of another structural connection manner of the second fixed end and the second connection end in the fixing device of the heat sink of the present invention, which is different from the structural connection relationship between the second fixed end and the second connection end in fig. 7.

Fig. 9 is a schematic view showing a structural connection relationship when the first fixing end of the fixing device of the heat sink of the present invention is an internal thread formed in the substrate.

Fig. 10 is a schematic view illustrating another connection structure of the fixing device of the heat sink according to the present invention, when the first fixing end is an internal thread formed in the substrate.

Description of the element reference numerals

110 remote radiator

111 remote heat sink substrate

112 screw

113 chassis stud

120 CPU chip

121 PCB board

130 casing wall

200 fixing device of radiator

210 first fixed end

220 second fixed end

230 connecting device

231 first connection end

232 second connecting end

233 control terminal

300 far-end radiator

310 heat sink base plate

400 casing wall

500 wait for the heat dissipating device

510 PCB board

Detailed Description

The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.

Please refer to fig. 4 to 10. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for convenience of description, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof may be made without substantial technical changes, and the present invention is also regarded as the scope of the present invention.

The present embodiment aims to provide a fixing device for a heat sink and a heat sink using the same, which are used to solve the problem of poor contact between a CPU chip and a near-end heat sink due to the length tolerance of a mounting stud of a far-end heat sink in the prior art.

The fixing device of the heat sink and the principle and the implementation of the heat sink applied thereto will be described in detail below, so that those skilled in the art can understand the fixing device of the heat sink and the heat sink applied thereto without creative work.

As shown in fig. 4, the present embodiment provides a fixing device 200 for a heat sink, the fixing device 200 for a heat sink including: a first fixing end 210, a second fixing end 220, and a connecting device 230. In the present embodiment, the first fixing end 210 is mounted on the heat sink substrate 310, that is, a fixing end is mounted on the heat sink substrate 310.

As shown in fig. 4 to 8, the first fixing end 210 is mounted on the upper surface of the heat sink substrate 310, that is, the first fixing end 210 is mounted outside the heat sink substrate 310.

Specifically, the first fixing end 210 is installed in the heat sink substrate 310 at a fixing end position for an external device.

In this embodiment, the heat sink substrate 310 is a substrate of the far-end heat sink 300, and the problem of poor contact between the device 500 to be cooled and the near-end heat sink caused by the length tolerance of the fixed end on the external device between the two fixed mounting surfaces of the far-end heat sink 300 and the near-end heat sink is solved by controlling the fixed mounting manner of the substrate of the far-end heat sink 300.

In this embodiment, the second fixing end 220 is fixed to an external device, and is located below the heat sink substrate 310 and spaced from the lower surface of the heat sink substrate 310 by a distance corresponding to a reduced length of the fixing end of the external device.

Wherein the external device is but not limited to a chassis, for example, the second fixed end 220 is fixed on the chassis wall 400. As shown in fig. 4 to 8, the fixing device 200 of the heat sink is illustrated in the embodiment by fixing the second fixing end 220 to the chassis wall 400.

In this embodiment, when the heat sink substrate 310 is fixed, the second fixing end 220 does not directly contact with the heat sink substrate 310, a certain interval is formed between the second fixing end 220 and the heat sink substrate 310, the second fixing end 220 does not need to support the heat sink substrate 310, and the second fixing end 220 is mainly used for supporting and fixing the lower portion of the connecting device 230.

In this embodiment, as shown in fig. 5 to 8, the connection device 230 includes: a first connection end 231, a second connection end 232, and a control end 233.

Specifically, the first connection end 231 is connected to the first fixed end 210 on the heat sink substrate 310; the lower end of the second connection end 232 sequentially passes through the first fixing end 210 and the heat sink substrate 310 to be connected with the second fixing end 220.

Further, since the other end of the heat sink substrate 310 is fixed at the to-be-cooled device 500 in advance, the first connection end 231 keeps the heat sink substrate 310 equipped with the first fixed end 210 horizontal with the end fixed in advance during the connection with the first fixed end 210 on the heat sink substrate 310, so that the substrate of the near-end connector at the to-be-cooled device 500 is not jacked up or tilted up by the influence of the heat sink substrate 310 of the far-end heat sink 300. After the bottom end surface of the first connection end 231 is in front contact with the upper surface of the heat sink substrate 310, the connection device 230 cannot move downward, and the connection between the first connection end 231 and the first fixed end 210 of the heat sink substrate 310 is completed. At this time, the second connecting end 232 of the connecting device 230 is fixed by the second fixing end 220 and cannot move up and down, and the heat sink substrate 310 of the far-end heat sink 300 and the fixing end of the device 500 to be cooled are kept horizontal, so that the problem of poor contact between the device 500 to be cooled and the near-end heat sink due to the length tolerance of the second fixing end 220 is solved.

In this embodiment, the control terminal 233 controls the connection between the first connection terminal 231 and the first fixing terminal 210, and the connection between the second connection terminal 232 and the second fixing terminal 220.

Specifically, the control end 233 is a nut with a straight or cross-shaped groove, and the rotation of the nut is controlled to control the first connection end 231 to be gradually connected with the first fixing end 210 in a matching manner and the second connection end 232 to be gradually connected with the second fixing end 220 in a matching manner.

In addition, the control end 233 is not limited to a nut, and the control end 233 may also be a controllable structure such as a rotating handle, for example, the rotating handle drives the first connecting end 231 and the second connecting end 232 to move correspondingly, so that the first connecting end 231 is gradually connected to the first fixing end 210 in a matching manner, and the second connecting end 232 is gradually connected to the second fixing end 220 in a matching manner.

In this embodiment, the lower end of the second connection end 232 sequentially passes through the first fixing end 210 and the heat sink substrate 310, and in the process of connecting the first connection end 231 with the first fixing end 210 on the heat sink substrate 310, because the first connection end 231 gradually moves downward, at this time, the second connection end 232 also gradually moves downward, so that the second connection end 232 and the second fixing end 220 are connected in a matching manner. When the bottom end surface of the first connection end 231 contacts the front surface of the upper surface of the heat sink substrate 310, the first connection end 231 cannot move downward to complete the connection between the first connection end 231 and the first fixed end 210 on the heat sink substrate 310, and meanwhile, the second connection end 232 is fixed by the second fixed end 220 and cannot move up and down to complete the connection between the second connection end 232 and the second fixed end 220 on the external device.

As can be seen from the above, in the fixing device 200 of the heat sink of the present embodiment, the first fixing end 210 is installed on the substrate of the far-end heat sink 300, and the length of the second fixing end 220 installed on the external device is reduced, the upper portion of the connecting device 230 is used as the first connecting end 231 to be fixed with the substrate of the far-end heat sink 300, and the lower portion of the connecting device 230 is used as the second connecting end 232 to be fixed with the second fixing end 220 installed on the external device, so that the far-end heat sink 300 is horizontally fixed, and the problem of poor contact between the CPU chip and the near-end heat sink due to the length tolerance of the mounting stud of the far-end heat sink 300 between the two fixing mounting surfaces of the.

The structure principle of the fixing apparatus 200 of the heat sink in this embodiment is explained in detail above, and the specific structures of the first fixing end 210, the second fixing end 220, the connecting device 230 and the connection manner therebetween in this embodiment are explained in detail below.

Specifically, in the present embodiment, the first way of the structure-matching connection between the first connection end 231 and the first fixed end 210 is as follows:

as shown in fig. 4 to 6, the first fixing end 210 is a hollow first externally threaded column; the first connection end 231 is connected to the lower surface edge of the control end 233, is installed outside the first fixing end 210, and is a hollow first internal threaded column matched with the first external threaded column.

That is, the first connection end 231 may be an internal threaded post, correspondingly, the first fixing end 210 is an external threaded post, and the first connection end 231 is connected with the first fixing end 210 in a matching manner through the matching of the internal threaded post of the first connection end 231 and the external threaded post of the first fixing end 210 in the downward movement process of the first connection end 231.

In the case that the first connecting end 231 is an internal threaded post and the first fixing end 210 is an external threaded post, the second connecting end 232 and the second fixing end 220 have the following two structures:

1) as shown in fig. 4 and 5, the second fixing end 220 is a hollow second internal threaded column; the second connection end 232 is connected to the middle of the lower surface of the control end 233, has a gap with the first connection end 231, is installed in the second fixing end 220, and is a second external thread column matched with the second internal thread column.

At this time, the first connection end 231 and the second connection end 232 are connected through the control end 233, there is no connection between the first connection end 231 and the second connection end 232, the first connection end 231 is an internal thread column, and the second connection end 232 is an external thread column.

At this time, the second connecting end 232 is an external threaded post, the second fixing end 220 installed on the external device is an internal threaded post, and the second connecting end 232 is connected with the second fixing end 220 in a downward moving process through the matching of the external threaded post of the second connecting end 232 and the internal threaded post of the second fixing end 220.

2) As shown in fig. 6, the second fixing end 220 is a third externally threaded post; the second connection end 232 is connected to the middle of the lower surface of the control end 233, has a gap with the first connection end 231, is installed outside the second fixing end 220, and is a hollow third internal threaded column matched with the third external threaded column.

At this time, the second connecting end 232 is an internal threaded column, the second fixing end 220 installed on the external device is an external threaded column, and the second connecting end 232 is connected with the second fixing end 220 in a downward moving process through the matching of the internal threaded column of the second connecting end 232 and the external threaded column of the second fixing end 220.

In this embodiment, the second way of the structure-matching connection between the first connection end 231 and the first fixed end 210 is as follows:

as shown in fig. 7 and 8, the first fixing end 210 is a hollow fourth internal threaded column; the first connection end 231 is connected to the middle of the lower surface of the control end 233, is installed in the first fixing end 210, and is a fourth external threaded column matched with the fourth internal threaded column.

That is, the first connection end 231 may also be an external threaded rod, correspondingly, the first fixing end 210 is an internal threaded rod, and in the downward movement process of the first connection end 231, the external threaded rod of the first connection end 231 is in fit connection with the internal threaded rod of the first fixing end 210, so that the first connection end 231 is in fit connection with the first fixing end 210.

In the case that the first connecting end 231 is an externally threaded post and the first fixing end 210 is an internally threaded post, the second connecting end 232 and the second fixing end 220 have the following two structures:

1) as shown in fig. 7, the second fixing end 220 is a hollow fifth internal threaded column; the second connection end 232 is connected to the bottom of the first connection end 231, is installed in the second fixing end 220, and is a fifth external threaded column matched with the fifth internal threaded column.

At this time, the first connection end 231 and the second connection end 232 are directly connected, the control end 233 is only connected with the first connection end 231, the first connection end 231 is controlled to be connected in a rotating manner, the second connection end 232 is indirectly controlled to be connected in a rotating manner, the first connection end 231 and the second connection end 232 are connected up and down, the first connection end 231 is an external thread column, and the second connection end 232 is also an external thread column.

In this embodiment, the first connection end 231 and the second connection end 232 are preferably but not limited to an integrally formed external threaded column.

As shown in fig. 7, the second connecting end 232 is an external thread column, the second fixing end 220 installed on the external device is an internal thread column, and the second connecting end 232 is connected with the internal thread column of the second fixing end 220 in a matching manner through the external thread column of the second connecting end 232 and the internal thread column of the second fixing end 220 in a downward moving process, so that the second connecting end 232 is connected with the second fixing end 220 in a matching manner.

2) As shown in fig. 8, the second fixing end 220 is a sixth externally threaded post; the second connection end 232 is connected to the bottom of the first connection end 231, is installed outside the second fixing end 220, and is a hollow sixth internal threaded column matched with the sixth external threaded column.

At this time, the first connection end 231 and the second connection end 232 are directly connected, the control end 233 is only connected with the first connection end 231, the first connection end 231 is controlled to be connected in a rotating manner, the second connection end 232 is indirectly controlled to be connected in a rotating manner, the first connection end 231 and the second connection end 232 are connected up and down, the first connection end 231 is an external thread column, and the second connection end 232 is an internal thread column.

In this embodiment, the first connection end 231 and the second connection end 232 are preferably but not limited to an integrally formed screw body having an upper portion of an external threaded column and a lower portion of a hollow internal threaded column.

As shown in fig. 8, the second connecting end 232 is an internal thread column, the second fixing end 220 installed on the external device is an external thread column, and the second connecting end 232 is connected in a downward moving process through the internal thread column of the second connecting end 232 and the external thread column of the second fixing end 220 in a matching manner, so that the second connecting end 232 is connected with the second fixing end 220 in a matching manner.

As shown in fig. 9 and 10, the first fixing end 210 is located inside the heat sink substrate 310, and the first fixing end 210 is an internal thread formed in the heat sink substrate 310 and penetrating through the heat sink substrate 310.

At this time, the first connection end 231 is an external threaded post connected to the lower surface of the control end and engaged with the internal thread of the heat sink base plate 310.

Specifically, in the present embodiment, the first connection end 231 and the first fixed end 210 are connected in a structure-fitting manner as follows:

as shown in fig. 9 and 10, the first fixing end 210 is formed as an internal thread formed inside the heat sink substrate 310, that is, the first fixing end 210 is formed by disposing an internal thread at a connection hole portion of the heat sink substrate 310 through which the second connection end 232 passes in fig. 4 to 8.

The first connection end 231 is connected to the middle of the lower surface of the control end 233, and the first connection end 231 is an external threaded post engaged with the internal thread of the heat sink base plate 310. After the second connection end 232 passes through the heat sink base plate 310, during the downward movement of the first connection end 231, the external thread of the first connection end 231 is connected with the internal thread of the first fixing end 210 in a matching manner, and when the lower surface of the control end 233 is close to the upper surface of the heat sink base plate 310, the connection between the first connection end 231 and the first fixing end 210 is completed.

When the first fixing end 210 is an internal thread formed in the heat sink substrate 310 and penetrating through the heat sink substrate 310, and the first connection end 231 is an external thread column matched with the internal thread in the heat sink substrate 310, the second connection end 232 has the following two structures:

the second connection end 232 is an external thread column or an internal thread column located on the lower surface of the first connection end 231. At this time, the second fixing end 220 is correspondingly positioned as an internal threaded column or an external threaded column.

The first connection end 231 and the second connection end 232 are preferably integrally formed, the control end 233 is connected with the first connection end 231 only, and the second connection end 232 is indirectly controlled to be connected in a rotating manner by controlling the first connection end 231 to be connected in a rotating manner.

At this time, the connection relationship between the second connection end 232 and the second fixing end 220 is the same as the connection manner between the second connection end 232 and the second fixing end 220 described in fig. 7 and fig. 8, and is not repeated herein.

This embodiment also provides a heat dissipation device, the heat dissipation device includes: proximal and distal heat sinks 300; the near-end heat sink is installed around the device 500 to be heat-dissipated, one end of the far-end heat sink 300 is connected to the device 500 to be heat-dissipated, and the other end is fixed with an external device through the fixing device 200 of the heat sink. The heat sink fixing device 200 has been described in detail above, and will not be described in detail herein. In this embodiment, the far-end heat sink 300 utilizes the far-end space of the device 500 to be cooled for heat dissipation, and the near-end heat sink utilizes the near-end space of the device 500 to be cooled for heat dissipation.

In this embodiment, the device to be cooled 500200 is a high power consumption device in a heat dissipation apparatus, for example, the device to be cooled 500500 is a CPU chip, and as shown in fig. 4, the CPU chip is mounted on the PCB 510.

The remote heat sink 300 is, but not limited to, a heat pipe heat exchanger. The heat pipe heat exchanger can remotely transmit the heat of the device 500 to be radiated, and transmits the absorbed heat of the device 500 to be radiated to a far end with concentrated air volume and relatively abundant space, so that the far end space is utilized for radiating.

Specifically, in the present embodiment, the heat pipe heat exchanger is, but not limited to, a thermosiphon heat exchanger.

Specifically, the heat pipe heat exchanger includes: the evaporator, the condenser, the steam pipeline and the return pipeline.

The outlet of the evaporator is connected with the inlet of the steam pipeline, the outlet of the steam pipeline is connected with the inlet of the condenser, the outlet of the condenser is connected with the inlet of the return pipeline, and the liquid of the return pipeline is conveyed to the inlet of the evaporator.

In this embodiment, the evaporator is installed on the device 500 to be cooled, and is preferably installed right above the device 500 to be cooled (CPU chip), and the evaporator evaporates the liquid at the inner end into gas after absorbing the heat of the device 500 to be cooled; the condenser receives the gas in the evaporator through a steam pipeline, condenses the received gas to form liquid, and conveys the liquid into the evaporator through a return pipeline.

When the temperature of the device 500 to be cooled is high, the heat of the device 500 to be cooled is transferred to the evaporator through the connection of the evaporator and the surface of the device 500 to be cooled, the evaporator starts working medium circulation at the inner end, then the heat is transmitted to the condenser at the far end through the steam pipeline, the heat is discharged from the condenser, and flows back to the evaporator in a liquid state through the backflow management, so that the temperature of the device 500 to be cooled is reduced.

In this embodiment, the near-end heat sink is disposed in the near-end space of the device 500 to be cooled, so as to fully utilize the near-end space to perform auxiliary heat dissipation, thereby improving the overall heat dissipation capability.

Specifically, in the present embodiment, the heat sink includes but is not limited to: heat conduction subassembly and radiator fin.

The heat conducting component is arranged on the upper surface of the evaporator and conducts heat on the upper surface of the evaporator; the heat dissipation fins are arranged on the heat conduction assembly and dissipate heat conducted by the heat conduction assembly.

The surface heat of the evaporator is rapidly conducted to the radiating fins through the guide-in assembly, and the heat is further radiated through the radiating fins.

Specifically, in the present embodiment, the heat conducting component is a heat pipe (Heatpipe) or a Vapor Chamber (VC).

The heat dissipation device of this embodiment, on the one hand, brings the heat of the device 500 to be dissipated to the far end through the heat pipe heat exchanger, and utilizes the far-end space to dissipate heat, on the other hand, utilizes the heat dissipation space around the device 500 to be dissipated to dissipate heat at the local side, thereby significantly improving the heat dissipation capability of the high-power device.

The remote heat sink 300 used in the heat sink of the present embodiment is fixed to an external device by the fixing device 200 of the heat sink, since the other end of the heat sink substrate 310 of the remote heat sink 300 has been fixed at the device to be heat-dissipated 500 in advance, the first connection ends 231 are connected with the first fixed ends 210 of the heat sink base plate 310 of the remote heat sink 300, keeping the heat sink base plate 310 mounted with the first fixing end 210 horizontal with the end fixed in advance, in this way, the heat sink substrate 310 of the remote heat sink 300 is kept horizontal with the fixed end of the device 500 to be heat-dissipated, the substrate of the near-end connector at the device 500 to be cooled is not jacked up or pressed and tilted up by the influence of the heat sink substrate 310 of the far-end heat sink 300, so that the problem of poor contact between the device 500 to be cooled and the near-end heat sink caused by the length tolerance of the second fixed end 220 is solved.

To sum up, the utility model discloses an install a double-screw bolt stiff end on the distal end radiator base plate, and subtract the length of the double-screw bolt stiff end of installing on the short-cut external device, it is fixed with the distal end radiator base plate with the upper portion of connecting device (screw), the double-screw bolt fixed end of installing on the lower part of connecting device (screw) and the external device is fixed, realize the fixed of distal end radiator, can effectively solve between two fixed mounting face of distal end radiator and near-end radiator because the problem of the CPU chip that the installation double-screw bolt length tolerance of distal end radiator brought and near-end radiator contact failure. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (11)

1. A fixing device of a radiator is characterized in that: the method comprises the following steps:

the first fixed end is arranged on the radiator substrate;

the second fixed end is fixed on an external device, is positioned below the radiator substrate and has a gap with the lower surface of the radiator substrate;

a connection device, comprising:

the first connecting end is connected with the first fixed end on the radiator substrate;

the lower end of the second connecting end sequentially penetrates through the first fixing end and the radiator substrate and is connected with the second fixing end;

and the control end controls the connection between the first connecting end and the first fixed end and the connection between the second connecting end and the second fixed end.

2. The heat sink fixing device according to claim 1, wherein:

the first fixed end is a hollow first external threaded column;

the first connecting end is connected to the lower surface edge of the control end, is arranged outside the first fixing end and is a hollow first internal thread column matched with the first external thread column.

3. The heat sink fixing device according to claim 2, wherein:

the second fixed end is a hollow second internal thread column;

the second connecting end is connected to the middle of the lower surface of the control end, has a gap with the first connecting end, is arranged in the second fixing end and is a second external thread column matched with the second internal thread column.

4. The heat sink fixing device according to claim 2, wherein:

the second fixed end is a third external threaded column;

the second connecting end is connected to the middle of the lower surface of the control end, has a gap with the first connecting end, is arranged outside the second fixing end, and is a hollow third internal threaded column matched with the third external threaded column.

5. The heat sink fixing device according to claim 1, wherein:

the first fixed end is a hollow fourth internal thread column;

the first connecting end is connected to the middle of the lower surface of the control end, is arranged in the first fixing end and is a fourth external thread column matched with the fourth internal thread column.

6. The heat sink fixing apparatus according to claim 5, wherein:

the second fixed end is a hollow fifth internal thread column;

the second connecting end is connected to the bottom of the first connecting end, is arranged in the second fixing end and is a fifth external threaded column matched with the fifth internal threaded column.

7. The heat sink fixing apparatus according to claim 6, wherein: the first connecting end and the second connecting end are integrally formed into an external thread column.

8. The heat sink fixing apparatus according to claim 5, wherein:

the second fixed end is a sixth external threaded column;

the second connecting end is connected to the bottom of the first connecting end, is arranged outside the second fixing end and is a hollow sixth internal threaded column matched with the sixth external threaded column.

9. The heat sink fixing apparatus according to claim 8, wherein: the first connecting end and the second connecting end are integrally formed into a thread body, the upper portion of the thread body is an external thread column, and the lower portion of the thread body is a hollow internal thread column.

10. The heat sink fixing device according to claim 1, wherein: the first fixing end is an internal thread which is formed in the radiator substrate and penetrates through the radiator substrate; the first connecting end is an external thread column which is connected to the lower surface of the control end and matched with the internal thread in the radiator substrate; the second connecting end is positioned on the external thread column or the internal thread column on the lower surface of the first connecting end.

11. A heat dissipation device, characterized in that: the method comprises the following steps:

the near-end radiator is arranged around the device to be radiated;

a remote heat sink having one end connected to the device to be heat-dissipated and the other end fixed to an external device by a fixing device of the heat sink as claimed in any one of claims 1 to 10.

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