CN212266789U - Mold processing device capable of preventing mold deformation - Google Patents
Mold processing device capable of preventing mold deformation Download PDFInfo
- Publication number
- CN212266789U CN212266789U CN201922183881.6U CN201922183881U CN212266789U CN 212266789 U CN212266789 U CN 212266789U CN 201922183881 U CN201922183881 U CN 201922183881U CN 212266789 U CN212266789 U CN 212266789U
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- die
- mold
- mould
- positioning pin
- base plate
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- 238000012545 processing Methods 0.000 title claims description 12
- 238000007723 die pressing method Methods 0.000 claims abstract description 20
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 229920001971 elastomer Polymers 0.000 claims description 11
- 239000005060 rubber Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 7
- 238000013461 design Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000003754 machining Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012797 qualification Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model relates to a architectural design device field, a can prevent mould processingequipment that mould warp, for realizing above-mentioned purpose, the utility model provides a following technical scheme: including last die holder board and lower die pressing plate, evenly be provided with a plurality of locating pins on the top face of last die holder board, evenly be provided with a plurality of long locating pin holes on the top face of last die holder board, be provided with the mould groove in the top of last die holder board, evenly be provided with a plurality of long locating pins on the bottom face of lower die pressing plate, be provided with buffer on the interior bottom surface of mould groove, the last seal gasket that is provided with of buffer, seal gasket's upper end is provided with the supporting shoe, be provided with the aluminum alloy thin slice on the supporting shoe, the right side of going up die holder board is provided with the condensate tank, the output of suction pump is provided with the condensate pipe, the condensate pipe runs through the condensate tank and connects last die holder board and extends to the mould inslot.
Description
Technical Field
The utility model relates to a mould processingequipment field specifically is a can prevent mould processingequipment that mould warp.
Background
The mould, the industrial production is used for injection moulding, blow moulding, extruding, die-casting or forging and pressing shaping, smelting, various moulds and tools of the required products to obtain, make the blank become worker with particular shape and size under the external force, it is used in blanking, die forging, cold heading, squeezing, powder metallurgy pressing, pressure casting extensively, and in the shaping processing of compression moulding or injection moulding of products such as engineering plastics, rubber, pottery, etc., the mould has particular outline or cavity shape, in the course of working of the work piece, because of the poor buffer property, can make the mould while working, the die is crushed or make it deform by the pressure die block, the work piece needs to use the way of machine tooling to guarantee its precision, the disadvantage doing so is: more material and machining time are consumed, the production efficiency is reduced, the machining precision is influenced, and the use requirement cannot be completely met.
SUMMERY OF THE UTILITY MODEL
This patent introduces a can prevent mould processingequipment that mould warp to it is relatively poor because of shock-absorbing capacity to solve prior art, can make the mould when the course of working, by the die block crushing or make it take place to warp, influence production efficiency and the more material of loss, influence the problem of precision.
In order to achieve the above object, the utility model provides a following technical scheme: a die processing device capable of preventing a die from deforming comprises an upper die base plate and a lower die pressing plate, wherein the upper die base plate is positioned below the lower die pressing plate, a plurality of positioning pins are uniformly arranged on the top end surface of the upper die base plate, a plurality of long positioning pin holes are uniformly arranged on the top end surface of the upper die base plate, a die groove is formed in the top end of the upper die base plate, an infrared heating plate is arranged on the outer side surface of the die groove, a plurality of long positioning pins are uniformly arranged on the bottom end surface of the lower die pressing plate, a plurality of positioning pin holes are uniformly arranged on the bottom end surface of the lower die pressing plate, a die block matched with the die groove is arranged on the bottom end surface of the lower die pressing plate, a buffer device is arranged on the inner bottom surface of the die groove, a sealing pad is arranged on the buffer device, a, the right side of going up the die holder board is provided with the condensate tank, be provided with the suction pump in the condensate tank, the output of suction pump is provided with the condensate pipe, the condensate pipe runs through the condensate tank and connects the die holder board and extend to the mould inslot.
Preferably, the buffer device comprises a rubber layer, a spiral spring layer and a support rod, wherein the support rod is positioned below the spiral spring layer, and the spiral spring layer is positioned below the rubber layer.
Preferably, condensed water is arranged in the condensed water tank, and supporting legs are arranged on the bottom side of the condensed water tank.
Preferably, the long positioning pin is arranged in a long positioning pin hole in the upper die base plate, the positioning pin is arranged in a positioning pin hole in the lower die pressing plate, and the long positioning pin and the positioning pin are both made of metal iron.
Preferably, six springs and six support rods are arranged in the spiral spring layer and are arranged in a linear mode.
Compared with the prior art, the beneficial effects of the utility model are that:
1. during mold machining, mold materials are placed into the mold groove, the infrared heating plate is started, the mold materials are preheated before machining, the brittleness of the mold is reduced, mold deformation and cracking during subsequent machining are avoided, and the qualification rate of the mold is reduced.
2. The buffer device is provided with a sealing gasket to prevent the mold material from permeating into the lower part of the mold groove, the long positioning pin hole is arranged on the upper mold base plate through the long positioning pin, the positioning pin hole is arranged on the lower mold pressing plate through the positioning pin, and the two positioning plates are mutually combined, so that the mold processing precision is ensured.
3. The die is characterized in that the bottom surface in the die groove is provided with a buffer device, the buffer device comprises a rubber layer, a spiral spring and a supporting rod, the pressing module is provided with an elastic buffer in the pressing process, the die cannot be crushed or deformed, and the die is rapidly cooled to form a fixed shape by utilizing condensed water.
Drawings
FIG. 1 is a schematic view of the internal structure of the upper mold base plate of the present invention;
FIG. 2 is a schematic view of the upper mold base plate of the present invention;
fig. 3 is the schematic view of the lower mold platen structure of the present invention.
In the figure: 1 upper die base plate, 2 lower die pressing plates, 3 positioning pins, 31 positioning pin holes, 4 long positioning pins, 41 long positioning pin holes, 5 die grooves, 51 pressing modules, 52 sealing gaskets, 53 supporting blocks, 54 aluminum alloy sheets, 6 infrared heating plates, 7 buffering devices, 71 rubber layers, 72 spiral spring layers, 73 supporting rods, 8 condensed water tanks, 81 condensed water pipes, 82 condensed water, 83 supporting legs and 9 water suction pumps.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a mold processing device capable of preventing mold deformation: the die comprises an upper die base plate 1 and a lower die pressing plate 2, wherein the upper die base plate 1 is positioned below the lower die pressing plate 2, a plurality of positioning pins 3 are uniformly arranged on the top end surface of the upper die base plate 1, a plurality of long positioning pin holes 41 are uniformly arranged on the top end surface of the upper die base plate 1, a die groove 5 is arranged in the top end of the upper die base plate 1, an infrared heating plate 6 is arranged on the outer side surface of the die groove 5, a plurality of long positioning pins 4 are uniformly arranged on the bottom end surface of the lower die pressing plate 2, a plurality of positioning pin holes 31 are uniformly arranged on the bottom end surface of the lower die pressing plate 2, a die block 51 matched with the die groove 5 is arranged on the bottom end surface of the lower die pressing plate 2, a buffer device 7 is arranged on the inner bottom surface of the die groove 5, a sealing gasket 52 is arranged on the buffer device 7, a supporting, the right side of going up mold base board 1 is provided with condensate tank 8, be provided with suction pump 9 in the condensate tank 8, the output of suction pump 9 is provided with condensate pipe 81, condensate pipe 81 runs through condensate tank 8 and connects mold base board 1 and extends to in the mould groove 5.
Referring to fig. 1 and 2, an upper die base plate 1 is located below a lower die platen 2, four positioning pins 3 are arranged on the top end face of the upper die base plate 1, long positioning pin holes 41 are arranged at corners of the top end face of the upper die base plate 1, a die slot 5 is arranged in the upper die base plate 1, long positioning pins 4 are arranged at corners of the bottom end face of the lower die platen 2, four positioning pin holes 31 are arranged on the bottom end face of the lower die platen 2, a die block 51 matched with the die slot 5 is arranged on the bottom end face of the lower die platen 2, the long positioning pins 4 are arranged in the long positioning pin holes 41 on the upper die base plate 1, the positioning pins 3 are arranged in the positioning pin holes 31 on the lower die platen 2, the long positioning pins 4 and the positioning pins 3 are made of metal iron, the metal iron has high hardness and are not easy to break, the design ensures the, the die has the advantages that the stamping edge opening of the whole die is smooth and flat in the stamping process, no collapsed edge exists at the corner, the loss of materials is reduced, and the production efficiency is improved.
Referring to fig. 3, the outer side of the mold slot 5 is provided with an infrared heating plate 6, the infrared heating plate 6 is positioned in the inner cavity of the upper mold plate, the energy of the infrared heater is saved by forming a cured coating on the radiation surface of the heater by the electrothermal coating, the coating can absorb a large amount of radiation heat energy due to high surface blackness and can convert the absorbed radiation heat energy into far infrared heat energy which is easy to be absorbed by an object and transmit the far infrared heat energy in the form of electromagnetic waves due to high emissivity, the micron-sized electrothermal coating has thick coating, large thermal resistance and high reflectivity, is used on the surface of the oven plate, converts the dissipated heat energy into the far infrared heat energy to be radiated in the oven in the form of electromagnetic waves and absorbed by the heated object in the oven and not easily absorbed by moisture, thereby the heat energy is kept in the oven, not only the moisture-discharging temperature is reduced, but also the temperature in, the nanometer electrothermal coating has thin coating layer and small thermal resistance, is used on the surface of a metal material heated and conducted in an oven, in the heat transfer process, the coating layer not only converts absorbed radiation heat energy into far infrared heat energy for transfer, but also changes the far infrared radiation heat energy into a far infrared radiation heat source, and the temperature gradient is increased due to the increase of the surface temperature, so that the heat energy transfer strength of a heated object is enhanced, the heat absorption capacity is greatly improved, the infrared heating plate 6 is used for preheating a mould before the mould is processed, the brittleness of the mould is reduced, the mould is prevented from being deformed and cracked during subsequent processing, the qualification rate of the mould is reduced, a buffer device 7 is arranged on the inner bottom surface of a mould groove 5, a sealing gasket 52 is arranged on the buffer device 7, in order to prevent the mould material from permeating into the lower part of the mould groove, a supporting block, the aluminum alloy is hard aluminum alloy formed by adding a small amount of copper, magnesium, manganese and the like into aluminum, the alloy is called as hard aluminum and has the advantages of hardness, beauty, lightness, durability, long-term rust resistance, a condensed water tank 8 is arranged on the right side of an upper die base plate 1, a water suction pump 9 is arranged in the condensed water tank 8, the water suction pump 9 is in circular motion of a motor, a diaphragm in the pump does reciprocating motion through a mechanical device, so that air in a pump cavity with a fixed volume is compressed and stretched to form vacuum (negative pressure), pressure difference is generated between the air suction port of the pump and the external atmospheric pressure, gas is pressed (sucked) into the pump cavity and then is discharged from an air exhaust port under the action of the pressure difference, a condensed water pipe 81 is arranged at the output end of the water suction pump 9, the condensed water pipe 81 penetrates through the condensed water tank 8 to be connected with the upper die base plate 1 and extends into a die slot 5, condensed water, the bottom side of the condensed water tank 8 is provided with a supporting leg 83, the buffer device 7 comprises a rubber layer 71, a spiral spring layer 72 and a supporting rod 73, the supporting rod 73 is positioned below the spiral spring layer 72, the precise adjustment performance is that the relation between the acting force and the displacement is very sensitive, the flexibility is good, the deformation range is relatively wide, the manufacture is relatively easy, the structure is relatively compact, the spiral spring layer 72 is positioned below the rubber layer 71, the rubber layer 71 is made of synthetic rubber, the buffer capacity is good, and the pressing module 51 has elastic buffer in the pressing process, so that the die cannot be crushed.
The working principle is as follows: when the die is machined, a die material is firstly placed into the die groove 5, the infrared heating plate 6 is started, the die is preheated before being machined, the brittleness of the die is reduced, the die deformation and cracking caused in subsequent machining are avoided, the qualification rate of the die is further reduced, the buffer device 7 is provided with the sealing gasket 52, in order to prevent the die material from permeating into the lower part of the die groove, the long positioning pin 4 is arranged on the long positioning pin hole 41 on the upper die base plate 1, the positioning pin 3 is arranged on the positioning pin hole 31 on the lower die pressing plate 2, the long positioning pin 4 and the positioning pin 3 are both made of metal iron, the hardness of the metal iron is higher, the breakage is not easy, the machining accuracy of the die is ensured, the diameter of the die groove 5 is larger than that of the pressing module 51, namely, a negative clearance mode is adopted, the stamping edge opening of the whole die can be smooth and, buffer 7 on the bottom surface in mould groove 5, buffer 7 includes rubber layer 71 and helical spring layer 72, bracing piece 73, make and press module 51 to have an elasticity buffering at the process of compressing tightly, make the mould can not crushed or warp by the pressure, at this moment, stop heating, open suction pump 9, leading-in condensate pipe 81 through condensate water 82 in condensate water tank 8, make the mould cool off fast and form fixed form, be equipped with aluminum alloy thin slice 54 on the supporting shoe 53, make it not fragile, prevent frequent change, condensate water tank 8 bottom side is equipped with supporting leg 83 and supports.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a can prevent mould processingequipment that mould warp, includes punch holder board (1) and lower platen (2), its characterized in that: the die comprises an upper die base plate (1), a lower die pressing plate (2), a plurality of positioning pins (3) are uniformly arranged on the top end surface of the upper die base plate (1), a plurality of long positioning pin holes (41) are uniformly arranged on the top end surface of the upper die base plate (1), a die groove (5) is formed in the top end of the upper die base plate (1), an infrared heating plate (6) is arranged on the outer side surface of the die groove (5), a plurality of long positioning pins (4) are uniformly arranged on the bottom end surface of the lower die pressing plate (2), a plurality of positioning pin holes (31) are uniformly arranged on the bottom end surface of the lower die pressing plate (2), a pressing module (51) matched with the die groove (5) is arranged on the bottom end surface of the lower die pressing plate (2), a buffer device (7) is arranged on the inner bottom surface of the die groove (5), and a sealing gasket (52) is arranged, the upper end of sealed pad (52) is provided with supporting shoe (53), be provided with aluminum alloy thin slice (54) on supporting shoe (53), the right side of going up die holder board (1) is provided with condensate tank (8), be provided with suction pump (9) in condensate tank (8), the output of suction pump (9) is provided with condensate pipe (81), condensate pipe (81) run through condensate tank (8) and connect die holder board (1) and extend to in mould groove (5).
2. The mold processing apparatus for preventing deformation of a mold as set forth in claim 1, wherein: the buffer device (7) comprises a rubber layer (71), a spiral spring layer (72) and a supporting rod (73), wherein the supporting rod (73) is positioned below the spiral spring layer (72), and the spiral spring layer (72) is positioned below the rubber layer (71).
3. The mold processing apparatus for preventing deformation of a mold as set forth in claim 1, wherein: condensed water (82) is arranged in the condensed water tank (8), and supporting legs (83) are arranged on the bottom side of the condensed water tank (8).
4. The mold processing apparatus for preventing deformation of a mold as set forth in claim 1, wherein: the long positioning pin (4) is arranged in a long positioning pin hole (41) in the upper die base plate (1), and the positioning pin (3) is arranged in a positioning pin hole (31) in the lower die pressing plate (2).
5. The mold processing apparatus for preventing deformation of a mold as set forth in claim 1, wherein: the number of the long positioning pins (4) and the number of the positioning pins (3) are four.
6. The mold processing apparatus for preventing deformation of a mold as set forth in claim 2, wherein: six springs are arranged in the spiral spring layer (72), and six support rods (73) are arranged in a linear mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922183881.6U CN212266789U (en) | 2019-12-09 | 2019-12-09 | Mold processing device capable of preventing mold deformation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922183881.6U CN212266789U (en) | 2019-12-09 | 2019-12-09 | Mold processing device capable of preventing mold deformation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212266789U true CN212266789U (en) | 2021-01-01 |
Family
ID=73872857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922183881.6U Expired - Fee Related CN212266789U (en) | 2019-12-09 | 2019-12-09 | Mold processing device capable of preventing mold deformation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212266789U (en) |
-
2019
- 2019-12-09 CN CN201922183881.6U patent/CN212266789U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210101 |