CN212211802U

CN212211802U - Microwave equipment with novel heat radiation structure

Info

Publication number: CN212211802U
Application number: CN202021263309.7U
Authority: CN
Inventors: 谢祝军
Original assignee: Wuxi Huace Electronic System Co Ltd
Current assignee: Wuxi Huace Electronic System Co Ltd
Priority date: 2020-07-01
Filing date: 2020-07-01
Publication date: 2020-12-22
Anticipated expiration: 2030-07-01

Abstract

The utility model discloses a microwave device with a novel heat dissipation structure, which relates to the technical field of microwave and comprises a box body, a lower cover plate, a printed circuit board, a power amplifier, a power supply and a radiator, wherein the radiator at least comprises an upper cover plate and a plurality of heat dissipation fins which are uniformly distributed on the upper surface of the upper cover plate in parallel; the upper cover plate fastens that the upper surface and the radiating fin of box body are located the box body outside, printed circuit board, power amplifier and power all set up in the inside cavity of box body, the top of power is connected with the radiator through first heat-conducting layer, power amplifier's top is passed through the metal heat conduction piece and is connected with the radiator, use heat-conducting layer and metal heat conduction piece directly to pass to the radiator with power and power amplifier's heat, can reduce the thermal resistance value of heat-conducting path, conduct the product outside with the heat in the short time, the fail safe nature of product provides the guarantee, the efficient heat-sinking capability of product has also been realized simultaneously, the yield of product has greatly been improved.

Description

Microwave equipment with novel heat radiation structure

Technical Field

The utility model belongs to the technical field of the microwave technique and specifically relates to a microwave equipment with novel heat radiation structure.

Background

With the continuous development of science and technology, people have higher and higher requirements on heat dissipation of electronic equipment, and particularly in the field of aerospace, any electronic equipment is stored or works under certain environmental conditions, wherein the influence of the temperature in climatic factors on the electronic equipment or a system is particularly important. The high temperature, the low temperature and the circulation thereof can generate important influence on most electronic components, which can cause the failure of the electronic components and further influence the failure of the whole equipment, and the method is particularly remarkable on the high-power amplifier products. There is data showing that in a transmitter, the reliability of a power transistor decreases by 60% for every 10 ℃ increase in junction temperature.

With the miniaturization and microminiaturization of electronic components, the high integration and micro-assembly of integrated circuits, and the like, the heat flux density of components and assemblies is continuously improved, and the thermal design is facing a serious challenge. At present, a plurality of domestic units adopt a traditional single-mode design method of conduction heat dissipation or air cooling heat dissipation and the like to carry out heat dissipation design on microwave equipment, but the microwave equipment has the limitation of low heat dissipation efficiency, can cause the phenomenon that the product fails to work under the normal temperature or high temperature environment, and has low reliability.

SUMMERY OF THE UTILITY MODEL

The inventor of the present invention provides a microwave equipment with a novel heat radiation structure aiming at the above problems and technical requirements, the technical scheme of the utility model is as follows:

a microwave device with a novel heat dissipation structure comprises a box body, a lower cover plate, a printed circuit board, a power amplifier, a power supply and a heat radiator, wherein the heat radiator at least comprises an upper cover plate and a plurality of heat dissipation fins which are uniformly distributed on the upper surface of the upper cover plate in parallel; the upper cover plate is fastened on the upper surface of the box body, the radiating fins are positioned outside the box body, and the lower cover plate is fastened on the lower surface of the box body; the printed circuit board, the power amplifier and the power supply are all arranged in the cavity inside the box body, the power amplifier and the power supply are respectively electrically connected with the printed circuit board, the top of the power supply is connected with the radiator through the first heat conduction layer, and the top of the power amplifier is connected with the radiator through the metal heat conduction block.

The further technical scheme is that the radiator is a heat pipe type radiator, the heat pipe type radiator further comprises heat pipes welded together with the radiating fins, and the heat pipes are uniformly distributed and embedded in the upper cover plate.

The further technical scheme is that the bottom of the power supply is directly connected with the box body, and the bottom and the top of the power supply are simultaneously cooled.

The technical scheme is that a partition plate is arranged in the box body to divide the box body into an upper cavity and a lower cavity, the upper cavity is located between the partition plate and an upper cover plate, the lower cavity is located between the partition plate and a lower cover plate, the power supply is arranged in the upper cavity, the bottom of the power supply is directly connected with the partition plate, and the top of the power supply is connected with the radiator through a first heat conduction layer.

The technical scheme is that the upper surface of the upper cover plate is further fixedly provided with a plurality of air blowing fans and a plurality of air draft fans, the air blowing fans and the air draft fans are respectively arranged on two sides of the radiating fins along the direction of the fins, the air blowing direction of each air blowing fan is parallel to the direction of the fins, and the air draft direction of each air draft fan is parallel to the direction of the fins.

The further technical scheme is that the top of the power amplifier is fastened with a metal heat-conducting block through a fastening piece, a second heat-conducting layer is arranged between the power amplifier and the metal heat-conducting block, and the upper surface of the metal heat-conducting block is connected with a radiator.

The utility model has the beneficial technical effects that:

the application discloses microwave equipment with novel heat radiation structure uses heat-conducting layer and metal heat-conducting block directly to pass to the radiator with power and power amplifier's heat in this microwave equipment, can reduce the thermal resistance value of heat-conducting path, conducts the product outside with the heat in the short time. The heat pipe can be with the even distribution of heat in the radiator bottom, can make heat and product external environment carry out the heat exchange in the short time, plays the radiating effect, avoids the heat to concentrate on local position and leads to the heat source device to burn out, has solved the uneven problem of product temperature field distribution. And finally, under the condition of using a forced air cooling mode combining air blowing and air draft, the heat dissipation efficiency of the product is improved, and the thermal reliability of the product is ensured. This utility model provides the guarantee for the fail safe nature of product, has also realized the efficient heat-sinking capability of product simultaneously, has greatly improved the yield of product.

Drawings

Fig. 1 is an exploded view of a microwave device as disclosed herein.

Fig. 2 is an angled assembly view of a microwave device and a schematic heat conduction path of a power amplifier as disclosed herein.

Fig. 3 is an assembly view of another angle of the microwave device and a schematic heat conduction path of a power supply as disclosed herein.

Fig. 4 is a structural view of the heat sink.

Fig. 5 is a schematic view of the assembly of the blower fan and the extractor fan with the radiator.

Detailed Description

The following describes the embodiments of the present invention with reference to the accompanying drawings.

The application discloses microwave equipment with novel heat radiation structure please refer to the exploded view that fig. 1 shows and the assembly view that fig. 2 and 3 show, this microwave equipment includes box body 1, lower apron 2, printed circuit board 3, power amplifier 4, power 5 and radiator 6, and radiator 6 includes upper cover plate 61 and a plurality of radiating fin 62 of parallel equipartition in upper cover plate 61 upper surface at least. The upper cover plate 61 is fastened to the upper surface of the case 1 and the heat radiating fins 62 are located outside the case 1, and the lower cover plate 2 is fastened to the lower surface of the case 1.

The printed circuit board 3, the power amplifier 4 and the power supply 5 are all arranged in the cavity inside the box body 1, the power amplifier 4 and the power supply 5 are respectively and electrically connected with the printed circuit board, it should be noted that, in practical implementation, the microwave equipment is also provided with other devices inside the box body, but high heat consumption devices inside the microwave equipment are mainly the power amplifier 4 and the power supply 5, so the application is only designed for the two devices, and other necessary conventional devices are not introduced.

The top of the power supply 5 is connected to the heat sink 6 through the first heat conducting layer 7, and the first heat conducting layer 7 can conduct the heat source on the top of the power supply 5 to the heat sink 6 for heat dissipation. This first heat-conducting layer 7 can adopt conventional silicone grease class heat conduction material to realize, but this application adopts carbon fiber material to make, and carbon fiber material's thermal conductivity is far higher than conventional silicone grease class heat conduction material to the material is longe-lived, difficult ageing, the reliability is high.

Further, the present application also designs a structure that the bottom and the top of the power supply 5 simultaneously dissipate heat, that is, the bottom of the power supply 5 is directly connected to the box 1, and a part of the generated heat is conducted to the box 1, and at the same time, the top uses the first heat conduction layer to conduct a part of the heat to the top of the power supply 5 and transfers the heat to the bottom of the heat sink 6, and the heat conduction path of the power supply 5 is as shown in fig. 2. The design method improves the heat dissipation efficiency of the power supply device, improves the thermal reliability of the product and ensures the safety of the product. The specific structure of this application is, 1 inside baffle 11 that is provided with of box body separates the box body for last cavity and lower cavity, goes up the cavity and lies in between baffle 11 and the upper cover plate 61, and the lower cavity lies in between baffle 11 and the lower cover plate 2, and power 5 sets up in last cavity and power 5's bottom is direct to be connected with baffle 11, and power 5's top is connected with radiator 6 through first heat-conducting layer 7.

The top of the power amplifier 4 is connected with the radiator through the metal heat conducting block 8, the metal heat conducting block 8 with high heat conductivity can directly conduct the heat source of the power amplifier 4 to the radiator 6, so that the thermal resistance value of the heat conducting path is reduced, heat is conducted to the outside of a product in a short time, and the heat conducting path of the power amplifier 4 is shown in fig. 3. In this application, the top of the power amplifier 4 is fastened with the metal heat conduction block 8 through a fastener, and a second heat conduction layer is arranged between the power amplifier 4 and the metal heat conduction block 8, the second heat conduction layer can be made of conventional heat conduction materials, the structure can reduce contact thermal resistance, and then the upper surface of the metal heat conduction block 8 is connected with a radiator.

In this application, radiator 6 is the heat pipe radiator, still include the heat pipe 63 that adopts the brazing process welding together with radiating fin 62, as shown in fig. 4, heat pipe 63 equipartition is embedded in upper cover plate 61, this kind of structure can make heat evenly distributed in radiator 6's bottom in the short time, can make heat and product external environment carry out the heat exchange in the short time, play the radiating action, the concentration of heat in local area has been avoided, lead to the device burnout in this region, the thermal reliability of product has been improved.

The upper surface of upper cover plate 61 is still fixed with a plurality of blower 9 and a plurality of exhaust fan 10, as shown in fig. 5, blower 9 and exhaust fan 10 set up respectively in radiating fin 62 along the both sides of fin direction, and every blower 9's the direction of blowing is on a parallel with the fin direction, and every exhaust fan 10's the direction of exhaust is on a parallel with the fin direction. The double-mode design can avoid the problem that the air duct resistance is increased to cause that the air cannot reach the position required by the design and the thermal reliability of a product cannot be guaranteed under the condition that the air duct path is too long in a single mode, and the heat dissipation efficiency is effectively improved and the safety of the product is guaranteed because the forced air cooling heat dissipation can be carried out on the radiator fins in a blowing and air draft combined mode. Can use the mode of blowing in one section of main heat source, flow through the fin surface with wind, take away its heat, use the convulsions mode in another section, aggravate the fluid flow between the fin, improve fin and air fluid's heat exchange capacity, guaranteed that the heat can be rapidly from fin surface to product service environment, play radiating effect, guaranteed the security of product.

What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.

Claims

1. The microwave equipment with the novel heat dissipation structure is characterized by comprising a box body, a lower cover plate, a printed circuit board, a power amplifier, a power supply and a heat radiator, wherein the heat radiator at least comprises an upper cover plate and a plurality of heat dissipation fins which are uniformly distributed on the upper surface of the upper cover plate in parallel; the upper cover plate is fastened on the upper surface of the box body, the radiating fins are positioned outside the box body, and the lower cover plate is fastened on the lower surface of the box body; the printed circuit board, the power amplifier and the power supply are all arranged in the cavity inside the box body, the power amplifier and the power supply are respectively electrically connected with the printed circuit board, the top of the power supply is connected with the radiator through a first heat conduction layer, and the top of the power amplifier is connected with the radiator through a metal heat conduction block.

2. The microwave equipment according to claim 1, wherein the heat sink is a heat pipe heat sink, the heat pipe heat sink further comprises heat pipes welded to the heat dissipation fins, and the heat pipes are uniformly embedded in the upper cover plate.

3. The microwave device according to claim 1, wherein the bottom of the power supply is directly connected to the box, and the bottom and the top of the power supply dissipate heat simultaneously.

4. The microwave device according to claim 3, wherein a partition is disposed inside the box body to divide the box body into an upper cavity and a lower cavity, the upper cavity is located between the partition and the upper cover plate, the lower cavity is located between the partition and the lower cover plate, the power source is disposed in the upper cavity, the bottom of the power source is directly connected to the partition, and the top of the power source is connected to the heat sink through the first heat conduction layer.

5. The microwave equipment of claim 1, wherein the upper surface of the upper cover plate is further fixed with a plurality of blowing fans and a plurality of exhaust fans, the blowing fans and the exhaust fans are respectively arranged on two sides of the radiating fins along the fin direction, the blowing direction of each blowing fan is parallel to the fin direction, and the exhaust direction of each exhaust fan is parallel to the fin direction.

6. The microwave device of claim 1, wherein a top portion of the power amplifier is fastened to the metal heat conducting block with a fastener and a second heat conducting layer is disposed between the power amplifier and the metal heat conducting block, an upper surface of the metal heat conducting block being connected to the heat sink.