CN212183568U

CN212183568U - High-efficient heat radiation structure of mobile phone motherboard

Info

Publication number: CN212183568U
Application number: CN202021341800.7U
Authority: CN
Inventors: 权剑良
Original assignee: Chongqing Boaote Intelligent Technology Co ltd
Current assignee: Chongqing Boaote Intelligent Technology Co ltd
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2020-12-18
Anticipated expiration: 2030-07-09

Abstract

The utility model relates to a cell-phone spare part technical field provides a high-efficient heat radiation structure of mobile phone motherboard, including mainboard body and cell-phone casing, the mainboard body is installed in the cell-phone casing, its characterized in that: the cell-phone casing is made by the metal material of easy heat conduction, and a side-mounting heating panel, it has a plurality of louvres to open on the heating panel, it places the district and the district is placed to the treater to have the battery of being used for on the mainboard body, the district is placed to the battery and the district is placed to the treater is used for installing battery and treater respectively, still install the fan on the mainboard body, still include two fixed conducting strips that set up on the mainboard body, two conducting strips are located the district is placed to the battery respectively and the district is placed to the treater, two conducting strips all pass behind the mobile phone motherboard with cell-phone body coupling, the surface of two conducting strips and battery or treater contact coats and is stamped heat conduction silicone grease. The utility model provides a pair of high-efficient heat radiation structure of mobile phone motherboard can dispel the heat high-efficiently.

Description

High-efficient heat radiation structure of mobile phone motherboard

Technical Field

The utility model relates to a cell-phone spare part technical field, concretely relates to high-efficient heat radiation structure of mobile phone motherboard.

Background

With the development of the science and technology level, the requirements of users on smart phones are higher and higher, for example, the smart phones are thin in appearance, high in chip processing speed and high in cruising ability, and the development of the three aspects can bring about the same problem that a mobile phone mainboard is heated more and more in the application process, and heat generated in the application cannot be dissipated quickly.

The chinese utility model patent with the publication number CN209693333U controls the opening of the micro fan, so that the air in the casing and the outside air flow through each other and convect, thereby achieving the purpose of heat dissipation. But relying only on a micro fan to dissipate heat is not ideal. Therefore, a new efficient heat dissipation structure for a mobile phone motherboard needs to be designed.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model aims at providing a high-efficient heat radiation structure of mobile phone motherboard makes it dispel the heat high-efficiently.

In order to achieve the above purpose, the present invention is implemented by the following technical solutions: a high-efficiency heat dissipation structure of a mobile phone mainboard comprises a mainboard body and a mobile phone shell, wherein the mainboard body is arranged in the mobile phone shell, the mobile phone shell is made of metal materials easy to conduct heat, a heat dissipation plate is arranged on one side of the mobile phone shell, a plurality of heat dissipation holes are formed in the heat dissipation plate, a battery placing area and a processor placing area are arranged on the mainboard body, the battery placing area and the processor placing area are respectively used for installing a battery and a processor, a fan is further arranged on the mainboard body,

the mobile phone is characterized by further comprising two heat conducting fins fixedly arranged on the mainboard body, wherein the two heat conducting fins are respectively located in the battery placing area and the processor placing area, the two heat conducting fins penetrate through the mobile phone mainboard and then are connected with the mobile phone shell, and the surfaces of the two heat conducting fins, which are in contact with the battery or the processor, are covered with heat conducting silicone grease.

Further, install temperature sensor and dustproof mechanism on the mainboard body with the cell-phone casing respectively, dustproof mechanism can avoid the dust in the outside air to get into the cell-phone casing from the louvre, temperature sensor with dustproof mechanism all with the treater electricity is connected.

Further, dustproof mechanism includes dust guard, electro-magnet and extension spring, it has the guide way to open on the cell-phone casing, the one end setting of dust guard is in the guide way, the other end passes behind the cell-phone casing with the surface contact of heating panel, the dust guard is made by iron material, and can slide in the guide way, the electro-magnet is fixed to be set up keeping away from of guide way the one end of dust guard, and with the treater electricity is connected, the extension spring makes the dust guard has and keeps away from the trend of electro-magnet.

Further, the inner wall of the guide groove is provided with a magnetism isolating sheet, and the magnetism isolating sheet is made of a magnetism isolating material.

The utility model has the advantages that:

1. the utility model provides a pair of high-efficient heat radiation structure of mobile phone motherboard, the heat that battery and treater during operation produced makes heat conduction silicone grease the semifluid state appear, and then the heat conduction silicone grease is abundant will fill the space between battery and heating panel and treater and the heating panel, lets its joint more inseparable for the conducting strip is better to the heat conduction effect of battery and treater. The heat of conducting strip transmits to the cell-phone casing again, and the cell-phone casing is made by metal material for the heat that the conduction was come dissipates more fast.

2. Under normal conditions, the dust guard covers the surface of heating panel to avoid the dust in the outside air to get into the cell-phone casing. When the temperature sensor detects that the air temperature in the mobile phone shell exceeds the preset value, the processor controls the electromagnet to work, the electromagnet attracts the dust-proof plate to enable the dust-proof plate covering the outer surface of the heat dissipation plate to move into the guide groove, then the processor controls the fan to work, so that the air in the mobile phone shell and the outside air are convected mutually, and the heat dissipation effect is further improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic top view of the present invention;

FIG. 3 is a schematic cross-sectional view taken along line B-B of FIG. 2;

FIG. 4 is a schematic cross-sectional view taken along the line C-C in FIG. 2;

fig. 5 is an enlarged schematic view of a portion a in fig. 2.

Reference numerals: 10-a main board body, 11-a battery placing area, 12-a processor placing area, 13-a fan, 14-a heat dissipation plate, 15-a magnetic separation sheet, 20-a mobile phone shell, 21-a guide groove, 30-a heat conduction sheet, 40-a temperature sensor, 50-a dustproof mechanism, 51-a dustproof plate, 52-an electromagnet and 53-a tension spring.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In this application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the description of the present application, it is to be understood that the terms "longitudinal," "lateral," "horizontal," "top," "bottom," "upper," "lower," "inner" and "outer" and the like are used in the orientation or positional relationship shown in the drawings, which are used for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

As shown in fig. 1-5, the utility model provides a high-efficient heat radiation structure of mobile phone motherboard, including mainboard body 10, cell-phone casing 20 and conducting strip 30, mainboard body 10 installs in cell-phone casing 20. The handset housing 20 is made of a metallic material that is easily heat conductive, facilitating the dissipation of heat as quickly as possible. One side installation heating panel 14 of cell-phone casing 20, it has a plurality of louvres to open on the heating panel 14, and the louvre communicates the inner chamber and the external world of cell-phone casing 20.

The main board body 10 has a battery placement region 11 and a processor placement region 12. The battery placing area 11 and the processor placing area 12 are used for installing a battery and a processor respectively, and a fan 13 is further installed on the main board body 10, wherein the fan 13 is electrically connected with the processor.

Since most of the heat generated by the mobile phone is generated when the battery and the processor work, it is very important to dissipate the heat of the battery and the processor. The two heat conducting fins 30 are fixedly mounted on the main board body 10 and are respectively located in the battery placement area 11 and the processor placement area 12. Two conducting strips 30 all pass behind the mobile phone motherboard and are connected with cell-phone casing 20, and preferably, two conducting strips 30 also can the integrative preparation shaping of cell-phone casing 20.

The surfaces of the two heat-conducting sheets 30 that contact the battery or the processor are covered with heat-conducting silicone grease. The heat-conducting silicone grease is a high-heat-conducting insulating organic silicon material, is almost never cured, and has excellent electrical insulating property and excellent heat-conducting property.

The working principle is as follows: the heat that battery and treater during operation produced can make heat conduction silicone grease the semifluid state appear, and then the heat conduction silicone grease will fill the battery and the heat dissipation plate 14 and the treater and the space between the heat dissipation plate 14 fully, has increased area of contact, lets its joint more inseparable for the conducting heat effect of conducting strip 30 to battery and treater is better. The heat received by the heat-conducting strip 30 is transferred to the mobile phone shell 20, and the mobile phone shell 20 is made of metal material, so that the heat generated by the working of the battery and the processor can be quickly dissipated by the mobile phone shell 20, and the purpose of high-efficiency heat dissipation is achieved.

In one embodiment, the temperature sensor 40 and the dust-proof mechanism 50 are mounted on the main board body 10 and the handset housing 20, respectively. The dustproof mechanism 50 can prevent dust in the outside air from entering the handset housing 20 through the heat dissipation holes, and both the temperature sensor 40 and the dustproof mechanism 50 are electrically connected to the processor.

Normally, the dustproof mechanism 50 covers the outer surface of the heat radiating plate 14 to prevent dust in the outside air from entering the handset case 20 through the heat radiating hole. However, when the temperature sensor 40 detects that the temperature of the air inside the handset housing 20 exceeds the preset value, the processor controls the dust-proof mechanism 50 to be out of contact with the heat dissipation plate 14, so that the hot air inside the handset housing 20 can dissipate part of the heat from the heat dissipation holes.

In one embodiment, specifically, the dust-proof mechanism 50 includes a dust-proof plate 51, an electromagnet 52, and a tension spring 53. The mobile phone case 20 is provided with a guide groove 21, one end of a dust-proof plate 51 is arranged in the guide groove 21, the other end of the dust-proof plate passes through the mobile phone case 20 and then contacts with the outer surface of the heat dissipation plate 14, and the dust-proof plate 51 is made of iron material and can slide in the guide groove 21. The guide groove 21 guides the sliding of the dust-proof plate 51.

The electromagnet 52 is fixedly installed at one end of the guide groove 21 away from the dust-proof plate 51 and is electrically connected to the processor. One end of the tension spring 53 is connected to the dust-proof plate 51, and the other end is connected to the handset case 20, and the tension spring 53 causes the dust-proof plate 51 to have a tendency to move away from the electromagnet 52.

Normally, the dust-proof plate 51 covers the outer surface of the heat dissipation plate 14 to prevent dust in the outside air from entering the handset case 20 through the heat dissipation hole. However, when the temperature inside the handset case 20 is too high and the heat dissipation plate 14 and the structure of the heat conductive silicone grease cannot effectively dissipate heat, the temperature sensor 40 detects the air temperature inside the handset case 20. When the detected temperature value is equal to or exceeds the preset value, the processor energizes the electromagnet 52, the electromagnet 52 generates attraction force to the dust-proof plate 51, so that the dust-proof plate 51 covering the outer surface of the heat dissipation plate 14 moves into the guide groove 21, and the heat dissipation holes are opened at the moment. The processor then controls the fan 13 to operate, so that the air inside the handset case 20 is convected to the outside air through the heat dissipation holes, thereby further improving the heat dissipation effect. When the temperature value detected by the temperature sensor 40 is lower than the preset value, the processor reversely energizes the electromagnet 52, and the electromagnet 52 generates a repulsive force to the dust-proof plate 51, so that the dust-proof plate 51 returns to the original position, covers the outer surface of the heat-dissipating plate 14, and continues to play a role in dust prevention.

In one embodiment, the magnetism isolating sheet 15 is installed on the inner wall of the guide groove 21, and the magnetism isolating sheet 15 is made of a magnetism isolating material. The magnetic shield 15 is preferably made of a metal material that does not react with the magnet. The design of the magnetic shielding sheet 15 can prevent the electromagnet 52 from reacting with the mobile phone case 20 made of metal material after being electrified, which is beneficial to keeping the electromagnet 52 stable during operation.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a mobile phone motherboard's high-efficient heat radiation structure, includes mainboard body and cell-phone casing, the mainboard body is installed in the cell-phone casing, its characterized in that: the mobile phone shell is made of metal materials easy to conduct heat, a heat dissipation plate is arranged on one side of the mobile phone shell, a plurality of heat dissipation holes are formed in the heat dissipation plate, a battery placing area and a processor placing area are arranged on the mainboard body and are respectively used for mounting a battery and a processor, a fan is further arranged on the mainboard body,

2. The efficient heat dissipation structure of a mobile phone motherboard according to claim 1, wherein: the mobile phone comprises a mainboard body and a mobile phone shell, wherein the mainboard body and the mobile phone shell are respectively provided with a temperature sensor and a dustproof mechanism, the dustproof mechanism can prevent dust in the outside air from entering the mobile phone shell from heat dissipation holes, and the temperature sensor and the dustproof mechanism are electrically connected with a processor.

3. The efficient heat dissipation structure of a mobile phone motherboard according to claim 2, wherein: dustproof mechanism includes dust guard, electro-magnet and extension spring, it has the guide way to open on the cell-phone casing, the one end setting of dust guard is in the guide way, the other end passes behind the cell-phone casing with the surface contact of heating panel, the dust guard is made by iron material, and can slide in the guide way, the electro-magnet is fixed to be set up keeping away from of guide way the one end of dust guard, and with the treater electricity is connected, the extension spring makes the dust guard has and keeps away from the trend of electro-magnet.

4. The efficient heat dissipation structure of a mobile phone motherboard according to claim 3, wherein: and the inner wall of the guide groove is provided with a magnetism isolating sheet which is made of a magnetism isolating material.