CN212183559U

CN212183559U - Plug-in mobile phone motherboard with shock-absorbing function

Info

Publication number: CN212183559U
Application number: CN202020687376.5U
Authority: CN
Inventors: 郑洪明; 王青
Original assignee: Ganzhou Jiangyuan Electronic Co ltd
Current assignee: Ganzhou Jiangyuan Electronic Co ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-12-18
Anticipated expiration: 2030-04-29

Abstract

The utility model discloses a grafting mobile phone motherboard with shock-absorbing function, including the mobile phone motherboard body, a plurality of grafting mechanisms of one side lateral wall fixedly connected with of mobile phone motherboard body, and the lateral wall gluing that the mobile phone motherboard body is close to grafting mechanism has a plurality of blotters, one side welding of mobile phone motherboard body has data interface, and the one end fixedly connected with arc thin slice that the mobile phone motherboard body is close to data interface. The utility model relates to a cell-phone accessory technical field through setting up blotter cooperation grafting mechanism, can utilize the foam-rubber cushion to support tight plug connector to when avoiding the condition such as the cell-phone falls, the plug connector breaks away from with grafting mechanism, tightly decides the bolt through setting up arc thin slice cooperation, can be in fixed cell-phone mainboard body, the cell-phone mainboard body cushions when the cell-phone falls, reduces the amplitude of cell-phone mainboard body, avoids cell-phone mainboard body to damage simultaneously.

Description

Plug-in mobile phone motherboard with shock-absorbing function

Technical Field

The utility model relates to a cell-phone accessory technical field especially relates to a grafting mobile phone motherboard with shock-absorbing function.

Background

The plug-in mobile phone motherboard is the most important accessory of the mobile phone, and the mobile phone motherboard can provide a series of joints for the connection of processors, video cards, sound effect cards, hard disks, memories, external devices and other devices, and the mobile phone motherboard is usually directly inserted into a related slot or connected by a circuit. The most important component on the motherboard is the chipset.

In the prior art, because a plurality of mobile phone accessories are plugged on the plugging mobile phone mainboard, the plugging accessories are easily affected by vibration and are loosened, when a mobile phone falls down, the plugging accessories are easily loosened due to vibration of the mainboard, so that various faults occur in the mobile phone, and the use experience of a user is affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem existing in the prior art and providing a grafting mobile phone motherboard with shock-absorbing function.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a grafting mobile phone motherboard with shock-absorbing function, includes the mobile phone motherboard body, a plurality of grafting mechanisms of one side lateral wall fixedly connected with of mobile phone motherboard body, and the mobile phone motherboard body is close to the lateral wall gluing of grafting mechanism and has a plurality of blotters, one side welding of mobile phone motherboard body has data interface, and the mobile phone motherboard body is close to data interface's one end fixedly connected with arc thin slice, and the lateral wall that the data interface was kept away from to the mobile phone motherboard body has seted up a plurality of through-holes, and is a plurality of all insert in the through-hole and be equipped with tightly decide the bolt, and every tightly decide the lateral wall of bolt all overlap and be equipped with two packing rings, the lateral wall of the mutual.

Preferably, the buffer pad is a spongy cushion, and the buffer pad wraps the insertion mechanism.

Preferably, the inner wall of the through hole is wrapped with a reinforcing shell, and the reinforcing shell is abutted to the gasket.

Preferably, the arc-shaped sheet is made of spring steel, and the shape of the arc-shaped sheet is spiral.

Preferably, both sides of the data interface are fixedly connected with supporting plates, and the surfaces of the supporting plates are provided with threaded holes.

Compared with the prior art, the beneficial effects of the utility model are that:

1. according to the plug-in mobile phone mainboard with the damping function, the cushion pad is arranged to be matched with the plug-in mechanism, the sponge pad can be utilized to tightly abut against the plug-in component, so that the situation that the plug-in component is separated from the plug-in mechanism when a mobile phone falls down is avoided, the arc-shaped thin sheet is arranged to be matched with the fastening bolt, the mobile phone mainboard body can be buffered when the mobile phone falls down while the mobile phone mainboard body is fixed, the amplitude of the mobile phone mainboard body is reduced, and meanwhile, the mobile phone mainboard body is prevented from being damaged;

2. this kind of grafting mobile phone motherboard with shock-absorbing function strengthens the shell through setting up, can avoid near the intensity decline of mobile phone motherboard body of through-hole, improves the shock resistance of mobile phone motherboard body, through the arc thin slice that sets up the spring steel material, can utilize the supplementary fixed data interface of the stronger characteristics of spring steel elasticity and mobile phone motherboard body to the shock attenuation is cushioned when taking place to collide with.

Drawings

Fig. 1 is a schematic top view of a plug-in mobile phone motherboard with a shock-absorbing function according to the present invention;

fig. 2 is a schematic cross-sectional structural view of a plug-in mobile phone motherboard with a shock-absorbing function according to the present invention;

fig. 3 is the utility model provides a blotter structure schematic diagram of grafting mobile phone motherboard with shock-absorbing function.

In the figure: 1. a mobile phone mainboard body; 2. a plug-in mechanism; 3. a cushion pad; 4. a data interface; 5. an arc-shaped sheet; 6. a through hole; 7. tightening the bolt; 8. a gasket; 9. reinforcing the shell; 10. a support plate; 11. a threaded bore.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-3, a plug-in mobile phone motherboard with shock-absorbing function, comprising a mobile phone motherboard body 1, a plurality of plug-in mechanisms 2 fixedly connected to a side wall of the mobile phone motherboard body 1, and a plurality of cushion pads 3 glued to a side wall of the mobile phone motherboard body 1 near the plug-in mechanisms 2, the cushion pads 3 being sponge pads, and the cushion pads 3 wrapping the plug-in mechanisms 2, a data interface 4 welded to one side of the mobile phone motherboard body 1, the data interface 4 being but not limited to Micro USB interface, USB type c and lighting for connecting the mobile phone to external devices and charging, a support plate 10 fixedly connected to both sides of the data interface 4, and a threaded hole 11 formed on the surface of the support plate 10, and an arc-shaped sheet 5 fixedly connected to one end of the mobile phone motherboard body 1 near the data interface 4, the arc-shaped sheet 5 being made of spring steel, and the arc-shaped sheet, through setting up arc thin slice 5 of spring steel material, can utilize the supplementary fixed data interface 4 of the stronger characteristics of spring steel elasticity and mobile phone motherboard body 1, and cushion the shock attenuation when taking place to collide with, and mobile phone motherboard body 1 keeps away from the lateral wall of data interface 4 and has seted up a plurality of through-holes 6, the inner wall parcel of through-hole 6 has intensive shell 9, and strengthen shell 9 and the setting of backing ring 8 counterbalance, strengthen shell 9 through setting up, can avoid near the intensity decline of mobile phone motherboard body 1 of through-hole 6, improve mobile phone motherboard body 1's shock resistance, all insert in a plurality of through-holes 6 and be equipped with tightly decide bolt 7, and every lateral wall that tightly decides bolt 7 all overlaps and is equipped with two backing rings 8, the lateral wall counterbalance setting of the lateral wall mobile phone motherboard body 1 that 8 are close to each other.

In the utility model, when installing, the mobile phone mainboard body 1 is installed in the mobile phone shell by the fastening bolt 7, and the data interface 4 is extended from the opening of the shell, then the data interface 4 is fixed near the opening of the shell by the support plate 10 matching with the screw hole 11, and the arc-shaped thin slice 5 is used to support the inner wall of the mobile phone shell and the mobile phone battery, the auxiliary fixing data interface 4 can buffer when vibrating, because the mobile phone battery is often arranged at the position, the mobile phone mainboard body 1 is not fixed by the fastening bolt 7, when the mobile phone generates the vibration caused by falling or other conditions, the gasket 8 matching with the arc-shaped thin slice 5 can absorb part of the impact force to avoid reducing the amplitude of the mobile phone mainboard body 1, thereby protecting the mobile phone mainboard body 1, and simultaneously avoiding the plug-in mechanism 2 from being separated from the plug connector in the mobile phone, on, buffer pad 3 can cushion grafting department, improves the anti-seismic performance of mobile phone motherboard body 1, utilizes the frictional force of buffer pad 3 and plug connector simultaneously, further avoids the plug connector of grafting mechanism 2 and cell-phone in to break away from.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A plug-in mobile phone mainboard with a shock absorption function comprises a mobile phone mainboard body (1), it is characterized in that the side wall of one side of the mobile phone mainboard body (1) is fixedly connected with a plurality of plug-in mechanisms (2), a plurality of cushion pads (3) are glued on the side wall of the mobile phone mainboard body (1) close to the plug-in mechanism (2), a data interface (4) is welded on one side of the mobile phone mainboard body (1), and one end of the mobile phone mainboard body (1) close to the data interface (4) is fixedly connected with an arc-shaped sheet (5), and the side wall of the mobile phone mainboard body (1) far away from the data interface (4) is provided with a plurality of through holes (6), fastening bolts (7) are inserted into the through holes (6), and the side wall of each fastening bolt (7) is sleeved with two washers (8), the side walls of the side wall mobile phone main board body (1) close to the gasket (8) are arranged in an abutting mode.

2. The plugging mobile phone motherboard with shock absorption function according to claim 1, wherein the cushion pad (3) is a sponge pad, and the cushion pad (3) is disposed to wrap the plugging mechanism (2).

3. The plugging mobile phone motherboard with shock absorption function according to claim 1, wherein the inner wall of the through hole (6) is wrapped with a reinforced shell (9), and the reinforced shell (9) is abutted to the gasket (8).

4. The plugging mobile phone motherboard with shock absorption function according to claim 1, wherein said arc-shaped sheet (5) is made of spring steel, and the shape of the arc-shaped sheet (5) is spiral.

5. The plugging mobile phone motherboard with shock absorption function according to claim 1, wherein both sides of said data interface (4) are fixedly connected with a support plate (10), and the surface of the support plate (10) is provided with a threaded hole (11).