CN212183130U - Modularized active power filter device convenient for heat dissipation - Google Patents
Modularized active power filter device convenient for heat dissipation Download PDFInfo
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- CN212183130U CN212183130U CN202020858267.5U CN202020858267U CN212183130U CN 212183130 U CN212183130 U CN 212183130U CN 202020858267 U CN202020858267 U CN 202020858267U CN 212183130 U CN212183130 U CN 212183130U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/20—Active power filtering [APF]
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Abstract
A modularized active power filter device convenient for heat dissipation comprises a case shell and a circuit board located inside the case shell, wherein the case shell comprises a case side plate, an upper cover plate, a front panel with a handle, a rear panel and a lower cover plate, an air inlet is formed in the lower portion of the front panel, and a long-strip-shaped air suction grid is arranged in the upper portion of the front panel; an air outlet is arranged below the rear panel, and a wiring terminal is arranged above the rear panel; an air inlet fan is arranged at the air inlet, and an air outlet fan is arranged at the air outlet; the case side plate, the upper cover plate, the front panel, the rear panel and the lower cover plate are directly connected and detached through mounting holes arranged on the side edges of the panels; an internal supporting partition plate is arranged in the housing of the machine box to divide the housing of the machine box into an upper layer and a lower layer, the upper layer and the lower layer are respectively sealed into independent air channels, the upper layer is subjected to forced air cooling through an air outlet fan, and the lower layer is subjected to forced air cooling through an air inlet fan; the optimized structural design has the characteristics of large air inlet quantity, uniform air supply, high heat dissipation efficiency and the like.
Description
Technical Field
The utility model relates to an active power filter device, a modularization active power filter device convenient to heat dissipation specifically says so.
Background
The traditional active power filter adopting the integrated layout has the characteristics of large volume, complex internal structure, low heat dissipation efficiency, difficult capacity expansion and the like. When integral type equipment broke down, need have a power failure to overhaul whole cabinet to the harmonic compensation to the power consumption environment has been stopped. The power consumption working condition environment which needs to compensate the harmonic waves is generally severe, the heat dissipation requirement on equipment is higher, and the temperature rise of the whole cabinet is higher when the integrated active power filter operates.
A common modular active power filter mounts a number of circuit boards, particularly digital control circuits, on top. Digital control circuit is very sensitive to ambient temperature, and when active power filter device was fully loaded the operation, the upper temperature rise that adopts passive heat dissipation was high, leads to the upper digital chip ageing with higher speed, has reduced the stability and the life of equipment, to some key application places, needs to develop an active power filter device of being convenient for the heat dissipation, stability is good and long service life urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an active power filter device of modularization convenient to heat dissipation to solve the bulky that above-mentioned prior art exists, inner structure is complicated, and the radiating efficiency is low, and the device upper strata passive form heat dissipation temperature that modularized design rises and leads to the ageing problem of digital control circuit chip.
The utility model adopts the technical proposal that: the utility model provides an active power filter device of modularization convenient to heat dissipation, includes the quick-witted case casing and is located the inside circuit board of quick-witted case casing, the quick-witted case casing includes machine box side board, upper cover plate, has front panel, rear panel and the lower cover plate of handle, its characterized in that: the lower part of the front panel is provided with an air inlet, the side edge of the front panel is fixedly provided with a flange edge, the side edge of the flange edge is provided with an arc-shaped hole with one open end (the device can be fixedly installed on the machine cabinet through the arc-shaped hole), and the upper part of the front panel is provided with a strip-shaped air suction grid; an air outlet is arranged below the rear panel, and a wiring terminal is arranged above the rear panel; an air inlet fan is arranged at the air inlet, and an air outlet fan is arranged at the air outlet; the case side plate, the upper cover plate, the front panel, the rear panel and the lower cover plate are directly connected and disassembled (screwed and loosened) through mounting holes arranged on the side edges of the panels; an internal supporting partition plate is arranged in the housing of the machine box to divide the housing of the machine box into an upper layer and a lower layer, the upper layer and the lower layer are respectively sealed into independent air channels, the upper layer is subjected to forced air cooling through an air outlet fan, and the lower layer is subjected to forced air cooling through an air inlet fan; the upper surface of the upper cover plate is in an undulate step shape.
Furthermore, a square hole grid is arranged on the lower portion of the front panel, a windowing window capable of being provided with a liquid crystal frame is arranged in the middle of the front panel, and two indicating lamp holes are formed in the right side of the strip-shaped air suction grid.
Furthermore, a square grid is arranged on the lower portion of the rear panel, and a grounding mounting hole is formed in the lower right corner of the rear panel.
Furthermore, the concave part of the surface of the upper cover plate is also provided with a plurality of semiconductor refrigeration heat dissipation devices, and each semiconductor refrigeration heat dissipation device comprises a semiconductor refrigeration piece, a heat dissipation substrate arranged on the heat dissipation surface of the semiconductor refrigeration piece and a plurality of heat dissipation fins arranged on the outer side of the heat dissipation substrate.
Furthermore, the lower surface of the lower cover plate is in an undulating step shape, and a plurality of heat dissipation holes are formed in the lower cover plate.
Furthermore, a digital control circuit board is also arranged, a digital temperature sensor is arranged on the digital control circuit board, and a control system on the digital control circuit board monitors the upper-layer environment temperature in real time; and when the ambient temperature is higher than a temperature alarm value preset by software, alarming or stopping the machine through a human-computer interface.
The utility model has the advantages and the characteristics that: all parts of the device can be mutually disassembled and assembled, thereby being convenient for generalized production, installation and maintenance. Through the overall structure design, the heat dissipation system is closed into two independent air channels, and the upper air channel and the lower air channel are provided with fans. The optimized structure design and the arrangement of the semiconductor refrigeration heat dissipation device enable the upper-layer fan to specially dissipate heat for the digital control circuit so as to reduce the influence of extremely high temperature rise on the digital circuit during full-load operation. The design of the lower independent air duct has the characteristics of large air inlet quantity, uniform air supply, high heat dissipation efficiency and the like.
Drawings
Fig. 1 is a schematic perspective view of a preferred embodiment of the present invention;
FIG. 2 is a schematic perspective view of a preferred embodiment of the present invention;
FIG. 3 is a schematic side perspective view of a preferred embodiment of the present invention;
fig. 4 is a schematic diagram of an air-cooling heat dissipation structure according to a preferred embodiment of the present invention;
FIG. 5 is a top cover plate with heat dissipation design according to a preferred embodiment of the present invention;
fig. 6 is a top cover plate with a semiconductor cooling and heat dissipating device according to another preferred embodiment of the present invention (power lines of the semiconductor cooling and heat dissipating device are not shown to clear the structure);
FIG. 7 is a schematic structural diagram of the semiconductor cooling device in FIG. 6;
FIG. 8 is a schematic view of a lower cover plate according to another preferred embodiment of the present invention;
wherein: 1. a case side plate, 1-1-an indicator light opening, 2-an upper cover plate, 2-1-a semiconductor heat dissipation device, 3-a front panel, 3-1-a square hole grid, 3-2-a strip air suction grid, 3-3-a window, 4-a liquid crystal frame, 5-a handle, 6-a flange edge, 6-1-an arc hole, 7-a rear panel, 7-1-a square grid, 7-2-a grounding installation hole, 8-an air outlet, 8-1-an air outlet fan, 9-a wiring terminal, 10-an air inlet, 10-1-an air inlet fan, 11-a fan bracket, 12-an internal supporting partition plate, 13-a circuit radiator and 14-a bus capacitor, 15-digital control circuit, 16-digital temperature sensor, 17-lower cover plate.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-4, a modular active power filter device convenient for heat dissipation includes a chassis housing and a circuit board located inside the chassis housing, the chassis housing includes a chassis side plate 1, an upper cover plate 2, a front plate 3 with a handle 5, a rear plate 7 and a lower cover plate 17, an air inlet 10 is provided at the lower part of the front plate 3, a flange edge 6 is fixedly provided at the side edge of the front plate 3, an arc hole 6-1 with an open end is provided at the side edge of the flange edge 6, and a strip-shaped air suction grid 3-2 is provided at the upper part of the front plate 3; an air outlet 8 is arranged below the rear panel 7, and a wiring terminal 9 is arranged above the rear panel; an air inlet fan 10-1 is arranged at the air inlet 10, and an air outlet fan 8-1 is arranged at the air outlet 8; the case side plate 1, the upper cover plate 2, the front panel 3, the rear panel 7 and the lower cover plate 17 are directly connected and detached with each other through mounting holes 18 arranged on the side edges of the panels; an internal supporting partition plate 12 is arranged inside the case shell to divide the case shell into an upper layer and a lower layer, the upper layer and the lower layer are respectively sealed into independent air channels, the upper layer is subjected to forced air cooling through an air outlet fan 8-1, and the lower layer is subjected to forced air cooling through an air inlet fan 10-1.
The lower part of the front panel 3 is provided with a square hole grid, the upper part of the front panel is provided with a strip-shaped air suction grid for protection, the middle part of the front panel is provided with a window for mounting the liquid crystal frame, and the right side of the strip-shaped air suction grid is provided with two indicating lamp openings 1-1; the handle 4 and the flange 5 may be mounted to the front panel. The strip-shaped air suction grids are located on the upper side of the front panel so as to avoid bus capacitors in the box body, and air can flow through the upper portions of the bus capacitors without resistance when air is sucked.
Example 2:
the difference from the embodiment 1 is that a square grid for protection is arranged at the lower part of the rear panel 7, and a grounding mounting hole is arranged at the lower right corner. The air outlet fan is positioned at the left side of the rear panel and just above the digital control circuit 15, so that heat dissipation of the digital control circuit is facilitated.
Example 3:
the difference from embodiment 1 is that the case side plate 1 is provided with mounting holes for the fan bracket 11, the intake fan 9 can be mounted to the fan bracket 11, and the circuit radiator 13 is provided with mounting holes for the internal support partition 12.
Example 4:
referring to fig. 4, the internal support bulkhead 12 may be mounted to the chassis side panel 1. The internal supporting partition plate 12 divides the box body into an upper layer and a lower layer, so that the upper layer and the lower layer are respectively sealed into independent air channels. The lower air duct is used for feeding air from a front panel square hole grid 3-1, four high-power air inlet fans are used for forced air cooling of the circuit radiator, and air flow is finally discharged from a rear panel square grid; the upper air duct is used for air intake from the strip-shaped air suction grid of the front panel, air flows through the top of the bus capacitor, then flows through the digital control circuit, and finally is forcibly discharged from the fan at the air outlet of the rear panel right behind the digital control circuit.
The digital control circuit board 15 is provided with a digital temperature sensor 16, and a control system monitors the upper-layer environment temperature in real time; and when the ambient temperature is higher than a temperature alarm value preset by software, alarming or stopping the machine through a human-computer interface.
Example 5:
referring to fig. 5, the difference from embodiment 1 is that the surface of the upper cover plate 2 with heat dissipation design is in a wavy step shape, which can enhance the strength and increase the heat dissipation area of the upper cover plate, and then is matched with the upper heat dissipation fan, so as to have a good heat dissipation effect on the upper layer of the chassis, and be applied to industrial occasions with very harsh environmental temperatures.
Similar to the upper cover plate, the lower surface of the lower cover plate 17 is in an undulated step shape, and the lower cover plate is provided with a plurality of heat dissipation holes 17-1, so that the strength can be enhanced, the heat dissipation area can be increased, and the heat dissipation effect can be further improved by the heat dissipation holes 17-1.
Example 6:
referring to fig. 6 and 7, a plurality of semiconductor refrigerating and heat dissipating devices 2-1 are further disposed at the concave portion of the surface of the upper cover plate 2, each semiconductor refrigerating and heat dissipating device 2-1 includes a semiconductor refrigerating plate 2-11, a heat dissipating substrate 2-12 mounted on the heat dissipating surface of the semiconductor refrigerating plate, and a plurality of heat dissipating fins 2-13 mounted on the outer side of the heat dissipating substrate and used for accelerating heat dissipation, the semiconductor refrigerating plates refrigerate by using the peltier effect, and for some key application places, it is possible to ensure that the digital chip of the active power filter device is at a good environmental temperature.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated.
The foregoing shows and describes the general principles and features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description of the above embodiments and the description is only for the purpose of illustrating the structural relationships and principles of the present invention, and that there can be various changes and modifications without departing from the spirit and scope of the present invention, and that these changes and modifications all fall within the scope of the claimed invention.
Claims (6)
1. The utility model provides an active power filter device of modularization convenient to heat dissipation, includes the chassis casing and is located the inside circuit board of chassis casing, the chassis casing includes chassis side board (1), upper cover plate (2), front panel (3) that have handle (5), rear panel (7) and apron (17) down, its characterized in that: an air inlet (10) is formed in the lower portion of the front panel (3), a flange edge (6) is fixedly arranged on the side edge of the front panel (3), an arc-shaped hole (6-1) with an open end is formed in the side edge of the flange edge (6), and a strip-shaped air suction grid (3-2) is arranged on the upper portion of the front panel (3); an air outlet (8) is arranged below the rear panel (7), and a wiring terminal (9) is arranged above the rear panel; an air inlet fan (10-1) is arranged at the air inlet (10), and an air outlet fan (8-1) is arranged at the air outlet (8); the case side plate (1), the upper cover plate (2), the front panel (3), the rear panel (7) and the lower cover plate (17) are directly connected and detached with each other through mounting holes (18) arranged on the side edges of the panels; an internal supporting partition plate (12) is arranged in the housing of the machine box to divide the housing of the machine box into an upper layer and a lower layer, the upper layer and the lower layer are respectively sealed into independent air channels, the upper layer is subjected to forced air cooling through an air outlet fan (8-1), and the lower layer is subjected to forced air cooling through an air inlet fan (10-1); the upper surface of the upper cover plate (2) is in a wavy step shape.
2. The modular active power filter device according to claim 1, characterized in that: the lower part of the front panel (3) is provided with a square hole grid (3-1), the middle part of the front panel is provided with a windowing (3-3) which can be used for installing a liquid crystal frame (4), and the right side of the strip-shaped air suction grid is provided with two indicating lamp openings (1-1).
3. The modular active power filter device according to claim 1, characterized in that: the lower part of the rear panel (7) is provided with a square grid (7-1), and the lower right corner is provided with a grounding mounting hole (7-2).
4. The modular active power filter device according to claim 1, characterized in that: the semiconductor refrigeration heat dissipation device comprises an upper cover plate (2), and is characterized in that a plurality of semiconductor refrigeration heat dissipation devices (2-1) are further arranged at the concave position of the surface of the upper cover plate (2), and each semiconductor refrigeration heat dissipation device (2-1) comprises a semiconductor refrigeration piece (2-11), a heat dissipation substrate (2-12) arranged on the heat dissipation surface of the semiconductor refrigeration piece, and a plurality of heat dissipation fins (2-13) arranged on the outer side of the heat dissipation substrate.
5. Modular active power filter device according to claim 4, characterized in that: the lower surface of the lower cover plate (17) is in an undulating step shape, and a plurality of heat dissipation holes (17-1) are formed in the lower cover plate.
6. A modular active power filter device according to any of claims 1-5, characterized in that: the device is also provided with a digital control circuit board (15), the digital control circuit board (15) is provided with a digital temperature sensor (16), and a control system of the digital temperature sensor (16) monitors the upper-layer environment temperature in real time; and when the ambient temperature is higher than a temperature alarm value preset by software, alarming or stopping the machine through a human-computer interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020858267.5U CN212183130U (en) | 2020-05-21 | 2020-05-21 | Modularized active power filter device convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020858267.5U CN212183130U (en) | 2020-05-21 | 2020-05-21 | Modularized active power filter device convenient for heat dissipation |
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| Publication Number | Publication Date |
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| CN212183130U true CN212183130U (en) | 2020-12-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020858267.5U Active CN212183130U (en) | 2020-05-21 | 2020-05-21 | Modularized active power filter device convenient for heat dissipation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805686A (en) * | 2021-09-27 | 2021-12-17 | 深圳市国鑫恒运信息安全有限公司 | Server with GPU module and CPU module capable of independently radiating heat separately |
| WO2023246084A1 (en) * | 2022-06-21 | 2023-12-28 | 阳光电源股份有限公司 | Grounding structure and electrical equipment |
-
2020
- 2020-05-21 CN CN202020858267.5U patent/CN212183130U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113805686A (en) * | 2021-09-27 | 2021-12-17 | 深圳市国鑫恒运信息安全有限公司 | Server with GPU module and CPU module capable of independently radiating heat separately |
| CN113805686B (en) * | 2021-09-27 | 2023-12-26 | 深圳市国鑫恒运信息安全有限公司 | Separate independent heat dissipation server for GPU module and CPU module |
| WO2023246084A1 (en) * | 2022-06-21 | 2023-12-28 | 阳光电源股份有限公司 | Grounding structure and electrical equipment |
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